CN113568237A - Electronic paper module and process - Google Patents
Electronic paper module and process Download PDFInfo
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- CN113568237A CN113568237A CN202110904946.0A CN202110904946A CN113568237A CN 113568237 A CN113568237 A CN 113568237A CN 202110904946 A CN202110904946 A CN 202110904946A CN 113568237 A CN113568237 A CN 113568237A
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- electronic paper
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 74
- 239000002184 metal Substances 0.000 claims abstract description 74
- 238000005520 cutting process Methods 0.000 claims abstract description 48
- 230000005611 electricity Effects 0.000 claims abstract 4
- 239000010410 layer Substances 0.000 claims description 198
- 239000012790 adhesive layer Substances 0.000 claims description 33
- 239000011241 protective layer Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 13
- 238000003860 storage Methods 0.000 abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052709 silver Inorganic materials 0.000 abstract description 10
- 239000004332 silver Substances 0.000 abstract description 10
- 238000010030 laminating Methods 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005441 aurora Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000003698 laser cutting Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1676—Electrodes
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides an electronic paper module and a process, and relates to the technical field of electronic paper. The utility model provides an electronic paper module, includes leading board, FPC circuit board and driver IC, and leading board includes TFT conductive metal layer, ITO conducting layer and electron paper layer, and electron paper layer is located between TFT conductive metal layer and the ITO conducting layer, and the spread groove has been seted up to electron paper layer's edge, and the FPC circuit board stretches into in the spread groove, and TFT conductive metal layer and ITO conducting layer are connected with the FPC circuit board electricity respectively, and the FPC circuit board is connected with driver IC electricity. The connecting groove is formed in the edge of the electronic paper, so that the electronic paper can be conveniently cleaned after being cut, the electronic paper is clean and cleaner, the yield of cutting is improved, and the reliability of products is guaranteed. Adopt the FPC circuit board to bind and connect electronic paper, need not advance some good silver thick liquid before the laminating of electronic paper, the FPC circuit board connection storage time extension after switching on can prepare material in advance to the productivity has been promoted greatly.
Description
Technical Field
The invention relates to the technical field of electronic paper, in particular to an electronic paper module and a process.
Background
The existing electronic paper module adopts a through hole silver paste conduction mode, a through hole needs to be subjected to laser half-cutting on the ITO film, the existing through hole is conducted, the silver paste is well advanced to conduct a com electrode before the lamination, the storage time after the silver paste is pointed is extremely short (calculated in minutes), the product is not facilitated to be prepared in advance, and the productivity is greatly influenced.
Disclosure of Invention
The invention aims to provide an electronic paper module which can improve storage time, prepare materials in advance and improve productivity.
Another objective of the present invention is to provide an electronic paper module process, which can improve storage time, thereby preparing materials in advance and improving productivity.
The embodiment of the invention is realized by the following steps:
in a first aspect, an embodiment of the present application provides an electronic paper module, which includes a front board, an FPC board, and a driver IC, where the front board includes a TFT conductive metal layer, an ITO conductive layer, and an electronic paper layer, the electronic paper layer is located between the TFT conductive metal layer and the ITO conductive layer, a connection groove is formed in an edge of the electronic paper layer, the FPC board extends into the connection groove, the TFT conductive metal layer and the ITO conductive layer are respectively electrically connected to the FPC board, and the FPC board is electrically connected to the driver IC.
In some embodiments of the present invention, the driving IC is electrically connected to the TFT conductive metal layer.
In some embodiments of the present invention, a first conductive adhesive layer is disposed between the FPC board and the TFT conductive metal layer, and a second conductive adhesive layer is disposed between the FPC board and the ITO conductive layer.
In some embodiments of the present invention, a PET layer is disposed on a side of the ITO conductive layer away from the electronic paper layer.
In some embodiments of the present invention, a protective layer is disposed on a side of the PET layer away from the ITO conductive layer.
In some embodiments of the present invention, the connecting groove has a rectangular structure.
In some embodiments of the present invention, a bonding pin is disposed on the FPC board, and the driver IC is electrically connected to the bonding pin.
