CN112213896A - Ink module, preparation method thereof, electronic paper and display device - Google Patents
Ink module, preparation method thereof, electronic paper and display device Download PDFInfo
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- CN112213896A CN112213896A CN202011187885.2A CN202011187885A CN112213896A CN 112213896 A CN112213896 A CN 112213896A CN 202011187885 A CN202011187885 A CN 202011187885A CN 112213896 A CN112213896 A CN 112213896A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 177
- 239000011241 protective layer Substances 0.000 claims abstract description 38
- 239000002390 adhesive tape Substances 0.000 claims abstract description 34
- 239000011800 void material Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 239000000565 sealant Substances 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000000926 separation method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1676—Electrodes
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
The embodiment of the application provides an ink module, a preparation method of the ink module, electronic paper and a display device. The ink module comprises a first protective layer, an ink layer and a conductive layer which are sequentially stacked; in a non-display area of the ink module, the ink layer is provided with a first vacancy, and at least part of the conductive layer is exposed at the first vacancy; the first protective layer has a second vacancy matching the first vacancy; the space formed by the first vacancy and the second vacancy is used for accommodating a conductive adhesive tape, so that one side of the conductive adhesive tape can be in electrical contact with part of the conductive layer. The embodiment of the application improves the problem that the film layer of the ink module is easily separated from the film layer connected with the film layer, enhances the adhesion between the film layers and improves the conductivity of the ink module.
Description
Technical Field
The application relates to the technical field of display, in particular to an ink module and a preparation method thereof, electronic paper and a display device.
Background
The electronic paper is an ultra-thin and ultra-light display screen, wherein, the structure of some electronic paper at present mainly includes device layer, ink module, drive circuit and protective layer etc. and the problem of rete part separation or excessive glue appears easily in the ink module among the prior art, leads to steam to get into the ink module and influences its electric conductive property.
Disclosure of Invention
The application aims at the defects of the existing mode, provides an ink module and a preparation method thereof, electronic paper and a display device, and aims to solve the technical problem that in the prior art, a film layer is easy to separate.
In a first aspect, an embodiment of the present application provides an ink module, including: a first protective layer, an ink layer and a conductive layer which are sequentially laminated;
in the non-display area of the ink module, the ink layer is provided with a first vacancy, and at least part of the conductive layer is exposed at the first vacancy;
the first protective layer has a second vacancy matching the first vacancy;
the space formed by the first and second openings is used for accommodating the conductive adhesive tape, so that one side of the conductive adhesive tape can be in electric contact with part of the conductive layer.
In a second aspect, an embodiment of the present application provides electronic paper, including: a device layer, a conductive adhesive tape and the ink module provided by the first aspect.
The device layer is positioned on one side of the first protective layer of the ink module, which is far away from the conductive layer;
the conductive adhesive tape is arranged in a space formed by the first vacancy and the second vacancy of the ink module, one side of the conductive adhesive tape is contacted with part of the conductive layer of the ink module, and the other side of the conductive adhesive tape is electrically contacted with the device layer.
In a third aspect, an embodiment of the present application provides a display device, including: the ink module provided by the first aspect; or, the electronic paper provided by the second aspect.
In a fourth aspect, the present embodiment provides a method for manufacturing an ink module, where the ink module provided in the first aspect includes a first protection layer, an ink layer, and a conductive layer, which are sequentially stacked, and includes:
cutting a second vacancy out of the first protective layer in the non-display area of the ink module, extending the second vacancy to the edge of the first protective layer, and forming an opening at the edge of the first protective layer;
and removing the part of the ink layer corresponding to the second vacancy to form a first vacancy and expose part of the conductive layer.
In a fifth aspect, this embodiment provides a method for manufacturing electronic paper, including: placing a conductive adhesive tape in a space formed by the first vacancy and the second vacancy of the ink module provided by the first aspect, and enabling one side of the conductive adhesive tape to be in electric contact with a part of the conductive layer;
the ink set provided in the first aspect as described above with the conductive tape placed thereon is mated to one side of the device layer such that the other side of the conductive tape is in electrical contact with the device layer.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:
in the ink module in this embodiment, adopt the conductive adhesive tape to arrange in the space that first vacancy and the second vacancy of ink module formed, the face contact in certain region is formed with the partial conducting layer of aforementioned ink module to one side of conductive adhesive tape, therefore compare in prior art, laminate more between the rete of ink module, can increase the adhesion between rete through such face contact remarkably, reduced the risk that the ink module takes place the partial separation of rete effectively, promoted the electric conductive property of ink module.
