CN114935858A

CN114935858A - Liquid crystal display device and method for manufacturing the same

Info

Publication number: CN114935858A
Application number: CN202210587880.1A
Authority: CN
Inventors: 向昌明
Original assignee: TCL Huaxing Photoelectric Technology Co Ltd
Current assignee: TCL Huaxing Photoelectric Technology Co Ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2022-08-23

Abstract

The application discloses a liquid crystal display device and a manufacturing method thereof, wherein the liquid crystal display device comprises: a first substrate; the first substrate and the second substrate are arranged oppositely, and side binding regions are arranged at the end parts of the first substrate and the second substrate; the bonding pad is arranged between the first substrate and the second substrate and positioned on the side bonding area, and one end face of the bonding pad is flush with one end face of the first substrate or the second substrate and is exposed outside; the conducting layer is arranged on the binding pad, and one end face of the conducting layer is flush with one end face of the binding pad; and the conductive film is arranged on one end face of the first substrate and one end face of the second substrate, and is electrically connected with the binding pad and one end face of the conductive layer. This application is connected through conducting film and a terminal surface electricity of binding pad, conducting layer, increase conducting film and the electrically conductive area of contact who binds the pad to solve the conducting film that the side set up and bind the problem that produces contact failure between the pad.

Description

Liquid crystal display device and method for manufacturing the same

Technical Field

The application relates to the technical field of display, in particular to a liquid crystal display device and a manufacturing method thereof.

Background

In the conventional display device, signals required by the display panel are input into the display panel through a process of bonding a Chip On Film (COF) or Flexible Printed Circuit (FPC) module. Due to the limitation of the bonding process, the design of the display panel usually requires that the signal lines in the display panel are firstly bundled through the fan-out area, the signal lines are concentrated in a small bonding area, then the COF/FPC module is bonded in the area, and the COF/FPC module forms electrical connection between a Printed Circuit Board (PCB) and a glass substrate.

In order to make the frame of the display device into a narrow frame, a side binding mode is proposed in recent years, namely, a binding pad is arranged on the side of the display panel, and then the COF module is bound on the side, so that the width of the binding pad is narrow, and the frame of the display panel is greatly narrowed. However, the side-bonding method has some problems, in which the contact area between the bonding pad and the silver paste is too small (the thickness of the bonding pad is about 0.5 μm), and thus the contact resistance between the COF module and the bonding pad is too large, which easily causes poor contact.

Disclosure of Invention

The application provides a liquid crystal display device and a manufacturing method thereof, which aim to solve the problem of poor contact of a binding pad in a side binding mode.

The application provides a liquid crystal display device, it includes:

a first substrate;

the first substrate and the second substrate are arranged oppositely, and side binding regions are arranged at the end parts of the first substrate and the second substrate;

the bonding pad is arranged between the first substrate and the second substrate and positioned on the side bonding area, and one end face of the bonding pad is flush with one end face of the first substrate or the second substrate so as to be exposed outside;

the conducting layer is arranged on the binding pad, and one end face of the conducting layer is flush with one end face of the binding pad;

the conductive film is arranged on one end face of the first substrate and one end face of the second substrate, and the conductive film is electrically connected with the binding pad and one end face of the conductive layer.

Optionally, in some embodiments of the present application, a thickness of the conductive layer is greater than a thickness of the bonding pad.

Optionally, in some embodiments of the present application, a protrusion protruding outward relative to an end surface of the first substrate is disposed on an end surface of the bonding pad and/or the conductive layer, and the conductive film covers the end surface of the bonding pad and/or the conductive layer and the protrusion.

Optionally, in some embodiments of the present application, a cavity is disposed on one end surface of the bonding pad and/or the conductive layer, and the conductive film covers the cavity and one end surface of the bonding pad and/or the conductive layer.

Optionally, in some embodiments of the present application, the conductive film includes:

the metal film is arranged on one end face of the first substrate or the second substrate and covers the binding pad and one end face of the conducting layer;

and the conductive adhesive film is arranged on one side of the metal film, which is far away from the binding pad.

Optionally, in some embodiments of the present application, the liquid crystal display device further includes:

the frame glue is positioned between the first substrate and the second substrate;

the first substrate is an array substrate, and the binding pad and the conductive layer are located between the first substrate and the frame adhesive.

Optionally, in some embodiments of the present application, the conductive layer includes any one of a tin metal layer and a composite layer.

Optionally, in some embodiments of the present application, the composite layer includes an ito layer and any one of an al metal layer and a cu metal layer.