In a second aspect, an embodiment of the present application provides an electronic paper module process, including the following steps:
cutting the edge of the electronic paper layer to obtain a connecting groove;
respectively attaching the TFT conductive metal layer and the ITO conductive layer to two sides of the electronic paper layer to obtain a front panel with connecting grooves;
extending the FPC circuit board into the connecting groove to electrically connect the FPC circuit board with the TFT conductive metal layer and simultaneously electrically connect the FPC circuit board with the ITO conductive layer;
and electrically connecting the FPC board with the drive IC.
In some embodiments of the present invention, after the step of cutting the edge of the electronic paper layer to obtain the connection groove, the step of respectively attaching the TFT conductive metal layer and the ITO conductive layer to both sides of the electronic paper layer to obtain the front panel having the connection groove further includes the following steps before the step of:
and removing residues in the connecting groove.
In some embodiments of the present invention, the step of electrically connecting the FPC board to the TFT conductive metal layer and the ITO conductive layer simultaneously comprises the steps of:
a first conductive adhesive layer is arranged between the TFT conductive metal layer and the FPC circuit board, and the first conductive adhesive layer is positioned in a contact area of the TFT conductive metal layer and the FPC circuit board;
and a second conductive adhesive layer is arranged between the ITO conductive layer and the FPC circuit board and is positioned in a contact area of the ITO conductive layer and the FPC circuit board.
Compared with the prior art, the embodiment of the invention has at least the following advantages or beneficial effects:
the embodiment of the invention provides an electronic paper module, which comprises a front board, an FPC (flexible printed circuit) board and a drive IC (integrated circuit), wherein the front board comprises a TFT (thin film transistor) conductive metal layer, an ITO (indium tin oxide) conductive layer and an electronic paper layer, the electronic paper layer is positioned between the TFT conductive metal layer and the ITO conductive layer, the edge of the electronic paper layer is provided with a connecting groove, the FPC board extends into the connecting groove, the TFT conductive metal layer and the ITO conductive layer are respectively and electrically connected with the FPC board, and the FPC board is electrically connected with the drive IC. The electronic paper layer is connected with the TFT conductive metal layer through an adhesive, and the TFT conductive metal layer is arranged on the TFT glass substrate. The connecting groove is obtained by cutting along the edge of the electronic paper layer close to the FPC circuit board to be used as a com electrode. And cutting by adopting an aurora device. The FPC board is electrically connected with the driving IC through a lead on the TFT conductive metal layer. The FPC circuit board is inserted into the connecting groove and is bound and conducted, so that the FPC circuit board is respectively connected with the TFT conductive metal layer and the ITO conductive layer, the com electrode is conducted to the drive IC through the FPC circuit board, and circuit conduction is achieved. The connecting groove is formed in the edge of the electronic paper, the size of the connecting groove is larger than that of the through hole, and meanwhile, the connecting groove is located in the edge, so that cleaning can be conveniently conducted after cutting, the cleaning is cleaner, the yield of cutting is improved, and the reliability of products is guaranteed. Adopt the FPC circuit board to bind and connect electronic paper, need not advance the good silver thick liquid of point before the laminating of electronic paper, FPC circuit board connection conduction after the save time extension (calculate with the day), can prepare material in advance to the productivity has been promoted greatly.
Therefore, the invention provides an electronic paper module which can improve the storage time, so that the materials can be prepared in advance, and the productivity is improved.