The surface contact formed by the conductive adhesive tape enables stronger adhesive force to be formed between the films, and the problem of part separation between the films is not easy to occur, so that the position of the conductive adhesive tape in the ink module is not limited, and further the expansion of a display area is facilitated on the premise of ensuring the conductive performance of a product.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a cross-sectional view of an ink module according to a first embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of a second embodiment of an ink module according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of a third embodiment of an ink module according to an embodiment of the present disclosure;
fig. 4 is a cross-sectional view of a fourth implementation manner of an electronic paper according to an embodiment of the present application;
fig. 5 is a cross-sectional view of a fifth implementation manner of an electronic paper according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a sixth implementation manner of electronic paper according to an embodiment of the present application;
fig. 7 is a cross-sectional view of a surface a-a' in a sixth implementation manner of an electronic paper according to an example of the present application;
FIG. 8 is a cross-sectional view of a B-B' plane in a sixth implementation of an electronic paper according to an example of the present application;
FIG. 9 is an enlarged view at D of FIG. 7 provided by an embodiment of the present application;
FIG. 10 is an enlarged view at C of FIG. 8 according to an exemplary embodiment of the present disclosure;
fig. 11 is a cross-sectional view of an opposite structure of a fifth implementation manner of electronic paper according to an example of the present application;
FIG. 12 is a schematic view illustrating a process for manufacturing an ink set according to an embodiment of the present disclosure;
fig. 13 is a schematic view of a process for manufacturing an electronic paper according to an embodiment of the present disclosure;
fig. 14 is a schematic view of a process for manufacturing another electronic paper according to an embodiment of the present disclosure;
in the figure:
100-an ink module;
101-a first protective layer;
102-an ink layer;
103-a conductive layer;
104-optical glue layer;
105-a first vacancy;
106-second vacancy;
100 a-ink module non-display area;
100 b-ink module display area;
200-a device layer;
300-conductive adhesive tape
400-a flexible circuit board;
500-a driver circuit;
600-silicon rubber;
601-sealing glue;
700-picture region;
800-picture frame area;
900-second protective layer.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The inventor of the application researches and discovers that the silver hole in the prior art is small in size, the adhesion force between the ink module and the device layer is small by adopting a method of coating silver colloid in the silver hole, and the problem of separation of the film layer part is easy to occur; and, because the silver colloid is liquid type binder, the adhesion between the rete also can be reduced to the arch that the silver colloid coating is inhomogeneous and form to aggravate the problem of the partial separation in rete, lead to steam to get into the ink module and influence its electric conductivity nature.
In addition, when the thickness of the silver paste to be coated is increased, the paste overflow can occur, which may cause short circuit between the ink module and other film layers and affect the conductivity of the product.
Because the separation between the rete or overflow glue appear easily in the silver-colored gluey scheme among the prior art, consequently, when the display area of ink module needs to be enlarged, need consider the cooperation size of silver hole and ink module edge, just so make display area's expansion receive the restriction, hardly realize the picture maximize.
The application provides an ink module and a preparation method thereof, electronic paper and a display device, and aims to solve the technical problems in the prior art.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the present application provides an ink module, as shown in fig. 1, including: a first protective layer 101, an ink layer 102, and a conductive layer 103 are sequentially stacked.
In the non-display area 100a of the ink module 100, the ink layer 102 has a first void 105, and at least a portion of the conductive layer 103 is exposed at the first void 105;
the first protective layer 101 has a second void 106 matching the first void 105;
the space formed by the first and second openings 105 and 106 is used for accommodating the conductive tape 300, so that one side of the conductive tape 300 can be in electrical contact with a part of the conductive layer 103.
Specifically, as shown in fig. 1, in the non-display area 100a of the ink module 100, the ink layer 102 has a first void 105, a second void 106 is formed between the first protection layer 101 and the ink layer 102, the first void 105 and the second void 106 are matched in size, the conductive tape 300 is attached in a space area formed by the first void 105 and the second void 106, and one side of the conductive tape 300 can be electrically contacted with a part of the conductive layer 103 of the ink module 100. The first protective layer 101 is an encapsulation layer for protecting the ink layer 102.
