CN107431059A - 用于可变形电子装置的阿基米德螺线设计 - Google Patents
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Abstract
本发明提供了一种电子装置,其包括第一功能体、第二功能体以及将所述第一功能体连接到所述第二功能体的至少一个连接构件。所述至少一个连接构件具有螺线图案,并且悬在空气中以允许伸展、弯曲或压缩。
Description
相关申请的交叉引用
本申请要求于2015年1月2日提交的美国临时专利申请No.62/099,324的优先权,其全部公开通过引用并入本文。
技术领域
本申请涉及可变形电子装置,特别涉及用于岛互连可变形电子装置中的螺线形电互连。
背景技术
近年来,可变形电子装置的快速发展已经出现,其成为一种有吸引力和有希望的新技术。这样的电子装置可以并入可穿戴装置中,诸如柔性显示器、可伸展电路、半球形电子眼和表皮装置等。利用变形电子装置,可以将装置制造成适合各种物理空间,而不需要非可变形电子装置的标准几何约束。实际上,这样的装置可以针对各种应用在纳米、微米、厘米或米级规模上加以开发。
已经使用许多方法来形成可变形电子装置,并且通常有两种常规的途径。第一种途径是使用固有地可伸展的有机材料来形成电子装置;然而,由于这些有机材料具有低电迁移率(即,带电粒子响应于电场穿过介质的能力),所以这种有机材料不适用于高性能电子装置。第二种途径方法利用“岛互连”结构,其中多个无机电子装置各自放置在刚性岛(例如,基底)上,并通过可伸展的互连电连接,从而使整个岛互连系统可伸展。岛互连结构通常由弹性体基底支撑,并且可折叠电子装置最近的发展利用纸折叠(即折纸)的概念来增加所得结构的柔性和可变形性。实际上,一个主要目的是提高可伸展电子装置的灵活性和可变形性,以允许它们在比以前可能使用的更广泛的各种应用中加以使用。利用岛互连方法,已知的互连被图案化以形成蛇形形状或半相似的蛇形形状以改善可变形性。基于蛇形的设计利用kirigarni(即切纸)的概念从二维平面制造非直线,使得平面内伸展由平面外变形补偿。然而,即使基于蛇形的设计在其伸展性能方面也受到限制。
因此,需要形成提高伸展性的互连的附加方法,使得可以开发具有广泛功能性和修改的便携性的电子装置。
发明内容
为了提高岛互连结构的可变形性,本发明涉及基于螺线的互连,其比常规的基于蛇形的互连更可伸展。
因此,本发明的一个方面涉及一种电子装置,其包括第一功能体、第二功能体和将第一功能体连接到第二功能体的至少一个连接构件,其中至少一个连接构件具有螺线图案并且悬在空气中以允许伸展、弯曲或压缩。
附图说明
在参考附图的详细描述中,本发明的优选实施例的这些和其它特征将变得更加明显,其中:
图1(A)-图1(C)是根据本发明的实施例的三个互连结构几何形状的俯视图;
图2(A)-(C)是图1(A)-(C)中所示的三个互连结构几何形状的俯视图,示出了根据本发明的实施例的每个的示例性尺寸;
图3(A)-(C)是图1(A)-1(C)中所示的三个互连结构的变形和未变形状态的俯视图;
图4(A)-(C)是描绘图2(A)-(C)中所示的三个互连结构中的每一个的应变行为的图;
图5是根据本发明的实施例的螺线互连结构的俯视图;
图6(A)是根据本发明实施例的修改的螺线互连结构的俯视图;
图6(B)是描绘图6(A)的修改的螺线互连结构的应变行为的图;以及
图7(A)-(B)是根据本发明的实施例的由图1(C)的螺线互连形成的岛互连结构的俯视图。
具体实施方式
本发明一般涉及用于岛互连可变形电子装置的基于螺线的互连几何形状。可变形电子装置通常包括通过一个或多个连接构件(也称为互连)电连接的多个单独的电子装置。连接构件是导电的,以便允许电信号在单个装置之间传导。电子装置没有被特别限制,并且可以是例如,能量存储和能源装置(例如,电池、太阳能电池和超级电容器)、消费产品(例如,可折叠显示器、照明装置、天线和可折叠玩具)和可穿戴电子装置(例如,健康监测系统和通信系统)。本发明的互连几何形状允许这些产品被制造得更加紧凑、便携和耐用,而不牺牲性能。
如本文所述,并且在不受任何特定理论约束的情况下,相信螺线形互连允许增加岛互连装置的伸展性。相信用于互连的螺线图案中的均匀和小的曲率有助于更大的伸展性。代替将周期性图案应用于互连的设计,非周期性图案在设计过程期间,特别是在某些极端条件下提供更高的自由度。
如本文所述,与已知的基于蛇形的互连几何形状相比,螺线互连几何形状具有较高的伸展性。螺线互连在弹性变形下可伸展高达250%,在无故障的情况下可伸展高达325%。
在图1(A)-(C)中示出了三个互连图案(也称为“连接构件”)的示例性平面内形状,如下:常规的蛇形(图1(A))、自相似的蛇形(图1(B))和阿基米德螺线结构100(图1(C))。常规的蛇形(图1(A))已经广泛用于形成互连并且是本领域已知的,并且最近已经研究了自相似的蛇形图案(图1(B))。图1(C)所示的阿基米德螺线结构100是本发明的主要目的。
图1(A)-(C)的互连可以由构造成能承受在相邻和相邻的功能体相对于彼此移动时形成的施加的弯曲应力的材料形成,从而形成所得到的电子装置。在一个实施例中,互连可以包括至少一个柔性层(未示出)。例如,互连可以由相对柔软的材料形成,诸如聚合物、凝胶等。聚合物例如可以是聚对二甲苯(poly-para-xylylene)或导电聚合物(派瑞林-C(Parylene-C)、聚酰亚胺、聚二甲基硅氧烷(PDMS))。或者,互连可以由本领域已知的适合用作导体的任何导电材料形成,诸如金属(例如,铜、铬、铝、金、银、铁、钴、钛等)、纳米纤维、导电氧化物(例如,ZnO、氧化铟锡(ITO)、氟掺杂氧化锡(FTO)、ReO3、IrO2、CrO2等)和正温度系数热敏电阻(PTC)和负温度系数热敏电阻(NTC)。
在另一示例中,互连可以由多层形成,诸如取决于具体应用的要求所需的形成互连的顶部或底部的第一层或互连的顶部和底部两者上的双层和/或多层。
