CN112135925B - 成膜装置和成膜方法 - Google Patents
成膜装置和成膜方法 Download PDFInfo
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- CN112135925B CN112135925B CN201980031668.3A CN201980031668A CN112135925B CN 112135925 B CN112135925 B CN 112135925B CN 201980031668 A CN201980031668 A CN 201980031668A CN 112135925 B CN112135925 B CN 112135925B
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- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
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| JP2018097404A JP7126381B2 (ja) | 2018-05-21 | 2018-05-21 | 成膜装置および成膜方法 |
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| PCT/JP2019/015389 WO2019225184A1 (ja) | 2018-05-21 | 2019-04-09 | 成膜装置および成膜方法 |
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| JP (1) | JP7126381B2 (https=) |
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| US20210222296A1 (en) | 2021-07-22 |
| JP2019203155A (ja) | 2019-11-28 |
| US11578407B2 (en) | 2023-02-14 |
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| CN112135925A (zh) | 2020-12-25 |
| KR20210006985A (ko) | 2021-01-19 |
| JP7126381B2 (ja) | 2022-08-26 |
| KR102571839B1 (ko) | 2023-08-28 |
| TW202006174A (zh) | 2020-02-01 |
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