In the above embodiment, the conductive tape 300 is a metal foil or conductive cloth with a highly conductive back adhesive, obviously, the adhesive force of the conductive tape 300 is larger than that of a silver adhesive in the prior art, and the conductive tape 300 is attached to the space region formed by the first vacancy 105 and the second vacancy 106 of the ink module 100, so that the surface contact between the ink module 100 and other film layers is realized, the adhesive force between the ink module 100 and other film layers is further improved, and the risk of partial separation between the film layers is effectively reduced.
In addition, the conductive tape 300 is a solid adhesive substance, and compared with a liquid silver adhesive in the prior art, the probability of the overflow phenomenon can be significantly reduced, the risk of short circuit between the ink module 100 and other film layers is also reduced, and the stability of the product is improved.
It should be noted that the sizes of the first vacancy 105 and the second vacancy 106 are matched, including that there is an error in the size of the first vacancy 105 which may be caused by the aluminum film cutting; and cleaning the ink layer 102 of the ink module 100, such as alcohol wiping, the fluidity of the alcohol may cause the second gap 106 to have an error in size. Thus, matching the size between the first void 105 and the second void 106 includes the first void 105 having a size that is smaller than, equal to, or larger than the second void 106.
The inventor of the present application considers that, along with the development of display technology, the size requirement for the display screen is higher and higher, and the method of connecting the ink module 100 and other film layers through the silver paste in the prior art is easy to cause the film layer part separation and the paste overflow, so that the limitation of the position of the silver hole is large when the size of the display area 100b in the ink module 100 is enlarged, and the screen maximization is difficult to realize. Therefore, the application further provides the following possible implementation modes for the ink module:
in the present embodiment, the first void 105 extends toward the edge of the ink layer 102 and forms an opening at the edge of the ink layer 102.
Alternatively, as shown in fig. 2, the first void 105 is located at the edge of the ink layer 102 and extends, and an opening is formed at the edge of the ink layer 102 to expose a portion of the conductive layer 103 of the ink module 100, and the conductive tape 300 connects the exposed portion of the conductive layer 103 and the device layer 200, and since the conductive tape 300 has strong adhesion, the problem of separation of the inter-film portions is not easy to occur, and is not limited to the position of the silver hole in the prior art. Therefore, under the premise of ensuring the conductive performance of the product, the maximization of the picture can be better realized.
Since the adhesive force of the conductive tape 300 is large and surface contact between the film layers can be realized, there is no need to design a spare contact (i.e., a second conductive tape); on the premise of ensuring the conductive performance of the product, the method is favorable for further realizing the maximization of the picture. In summary, the embodiment of the present application can significantly increase the cutting number of the ink module 100 with the same amount of production materials.
In addition, an opening is formed at the edge of the ink layer 102, so that the ink layer 102 at the edge of the ink module 100 can be cleaned more conveniently, the risk of short circuit between films caused by the ink layer 102 residue in the silver hole area in the prior art is reduced, the yield of products is effectively improved, and the product preparation process is simplified.
The inventor of the present application has noticed that, in order to better prevent moisture from entering the ink module 100 and affecting the image display of the ink module 100, a protection layer is disposed around the ink module 100, wherein the medium connecting the ink module 100 and the protection layer is the optical adhesive layer 104.
Optionally, as shown in fig. 3, the ink module 100 further includes an optical adhesive layer 104; the optical adhesive layer 104 is located on the side of the conductive layer 103 away from the ink layer 102. Through optical adhesive layer 104, can realize ink module 100 and the effective connection of the rete that blocks water, further prevent that the moisture from entering ink module 100 in, guaranteed the picture display of ink module 100.
Based on the same inventive concept, the embodiment of the application provides electronic paper, which comprises: the device layer 200, the conductive tape 300 and the ink module 100 of the first aspect;
the device layer 200 is located on a side of the first protective layer 101 of the ink module 100 away from the conductive layer 103;
the conductive tape 300 is disposed in a space formed by the first opening 105 and the second opening 106 of the ink module 100, one side of the conductive tape 300 is in contact with a portion of the conductive layer 103 of the ink module 100, and the other side of the conductive tape 300 is in electrical contact with the device layer 200.
