CN110333636A - A kind of electronic paper display mould group and preparation method thereof, display device of electronic paper - Google Patents
A kind of electronic paper display mould group and preparation method thereof, display device of electronic paper Download PDFInfo
- Publication number
- CN110333636A CN110333636A CN201910383840.3A CN201910383840A CN110333636A CN 110333636 A CN110333636 A CN 110333636A CN 201910383840 A CN201910383840 A CN 201910383840A CN 110333636 A CN110333636 A CN 110333636A
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- Prior art keywords
- layer
- inks
- array substrate
- electronic paper
- conducting resinl
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000000976 ink Substances 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000010410 layer Substances 0.000 claims description 148
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 13
- 238000005520 cutting process Methods 0.000 abstract description 8
- 238000010079 rubber tapping Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1676—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1676—Electrodes
- G02F1/16766—Electrodes for active matrices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1685—Operation of cells; Circuit arrangements affecting the entire cell
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The present invention relates to field of display technology, a kind of electronic paper display mould group and preparation method thereof, display device of electronic paper are disclosed, which includes: array substrate, and array substrate includes pixel circuit and common signal line；The e-inks layer of pixel circuit side is provided with set on array substrate；Deviate from the transparent cover plate of array substrate side set on e-inks layer, transparent cover plate is equipped with common electrode layer towards the side of e-inks layer；One end of conducting resinl set on the side of e-inks layer, conducting resinl is electrically connected with common electrode layer, and the other end is electrically connected with common signal line.In the electronic paper display mould group, common electrode layer is arranged on transparent cover plate, conducting resinl is located at e-inks layer side and is electrically connected common electrode layer with common signal line, without the aperture in e-inks layer, it avoids bad to common electrode layer generation cutting in Tapping procedures, the bad risk of product is reduced, product yield is improved, is conducive to the preparation process for simplifying electronic paper display mould group.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of electronic paper display mould group and preparation method thereof, Electronic Paper
Display device.
Background technique
Electronic Paper is a kind of ultra-thin, ultralight display screen, wherein the structure of current some Electronic Papers is mainly TFT glass
Layer, FPL (e-inks lamella) and transparent protective layer are driven, as shown in Figure 1, and needing in E-paper structure by FPL layers at present
Via hole is partly cut out, drives the driving circuit in layer to be connected to TFT glass the ITO in FPL by conducting resinl to realize, still,
General using laser cutting when cutting through hole for FPL layers, the ITO layer being easy to happen in FPL in process of production, which is crossed, cuts bad, appearance
Easily lead to product yield reduction.
Summary of the invention
The invention discloses a kind of electronic paper display mould group and preparation method thereof, display device of electronic paper, the Electronic Paper is aobvious
Show that transparent cover plate is arranged in towards the surface of e-inks layer in mould group, common electrode layer, e-inks layer is arranged in conducting resinl
Common electrode layer is electrically connected by side with common signal line, is not necessarily to the aperture in e-inks layer, is avoided in Tapping procedures to public affairs
Common electrode layer generation cutting is bad, reduces the bad risk of product, effectively improves product yield, and is conducive to simplify electronic paper display
The preparation process of mould group.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of electronic paper display mould group, comprising:
Array substrate, the array substrate include pixel circuit and the common signal for loading public voltage signal
Line；
The e-inks layer of pixel circuit side is provided with set on the array substrate；
Deviate from the transparent cover plate of the array substrate side set on the e-inks layer, the transparent cover plate is described in
The side of e-inks layer is equipped with common electrode layer；
Conducting resinl set on the side of the e-inks layer, one end of the conducting resinl are electrically connected with the common electrode layer
It connects, the other end is electrically connected with the common signal line.
