JP2019203155A - 成膜装置および成膜方法 - Google Patents
成膜装置および成膜方法 Download PDFInfo
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- JP2019203155A JP2019203155A JP2018097404A JP2018097404A JP2019203155A JP 2019203155 A JP2019203155 A JP 2019203155A JP 2018097404 A JP2018097404 A JP 2018097404A JP 2018097404 A JP2018097404 A JP 2018097404A JP 2019203155 A JP2019203155 A JP 2019203155A
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Abstract
Description
成膜装置100は容量結合型のプラズマ処理装置として構成されており、基板Wに対してPEALDにより所定の膜を成膜する成膜機能とエッチング機能とを有する。基板Wとしては、例えば半導体ウエハを挙げることができるが、これに限定されない。
まず、ゲートバルブ58を開放して真空搬送室から搬送装置によりウエハWをチャンバー1内に搬入し、ステージ2上に載置する。搬送装置を退避させた後、ゲートバルブ58を閉じる。
2;ステージ
10;シャワーヘッド
11;上部電極
12;シャワープレート
13;絶縁部材
14;ガス拡散空間
20;ガス供給機構
26;第1高周波電源
30;第1の容量結合プラズマ生成部
31;電極
33;第2高周波電源
40;第2の容量結合プラズマ生成部
53;排気装置
60;制御部
100;成膜装置
P1;第1の容量結合プラズマ
P2;第2の容量結合プラズマ
W;基板
Claims (15)
- 基板上にプラズマALDにより所定の膜を成膜する成膜装置であって、
基板を収容するチャンバーと、
前記チャンバー内で基板を支持するステージと、
前記ステージに対向して設けられ、導電性の上部電極および該上部電極と絶縁された導電性のシャワープレートを有し、成膜のための成膜原料ガスおよび反応ガスを含むガスが供給され、該ガスを前記チャンバー内に導入するシャワーヘッドと、
前記ステージに含まれる電極と、
前記上部電極に接続された第1高周波電源と、
前記電極に接続された第2高周波電源と
を備え、
前記第1高周波電源から前記上部電極に高周波電力が供給されることにより、前記上部電極および前記シャワープレートの間に高周波電界が形成されて、第1の容量結合プラズマが生成され、
前記第2高周波電源から前記電極に高周波電力が供給されることにより、前記シャワープレートと前記電極との間に高周波電界が形成されて、前記第1の容量結合プラズマとは独立した第2の容量結合プラズマが生成される、成膜装置。 - 前記第1高周波電源に替えて、または前記第1高周波電源に加えて、前記上部電極にDCパルスを印加するDCパルス印加ユニットを備える、請求項1に記載の成膜装置。
- 前記第1の容量結合プラズマにより前記反応ガスが解離され、主に反応ガスのラジカルが前記成膜原料ガスと反応して、前記基板上に所定の膜が成膜される、請求項1または請求項2に記載の成膜装置。
- 前記第1の容量結合プラズマは、前記シャワーヘッド内のガス拡散空間内にリモートプラズマとして形成され、前記シャワープレートを通過した主に反応ガスのラジカルが前記基板に供給される、請求項1または請求項2に記載の成膜装置。
- 前記第2の容量結合プラズマにより、前記基板に形成された膜が、主にイオンアシストによりエッチングされる、請求項1から請求項4のいずれか1項に記載の成膜装置。
- 前記シャワープレートの直下に設けられ、前記シャワープレートを通過する前記第2の容量結合プラズマ中のイオンを除去するイオントラップをさらに備える、請求項5に記載の成膜装置。
- 前記シャワープレートは接地されている、請求項1から請求項6のいずれか1項に記載の成膜装置。
- 前記シャワープレートには接地ラインが接続され、前記接地ラインに設けられたインピーダンス調整回路をさらに備える、請求項1から請求項6のいずれか1項に記載の成膜装置。
- 前記電極に接続された、前記基板に高周波バイアスを印加する機能を有する第3の高周波電源をさらに備える、請求項1から請求項8のいずれか1項に記載の成膜装置。
- 基板上にプラズマALDにより所定の膜を成膜する成膜方法であって、
基板に対して成膜原料ガスを間欠的に供給する第1工程と、
前記成膜原料ガスを供給していない期間に間欠的に第1の容量結合プラズマにより反応ガスを解離させて主に反応ガスのラジカルを前記基板に供給する第2工程と、
任意のタイミングで、前記第1の容量結合プラズマとは独立して、基板にイオンアシストによるエッチング作用を及ぼす第2の容量結合プラズマを生成する第3工程と
を有する、成膜方法。 - 前記第1工程では、前記基板に成膜原料ガスを吸着させ、前記第2工程では、前記第1容量結合プラズマにより生成された主に前記反応ガスのラジカルを前記基板に吸着された前記成膜原料ガスと反応させる、請求項10に記載の成膜方法。
- 前記第3工程を、前記第2工程と同様のタイミングで実施する、請求項10または請求項11に記載の成膜方法。
- 前記第3工程を、前記第2工程を行うタイミングの一部で、前記第2工程と同時に実施する、請求項10または請求項11に記載の成膜方法。
- 前記第2工程を行うタイミングの一部を、前記第3工程で置き換えて実施する、請求項10または請求項11に記載の成膜方法。
- 請求項1から請求項9のいずれかの成膜装置により行われる、請求項10から請求項14のいずれか1項に記載の成膜方法。
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WO2019225184A1 (ja) | 2019-11-28 |
CN112135925A (zh) | 2020-12-25 |
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US11578407B2 (en) | 2023-02-14 |
CN112135925B (zh) | 2023-05-23 |
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