Specifically, as shown in fig. 4 and 5, the device layer 200 is located on a side of the first protection layer 101 of the ink module 100 away from the conductive layer 103, in the ink module 100, the ink layer 102 has a first void 105, a second void 106 is located between the first protection layer 101 and the ink layer 102, the second void 106 is connected to the device layer 200, and the conductive tape 300 is located in a space formed by the first void 105 and the second void 106, that is, one side of the conductive tape 300 is in contact with a portion of the conductive layer 103 of the ink module 100, and the other side of the conductive tape 300 is in contact with the device layer 200, and the conductive tape 300 is a metal foil or a conductive cloth with a high conductive back adhesive, and can form a reliable contact surface with the portion of the conductive layer 103 of the ink module 100 and the device layer 200, respectively.
In the above embodiment, the conductive tape 300 is in surface contact with part of the conductive layer 103 of the ink module 100 and the device layer 200, so that the adhesion between the two film layers is relatively large, the risk of partial separation between the two film layers is reduced, the conductivity between the ink module 100 and the device layer 200 is improved, and the effective control of the device layer 200 on the image display of the ink module 100 is realized.
It should be noted that, in the above embodiment, the size between the first vacancy 105 and the second vacancy 106 is the same as the size in the foregoing first aspect, including that the size of the first vacancy 105 is smaller than, equal to, or larger than the size of the second vacancy 106.
The inventor of the present application considers that moisture inevitably enters the ink module 100, and the metal wires in the ink module 100 for image display are oxidized due to the moisture, which affects the image display of the ink module 100. Moreover, due to the influence of moisture, the electrical contact between the ink module 100 and the device layer 200 may also be influenced, thereby influencing the control of the device layer 200 on the display screen. For this reason, the present application also provides the following possible implementation manners for electronic paper:
in the embodiment of the present application, the electronic paper further includes a second protective layer 900 and a sealant 601;
the second passivation layer 900 is located on a side of the conductive layer 103 of the ink module 100 away from the ink layer 102;
the sealant 601 is located at the outer edge of the ink module 100 and between the second passivation layer 900 and the device layer 200.
Specifically, as shown in fig. 4 to 6, the second passivation layer 900 is located on a side of the conductive layer 103 of the ink module 100 away from the ink layer 102 for blocking moisture to protect the display. It should be noted that the medium connecting the second passivation layer 900 and the ink module 100 is the optical adhesive layer 104, that is, one side of the optical adhesive layer 104 is necessarily connected to the second passivation layer 900, and the optical adhesive layer 104 is located on the side of the conductive layer 103 away from the ink layer 102. Therefore, the second protection layer 900 is also located on the side of the optical adhesive layer 104 away from the ink layer 102.
As shown in fig. 9, in order to better prevent moisture from entering the ink module 100, a seal adhesive 601 is disposed at an outer edge of the ink module 100 and is located between the second protection layer 900 and the device layer 200, and a certain sealed space is formed between the ink module 100 and the second protection layer 900 by using the seal adhesive 601 and the second protection layer 900 in a matching manner, so that moisture is further prevented from entering the ink module, the risk of influence of moisture on a display screen is reduced, and the conductivity of a product is improved.
Alternatively, when the first void 105 forms an opening at the edge of the ink layer 102, the sealant 601 in the above embodiment may also be implemented as follows:
the sealant 601 located at the opening of the first void 105 is in contact with at least one edge of the conductive tape 300 and the conductive layer 103.
Specifically, as shown in fig. 9 and 10, a first void 105 is formed at an edge of the ink layer 102, and a sealant located at an opening of the first void 105 is in contact with at least one edge of the conductive tape 300 and the conductive layer 103. The sealant 601 located at the opening of the first void 105 has the same function as the sealant in the above embodiment, and a closed space can be formed between the ink module 100 and the second protective layer 900, so that moisture is better prevented from entering the ink module 100, the risk of the moisture affecting the display screen is reduced, and the conductivity of the product is improved.
Based on the same inventive concept, the embodiment of the present application further provides a display device, including: any one of the ink module and the electronic paper provided in the foregoing embodiments.
The principles of the ink module 100 and the electronic paper adopted in the display device of this embodiment are the same as the principles of the ink module 100 and the electronic paper of any one of the foregoing embodiments, and are not described herein again. The display device manufactured by the ink module 100 and the electronic paper also has the advantages of stable conductivity, good display effect and high reliability.
Based on the same inventive concept, the embodiment of the present application provides a method for manufacturing an ink module 100, a schematic flow chart of the method is shown in fig. 12, and the method includes steps S1201-S1202:
s1201, cutting a second vacancy in the first protective layer in the non-display area of the ink module, extending the second vacancy to the edge of the first protective layer, and forming an opening at the edge of the first protective layer;
and S1202, removing the part of the ink layer corresponding to the second vacancy to form a first vacancy and expose part of the conductive layer.
