CN208570579U - A kind of encapsulation cooling device of smart card - Google Patents
A kind of encapsulation cooling device of smart card Download PDFInfo
- Publication number
- CN208570579U CN208570579U CN201821224012.2U CN201821224012U CN208570579U CN 208570579 U CN208570579 U CN 208570579U CN 201821224012 U CN201821224012 U CN 201821224012U CN 208570579 U CN208570579 U CN 208570579U
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- smart card
- cooling
- track
- encapsulation
- cooling device
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Abstract
The utility model discloses a kind of encapsulation cooling devices of smart card, the track of smart card is used for transmission including angle demodulator and two, angle demodulator is used to support smart card and adjusts the placed angle of smart card, wherein at least one track with smart card rear-face contact region below offer the first cooling duct of cooling water can be connected, the both ends of the first cooling duct are connected to cooling water pipe.This cooling device is after smart card completes hot-pressing processing, first cooling track can cool down to the back side of the smart card of high temperature, when smart card can be transferred to cold pressing station, the cold pressing head and cooling track for being cold-pressed station are rapidly cooled the front and back of smart card, cool down simultaneously, accelerate cooling rate, keeps the smart card some materials melted cooling and Nian Jie with module chip at an entirety rapidly.
Description
Technical field
The utility model relates to smart chip card technical field more particularly to a kind of encapsulation cooling devices of smart card.
Background technique
Currently, having hot pressing and cold pressing two procedures in the chip encapsulating device of smart chip card.Hot pressing is reached in smart card
When process, there is a thermal head above the smart card for being filled with module chip, thermal head can be depressed at module chip, mould
Block chip is heated to the high temperature of setting, at this point, the module chip of high temperature can melt the smart card periphery material touched.So
Afterwards, smart card can be sent to down one of cold pressing process, and the cold pressing head above smart card can be depressed into module chip, height
The module chip of temperature state is cooled down, smart card card body fusing material cooling after, module chip will it is Nian Jie with card body at
One entirety, this completes the processes of module core and the encapsulation of smart card card body.This type of cooling needs intelligent body to reach
It can just be begun to cool after cold pressing process, and mainly by contacting with cold pressing head come fast cooling, intelligence can only be touched by being cold-pressed head
The front of card rapidly can not carry out cooling down in the back side to intelligence, and the speed of cooling is slower, and effect is bad, in smart card
Face has small part material and is in the condition of high temperature, and card body is finally easy to cause to deform or occur mark.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, the utility model provides a kind of encapsulation cooling device of smart card,
It can realize the back side cooling down of smart card, accelerate cooling rate.
The utility model solves technical solution used by its technical problem are as follows:
A kind of encapsulation cooling device of smart card, the track of smart card, institute are used for transmission including angle demodulator and two
It states angle demodulator to be used to support smart card and adjust the placed angle of smart card, wherein at least one track is carried on the back with smart card
Offer the first cooling duct that cooling water can be connected below face contact region, the both ends of first cooling duct with it is cold
But water pipe is connected to.
As an improvement of the above technical solution, the angle demodulator includes that the rotation of pedestal and flexible connection pedestal is put down
Platform, the top surface of the rotatable platform support the middle section of intelligent card backside.
As an improvement of the above technical solution, for the pedestal through the second cooling duct is offered, described second is cooling logical
The both ends in road are connected to cooling water pipe.
As an improvement of the above technical solution, the track is equipped with the placed side for supporting smart card back side side, institute
It states track and is equipped with installation base in the outside of placed side, be fixedly connected with the blend stop for being parallel to track, institute on the installation base
The side for stating blend stop is extend out to above placed side, is formed between the blend stop, installation base and placed side and is accommodated smart card side
Groove, smart card can be moved forward and backward along groove.
As an improvement of the above technical solution, the both ends of first cooling duct are equipped with three-way connection, the threeway
One end of connector is connected to the first cooling duct, and the other both ends of the three-way connection are respectively communicated with that there are two for connecting cooling
The interface of water pipe.
As an improvement of the above technical solution, first cooling duct is parallel with the moving direction of smart card.
The beneficial effects of the utility model have:
The track of this cooling device with smart card rear-face contact region below offer the first cooling duct, first is cold
But the both ends in channel are connected to cooling water pipe, cooling water is connected, after smart card completes hot-pressing processing, and the first cooling track
Can cool down to the back side of the smart card of high temperature, when smart card can be transferred to cold pressing station when, be cold-pressed station cold pressing head and
Cooling track is rapidly cooled the front and back of smart card, cools down simultaneously, accelerates cooling rate, makes the intelligence melted
Card portion material is cooling and Nian Jie with module chip at an entirety rapidly.
Detailed description of the invention
With reference to the accompanying drawing and specific embodiment the utility model is described in further detail, in which:
Fig. 1 is the structural schematic diagram of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the utility model embodiment middle orbit；
Fig. 3 is the structural schematic diagram of the angle demodulator of the utility model embodiment；
Fig. 4 is the structural schematic diagram of the sealed in unit of the utility model embodiment.
Specific embodiment
Referring to Fig. 1 and Fig. 4, a kind of encapsulation cooling device of smart card of the utility model, including two tracks 1, track 1
Be used for transmission smart card 2, wherein at least one track 1 with 2 rear-face contact region of smart card below offer can be connected it is cold
But the first cooling duct 3 of water, the both ends of first cooling duct 3 are connected to cooling water pipe, wherein first is cooling logical
Road 3 is parallel with the moving direction of smart card 2.
