TWI353650B - Chip embedded package structure and method for fab - Google Patents

Chip embedded package structure and method for fab Download PDF

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Publication number
TWI353650B
TWI353650B TW97117544A TW97117544A TWI353650B TW I353650 B TWI353650 B TW I353650B TW 97117544 A TW97117544 A TW 97117544A TW 97117544 A TW97117544 A TW 97117544A TW I353650 B TWI353650 B TW I353650B
Authority
TW
Taiwan
Prior art keywords
fab
method
package structure
chip embedded
embedded package
Prior art date
Application number
TW97117544A
Other versions
TW200947607A (en
Inventor
Kuo Chun Chiang
Hsien Chieh Lin
Shih Tsung Lin
Ming Shien Lee
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW97117544A priority Critical patent/TWI353650B/en
Publication of TW200947607A publication Critical patent/TW200947607A/en
Application granted granted Critical
Publication of TWI353650B publication Critical patent/TWI353650B/en

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TW97117544A 2008-05-13 2008-05-13 Chip embedded package structure and method for fab TWI353650B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Publications (2)

Publication Number Publication Date
TW200947607A TW200947607A (en) 2009-11-16
TWI353650B true TWI353650B (en) 2011-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW97117544A TWI353650B (en) 2008-05-13 2008-05-13 Chip embedded package structure and method for fab

Country Status (1)

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TW (1) TWI353650B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9324664B2 (en) 2013-02-22 2016-04-26 Unimicron Technology Corp. Embedded chip package structure
TWI572268B (en) * 2014-10-13 2017-02-21 欣興電子股份有限公司 Interposer and manufacturing method therefor
US10051742B2 (en) 2015-12-10 2018-08-14 Industrial Technology Research Institute Power module and manufacturing method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117782B (en) * 2010-01-06 2012-12-26 南亚电路板股份有限公司 Composite buried element structure and manufacturing method thereof
TWI411075B (en) 2010-03-22 2013-10-01 Advanced Semiconductor Eng Semiconductor package and manufacturing method thereof
TWI400998B (en) * 2010-08-20 2013-07-01 Nan Ya Printed Circuit Board Printed circuit board and method for fabricating the same
CN102387659B (en) * 2010-09-03 2013-04-10 南亚电路板股份有限公司 Printed circuit board and production method thereof
US8941222B2 (en) 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
TWI585918B (en) * 2014-07-18 2017-06-01 Siliconware Precision Industries Co Ltd Interposer and method of manufacture
TWI566348B (en) * 2014-09-03 2017-01-11 Siliconware Precision Industries Co Ltd Package structure and method of manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9324664B2 (en) 2013-02-22 2016-04-26 Unimicron Technology Corp. Embedded chip package structure
TWI572268B (en) * 2014-10-13 2017-02-21 欣興電子股份有限公司 Interposer and manufacturing method therefor
US10051742B2 (en) 2015-12-10 2018-08-14 Industrial Technology Research Institute Power module and manufacturing method thereof

Also Published As

Publication number Publication date
TW200947607A (en) 2009-11-16

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