The embodiment of the invention provides an electronic paper module process, which comprises the following steps: the method comprises the following steps: cutting the edge of the electronic paper layer to obtain a connecting groove; the cutting adopts a laser cutting process, the cutting is inwards performed along the edge of the electronic paper layer close to the FPC circuit board, during the cutting, the cutting track of the aurora device is a linear track, compared with a circular track, the linear track is more stable, the ITO conductive layer is not easily damaged by mistake during the laser cutting to be cut off or semi-cut off, and therefore the yield can be improved; thereby improve product reliability, the straight line orbit is fast more than circular simultaneously, consequently, can also promote cutting efficiency. Respectively attaching the TFT conductive metal layer and the ITO conductive layer to two sides of the electronic paper layer to obtain a front panel with connecting grooves; the TFT conductive metal layer is connected with the electronic paper layer through adhesive. The TFT conductive metal layer is arranged on the TFT glass substrate, a PET layer is arranged on one side, far away from the electronic paper layer, of the ITO conductive layer, and a protective layer is arranged on one side, far away from the ITO conductive layer, of the PET layer. And (3) extending the FPC circuit board into the connecting groove to electrically connect the FPC circuit board with the TFT conductive metal layer and simultaneously electrically connect the FPC circuit board with the ITO conductive layer. In this embodiment, the FPC board is a FOG FPC board, and the FPC board is partially extended, and the extended portion is inserted into the connecting groove. And electrically connecting the FPC board with the drive IC. The FPC board is connected with the driving IC through a lead on the TFT conductive metal layer. The connecting groove is formed in the edge of the electronic paper, the size of the connecting groove is larger than that of the through hole, and meanwhile, the connecting groove is located in the edge, so that cleaning can be conveniently conducted after cutting, the cleaning is cleaner, the yield of cutting is improved, and the reliability of products is guaranteed. Adopt the FPC circuit board to bind and connect electronic paper, need not advance the good silver thick liquid of point before the laminating of electronic paper, FPC circuit board connection conduction after the save time extension (calculate with the day), can prepare material in advance to the productivity has been promoted greatly.
Therefore, the invention provides an electronic paper module process which can improve storage time, prepare materials in advance and improve productivity.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the invention;
FIG. 2 is a schematic diagram of an electronic paper module according to an embodiment of the present disclosure;
fig. 3 is a process flow diagram of an electronic paper module according to an embodiment of the invention.
Icon: 1-TFT glass substrate; 2-a TFT conductive metal layer; 3-an adhesive layer; 4-an electronic paper layer; 5-an ITO conductive layer; 6-PET layer; 7-a protective layer; 8-a second conductive adhesive layer; 9-a first conductive adhesive layer; 10-a drive IC; 11-FPC wiring board; 12-connecting groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are usually placed in when used, the orientations or positional relationships are only used for convenience of describing the present invention and simplifying the description, but the terms do not indicate or imply that the devices or elements indicated must have specific orientations, be constructed in specific orientations, and operate, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not require that the components be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, "a plurality" represents at least 2.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example 1
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the present disclosure, and fig. 2 is a schematic connection diagram of an electronic paper module according to an embodiment of the present disclosure. The embodiment provides an electronic paper module, which comprises a front panel, an FPC board 11 and a driver IC10, wherein the front panel comprises a TFT conductive metal layer 2, an ITO conductive layer 5 and an electronic paper layer 4, the electronic paper layer 4 is located between the TFT conductive metal layer 2 and the ITO conductive layer 5, a connecting groove 12 is formed in the edge of the electronic paper layer 4, the FPC board 11 extends into the connecting groove 12, the TFT conductive metal layer 2 and the ITO conductive layer 5 are respectively electrically connected with the FPC board 11, and the FPC board 11 is electrically connected with the driver IC 10.
In this embodiment, the electronic paper layer 4 and the TFT conductive metal layer 2 are connected by an adhesive layer 3, and the TFT conductive metal layer 2 is disposed on the TFT glass substrate 1. The connecting groove 12 is cut along the edge of the electronic paper layer 4 close to the FPC board 11 to serve as a com electrode. In this embodiment, the cutting is performed using an aurora device. The FPC board 11 is electrically connected to the driver IC10 through a lead wire on the TFT conductive metal layer 2. The FPC board 11 is inserted into the connecting groove 12, and the FPC board 11 is bonded and conducted, so that the FPC board 11 is connected to the TFT conductive metal layer 2 and the ITO conductive layer 5, respectively, and the FPC board 11 conducts the com electrode to the driver IC10, thereby realizing circuit conduction. Through seting up spread groove 12 in the edge of electronic paper, the size of spread groove 12 is big than the size of through-hole, simultaneously, the edge that is located of spread groove 12 for can be very convenient after the cutting clean, clean cleaner, thereby improve the yields of cutting, guaranteed the reliability of product. Adopt FPC circuit board 11 to bind and connect electronic paper, need not advance before the laminating of electronic paper and click good silver thick liquid, FPC circuit board 11 connects storage time extension (in days) after switching on, can prepare material in advance to the productivity has been promoted greatly.