In above-mentioned electronic paper display mould group, array substrate be equipped with pixel circuit and common signal line, common signal line with
Pixel circuit mutually insulated, common signal line are equipped with the side of pixel circuit for loading public voltage signal, in array substrate
It is provided with e-inks layer, and is equipped with transparent cover plate away from the side of array substrate in e-inks layer, wherein transparent cover plate
On the surface of the side of e-inks layer is provided with common electrode layer, wherein the side of transparent cover plate and array substrate is visited
E-inks layer out, i.e., the side between transparent cover plate and array substrate and positioned at e-inks layer has gap, in electronics
Conducting resinl is arranged in the side of ink layer, and conducting resinl one end is electrically connected with the public electrode on transparent cover plate, the other end and public letter
Number line electrical connection, that is, common electrode layer realized with common signal line by the conducting resinl in e-inks layer side and be electrically connected, phase
Than being arranged on e-inks layer in prior art common electrode layer, and need the aperture filling conducting resinl electricity in e-inks layer
Common electrode layer and common signal line are connected, the side of e-inks layer is arranged in the conducting resinl in the present invention, so that it may will be public
Common electrode layer is electrically connected with common signal line, is not necessarily to the aperture in e-inks layer, is avoided in Tapping procedures to common electrode layer
It is bad to generate cutting, reduces the bad risk of product, effectively improves product yield, and the electronic paper display mould group in the present invention is being made
For the cleaning process not needed after then eliminating aperture and aperture in half cut-out hole of e-inks layer in the process, simplify
Preparation process is saved using equipment and human resources.
Therefore, transparent cover plate is arranged in towards the surface of e-inks layer in above-mentioned electronic paper display mould group, common electrode layer,
Common electrode layer is electrically connected by the side that e-inks layer is arranged in conducting resinl with common signal line, without in e-inks layer
Aperture, avoid in Tapping procedures to common electrode layer generate cutting it is bad, reduce the bad risk of product, it is good to effectively improve product
Rate, and be conducive to simplify the preparation process of electronic paper display mould group.
Preferably, the conducting resinl includes at least two conductive adhesive tapes, and at least two conductive adhesive tape is along the electronics
The extending direction of ink layer a side is spaced apart.
Preferably, the e-inks layer includes multiple ink micro-cups in array distribution, in each ink micro-cup
Including the mutually different ink particle of multiple color.
Preferably, the e-inks layer is equipped with the first adhesive layer, and the electronics towards the side of the array substrate
Sealant is equipped between ink layer and first adhesive layer；The side of e-inks layer towards the transparent cover plate is equipped with
Second adhesive layer.
Preferably, the drive being electrically connected with the pixel circuit and the common signal line is additionally provided in the array substrate
Dynamic chip, the driving chip and the conducting resinl are located at the opposite two sides of the e-inks layer.
Preferably, the envelope for encapsulating the e-inks layer is formed between the array substrate and the transparent cover plate
Tankage, the encapsulation slot is interior to be equipped with packaging plastic, wherein the conducting resinl is set in the encapsulation slot, and the conducting resinl is located at
The packaging plastic is towards the side of the e-inks layer.
The present invention also provides a kind of display device of electronic paper, any one electronics provided including such as above-mentioned technical proposal
Paper display module.
Based on identical inventive concept, the present invention also provides a kind of preparation methods of electronic paper display mould group, comprising:
Array basal plate is provided, the array substrate includes pixel circuit and for loading the public of public voltage signal
Signal wire；
E-inks layer is attached in the side that the array substrate is equipped with pixel circuit；
Transparent cover plate is attached away from the side of the array substrate in the e-inks layer, the transparent cover plate is towards institute
The side for stating e-inks layer is equipped with common electrode layer；
Conducting resinl is injected between the transparent cover plate and the array substrate, the conducting resinl is located at e-inks layer
Side, and one end of the conducting resinl is electrically connected with the common electrode layer, the other end is electrically connected with the common signal line.
Preferably, before the transparent cover plate being attached on the e-inks layer, using evaporation coating method described
The side of bright cover board forms the common electrode layer.
Preferably, the preparation method further include: between the transparent protective layer and array substrate inject conducting resinl it
Afterwards, packaging plastic is coated in the side of the transparent cover plate and array substrate, and the packaging plastic extends partially into the transparent guarantor
In gap between sheath and array substrate.