With further reference to Fig. 2, the both ends of first cooling duct 3 are equipped with three-way connection 6, the three-way connection 6
One end is connected to the first cooling duct 3, and the other both ends of the three-way connection 6 are respectively communicated with that there are two for connecting cooling water pipe
Interface 7, cooling water pass through the first cooling duct 3 after so that its temperature is dropped to low temperature.
In addition, the track 1 is equipped with placed side 11 for supporting 2 back side side of smart card, the track 1 is in placed side
11 outside is equipped with installation base 12, is fixedly connected with the blend stop 13 for being parallel to track 1, the gear on the installation base 12
The side of item 13 extend out to 11 top of placed side, is formed between the blend stop 13, installation base 12 and placed side 11 and accommodates intelligence
Block the groove 5 of 2 sides, smart card 2 can be moved forward and backward along groove 5, and blend stop 13 plays guidance and positioning intelligence when transmitting smart card 2
2 effect can be blocked.
With further reference to Fig. 3, this cooling device further includes angle demodulator 4, and the angle demodulator 4 includes 41 He of pedestal
It is flexibly connected the rotatable platform 42 of pedestal 41, the middle section at top surface bearing 2 back side of smart card of the rotatable platform 42 is described
Angle demodulator 4 is used to support smart card 2 and adjusts the placed angle of smart card 2, as shown in figure 4, angle demodulator 4 is in warm
After pressure head 81 and cold pressing head 91 are depressed into module chip 10, if thermal head 81/ is cold-pressed 91 surface of head and contacts with module chip 10
When face is not parallel, angle demodulator 4 can generate angular transformation, and thermal head 81/ is made to be cold-pressed connecing for 91 surface of head and module chip 10
Contacting surface becomes parallel contact, and the dynamics for being cold-pressed the pushing of head 91 is made to thermal head 81/ to become more balanced.
In order to further enhance the cooling effect at 2 back side of smart card, the pedestal 41, which runs through, offers the second cooling duct
43, the both ends of second cooling duct 43 are connected to cooling water pipe, and cooling water makes its entire angle tune after passing through pedestal 41
The temperature of section device 4 drops to low temperature.
As shown in figure 4, this cooling device can be applied in sealed in unit, during the work time, smart card 2 is on track 1
It is sent to hot-pressing station 8, the thermal head 81 above smart card 2 is depressed on module chip 10, quickly module chip 10
Heating reaches setting high temperature, and melts 2 material of periphery smart card touched with module chip 10, when smart card 2 completes heat
After pressure processing, the back side that the first cooling track 3 is capable of smart card 2 to high temperature cools down, and can be transferred to smart card 2 cold
When pressure station 9, the front for being cold-pressed cold pressing 91 pairs of smart cards of head at station cools down, meanwhile, the first cooling track 3 and second is cooling logical
Road 43 is jointly rapidly cooled 2 back side of smart card, cools down, and accelerates cooling rate, makes 2 some materials of smart card melted
It is cooling and Nian Jie with module chip 10 at an entirety rapidly.
The above, the only better embodiment of the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as its technical effect for reaching the utility model with any same or similar means, all should belong to the utility model
Protection scope.
Claims (6)
1. a kind of encapsulation cooling device of smart card, it is characterised in that: be used for transmission smart card including angle demodulator and two
Track, the angle demodulator is used to support smart card and adjusts the placed angle of smart card, and wherein at least one track exists
With the first cooling duct that cooling water can be connected is offered below smart card rear-face contact region, first cooling duct
Both ends are connected to cooling water pipe.
2. a kind of encapsulation cooling device of smart card according to claim 1, it is characterised in that: the angle demodulator packet
It includes pedestal and is flexibly connected the rotatable platform of pedestal, the top surface of the rotatable platform supports the middle section of intelligent card backside.
3. a kind of encapsulation cooling device of smart card according to claim 2, it is characterised in that: the pedestal, which runs through, to be opened up
There is the second cooling duct, the both ends of second cooling duct are connected to cooling water pipe.
4. a kind of encapsulation cooling device of smart card according to claim 1, it is characterised in that: the track is equipped with and is used for
The placed side of smart card back side side is supported, the track is equipped with installation base in the outside of placed side, on the installation base
Be fixedly connected with the blend stop for being parallel to track, the side of the blend stop is extend out to above placed side, the blend stop, installation base and
The groove for accommodating smart card side is formed between placed side, smart card can be moved forward and backward along groove.
5. a kind of encapsulation cooling device of smart card according to claim 1 or 4, it is characterised in that: described first is cooling
The both ends in channel are equipped with three-way connection, and one end of the three-way connection is connected to the first cooling duct, the three-way connection
In addition both ends are respectively communicated with that there are two for connecting the interface of cooling water pipe.
6. a kind of encapsulation cooling device of smart card according to claim 5, it is characterised in that: first cooling duct
It is parallel with the moving direction of smart card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821224012.2U CN208570579U (en) | 2018-07-31 | 2018-07-31 | A kind of encapsulation cooling device of smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821224012.2U CN208570579U (en) | 2018-07-31 | 2018-07-31 | A kind of encapsulation cooling device of smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208570579U true CN208570579U (en) | 2019-03-01 |
Family
ID=65449040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821224012.2U Active CN208570579U (en) | 2018-07-31 | 2018-07-31 | A kind of encapsulation cooling device of smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208570579U (en) |
-
2018
- 2018-07-31 CN CN201821224012.2U patent/CN208570579U/en active Active
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