Example 2
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the present disclosure, and fig. 2 is a schematic connection diagram of an electronic paper module according to an embodiment of the present disclosure. This embodiment provides an electronic paper module, which is substantially the same as embodiment 1, and the main differences between them are: the driver IC10 is electrically connected to the TFT conductive metal layer 2. In this embodiment, the driving IC10 is connected through the conductive wire of the TFT conductive metal layer 2, so that the com electrode is conducted to the driving IC10, thereby achieving the double-insurance function and enhancing the conduction reliability.
Example 3
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the invention. This embodiment provides an electronic paper module, which is substantially the same as embodiment 1, and the main differences between them are: a first conductive adhesive layer 9 is disposed between the FPC board 11 and the TFT conductive metal layer 2, and a second conductive adhesive layer 8 is disposed between the FPC board 11 and the ITO conductive layer 5.
In this embodiment, the first conductive adhesive layer 9 is located in a region where the TFT conductive metal layer 2 contacts the FPC board 11, and the second conductive adhesive layer 8 is located in a region where the ITO conductive layer 5 contacts the FPC board 11. The first conductive adhesive layer 9 and the second conductive adhesive layer 8 both use anisotropic conductive adhesive to achieve conduction in the vertical direction, so that the electrical connection between the FPC board 11 and the TFT conductive metal layer 2 and the ITO conductive layer 5 is more reliable. Meanwhile, by arranging the first conductive adhesive layer 9 and the second conductive adhesive layer 8, the FPC circuit board 11 is bound by the hot press after being inserted into the connecting groove 12, so that the FPC circuit board 11 is stably connected and changed, the conduction stability is ensured, and the performance of the product is improved.
Example 4
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the invention. This embodiment provides an electronic paper module, which is substantially the same as embodiment 1, and the main differences between them are: and a PET layer 6 is arranged on one side of the ITO conductive layer 5, which is far away from the electronic paper layer 4. In this embodiment, the PET layer 6 is made of a PET film, which has good transparency and facilitates light transmission.
Example 5
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the invention. This embodiment provides an electronic paper module, which is substantially the same as embodiment 4, and the main differences between them are: a protective layer 7 is arranged on the side of the PET layer 6 away from the ITO conductive layer 5. In this embodiment, the cover glass is used as the protective layer 7, which can protect electronic paper and can also be transparent.
Example 6
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the present disclosure, and fig. 2 is a schematic connection diagram of an electronic paper module according to an embodiment of the present disclosure. This embodiment provides an electronic paper module, which is substantially the same as embodiment 1, and the main differences between them are: the connecting groove 12 has a rectangular structure. By adopting the rectangular connecting groove 12, the cutting track of the aurora device is a linear track during cutting, and compared with a circular track, the linear track is more stable, so that the ITO conductive layer 5 is not easily damaged by mistake during laser cutting to be cut off or semi-cut off, and the yield can be improved; thereby improve product reliability, the straight line orbit is fast more than circular simultaneously, consequently, can also promote cutting efficiency.
Example 7
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of an electronic paper module according to an embodiment of the present disclosure, and fig. 2 is a schematic connection diagram of an electronic paper module according to an embodiment of the present disclosure. This embodiment provides an electronic paper module, which is substantially the same as embodiment 1, and the main differences between them are: the FPC board 11 is provided with bonding pins (not shown), and the driver IC10 is electrically connected to the bonding pins (not shown). In this embodiment, the FPC board 11 is connected to the driver IC10 and the wiring of the TFT conductive metal layer 2 through the bonding pins (not shown). The bonding pins (not shown) are located at the uppermost pins of the FPC board 11 and serve as the com electrode bonding locations, and the com electrodes are electrically connected to the driver IC10 through the wiring of the TFT conductive metal layer 2. Through setting up the binding pin, make above-mentioned FPC circuit board 11 have com electrode and bind the location, thereby make and switch on more reliable and more stable.