Detailed description of the invention
Fig. 1 to Fig. 4 is that the layer in a kind of electronic paper display mould group preparation process provided in an embodiment of the present invention becomes
Change schematic diagram；
Fig. 5 be Fig. 4 in electronic paper display mould group along A to structural schematic diagram；
Fig. 6 is the schematic top plan view of the electronic paper display mould group in 4；
Fig. 7 is a kind of schematic diagram of the setting of electronic paper display mould group conducting resinl provided in an embodiment of the present invention；
Fig. 8 is the schematic top plan view of the electronic paper display mould group in Fig. 7；
Fig. 9 is a kind of preparation flow schematic diagram of electronic paper display mould group provided in an embodiment of the present invention；
Icon: 1- array substrate；2- e-inks layer；3- transparent cover plate；4- conducting resinl；The first adhesive layer of 5-；6- second
Adhesive layer；7- driving chip；21- ink micro-cup；31- common electrode layer；41- conductive adhesive tape.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 4, wherein Fig. 4 is a kind of structural schematic diagram of electronic paper display mould group provided in an embodiment of the present invention,
The embodiment of the invention provides a kind of electronic paper display mould groups, comprising: array substrate 1, array substrate 1 include pixel circuit and
For loading the common signal line of public voltage signal；The e-inks layer of pixel circuit side is provided with set on array substrate 1
2；Deviate from the transparent cover plate 3 of 1 side of array substrate set on e-inks layer 2, transparent cover plate 3 is towards the side of e-inks layer 2
Equipped with common electrode layer 31；Conducting resinl 4 set on the side of e-inks layer 2,31 electricity of one end and common electrode layer of conducting resinl 4
Connection, the other end are electrically connected with common signal line.
In above-mentioned electronic paper display mould group, array substrate 1 be equipped with pixel circuit and common signal line, common signal line with
Pixel circuit mutually insulated, common signal line are equipped with the side of pixel circuit for loading public voltage signal, in array substrate 1
It is provided with e-inks layer 2, and is equipped with transparent cover plate 3 away from the side of array substrate 1 in e-inks layer 2, wherein is transparent
The surface of the side of e-inks layer 2 is provided with common electrode layer 31 on cover board 3, wherein transparent cover plate 3 and array substrate 1
Side lean out e-inks layer 2, i.e., between transparent cover plate 3 and array substrate 1 and be located at e-inks layer 2 side have
There is gap, conducting resinl 4 is set in the side of e-inks layer 2,4 one end of conducting resinl is electrically connected with the public electrode on transparent cover plate 3
It connects, the other end is electrically connected with common signal line, that is, common electrode layer 31 passes through the conducting resinl 4 and public affairs in 2 side of e-inks layer
Signal wire realizes electrical connection altogether, and common electrode layer 31 is arranged on e-inks layer 2 compared with the prior art, and needs in electronics
Aperture filling conducting resinl 4 is electrically connected common electrode layer 31 and common signal line, the conducting resinl in the embodiment of the present invention in ink layer 2
4 are arranged in the side of e-inks layer 2, so that it may be electrically connected common electrode layer 31 with common signal line, without in electronics oil
Aperture in layer of ink 2, avoid in Tapping procedures to common electrode layer 31 generate cutting it is bad, reduce the bad risk of product, effectively mention
High product yield, and the electronic paper display mould group in the embodiment of the present invention is not needed during the preparation process in e-inks layer 2 half
Cut-out hole then eliminates the cleaning process after aperture and aperture, simplifies preparation process, save using equipment and people
Power resource.
Therefore, transparent cover plate 3 is arranged in towards e-inks layer 2 in above-mentioned electronic paper display mould group, common electrode layer 31
Common electrode layer 31 is electrically connected by surface, the side that e-inks layer 2 is arranged in conducting resinl 4 with common signal line, without in electricity
Aperture in seed oil layer of ink 2, avoid in Tapping procedures to common electrode layer 31 generate cutting it is bad, reduce the bad risk of product, have
Effect improves product yield, and is conducive to simplify the preparation process of electronic paper display mould group.
In above-mentioned electronic paper display mould group, about conducting resinl 4 specific structure be arranged, wherein conducting resinl 4 may include to
Few two conductive adhesive tapes 41, at least two conductive adhesive tape 41 are spaced apart along the extending direction of 2 a side of e-inks layer.Tool
Body, as shown in Fig. 4, Fig. 5 and Fig. 6, conducting resinl 4, which can be set, can be set to two a sides along e-inks layer 2
The conductive adhesive tape 41 of extending direction arrangement, one end of each conductive adhesive tape 41 are electrically connected with common electrode layer 31, the other end and public affairs
Signal wire electrical connection altogether；It wherein, as shown in Figure 7 and Figure 8, can also be in electronics oil as another set-up mode of conducting resinl
Two conductive adhesive tapes 41 are respectively set in two sides in the side of layer of ink 2, make connectivity between common electrode layer and common signal line
More preferably, more stable；Wherein, it should be noted that when conductive adhesive tape is respectively set in the two sides in 2 side of e-inks layer, if
The two sides for setting conductive adhesive tape can be adjacent two sides and be also possible to opposite two sides, and the present embodiment, which is not done, to be limited to.