图1(A)-(C)中所示的每个几何形状可以具有适合于特定用途并且是本领域技术人员已知的任何尺寸。在图2(A)-(C)所示的一个示例性实施例中,每个图案由具有约1微米厚度(未示出)和约40微米的互连体宽度(w)的互连体102形成。图2(A)的常规的蛇形的半径(r)和图2(B)的半类似蛇形分别为约20μm和10μm。常规的蛇形的每个蛇形折叠的长度(l)为约310微米,并且自相似蛇形的每个蛇形折叠的长度(l1,l2)分别为235微米和580微米。这些尺寸仅以示例方式加以提供,并且可以使用适合于特定用途或应用的任何尺寸。
在一个示例性实施例中,阿基米德螺线结构100可以由极坐标中的分析函数规定为r=A·θq,其中r是螺线图案的半径,θ=[0,3π],A是几何前因子,并且q是确定函数形状的幂。变量A或q的值没有限制,它们是相关的,并且决定了螺线图案的形状。在另一个示例性实施例中,阿基米德螺线结构100由极坐标中的分析函数规定为r=±60θ1/1.7,θ=[0,3π],其中r是螺线图案的半径。在一个实施例中,螺线结构100的体宽(w)约为40微米。以这种方式,所有三种图案(图2(A)-(C))大致在x方向上具有约1000μm的相同的跨度,在y方向上具有约400μm的相同高度,以及约5.650μm的相同轮廓长度。在使用铜形成互连的一个实施例中,杨氏模量E是119GPa,并且泊松比v是0.34。可塑性被认为并且描述为其中εY=0.3%为屈服应变,Ep=530MPa并且n=0.44。
为了比较图2(A)-(C)的互连几何形状,开发了统一的标准。对于典型的岛互连结构,在无限制的状态下,岛也被称为功能体,应占据平面内大部分区域以增加面积覆盖。以示例的方式,可以使用2mm×2mm的岛和在岛之间的1mm间隙,其中2mm×2mm的岛大小与一些小的常规电子芯片的大小一致,并且面积覆盖可以达到45%以上。因此,由互连(即连接构件)填充的区域为2mm×1mm。在该区域中,可以使用一个互连或多个互连。考虑到所得结构的导电性,优选使用多个互连,因为一个互连的断裂不会导致整个结构的电气故障。因此,在一个实施例中,在每个岛之间的间隙中放置四个相同的互连,并且每个互连占据不超过0.5mm(高度)×1mm(宽度)的空间。统一地比较图1(A)-(C)中所示的不同互连之中的伸展性的另一个标准为应该使用相同的截面积和每个岛的面内轮廓长度,因此不同互连之中的电阻保持一致。
为了分析图2(A)-2(C)中所示的每个互连几何形状的伸展性,使用商业可用的有限元分析软件ABAQUS(由法国的Velizy-Villacoublay的Dassault Systemes制造)进行有限元分析。执行屈曲分析以获得前十个屈曲模式,然后以随机重量因子输入作为缺陷。在分析期间,使用具有降阶积分的20节点二次元(C3D20R),并且确保网格收敛。接下来,将规定的位移力施加到每个互连的最右端以伸展互连,同时最左端保持固定。在一定的加载步骤处,移除规定的位移力以确定变形是否可恢复。
在图3(A)-(C)中示出伸展性测试的结果。这些图示出了在相同的面内跨度和轮廓长度的限制下,图2(A)-(c)的三个图案中的每一个的弹性伸展性。这里,弹性伸展性定义为互连进入塑性变形区域的临界应变,即其中最大等效应变超过屈服应变。还分析了去除伸展力后的恢复能力。因此,对于每个三个互连几何形状,示出了在临界应变下的变形状态和在伸展力被去除时的释放状态两者,其中图例示出了等效塑性应变。为了比较,还提供了在临界应变的中间点处的互连的两个状态(变形的和释放的),其仍然在弹性范围内,因此变形是完全可恢复的。
如图3(A)-图3(C)所示,结果清楚地示出阿基米德螺线结构100具有最大的弹性伸展性,高达200%,而常规的蛇形和自相似的蛇形分别具有112%和98%的弹性伸展性。变形状态的图示示出了对于每个互连,平面内伸展伴随着平面外变形(主要是扭曲和弯曲)。换句话说,平面外变形补偿了平面内变形。特别是对于阿基米德螺线结构100,展开状变形发生以便补偿平面内伸展。从应用的角度来看,需要低水平的平面外变形,以便允许装置在厚度方向上更密集地堆叠。当临界应变被释放时,即使当已经发生塑性变形时,互连几乎恢复到其未变形的形状。这是因为,在临界点或稍微超过临界点处,进入塑性区的区域非常有限,并且大多数互连仍处于弹性域内。塑性变形定位在具有大曲率的区域处。
在图4(A)-(C)的曲线图中提供了上述测试的每个互连图案的应变行为。这里,每个互连的伸展性定义为最大主应变的最大值超过断裂应变1%的临界应变。图4(A)-(C)还示出了这三个互连图案之中的面外变形。图例表示具有塑性变形的材料的百分比。这里,示出了阿基米德螺线结构100仍然具有最高达270%的伸展性,而其他两个蛇形结构具有约220%的较小伸展性。阿基米德螺线结构100具有最高水平的面外变形,因为螺线的外环旋转以补偿面内伸展,但是最大面外变形300μm在岛或装置的厚度的范围内,这不会影响垂直方向上的堆叠密度。如图例所示,塑性变形的百分比相当小,约为1%,这表示甚至在进入塑性变形区之后螺线结构100具有恢复到其未变形状态的良好能力。
图3(A)-(C)和图4(A)-(C)所示的比较表明在相同的面内跨度和轮廓长度的限制下,互连图案的均匀和小的曲率可能有助于更大的伸展性。规则和半相似的蛇形(分别为图1(A)和图1(B))在其直线段上具有零曲率,但在其直线之间的接合处具有大的曲率。由于基于蛇形结构的设计限制,需要大的曲率以具有大的面填充比率。因此,基于蛇形结构的曲率沿着其长度从零曲率变化到大曲率,这导致较低的伸展性。
根据另一实施例,如图5所示,修改的螺线结构102用于形成互连,其中曲率沿着轮廓长度平滑地发展,使得它为拉长的。在一个实施例中,修改的螺线结构具有从0到3π变化的极角。
在另一个实施例中,使用两个阿基米德螺线结构100来形成互连。为了使基于螺线的结构更通用使得其可以更好地适合于非正方形区域,可以使用修改的阿基米德螺线结构100',如图6(A)所示。这里,水平和垂直尺寸之间的比率被调整以适合于非正方形区域。该途径是通过将平滑逼近乘以极坐标系中的θ的阶梯函数,然后插入直线以适应面内区域来修改原始的阿基米德螺线结构100。如图6(A)所示,互连体宽度(w)为40微米,并且每个折叠的长度(l)为300微米,但是可以使用适合于在特定应用中使用的任何特定尺寸。