Example 8
Referring to fig. 3, fig. 3 is a flow chart illustrating a process of an electronic paper module according to an embodiment of the invention. The embodiment provides an electronic paper module process, which comprises the following steps:
step S110: cutting the edge of the electronic paper layer 4 to obtain a connecting groove 12; the cutting adopts a laser cutting process, the cutting is carried out inwards along the edge of the electronic paper layer 4 close to the FPC circuit board 11, during the cutting, the cutting track of the aurora device is a linear track, compared with a circular track, the linear track is more stable, the ITO conductive layer 5 is not easily damaged by mistake during the laser cutting, and the cutting or half cutting is carried out, so that the yield can be improved; thereby improve product reliability, the straight line orbit is fast more than circular simultaneously, consequently, can also promote cutting efficiency.
Step S130: respectively attaching the TFT conductive metal layer 2 and the ITO conductive layer 5 to two sides of the electronic paper layer 4 to obtain a front panel with a connecting groove 12; in this embodiment, the TFT conductive metal layer 2 and the electronic paper layer 4 are connected by an adhesive layer 3. The TFT conductive metal layer 2 is arranged on the TFT glass substrate 1, a PET layer 6 is arranged on one side, far away from the electronic paper layer 4, of the ITO conductive layer 5, and a protective layer 7 is arranged on one side, far away from the ITO conductive layer 5, of the PET layer 6.
Step S140: the FPC board 11 is inserted into the connecting groove 12, so that the FPC board 11 is electrically connected with the TFT conductive metal layer 2, and the FPC board 11 is electrically connected with the ITO conductive layer 5. In this embodiment, the FPC board 11 is an FOG FPC board 11, and the FPC board 11 is partially extended, and the extended portion is inserted into the connecting groove 12.
Step S150: the FPC board 11 is electrically connected to the driver IC 10. The FPC board 11 is connected to the driver IC10 through a lead wire on the TFT conductive metal layer 2.
In the above-mentioned realization process, through seting up spread groove 12 in the edge of electronic paper, the size of spread groove 12 is big than the size of through-hole, simultaneously, the edge that is located of spread groove 12 for can be very convenient clean after the cutting, clean cleaner, thereby improve the yields of cutting, guaranteed the reliability of product. Adopt FPC circuit board 11 to bind and connect electronic paper, need not advance before the laminating of electronic paper and click good silver thick liquid, FPC circuit board 11 connects storage time extension (in days) after switching on, can prepare material in advance to the productivity has been promoted greatly.
Example 9
Referring to fig. 3, fig. 3 is a flow chart illustrating a process of an electronic paper module according to an embodiment of the invention. The present embodiment provides an electronic paper module process, which is substantially the same as embodiment 8, and the main difference between the two processes is as follows: after the step of cutting the edge of the electronic paper layer 4 to obtain the connecting groove 12, the step of respectively attaching the TFT conductive metal layer 2 and the ITO conductive layer 5 to both sides of the electronic paper layer 4 to obtain the front panel with the connecting groove 12 further includes the following steps before the step of:
step S120: the connecting groove 12 is cleaned of residues. In this embodiment, the connecting groove 12 is opened at the edge, so that the residue can be cleaned conveniently. Through cleaning the connecting groove 12, the FPC board 11 is more fully contacted with the connecting groove 12 and cannot be influenced by residues, so that the stability of a circuit is improved, and the reliability of a product is improved.
Example 10
Referring to fig. 3, fig. 3 is a flow chart illustrating a process of an electronic paper module according to an embodiment of the invention. The present embodiment provides an electronic paper module process, which is substantially the same as embodiment 9, and the main difference between the two processes is as follows: the step of electrically connecting the FPC board 11 to the TFT conductive metal layer 2 and the step of electrically connecting the FPC board 11 to the ITO conductive layer 5 include the steps of:
a first conductive adhesive layer 9 is arranged between the TFT conductive metal layer 2 and the FPC board 11, and the first conductive adhesive layer 9 is positioned in a contact area of the TFT conductive metal layer 2 and the FPC board 11;
a second conductive adhesive layer 8 is arranged between the ITO conductive layer 5 and the FPC board 11, and the second conductive adhesive layer 8 is located in a contact region between the ITO conductive layer 5 and the FPC board 11.
