CN112020772A - 基板、电子装置、接合结构及其接合方法 - Google Patents

基板、电子装置、接合结构及其接合方法 Download PDF

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Publication number
CN112020772A
CN112020772A CN201880091113.3A CN201880091113A CN112020772A CN 112020772 A CN112020772 A CN 112020772A CN 201880091113 A CN201880091113 A CN 201880091113A CN 112020772 A CN112020772 A CN 112020772A
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China
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substrate
joint
axis
bonding
bottom plate
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Pending
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CN201880091113.3A
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English (en)
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许志高
沈贺文
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

本发明公开一种基板，包括底板及设于所述底板上的至少一个接合部，所述接合部为部分阿基米德螺旋结构。由于基板上的接合部为部分阿基米德螺旋结构，可将基板旋转调整，避免基板上的接合部因热膨胀等因素造成错位的问题，提高了基板的对位精度，进而提高所述基板的接合进度。本发明还提供一种电子装置、接合结构及其接合方法。

Description

PCT国内申请，说明书已公开。

Claims (15)

  1. PCT国内申请，权利要求书已公开。
CN201880091113.3A 2018-04-28 2018-04-28 基板、电子装置、接合结构及其接合方法 Pending CN112020772A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/085115 WO2019205150A1 (zh) 2018-04-28 2018-04-28 基板、电子装置、接合结构及其接合方法

Publications (1)

Publication Number Publication Date
CN112020772A true CN112020772A (zh) 2020-12-01

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ID=68293696

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CN201880091113.3A Pending CN112020772A (zh) 2018-04-28 2018-04-28 基板、电子装置、接合结构及其接合方法

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US (1) US11304296B2 (zh)
CN (1) CN112020772A (zh)
WO (1) WO2019205150A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113808477A (zh) * 2020-06-15 2021-12-17 群创光电股份有限公司 显示装置

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765027A1 (fr) * 1997-06-23 1998-12-24 Framatome Sa Dispositif de reconstitution d'assemblages de combustible d'un reacteur nucleaire
US20030070833A1 (en) * 2001-10-17 2003-04-17 Barth Phillip W. Extensible spiral for flex circuit
JP2005032842A (ja) * 2003-07-08 2005-02-03 Ibiden Co Ltd 電極構造およびセラミック接合体
JP2008047839A (ja) * 2006-08-21 2008-02-28 Ricoh Co Ltd 妨害電磁波低減装置
CN101383446A (zh) * 2008-10-21 2009-03-11 厦门大学 三频光子带隙介电常数渐变陶瓷阿基米德螺旋天线
US20120251757A1 (en) * 2009-10-19 2012-10-04 Tesa Se Method for Producing Bonds
US20120247927A1 (en) * 2009-09-28 2012-10-04 Wam Industriale S.P.A. Archimedean screw
CN103983688A (zh) * 2014-04-14 2014-08-13 北京理工大学 用于叶片类曲面裂纹检测的嵌入式平面线圈阵列传感器
CN104022360A (zh) * 2014-04-24 2014-09-03 江苏科技大学 复合结构平面螺旋天线
CN104953260A (zh) * 2015-06-16 2015-09-30 华北电力大学（保定） 一种检测电气设备局部放电的宽带平面螺旋天线及其设计方法
WO2016067269A1 (en) * 2014-10-30 2016-05-06 Uti Limited Partnership Null forming in circularly polarized antenna patterns using reactive loading of multi-arm spiral antenna
FR3049212A1 (fr) * 2016-03-22 2017-09-29 Rsi Compacteur de produits comportant une phase liquide
CN206608789U (zh) * 2017-03-09 2017-11-03 广州市中昊装饰材料有限公司 一种led无驱动变光变功率一体化铝基板灯
JP2017203336A (ja) * 2016-05-13 2017-11-16 三菱電機株式会社 ロック装置及びホーム柵
CN107431059A (zh) * 2015-01-02 2017-12-01 亚利桑那州立大学董事会 用于可变形电子装置的阿基米德螺线设计
CN107923581A (zh) * 2015-08-20 2018-04-17 飞利浦照明控股有限公司 板装的led阵列

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102364679A (zh) * 2011-10-10 2012-02-29 常熟市广大电器有限公司 一种芯片封装结构

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765027A1 (fr) * 1997-06-23 1998-12-24 Framatome Sa Dispositif de reconstitution d'assemblages de combustible d'un reacteur nucleaire
US20030070833A1 (en) * 2001-10-17 2003-04-17 Barth Phillip W. Extensible spiral for flex circuit
JP2005032842A (ja) * 2003-07-08 2005-02-03 Ibiden Co Ltd 電極構造およびセラミック接合体
JP2008047839A (ja) * 2006-08-21 2008-02-28 Ricoh Co Ltd 妨害電磁波低減装置
CN101383446A (zh) * 2008-10-21 2009-03-11 厦门大学 三频光子带隙介电常数渐变陶瓷阿基米德螺旋天线
US20120247927A1 (en) * 2009-09-28 2012-10-04 Wam Industriale S.P.A. Archimedean screw
US20120251757A1 (en) * 2009-10-19 2012-10-04 Tesa Se Method for Producing Bonds
CN103983688A (zh) * 2014-04-14 2014-08-13 北京理工大学 用于叶片类曲面裂纹检测的嵌入式平面线圈阵列传感器
CN104022360A (zh) * 2014-04-24 2014-09-03 江苏科技大学 复合结构平面螺旋天线
WO2016067269A1 (en) * 2014-10-30 2016-05-06 Uti Limited Partnership Null forming in circularly polarized antenna patterns using reactive loading of multi-arm spiral antenna
CN107431059A (zh) * 2015-01-02 2017-12-01 亚利桑那州立大学董事会 用于可变形电子装置的阿基米德螺线设计
CN104953260A (zh) * 2015-06-16 2015-09-30 华北电力大学（保定） 一种检测电气设备局部放电的宽带平面螺旋天线及其设计方法
CN107923581A (zh) * 2015-08-20 2018-04-17 飞利浦照明控股有限公司 板装的led阵列
FR3049212A1 (fr) * 2016-03-22 2017-09-29 Rsi Compacteur de produits comportant une phase liquide
JP2017203336A (ja) * 2016-05-13 2017-11-16 三菱電機株式会社 ロック装置及びホーム柵
CN206608789U (zh) * 2017-03-09 2017-11-03 广州市中昊装饰材料有限公司 一种led无驱动变光变功率一体化铝基板灯

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US11304296B2 (en) 2022-04-12
WO2019205150A1 (zh) 2019-10-31

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