It should also be noted that, conducting resinl can also be respectively set in three sides or every side in 2 side of e-inks layer
Item can according to actual needs be arranged conductive adhesive tape, and the present embodiment, which is not done, to be limited to；In addition, public in array substrate 1
Signal wire can cooperate conductive adhesive tape 41 to be arranged as the case may be, can load public voltage signal to common electrode layer 31 and be
Can, the present embodiment, which is not done, to be limited to.
Specifically, the conducting resinl 4 in above-mentioned electronic paper display mould group is elargol.
Specifically, e-inks layer 2 includes multiple ink micro-cups 21 in array distribution, includes in each ink micro-cup 21
The mutually different ink particle of multiple color.The ink particle of different colours in each ink micro-cup 21 can be according to being applied to
Pressure difference between corresponding common electrode layer 31 and pixel circuit does corresponding movement, wherein right in each ink micro-cup 21
In the pixel circuit and common electrode layer 31 answered, the voltage that pixel circuit provides is known as pixel voltage, and common electrode layer 31 provides
Voltage be common voltage, the driving of ink micro-cup 21 is to drive ink by the voltage difference of pixel voltage and common voltage
Movement, the ink of different pixel voltage control different colours, thus the picture indicated a need for.
Specifically, as shown in figure 4, e-inks layer 2 is equipped with the first adhesive layer 5, and ink towards the side of array substrate 1
Sealant is equipped between layer and the first adhesive layer 5；Ink layer is equipped with the second adhesive layer 6 towards the side of transparent cover plate 3.Electronics oil
It is bonded between layer of ink 2 and array substrate 1 by the first adhesive layer 5, and passes through second between e-inks layer 2 and transparent cover plate 3
Adhesive layer 6 bonds, and connection type is simple and the connection of composite and flexible display device, and solid and reliable.
Specifically, as shown in Figure 4 and Figure 6, it is additionally provided in array substrate 1 and is electrically connected with pixel circuit and common signal line
Driving chip 7, driving chip 7 and conducting resinl 4 can be located to the opposite two sides of e-inks layer 2, convenient for conduction
The setting of glue 4, and dirt can be caused to driving chip and the circuit connecting with driving chip to avoid when conducting resinl 4 is arranged
Dye.
It should be noted that conducting resinl 4 also can be set in any side of e-inks layer 2, distinguish with driving chip
The not ipsilateral of e-inks layer 2 is set, or the same side of e-inks layer 2 is set with driving chip, the present embodiment is not
It does and limits to.
Specifically, it is formed with the encapsulation slot for encapsulating e-inks layer 2 between array substrate 1 and transparent cover plate 3, encapsulates
Packaging plastic is equipped in slot, wherein conducting resinl 4 is set in encapsulation slot, and conducting resinl 4 is located at packaging plastic towards e-inks layer 2
E-inks layer 2 is encapsulated between array substrate 1 and transparent cover plate 3 by side, packaging plastic, and directly setting is led in encapsulation slot
Electric glue 4, convenient for setting.
The embodiment of the invention also provides a kind of display device of electronic paper, any one including providing in such as above-described embodiment
Kind electronic paper display mould group.
Based on identical inventive concept, as shown in Figure 1 to Figure 4 and shown in Fig. 9, the embodiment of the invention also provides a kind of electronics
The preparation method of paper display module, comprising:
Step S101, provides array basal plate 1, and array substrate 1 includes pixel circuit and believes for loading common voltage
Number common signal line；
Step S102 attaches e-inks layer 2 in the side that array substrate 1 is equipped with pixel circuit；
Step S103 attaches transparent cover plate 3,3 direction of transparent cover plate away from the side of array substrate 1 in e-inks layer 2
The side of e-inks layer 2 is equipped with common electrode layer 31；
Step S104, injects conducting resinl 4 between transparent cover plate 3 and array substrate 1, and conducting resinl 4 is located at e-inks layer 2
Side, and one end of conducting resinl 4 is electrically connected with common electrode layer 31, and the other end is electrically connected with common signal line.