In this embodiment, the first conductive adhesive layer 9 and the second conductive adhesive layer 8 both use anisotropic conductive adhesives to achieve vertical conduction, so that the electrical connection between the FPC board 11 and the TFT conductive metal layer 2 and the ITO conductive layer 5 is more reliable. Meanwhile, by arranging the first conductive adhesive layer 9 and the second conductive adhesive layer 8, the FPC circuit board 11 is bound by the hot press after being inserted into the connecting groove 12, so that the FPC circuit board 11 is stably connected and changed, the conduction stability is ensured, and the performance of the product is improved.
In summary, an embodiment of the present invention provides an electronic paper module and a process thereof, where the electronic paper module includes a front board, an FPC board 11, and a driver IC10, the front board includes a TFT conductive metal layer 2, an ITO conductive layer 5, and an electronic paper layer 4, the electronic paper layer 4 is located between the TFT conductive metal layer 2 and the ITO conductive layer 5, a connection groove 12 is formed at an edge of the electronic paper layer 4, the FPC board 11 extends into the connection groove 12, the TFT conductive metal layer 2 and the ITO conductive layer 5 are electrically connected to the FPC board 11, and the FPC board 11 is electrically connected to the driver IC 10. The electronic paper layer 4 is connected to the TFT conductive metal layer 2 through an adhesive layer 3, and the TFT conductive metal layer 2 is disposed on the TFT glass substrate 1. The connecting groove 12 is cut along the edge of the electronic paper layer 4 close to the FPC board 11 to serve as a com electrode. And cutting by adopting an aurora device. The FPC board 11 is electrically connected to the driver IC10 through a lead wire on the TFT conductive metal layer 2. The FPC board 11 is inserted into the connecting groove 12, and the FPC board 11 is bonded and conducted, so that the FPC board 11 is connected to the TFT conductive metal layer 2 and the ITO conductive layer 5, respectively, and the FPC board 11 conducts the com electrode to the driver IC10, thereby realizing circuit conduction. Through seting up spread groove 12 in the edge of electronic paper, the size of spread groove 12 is big than the size of through-hole, simultaneously, the edge that is located of spread groove 12 for can be very convenient after the cutting clean, clean cleaner, thereby improve the yields of cutting, guaranteed the reliability of product. Adopt FPC circuit board 11 to bind and connect electronic paper, need not advance before the laminating of electronic paper and click good silver thick liquid, FPC circuit board 11 connects storage time extension (in days) after switching on, can prepare material in advance to the productivity has been promoted greatly. Therefore, the invention provides an electronic paper module which can improve the storage time, so that the materials can be prepared in advance, and the productivity is improved. The embodiment of the invention provides an electronic paper module process, which comprises the following steps: the method comprises the following steps: cutting the edge of the electronic paper layer 4 to obtain a connecting groove 12; the cutting adopts a laser cutting process, the cutting is carried out inwards along the edge of the electronic paper layer 4 close to the FPC circuit board 11, during the cutting, the cutting track of the aurora device is a linear track, compared with a circular track, the linear track is more stable, the ITO conductive layer 5 is not easily damaged by mistake during the laser cutting, and the cutting or half cutting is carried out, so that the yield can be improved; thereby improve product reliability, the straight line orbit is fast more than circular simultaneously, consequently, can also promote cutting efficiency. Respectively attaching the TFT conductive metal layer 2 and the ITO conductive layer 5 to two sides of the electronic paper layer 4 to obtain a front panel with a connecting groove 12; the TFT conductive metal layer 2 and the electronic paper layer 4 are connected through an adhesive layer 3. The TFT conductive metal layer 2 is arranged on the TFT glass substrate 1, a PET layer 6 is arranged on one side, far away from the electronic paper layer 4, of the ITO conductive layer 5, and a protective layer 7 is arranged on one side, far away from the ITO conductive layer 5, of the PET layer 6. The FPC board 11 is inserted into the connecting groove 12, so that the FPC board 11 is electrically connected with the TFT conductive metal layer 