通过在一端施加规定的位移力同时固定另一端来分析修改的阿基米德螺线结构100'的伸展性,如本文所述。该伸展性测试的结果在图6(B)中提供。使用与图4(A)-(C)中使用的相同的图例,在图6(B)上标出原始螺线结构100的结果。显然,该曲线图显示,修改的阿基米德螺线结构100'比原始螺线结构100更可伸展,具有在断裂前超过250%的弹性伸展性和325%的伸展性。最大面外位移约为450μm,这是可接受的水平。不受任何特定理论的束缚,据信修改的阿基米德螺线结构100'更可伸展,因为新添加的直线部分104允许结构更容易地产生面外变形而不引入大的曲率。
在一个方面中,螺线结构100耦合到并定位在相对的功能体700之间,以形成岛互连结构702,如图7(A)所示。在图7(B)所示的另一实施例中,使用两个螺线结构100来形成岛互连结构702'。在替代实施例中,岛互连结构702可以由多个螺线结构100形成,每个螺线结构100耦合到相对的功能体700。因此,每个互连能够选择性地在固定位置和可弯(pliable)位置之间可移动,所述固定位置处,不允许连接的功能体700之间的相对运动,在所述可弯位置处,允许连接的功能体700之间的相对运动。
尽管在前面的说明书中已经公开了本发明的几个实施例,但是本领域技术人员应当理解,本发明所涉及的许多修改和其它实施例将被考虑在内,具有在前面的描述和相关附图中呈现的教导的优点。因此,应当理解,本发明不限于上述公开的特定实施例,并且许多修改和其他实施例旨在被包括在所附权利要求的范围内。此外,尽管在本文中以及在随后的权利要求中采用了具体术语,但是它们仅在通用和描述性意义上使用,而不是限制所述发明以及所附权利要求的目的。
Claims (16)
1.一种电子装置,包括:
第一功能体;
第二功能体;以及
将所述第一功能体连接到所述第二功能体的至少一个连接构件,其中所述至少一个连接构件具有螺线图案并且悬在空气中以允许伸展、弯曲或压缩。
2.根据权利要求1所述的电子装置,其中所述螺线图案是阿基米德螺线。
3.根据权利要求2所述的电子装置,其中所述阿基米德螺线由函数r=A·θq规定,其中r是所述螺线图案的半径,θ=[0,3π],A是几何前因子,并且q是确定函数形状的幂。
4.根据权利要求2所述的电子装置,其中所述阿基米德螺线由函数r=±60θ1/1.7规定,其中r是所述螺线图案的半径,并且θ=[0,3π]。
5.根据权利要求2所述的电子装置,其中所述阿基米德螺线是拉长的。
6.根据权利要求1所述的电子装置,其中所述至少一个连接构件在固定位置和可弯位置之间是选择性地可移动的,使得所述第一功能体相对于所述第二功能体可移动,反之亦然。
7.根据权利要求1所述的电子装置,其中所述至少一个连接构件是导体。
8.根据权利要求7所述的电子装置,其中所述至少一个连接构件由铜、铬、铝、金、银、铁、钴、钛、导电纳米纤维、ZnO、氧化铟锡(ITO)、氟掺杂氧化锡(FTO)、ReO3、IrO2、CrO2、聚对二甲苯、派瑞林-C、聚酰亚胺或聚二甲基硅氧烷形成。
9.根据权利要求1所述的电子装置,其中所述至少一个连接构件具有约1微米的厚度。
10.根据权利要求1所述的电子装置,其中所述电子装置是电池。
11.根据权利要求1所述的电子装置,其中所述至少一个连接构件具有达200%的弹性伸展性。
12.根据权利要求1所述的电子装置,其中所述至少一个连接构件包括至少两个电连接的连接构件,每个连接构件具有螺线图案。
13.根据权利要求12所述的电子装置,其中所述至少两个电连接的连接构件具有达250%的弹性伸展性。
14.根据权利要求1所述的电子装置,其中所述电子装置包括多个功能体,每个功能体通过具有螺线图案的至少一个连接构件连接。
15.根据权利要求1所述的电子装置,其中所述至少一个连接构件由多层形成。
16.根据权利要求15所述的电子装置,其中所述多层中的至少一个是柔性层。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108520794A (zh) * | 2018-03-16 | 2018-09-11 | 连云港才用网络科技有限公司 | 可伸缩导线 |
CN112020772A (zh) * | 2018-04-28 | 2020-12-01 | 深圳市柔宇科技股份有限公司 | 基板、电子装置、接合结构及其接合方法 |
CN113314762A (zh) * | 2021-04-07 | 2021-08-27 | 湖州柔驰新能科技有限公司 | 一种多功能柔性电池及其制备方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017035318A1 (en) | 2015-08-25 | 2017-03-02 | Arizona Board Of Regents On Behalf Of Arizona State University | Edible supercapacitors |
US11342563B2 (en) | 2017-05-16 | 2022-05-24 | Arizona Board Of Regents On Behalf Of Arizona State University | Three-dimensional soft electrode for lithium metal batteries |
US10950912B2 (en) | 2017-06-14 | 2021-03-16 | Milwaukee Electric Tool Corporation | Arrangements for inhibiting intrusion into battery pack electrical components |
