CN112088429A - 均热板以及其制造方法 - Google Patents

均热板以及其制造方法 Download PDF

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Publication number
CN112088429A
CN112088429A CN202080002652.2A CN202080002652A CN112088429A CN 112088429 A CN112088429 A CN 112088429A CN 202080002652 A CN202080002652 A CN 202080002652A CN 112088429 A CN112088429 A CN 112088429A
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CN
China
Prior art keywords
circuit board
soaking plate
etching
metal
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080002652.2A
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English (en)
Chinese (zh)
Inventor
小松信夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kmt Technology Research Co ltd
Original Assignee
Kmt Technology Research Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kmt Technology Research Co ltd filed Critical Kmt Technology Research Co ltd
Publication of CN112088429A publication Critical patent/CN112088429A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080002652.2A 2019-01-15 2020-01-10 均热板以及其制造方法 Pending CN112088429A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019014840 2019-01-15
JP2019-014840 2019-01-15
PCT/JP2020/000587 WO2020149223A1 (ja) 2019-01-15 2020-01-10 ベーパーチャンバー及びその製造方法

Publications (1)

Publication Number Publication Date
CN112088429A true CN112088429A (zh) 2020-12-15

Family

ID=71613319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080002652.2A Pending CN112088429A (zh) 2019-01-15 2020-01-10 均热板以及其制造方法

Country Status (3)

Country Link
JP (2) JP7236165B2 (ja)
CN (1) CN112088429A (ja)
WO (1) WO2020149223A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113281967A (zh) * 2021-05-07 2021-08-20 江西展耀微电子有限公司 一种均热板的盖板制作方法及均热板的制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003329379A (ja) * 2002-05-10 2003-11-19 Furukawa Electric Co Ltd:The ヒートパイプ回路基板
JP4325263B2 (ja) * 2003-04-21 2009-09-02 ソニー株式会社 回路装置及び電子機器
JP2006159797A (ja) * 2004-12-10 2006-06-22 Toyo Kohan Co Ltd 空洞構造形成体、および空洞構造形成体に用いる空洞構造形成材と、空洞構造形成材に用いる積層材、並びに空洞構造体を用いた部品
JP2006313038A (ja) * 2005-05-09 2006-11-16 Osk International:Kk ヒートパイプ回路基板の製造方法とヒートパイプ回路基板
JP4874664B2 (ja) * 2006-02-08 2012-02-15 株式会社フジクラ ヒートパイプ
JP5735594B2 (ja) * 2009-04-16 2015-06-17 モレックス インコーポレイテドＭｏｌｅｘ Ｉｎｃｏｒｐｏｒａｔｅｄ 冷却装置
JP7167416B2 (ja) * 2017-02-09 2022-11-09 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法
JP6917006B2 (ja) * 2017-05-24 2021-08-11 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113281967A (zh) * 2021-05-07 2021-08-20 江西展耀微电子有限公司 一种均热板的盖板制作方法及均热板的制作方法
CN113281967B (zh) * 2021-05-07 2024-02-09 江西新菲新材料有限公司 一种均热板的盖板制作方法及均热板的制作方法

Also Published As

Publication number Publication date
JPWO2020149223A1 (ja) 2021-11-25
JP7236165B2 (ja) 2023-03-09
WO2020149223A1 (ja) 2020-07-23
JP7341560B2 (ja) 2023-09-11
JP2022145713A (ja) 2022-10-04

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