Electronic paper display mould group is prepared using above-mentioned preparation method, conducting resinl 4 is arranged in the side of e-inks layer 2,
Common electrode layer 31 can be electrically connected with common signal line, be not necessarily to the aperture in e-inks layer 2, avoid in Tapping procedures
It is bad to the generation cutting of common electrode layer 31, the bad risk of product is reduced, effectively improves product yield, and in the embodiment of the present invention
Electronic paper display mould group do not need then to eliminate aperture and aperture in 2 half cut-out hole of e-inks layer during the preparation process
Later cleaning process, simplifies preparation process, saves using equipment and human resources.
Specifically, before transparent cover plate 3 being attached on e-inks layer 2, using evaporation coating method the one of transparent cover plate 3
Side forms common electrode layer 31.
Specifically, preparation method further include: injected after conducting resinl 4 between transparent protective layer and array substrate 1, saturating
The side of bright cover board 3 and array substrate 1 coats packaging plastic, and packaging plastic extend partially into transparent protective layer and array substrate 1 it
Between gap in.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of electronic paper display mould group characterized by comprising
Array substrate, the array substrate include pixel circuit and the common signal line for loading public voltage signal；
The e-inks layer of pixel circuit side is provided with set on the array substrate；
Deviate from the transparent cover plate of the array substrate side set on the e-inks layer, the transparent cover plate is towards the electronics
The side of ink layer is equipped with common electrode layer；
Conducting resinl set on the side of the e-inks layer, one end of the conducting resinl are electrically connected with the common electrode layer,
The other end is electrically connected with the common signal line.
2. electronic paper display mould group according to claim 1, which is characterized in that the conducting resinl includes at least two conductive
Adhesive tape, at least two conductive adhesive tape are spaced apart along the extending direction of described e-inks layer a side.
3. electronic paper display mould group according to claim 1, which is characterized in that the e-inks layer includes in array point
Multiple ink micro-cups of cloth include the mutually different ink particle of multiple color in each ink micro-cup.
4. electronic paper display mould group according to claim 3, which is characterized in that the e-inks layer is towards the array
The side of substrate is equipped with the first adhesive layer, and sealant is equipped between the e-inks layer and first adhesive layer；It is described
E-inks layer is equipped with the second adhesive layer towards the side of the transparent cover plate.
5. electronic paper display mould group according to claim 1, which is characterized in that be additionally provided in the array substrate with it is described
Pixel circuit and the driving chip of common signal line electrical connection, the driving chip and the conducting resinl are located at institute
State the opposite two sides of e-inks layer.
6. electronic paper display mould group according to claim 1-5, which is characterized in that the array substrate with it is described
It is formed with the encapsulation slot for encapsulating the e-inks layer between transparent cover plate, is equipped with packaging plastic in the encapsulation slot, wherein
The conducting resinl is set in the encapsulation slot, and the conducting resinl is located at the packaging plastic towards the one of the e-inks layer
Side.
7. a kind of display device of electronic paper, which is characterized in that including electronic paper display mould as claimed in any one of claims 1 to 6
Group.
8. a kind of preparation method of such as described in any item electronic paper display mould groups of claim 1-7 characterized by comprising
Array basal plate is provided, the array substrate includes pixel circuit and the common signal for loading public voltage signal
Line；
E-inks layer is attached in the side that the array substrate is equipped with pixel circuit；
Transparent cover plate is attached away from the side of the array substrate in the e-inks layer, the transparent cover plate is towards the electricity
The side of seed oil layer of ink is equipped with common electrode layer；
Conducting resinl is injected between the transparent cover plate and the array substrate, the conducting resinl is located at the week of e-inks layer
Side, and one end of the conducting resinl is electrically connected with the common electrode layer, the other end is electrically connected with the common signal line.
9. preparation method according to claim 8, which is characterized in that the transparent cover plate is attached to the e-inks
Before on layer, the common electrode layer is formed in the side of the transparent cover plate using evaporation coating method.
10. preparation method according to claim 8, which is characterized in that further include: in the transparent protective layer and array base
It is injected after conducting resinl between plate, coats packaging plastic, and the packaging plastic portion in the side of the transparent cover plate and array substrate
Divide and extends into the gap between the transparent protective layer and array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910383840.3A CN110333636A (en) | 2019-05-09 | 2019-05-09 | A kind of electronic paper display mould group and preparation method thereof, display device of electronic paper |
Applications Claiming Priority (1)
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| CN112213896A (en) * | 2020-10-29 | 2021-01-12 | 京东方科技集团股份有限公司 | Ink module, preparation method thereof, electronic paper and display device |
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