US11267613B2 (en) | 2018-02-02 | 2022-03-08 | Arizona Board Of Regents On Behalf Of Arizona State University | Origami-based collapsible and watertight cases |
WO2019164960A1 (en) | 2018-02-20 | 2019-08-29 | Hanqing Jiang | SWALLOWABLE, FOOD-BASED, DIGESTIBLE WIRELESS DEVICE FOR MEASURING GASTRIC pH |
US20240131234A1 (en) | 2021-02-20 | 2024-04-25 | Christian-Albrechts-Universitaet Zu Kiel | Auxetic web structure or field structure, and use |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030070833A1 (en) * | 2001-10-17 | 2003-04-17 | Barth Phillip W. | Extensible spiral for flex circuit |
CN101416302A (zh) * | 2006-04-07 | 2009-04-22 | 皇家飞利浦电子股份有限公司 | 可弹性变形的集成电路器件 |
KR20100131593A (ko) * | 2009-06-08 | 2010-12-16 | 서울대학교산학협력단 | 잡아 늘일 수 있는 전자소자들의 금속 연결 구조 및 그 제조방법 |
US20140220422A1 (en) * | 2013-02-06 | 2014-08-07 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with fluid containment |
Family Cites Families (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5008496A (en) | 1988-09-15 | 1991-04-16 | Siemens Aktiengesellschaft | Three-dimensional printed circuit board |
US4922059A (en) | 1988-12-29 | 1990-05-01 | Motorola, Inc. | Origami composite EMI/TEMPEST proof electronics module |
JPH03241392A (ja) | 1990-02-20 | 1991-10-28 | Casio Comput Co Ltd | 表示パネルの実装構造 |
US5115344A (en) | 1990-10-03 | 1992-05-19 | Motorola, Inc. | Tunable diffraction grating |
US5121297A (en) | 1990-12-31 | 1992-06-09 | Compaq Computer Corporation | Flexible printed circuits |
US5459461A (en) | 1993-07-29 | 1995-10-17 | Crowley; Robert J. | Inflatable keyboard |
US5519596A (en) | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
US6050962A (en) | 1997-04-21 | 2000-04-18 | Virtual Technologies, Inc. | Goniometer-based body-tracking device and method |
US5903440A (en) | 1998-01-30 | 1999-05-11 | Delco Electronics Corporaiton | Method of forming assemblies of circuit boards in different planes |
US6476733B1 (en) | 1998-10-28 | 2002-11-05 | Ahmad Amiri | Thin electronic data input device |
US5969783A (en) | 1998-12-11 | 1999-10-19 | National Semiconductor Corporation | Reflective liquid crystal display and connection assembly and method |
DE19909399C1 (de) | 1999-03-04 | 2001-01-04 | Osram Opto Semiconductors Gmbh | Flexibles LED-Mehrfachmodul, insb. für ein Leuchtengehäuse eines Kraftfahrzeuges |
US6384890B1 (en) | 1999-11-15 | 2002-05-07 | National Semiconductor Corporation | Connection assembly for reflective liquid crystal projection with branched PCB display |
US6461762B1 (en) | 2000-04-20 | 2002-10-08 | Industrial Technology Research Institute | Rechargeable battery structure having a stacked structure of sequentially folded cells |