Optionally, in some embodiments of the present application, the composite layer includes an indium titanium metal layer, a copper metal layer, and an indium tin oxide layer, which are sequentially stacked.

Optionally, in some embodiments of the present application, the composite layer includes a first ito layer, an al layer, and a second ito layer sequentially stacked.

Correspondingly, the application also provides a preparation method of the liquid crystal display device, which comprises the following steps:

providing a first substrate, wherein a side binding area is arranged at the end part of the first substrate, and a binding pad is formed on the side binding area;

forming a conductive layer on the bonding pad;

providing a second substrate, and forming frame glue on the second substrate;

arranging the first substrate and the second substrate oppositely, bonding and connecting the first substrate and the second substrate through frame glue, and arranging the binding pad or the conducting layer oppositely to the frame glue;

edging the end parts of the first substrate and the second substrate until the binding pad and the conductive layer are exposed;

and arranging a conductive film on one end face of the first substrate and one end face of the second substrate, wherein the conductive film is electrically connected with the binding pad and the conductive layer respectively.

The application provides a liquid crystal display device and a manufacturing method thereof, wherein the liquid crystal display device comprises: a first substrate; the first substrate and the second substrate are arranged oppositely, and side binding regions are arranged at the end parts of the first substrate and the second substrate; the bonding pad is arranged between the first substrate and the second substrate and positioned on the side bonding area, and one end face of the bonding pad is flush with one end face of the first substrate or the second substrate and is exposed outside; the conducting layer is arranged on the binding pad, and one end face of the conducting layer is flush with one end face of the binding pad; and the conductive film is arranged on one end face of the first substrate and one end face of the second substrate, and the conductive film is electrically connected with the binding pad and one end face of the conductive layer. This application is through bind and be equipped with the conducting layer on the pad, then establish conductive film first base plate or on the terminal surface of second base plate, conductive film with bind the pad a terminal surface electricity of conducting layer is connected, consequently can increase conductive film with bind the conductive contact area of pad to solve the conductive film that the side set up with bind and produce contact failure between the pad problem.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a first structure of a liquid crystal display device provided in the present application;

fig. 2 is a schematic view of a conductive layer of a liquid crystal display device provided in the present application;

FIG. 3 is a flow chart of a method for fabricating a liquid crystal display device provided herein;

fig. 4 is a diagram illustrating a process for manufacturing a liquid crystal display device according to the present application;

FIG. 5 is a diagram illustrating a second structure of an LCD device according to the present application;

fig. 6 is a schematic diagram of a third structure of the liquid crystal display device provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The present application provides a liquid crystal display device and a method of manufacturing the same, which will be described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments of the present application.

Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of a liquid crystal display device 100 provided by the present application. The embodiment of the present application provides a liquid crystal display device 100, which includes: a first substrate 10, a second substrate 20, a bonding pad 40, a conductive layer 50, and a conductive film 60;

the first substrate 10 and the second substrate 20 are disposed opposite to each other, and a side bonding region 30 is disposed at an end of each of the first substrate 10 and the second substrate 20. In addition, a liquid crystal layer 90 is disposed between the first substrate 10 and the second substrate 20, and the side binding region 30 is located outside the liquid crystal layer 90.

The bonding pad 40 is disposed between the first substrate 10 and the second substrate 20 and located on the side bonding region 30, and an end surface of the bonding pad 40 is flush with an end surface of the first substrate 10 or the second substrate 20 to be exposed; the conductive layer 50 is arranged on the binding pad 40, and one end surface of the conductive layer 50 is flush with one end surface of the binding pad 40; the conductive film 60 is disposed on one end surface of the first substrate 10 and the second substrate 20, and the conductive film 60 is electrically connected to the bonding pad 40 and one end surface of the conductive layer 50.

This application adopts the mode that the side was bound, is about to bind pad 40 and establishes the side at display panel, and then COF module or FPC module bind in the side, and this kind of mode can be so that bind the width of pad 40 narrower to make display panel's frame narrow greatly. Specifically, the present application is provided with the conductive layer 50 on the bonding pad 40, and then the conductive film 60 is disposed on an end surface of the first substrate 10 or the second substrate 20, the conductive film 60 is electrically connected to the bonding pad 40 and an end surface of the conductive layer 50, so that the conductive contact area between the conductive film 60 and the bonding pad 40 can be increased, and the problem of poor contact between the conductive film 60 disposed on the side surface and the bonding pad 40 is solved.