Specifically, as shown in fig. 1 and fig. 2, when the ink module 100 is prepared by the preparation method in this embodiment, a laser cutting or laser cutting method is required to cut the second void 106 in the first protective layer 101 located in the non-display area 100b of the ink module 100, and an opening is formed at the edge of the first protective layer 101; portions of the ink layer 102 corresponding to the second voids 106 are removed by cleaning with alcohol or the like to form the second voids 106 and expose portions of the conductive layer 103.
In the preparation process of the ink module in the embodiment, the opening does not need to be cut in the ink module 100, so that the problem that part of the conductive layer 103 of the ink module 100 is badly cut in the opening process is avoided, the risk of poor products is reduced, the yield of the products is effectively improved, the cleaning process after opening and opening is omitted in the embodiment of the invention, the preparation process is simplified, and the used equipment and the human resources are saved.
Based on the same inventive concept, the embodiment of the application provides a method for preparing electronic paper, the flow schematic diagram of the method is shown in fig. 13, and the method comprises steps S1301-S1302:
s1301, placing a conductive tape in a space formed by the first void and the second void of the ink module provided in the first aspect, and making one side of the conductive tape electrically contact with a portion of the conductive layer;
s1302, the ink module with the conductive adhesive tape is combined with one side of the device layer, so that the other side of the conductive adhesive tape is in electrical contact with the device layer.
Specifically, in the preparation method of the embodiment, the conductive tape is required to be attached to the space formed by the first vacancy 105 and the second vacancy 106 of the ink module 100, and one side of the conductive tape 300 is in electrical contact with a part of the conductive layer 103; the ink module 100 with the conductive tape 300 placed thereon is aligned with one side of the device layer 200 in an alignment manner, so that the other side of the conductive tape 300 is in electrical contact with the device layer 200.
Through the preparation method in the embodiment, the electrical connection between the ink module 100 and the device layer 200 can be realized, and the surface contact between the ink module 100 and the device layer 200 is realized through the conductive adhesive tape 300, so that the risk of the interlayer part separation in the prior art is effectively reduced.
Optionally, an embodiment of the present application further provides another method for preparing electronic paper, a schematic flow diagram of the method is shown in fig. 14, and the method includes steps S1301-S1303:
s1401, placing a conductive adhesive tape in a space formed by a first vacancy and a second vacancy of the ink module provided by the first aspect, and making one side of the conductive adhesive tape electrically contact with a part of the conductive layer;
s1402, the ink module with the conductive adhesive tape is combined with one side of the device layer, so that the other side of the conductive adhesive tape is in electrical contact with the device layer.
And S1403, the second protective layer with the periphery coated with the sealant at one side is attached to one side of the conductive layer of the ink module, so that the sealant is positioned at the outer edge of the ink module and attached to the device layer.
Specifically, as shown in fig. 6 and 9, the sealant 105 is coated on the peripheral edge of one side of the second protective layer 900, and the second protective layer 900 is attached to the side of the ink module 100 to which the conductive tape 300 is attached, that is, the second protective layer 900 is attached to the side of the conductive layer 103 of the ink module 100. The area where the ink module is located is formed into a closed space by the sealant 105 and the second protection layer 900, so that moisture is prevented from entering the ink module 100 to the maximum extent, and the risk that the ink module 100 affects the display screen due to the moisture is reduced. Meanwhile, the sealant 105 is located at the outer edge of the ink module 100 and attached to the device layer 200, which means that the connection between the device layer 200 and the ink module 100 is sealed, so that moisture is prevented from entering the connection between the device layer 200 and the ink module 100, the conductivity between the device layer 200 and the ink module 100 is ensured, and the reliability of image display of a product is improved.