WO2001094253A2 (en) | 2000-06-02 | 2001-12-13 | Calient Networks, Inc. | Bulk silicon structures with thin film flexible elements |
US6482540B1 (en) | 2000-07-14 | 2002-11-19 | Valence Technology (Nevada), Inc. | Multi-fold rechargeable battery cell structure |
US6584857B1 (en) | 2000-11-20 | 2003-07-01 | Eastman Kodak Company | Optical strain gauge |
US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
US6455931B1 (en) * | 2001-05-15 | 2002-09-24 | Raytheon Company | Monolithic microelectronic array structure having substrate islands and its fabrication |
US6695457B2 (en) | 2001-06-02 | 2004-02-24 | Capella Photonics, Inc. | Bulk silicon mirrors with hinges underneath |
ES2187285B1 (es) | 2001-08-24 | 2004-08-16 | Lear Automotive (Eeds) Spain, S.L. | Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido. |
AU2002330718A1 (en) * | 2001-09-03 | 2003-03-18 | National Microelectronic Research Centre University College Cork - National University Of Ireland Co | Integrated circuit structure and a method of making an integrated circuit structure |
JP2003151526A (ja) | 2001-11-14 | 2003-05-23 | Nissan Motor Co Ltd | 組電池及びその設置方法 |
TW515062B (en) | 2001-12-28 | 2002-12-21 | Delta Optoelectronics Inc | Package structure with multiple glue layers |
US20030129488A1 (en) | 2002-01-09 | 2003-07-10 | Gross Oliver J. | Planar battery and method of sealing |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
TW558622B (en) | 2002-01-24 | 2003-10-21 | Yuan Lin | Lamp on sheet and manufacturing method thereof |
US20050099361A1 (en) | 2002-03-27 | 2005-05-12 | Vladimir Majer | Foldable display/screen for portable electronic devices |
CN100585274C (zh) | 2002-10-25 | 2010-01-27 | 森山产业株式会社 | 发光模块 |
US7371970B2 (en) | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
KR100958647B1 (ko) | 2002-12-18 | 2010-05-20 | 삼성에스디아이 주식회사 | 파우치형 이차전지 유니트 |
US20050110702A1 (en) | 2003-11-21 | 2005-05-26 | Aoki Paul M. | Collapsible display device and methods for using the same |
JP4507604B2 (ja) | 2004-01-16 | 2010-07-21 | 信越半導体株式会社 | 貼り合せ歪みウェーハの歪み量測定方法 |
US7513664B2 (en) | 2004-05-10 | 2009-04-07 | Ichikoh Industries, Ltd. | Outside mirror apparatus including lighting device for vehicle |
JP4536430B2 (ja) | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
US7629691B2 (en) * | 2004-06-16 | 2009-12-08 | Honeywell International Inc. | Conductor geometry for electronic circuits fabricated on flexible substrates |
KR100601534B1 (ko) | 2004-07-28 | 2006-07-19 | 삼성에스디아이 주식회사 | 전지용 외장재 및 이를 이용한 리튬 폴리머 전지 |