In some embodiments, the thickness of the conductive layer 50 is greater than the thickness of the bond pad 40. Specifically, the conductive layer 50 has a thickness ranging from 1 micron to 3 microns. The bonding pad 40 has a thickness ranging from 0.5 micrometers to 1 micrometer.

In some embodiments, the conductive film 60 includes:

a metal film 61, wherein the metal film 61 is disposed on an end surface of the first substrate 10 or the second substrate 20 and covers the bonding pad 40 and an end surface of the conductive layer 50;

and the conductive adhesive film 62 is arranged on one side of the metal film 61 far away from the binding pad 40.

The metal film 61 is a silver paste film, that is, when the conductive film 60 is disposed on one end surface of the first substrate 10 and the second substrate 20, a layer of silver paste film is formed on one end surface of the first substrate 10 or the second substrate 20, and then the conductive film 62 is adhered to the silver paste film.

Further, in some embodiments, the liquid crystal display device 100 further includes:

the chip on film 70, the chip on film 70 is disposed on one side of the conductive film 60 away from the bonding pad 40, and the chip on film 70 is electrically connected to the conductive film 60.

The present application can be connected to an external signal line by providing the chip on film 70.

Still further, in some embodiments, the liquid crystal display device 100 further includes:

the frame glue 80, the frame glue 80 is positioned between the first substrate 10 and the second substrate 20;

the first substrate 10 is an array substrate, and the bonding pad 40 and the conductive layer 50 are located between the first substrate 10 and the sealant 80. Specifically, the sealant 80 is located outside the liquid crystal layer 90, and the bonding pad 40 and the conductive layer 50 are disposed between the first substrate 10 and the sealant 80, so that the space occupied by the bonding pad 40 can be reduced, and the frame of the liquid crystal display device 100 is narrower.

Referring to fig. 2, fig. 2 is a schematic diagram of a conductive layer of the liquid crystal display device 100 provided in the present application, and fig. 2 provides a composite layer structure of four conductive layers (a), (B), (C), and (D). In some embodiments, the conductive layer 50 includes any one of a tin metal layer and a composite layer, wherein the tin metal layer is a high temperature resistant material and can avoid melting at high temperature to affect the contact effect. In addition, referring to fig. 2 (a), the composite layer may include an ito layer 51 and an al layer 52. Referring to fig. 2 (B), the composite layer may also include an ito layer 51 and a cu layer 53. In some other embodiments, referring to fig. 2 (C), the composite layer includes an indium-titanium metal layer 54, a copper metal layer 53, and an indium-tin oxide layer 51 sequentially stacked. Referring to fig. 2 (D), in some other embodiments, the composite layer includes a first ito layer 55, an al layer 52, and a second ito layer 56 sequentially stacked.

Referring to fig. 3 and fig. 4, fig. 3 is a flowchart of a method for manufacturing the liquid crystal display device 100 provided in the present application, and fig. 4 is a process diagram of the liquid crystal display device 100 provided in the present application. Correspondingly, an embodiment of the present application further provides a method for manufacturing the liquid crystal display device 100, which includes:

s10, providing a first substrate 10, wherein a side bonding region 30 is disposed at an end of the first substrate 10, and a bonding pad 40 is formed on the side bonding region 30;

s20, forming a conductive layer 50 on the bonding pad 40;

s30, providing a second substrate 20, and forming a sealant 80 on the second substrate 20;

s40, oppositely disposing the first substrate 10 and the second substrate 20, and bonding the first substrate 10 and the second substrate 20 by using a sealant 80, wherein the bonding pad 40 or the conductive layer 50 is oppositely disposed to the sealant 80;

s50, edging the ends of the first substrate 10 and the second substrate 20 until the bonding pad 40 and the conductive layer 50 are exposed;

s60, disposing a conductive film 60 on one end surface of the first substrate 10 and the second substrate 20, wherein the conductive film 60 is electrically connected to the bonding pad 40 and the conductive layer 50, respectively.