In addition, in order to realize the screen display and control of the ink module 100, the electronic paper display structure further includes a driving circuit 500 and a flexible circuit board 400. The driving circuit 500 is a driver for driving the ink module 100 to display, and the ink module 100 is electrically connected to the driving circuit 500 through the conductive tape 300; the flexible circuit board 400 is used to connect a system circuit board, and the pins of the driving circuit 500 correspond to the metal terminal pins of the flexible circuit board 400 one to one. The external control signal is connected to the flexible circuit board 400 through a corresponding interface, and the driving circuit 500 is controlled through the flexible circuit board 400 to respond to the external signal, thereby realizing the brightness and color control of the display screen.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. the conductive adhesive tape is arranged in a space formed by the first vacancy and the second vacancy of the ink module, and the conductive adhesive tape is in surface contact with part of the conductive layer of the ink module, so that compared with the prior art, the adhesive force between the film layers can be obviously increased, and the risks of film layer part separation and glue overflow of the ink module are effectively reduced;
2. the ink module is connected with other film layers through the conductive adhesive tape, so that the adhesion force between the film layers is increased, the conductivity between the film layers is improved, and the stability of the display device is improved;
3. because the conductive adhesive tape is not limited to the position of the silver hole, the conductive adhesive tape can be placed at the edge of the ink layer and the first protective layer on the premise of ensuring the conductive performance of the product, and the maximization of the picture is facilitated;
4. half-cutting of holes in the ink module is not needed, poor cutting of part of the conductive layer of the ink module in the hole-cutting process is avoided, and the product yield is effectively improved;
5. the cleaning process after opening and holing is omitted, the preparation process is simplified, and used equipment and human resources are saved.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. An ink module is characterized by comprising a first protective layer, an ink layer and a conductive layer which are sequentially stacked;
in a non-display area of the ink module, the ink layer is provided with a first vacancy, and at least part of the conductive layer is exposed at the first vacancy;
the first protective layer has a second vacancy matching the first vacancy;
the space formed by the first vacancy and the second vacancy is used for accommodating a conductive adhesive tape, so that one side of the conductive adhesive tape can be in electrical contact with part of the conductive layer.
2. The ink set of claim 1, wherein the first void extends toward an edge of the ink layer and forms an opening at the edge of the ink layer.
3. The ink set as claimed in claim 1 or 2, wherein the ink set further comprises an optical glue layer; the optical adhesive layer is positioned on one side of the conductive layer, which is far away from the ink layer.
4. An electronic paper, comprising: a device layer, a conductive tape, and the ink set of any one of claims 1-3;
the device layer is positioned on one side, away from the conductive layer, of the first protective layer of the ink module;
the conductive adhesive tape is arranged in a space formed by the first vacancy and the second vacancy of the ink module, one side of the conductive adhesive tape is in contact with part of the conductive layer of the ink module, and the other side of the conductive adhesive tape is in electrical contact with the device layer.
5. The electronic paper according to claim 4, further comprising: a second protective layer and a sealant;
the second protective layer is positioned on one side, away from the ink layer, of the conductive layer of the ink module;
the sealant is positioned at the outer edge of the ink module and between the second protective layer and the device layer.
6. The electronic paper of claim 5, wherein the sealant at the opening of the first void contacts an edge of at least one of the conductive tape and the conductive layer.
7. A display device, comprising: the ink set of any one of claims 1-3; or, the electronic paper of any of claims 4-6.
8. The preparation method of the ink module comprises a first protective layer, an ink layer and a conductive layer which are sequentially stacked, and is characterized by comprising the following steps of:
cutting a second vacancy out of the first protective layer in the non-display area of the ink module, enabling the second vacancy to extend to the edge of the first protective layer, and forming an opening at the edge of the first protective layer;
and removing the part of the ink layer corresponding to the second vacancy to form a first vacancy and expose part of the conductive layer.
9. A preparation method of electronic paper is characterized by comprising the following steps:
placing a conductive tape in a space formed by the first and second openings of the ink set according to any one of claims 1 to 3, and making one side of the conductive tape in electrical contact with a portion of the conductive layer;
and closing the ink module with the conductive adhesive tape to one side of a device layer so as to enable the other side of the conductive adhesive tape to be in electrical contact with the device layer.
10. The method for preparing a device layer according to claim 9, wherein after the step of aligning the ink module with the conductive tape, the method further comprises:
and attaching the second protective layer with the periphery coated with the sealant on one side to one side of the conductive layer of the ink module, so that the sealant is positioned on the outer edge of the ink module and attached to the device layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011187885.2A CN112213896A (en) | 2020-10-29 | 2020-10-29 | Ink module, preparation method thereof, electronic paper and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011187885.2A CN112213896A (en) | 2020-10-29 | 2020-10-29 | Ink module, preparation method thereof, electronic paper and display device |
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| CN112213896A true CN112213896A (en) | 2021-01-12 |
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