US7215547B2 (en) | 2004-08-16 | 2007-05-08 | Delphi Technologies, Inc. | Integrated cooling system for electronic devices |
US7718580B2 (en) | 2004-09-03 | 2010-05-18 | Idemitsu Kosan Co., Ltd. | Internal-olefin composition and base oil comprising the composition for oil drilling |
US7259106B2 (en) | 2004-09-10 | 2007-08-21 | Versatilis Llc | Method of making a microelectronic and/or optoelectronic circuitry sheet |
US7371143B2 (en) | 2004-10-20 | 2008-05-13 | Corning Incorporated | Optimization of parameters for sealing organic emitting light diode (OLED) displays |
CN1297033C (zh) | 2004-11-25 | 2007-01-24 | 惠州Tcl金能电池有限公司 | 一种锂电池的电芯结构及其制造方法 |
US7351346B2 (en) | 2004-11-30 | 2008-04-01 | Agoura Technologies, Inc. | Non-photolithographic method for forming a wire grid polarizer for optical and infrared wavelengths |
DE102005012404B4 (de) | 2005-03-17 | 2007-05-03 | Siemens Ag | Leiterplatte |
KR101171192B1 (ko) | 2005-10-21 | 2012-08-06 | 삼성전자주식회사 | 박막트랜지스터 기판와 그 제조방법 |
EP1816493A1 (en) | 2006-02-07 | 2007-08-08 | ETH Zürich | Tunable diffraction grating |
US7265719B1 (en) | 2006-05-11 | 2007-09-04 | Ball Aerospace & Technologies Corp. | Packaging technique for antenna systems |
US8087117B2 (en) | 2006-05-19 | 2012-01-03 | Irobot Corporation | Cleaning robot roller processing |
TW200802928A (en) | 2006-06-13 | 2008-01-01 | Bright View Electronics Co Ltd | A flexible ribbon illumination device and manufacture method thereof |
US8071883B2 (en) | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
JP2008112849A (ja) | 2006-10-30 | 2008-05-15 | Toshiba Corp | プリント配線板、プリント配線板の屈曲加工方法および電子機器 |
US8460785B2 (en) | 2006-11-15 | 2013-06-11 | Board Of Trustees Of Michigan State University | Wrinkle-free nanomechanical film |
US7858156B2 (en) | 2006-11-27 | 2010-12-28 | The University Of Massachusetts | Surface buckling method and articles formed thereby |
TWI306364B (en) | 2006-12-29 | 2009-02-11 | Ind Tech Res Inst | Flexible display panel device |
KR100879864B1 (ko) | 2007-06-28 | 2009-01-22 | 삼성모바일디스플레이주식회사 | 발광 표시 장치 및 그의 제조 방법 |
US20090103295A1 (en) | 2007-10-17 | 2009-04-23 | Keeper Technology Co., Ltd. | LED unit and LED module |
US20090167171A1 (en) | 2007-11-22 | 2009-07-02 | Samsung Mobile Display Co., Ltd. | Display device, organic light emitting diode display and manufacturing method of the same |
KR101110865B1 (ko) | 2007-11-27 | 2012-02-15 | 엘이디라이텍(주) | 램프유닛 |
DE102007061979A1 (de) | 2007-12-21 | 2009-06-25 | Giesecke & Devrient Gmbh | Sicherheitselement |
KR100893619B1 (ko) | 2008-02-18 | 2009-04-20 | 삼성모바일디스플레이주식회사 | 유기발광 표시장치를 구비한 전자 기기 |