Referring to fig. 5, fig. 5 is a schematic diagram of a second structure of the liquid crystal display device 100 provided in the present application. The present embodiment is different from the liquid crystal display device 100 provided in fig. 1 in that a protrusion 101 protruding outward relative to an end surface of the first substrate 10 is provided on an end surface of the bonding pad 40 and/or the conductive layer 50, and the conductive film 60 covers the end surface of the bonding pad 40 and/or the conductive layer 50 and the protrusion 101. By providing a protrusion 101 on one end surface of the bonding pad 40 and/or the conductive layer 50, a contact area of the bonding pad 40 and/or the conductive layer 50 with the conductive film 60 may be increased. Specifically, a layer of silver paste film is formed on an end surface of the first substrate 10 or the second substrate 20, the silver paste film is formed by solidifying liquid silver paste, and the thickness of the protrusion 101 is smaller than or equal to the thickness of the silver paste film, so that the silver paste film can cover the bonding pad 40 and/or an end surface of the conductive layer 50 and the conductive film 60 and the protrusion 101, thereby increasing the contact area between the bonding pad 40 and/or the conductive layer 50 and the conductive film 60. Specifically, in some embodiments, an end surface of the bonding pad 40 and an end surface of the conductive layer 50 are each provided with a protrusion 101 protruding outward with respect to an end surface of the first substrate 10.

In other embodiments of the present application, one end surface of the bonding pad 40 or the conductive layer 50 is provided with a protrusion 101 protruding outward with respect to one end surface of the first substrate 10, and in this embodiment, only one of the bonding pad 40 and the conductive layer 50 is provided with the protrusion 101.

Referring to fig. 6, fig. 6 is a schematic diagram of a third structure of the liquid crystal display device 100 provided in the present application. This embodiment is different from the lcd device 100 provided in fig. 1 in that a cavity 102 is formed on one end surface of the bonding pad 40 and/or the conductive layer 50, and the conductive film 60 covers the cavity 102 and one end surface of the bonding pad 40 and/or the conductive layer 50. By providing a cavity 102 at one end of the bonding pad 40 and/or the conductive layer 50, the contact area of the bonding pad 40 and/or the conductive layer 50 with the conductive film 60 can be increased. Specifically, a silver paste film is formed on an end surface of the first substrate 10 or the second substrate 20, and the silver paste film is formed by solidifying liquid silver paste, so that the silver paste film can cover the bonding pad 40 and/or an end surface of the conductive layer 50 and the conductive film 60 and fill the cavity 102, thereby increasing a contact area between the bonding pad 40 and/or the conductive layer 50 and the conductive film 60. Specifically, in some embodiments, a cavity 102 is formed on both an end surface of the bonding pad 40 and an end surface of the conductive layer 50.

In other embodiments of the present application, one end of the bonding pad 40 or the conductive layer 50 is provided with a cavity 102, and in this embodiment, only one of the bonding pad 40 and the conductive layer 50 is provided with a cavity 102.

The foregoing detailed description is directed to a display device provided in an embodiment of the present application, and specific examples are used herein to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A liquid crystal display device, comprising:

a first substrate;

2. The liquid crystal display device according to claim 1, wherein a thickness of the conductive layer is larger than a thickness of the bonding pad.

3. The liquid crystal display device according to claim 1, wherein one end surface of the bonding pad and/or the conductive layer is provided with a protrusion protruding outward with respect to one end surface of the first substrate, and the conductive film covers the one end surface of the bonding pad and/or the conductive layer and the protrusion.

4. The liquid crystal display device according to claim 1, wherein a cavity is provided at one end surface of the bonding pad and/or the conductive layer, and the conductive film covers the cavity and the one end surface of the bonding pad and/or the conductive layer.

5. The liquid crystal display device according to claim 1, wherein the conductive film comprises:

6. The liquid crystal display device according to claim 1, further comprising:

the first substrate is an array substrate, and the binding pad and the conductive layer are located between the first substrate and the frame glue.

7. The liquid crystal display device according to claim 1, wherein the conductive layer comprises any one of a tin metal layer and a composite layer.

8. The liquid crystal display device according to claim 7, wherein the composite layer includes an indium tin oxide layer and any one of an aluminum metal layer and a copper metal layer.

9. The liquid crystal display device according to claim 7, wherein the composite layer comprises an indium titanium metal layer, a copper metal layer, and an indium tin oxide layer, which are sequentially stacked;

or the composite layer comprises a first indium tin oxide layer, an aluminum metal layer and a second indium tin oxide layer which are sequentially stacked.

10. A method for manufacturing a liquid crystal display device, comprising:

forming a conductive layer on the bonding pad;

providing a second substrate, and forming frame glue on the second substrate;

the first substrate and the second substrate are oppositely arranged, the first substrate and the second substrate are connected in a bonding mode through frame glue, and the binding bonding pads or the conducting layers and the frame glue are oppositely arranged;