2, and the FPC board 11 is electrically connected with the ITO conductive layer 5. In this embodiment, the FPC board 11 is an FOG FPC board 11, and the FPC board 11 is partially extended, and the extended portion is inserted into the connecting groove 12. The FPC board 11 is electrically connected to the driver IC 10. The FPC board 11 is connected to the driver IC10 through a lead wire on the TFT conductive metal layer 2. Through seting up spread groove 12 in the edge of electronic paper, the size of spread groove 12 is big than the size of through-hole, simultaneously, the edge that is located of spread groove 12 for can be very convenient after the cutting clean, clean cleaner, thereby improve the yields of cutting, guaranteed the reliability of product. Adopt FPC circuit board 11 to bind and connect electronic paper, need not advance before the laminating of electronic paper and click good silver thick liquid, FPC circuit board 11 connects storage time extension (in days) after switching on, can prepare material in advance to the productivity has been promoted greatly. Therefore, the invention provides an electronic paper module process which can improve storage time, prepare materials in advance and improve productivity.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an electronic paper module, its characterized in that, includes leading board, FPC circuit board and driver IC, leading board includes TFT conductive metal layer, ITO conducting layer and electron paper layer, electron paper layer is located between TFT conductive metal layer and the ITO conducting layer, the spread groove has been seted up to electron paper layer's edge, the FPC circuit board stretches into in the spread groove, TFT conductive metal layer with the ITO conducting layer respectively with the FPC circuit board electricity is connected, the FPC circuit board with driver IC electricity is connected.
2. The electronic paper module of claim 1, wherein the driver IC is electrically connected to the TFT conductive metal layer.
3. The electronic paper module of claim 1, wherein a first conductive adhesive layer is disposed between the FPC board and the TFT conductive metal layer, and a second conductive adhesive layer is disposed between the FPC board and the ITO conductive layer.
4. The electronic paper module of claim 1, wherein a side of the ITO conductive layer away from the electronic paper layer is provided with a PET layer.
5. The electronic paper module of claim 4, wherein a protective layer is disposed on a side of the PET layer away from the ITO conductive layer.
6. The e-paper module of claim 1, wherein the connection slot is a rectangular structure.
7. The electronic paper module of claim 1, wherein a binding pin is disposed on the FPC board, and the driver IC is electrically connected to the binding pin.
8. An electronic paper module process is characterized by comprising the following steps:
cutting the edge of the electronic paper layer to obtain a connecting groove;
respectively attaching the TFT conductive metal layer and the ITO conductive layer to two sides of the electronic paper layer to obtain a front panel with connecting grooves;
the FPC circuit board is stretched into the connecting groove, so that the FPC circuit board is electrically connected with the TFT conductive metal layer, and meanwhile, the FPC circuit board is electrically connected with the ITO conductive layer;
and electrically connecting the FPC board with the drive IC.
9. The electronic paper module process of claim 8, wherein after the step of cutting the edge of the electronic paper layer to obtain the connecting grooves, the step of respectively attaching the TFT conductive metal layer and the ITO conductive layer to both sides of the electronic paper layer to obtain the front panel with the connecting grooves further comprises the following steps:
and removing residues in the connecting groove.
10. The electronic paper module process of claim 9, wherein the step of electrically connecting the FPC board to the TFT conductive metal layer and simultaneously electrically connecting the FPC board to the ITO conductive layer comprises the steps of:
a first conductive adhesive layer is arranged between the TFT conductive metal layer and the FPC circuit board, and is positioned in a contact area of the TFT conductive metal layer and the FPC circuit board;
the ITO conducting layer with be provided with the second conductive adhesive layer between the FPC circuit board, the second conductive adhesive layer is located the ITO conducting layer with the region of FPC circuit board contact.
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