WO2009126544A1 (en) | 2008-04-08 | 2009-10-15 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University | Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
US8906284B2 (en) | 2008-05-28 | 2014-12-09 | The University Of Massachusetts | Wrinkled adhesive surfaces and methods for the preparation thereof |
US8207473B2 (en) | 2008-06-24 | 2012-06-26 | Imec | Method for manufacturing a stretchable electronic device |
US8646693B2 (en) | 2008-08-29 | 2014-02-11 | The Invention Science Fund I, Llc | Application control based on flexible electronic device conformation sequence status |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US9459656B2 (en) | 2008-10-12 | 2016-10-04 | Samsung Electronics Co., Ltd. | Flexible devices and related methods of use |
KR20100070217A (ko) | 2008-12-17 | 2010-06-25 | 한국전자통신연구원 | 가변형 회절 격자 장치 |
US8080736B2 (en) | 2009-02-18 | 2011-12-20 | Teledyne Scientific & Imaging, Llc | Non-planar microcircuit structure and method of fabricating same |
TWM379006U (en) | 2009-10-22 | 2010-04-21 | Jia-hao ZHANG | LED light bar |
TW201127228A (en) | 2010-01-22 | 2011-08-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
WO2011113038A2 (en) | 2010-03-12 | 2011-09-15 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Buckled silicon nanostructures on elastomeric substrates for rechargeable lithium ion batteries |
JP5426771B2 (ja) | 2010-06-29 | 2014-02-26 | パナソニック株式会社 | 薄型フレキシブル電池 |
US20120143525A1 (en) | 2010-12-03 | 2012-06-07 | Baker Hughes Incorporated | Interpretation of Real Time Compaction Monitoring Data Into Tubular Deformation Parameters and 3D Geometry |
US8716037B2 (en) | 2010-12-14 | 2014-05-06 | International Business Machines Corporation | Measurement of CMOS device channel strain by X-ray diffraction |
TW201227639A (en) | 2010-12-29 | 2012-07-01 | Ind Tech Res Inst | Flexible display apparatus and fabrication method of flexible display apparatus |
US8780579B2 (en) | 2011-01-05 | 2014-07-15 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US8792169B2 (en) | 2011-01-24 | 2014-07-29 | Arizona Board Of Regents On Behalf Of Arizona State University | Optical diffraction gratings and methods for manufacturing same |
JP2012255766A (ja) | 2011-05-19 | 2012-12-27 | Elpida Memory Inc | 結晶材料の格子歪分布評価方法及び格子歪分布評価システム |
US9343716B2 (en) | 2011-12-29 | 2016-05-17 | Apple Inc. | Flexible battery pack |
TWI459201B (zh) | 2012-04-27 | 2014-11-01 | Toshiba Kk | Information processing device |
US9882224B2 (en) | 2012-08-21 | 2018-01-30 | Nokia Technologies Oy | Method and apparatus for flexible battery |
WO2014113489A1 (en) | 2013-01-15 | 2014-07-24 | Hanqing Jiang | Origami enabled manufacturing systems and methods |
KR20140094880A (ko) | 2013-01-23 | 2014-07-31 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
US10292263B2 (en) | 2013-04-12 | 2019-05-14 | The Board Of Trustees Of The University Of Illinois | Biodegradable materials for multilayer transient printed circuit boards |
US10153519B2 (en) | 2013-12-27 | 2018-12-11 | Arizona Board Of Regents On Behalf Of Arizona State University | Deformable origami batteries |
US10418664B2 (en) | 2014-09-26 | 2019-09-17 | Arizona Board Of Regents On Behalf Of Arizona State University | Stretchable batteries |
WO2016073584A1 (en) | 2014-11-04 | 2016-05-12 | Arizona Board Of Regents On Behalf Of Arizona State University | Origami enabled deformable electronics |
US10502991B2 (en) | 2015-02-05 | 2019-12-10 | The Arizona Board Of Regents On Behalf Of Arizona State University | Origami displays and methods for their manufacture |
KR20160127892A (ko) | 2015-04-27 | 2016-11-07 | 삼성디스플레이 주식회사 | 플렉서블 기판 및 이를 포함하는 표시 장치 |
US11342563B2 (en) | 2017-05-16 | 2022-05-24 | Arizona Board Of Regents On Behalf Of Arizona State University | Three-dimensional soft electrode for lithium metal batteries |
US11267613B2 (en) | 2018-02-02 | 2022-03-08 | Arizona Board Of Regents On Behalf Of Arizona State University | Origami-based collapsible and watertight cases |
-
2015
- 2015-12-30 CN CN201580077410.9A patent/CN107431059B/zh active Active
- 2015-12-30 WO PCT/US2015/068038 patent/WO2016109652A1/en active Application Filing
-
2017
- 2017-06-16 US US15/625,924 patent/US10660200B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030070833A1 (en) * | 2001-10-17 | 2003-04-17 | Barth Phillip W. | Extensible spiral for flex circuit |
CN101416302A (zh) * | 2006-04-07 | 2009-04-22 | 皇家飞利浦电子股份有限公司 | 可弹性变形的集成电路器件 |
US20090283891A1 (en) * | 2006-04-07 | 2009-11-19 | Koninklijke Philips Electronics N.V. | Elastically deformable integrated-circuit device |
KR20100131593A (ko) * | 2009-06-08 | 2010-12-16 | 서울대학교산학협력단 | 잡아 늘일 수 있는 전자소자들의 금속 연결 구조 및 그 제조방법 |
US20140220422A1 (en) * | 2013-02-06 | 2014-08-07 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with fluid containment |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108520794A (zh) * | 2018-03-16 | 2018-09-11 | 连云港才用网络科技有限公司 | 可伸缩导线 |
CN112020772A (zh) * | 2018-04-28 | 2020-12-01 | 深圳市柔宇科技股份有限公司 | 基板、电子装置、接合结构及其接合方法 |
CN113314762A (zh) * | 2021-04-07 | 2021-08-27 | 湖州柔驰新能科技有限公司 | 一种多功能柔性电池及其制备方法 |
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US10660200B2 (en) | 2020-05-19 |
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