WO2019205150A1 - 基板、电子装置、接合结构及其接合方法 - Google Patents

基板、电子装置、接合结构及其接合方法 Download PDF

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Publication number
WO2019205150A1
WO2019205150A1 PCT/CN2018/085115 CN2018085115W WO2019205150A1 WO 2019205150 A1 WO2019205150 A1 WO 2019205150A1 CN 2018085115 W CN2018085115 W CN 2018085115W WO 2019205150 A1 WO2019205150 A1 WO 2019205150A1
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WIPO (PCT)
Prior art keywords
substrate
axis
joint
joint portion
bottom plate
Prior art date
Application number
PCT/CN2018/085115
Other languages
English (en)
French (fr)
Inventor
许志高
沈贺文
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2018/085115 priority Critical patent/WO2019205150A1/zh
Priority to CN201880091113.3A priority patent/CN112020772A/zh
Priority to US17/041,391 priority patent/US11304296B2/en
Publication of WO2019205150A1 publication Critical patent/WO2019205150A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a substrate, an electronic device, a bonding structure, and a bonding method thereof.
  • a flexible printed circuit board (FPC: Flexible Printed Circuit) is bonded/bonded to a substrate of a flexible display panel to realize an electrical signal. input of.
  • FPC Flexible Printed Circuit
  • embodiments of the present invention disclose a substrate, an electronic device, a bonding structure, and a bonding method thereof.
  • a substrate comprising a bottom plate and at least one joint portion disposed on the bottom plate, the joint portion being a partial Archimedes spiral structure.
  • the substrate includes a first axis
  • the joint portion includes at least one first joint portion and at least one second joint portion, the at least one first joint portion being located at one side of the first axis, At least one second joint is located on the other side of the first axis.
  • the at least one first joint portion and the at least one second joint portion are spaced apart along a second axis, the first axis intersecting the second axis.
  • each of the first engaging portions is disposed corresponding to a second engaging portion, and each of the first engaging portions and its corresponding second engaging portion are centrally symmetrical with respect to an intersection of the first axis and the second axis.
  • first axis is perpendicular to the second axis.
  • all the first joint portions are located in the same Archimedes spiral structure.
  • the substrate is a flexible substrate.
  • a bonding structure comprising a first substrate and a second substrate, wherein the first substrate and the second substrate each comprise a bottom plate and at least one joint portion disposed on the bottom plate, and the first substrate is bonded The portion is bonded to the corresponding joint portion on the second substrate, and at least one of the first substrate and the second substrate is a substrate as described above.
  • a spacing between each adjacent two joints on the first substrate is the same as a spacing between corresponding two adjacent joints on the second substrate.
  • a joint portion of one of the first substrate and the second substrate is a partial Archimedes spiral structure, and a joint portion of the other substrate includes an arc structure.
  • the first substrate is a flexible display panel
  • the second substrate is a flexible circuit board.
  • An electronic device comprising a joint structure as described above.
  • a joining method of the joining structure as described above, comprising the steps of:
  • the first axis of the bottom plate of the second substrate corresponds to the first axis of the bottom plate of the first substrate
  • the second axis of the bottom plate of the second substrate corresponds to the second axis of the bottom plate of the first substrate for initial alignment.
  • the second substrate is rotated twice at a first angle around a center point, and the center point is the second substrate A point of intersection of the first axis and the second axis of the second substrate.
  • the difference between the joint portions of the first substrate due to thermal expansion is L; and the second portion of the second substrate is parallel to the second axis
  • the substrate, the electronic device, the bonding structure and the bonding method thereof are provided. Since the bonding portion on the substrate has a partial Archimedes spiral structure, when the substrates need to be joined, the substrate can be rotated and adjusted to avoid the joint portion on the substrate. The problem of misalignment due to factors such as thermal expansion improves the alignment accuracy of the substrate and further improves the bonding progress of the substrate.
  • FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the joint structure in the electronic device shown in FIG. 1.
  • FIG. 3 is a schematic view showing an Archimedes spiral structure in which an Archimedean spiral structure in which a joint portion of the first substrate is located and a corresponding joint portion on the second substrate are expanded.
  • Fig. 4 is a schematic view showing the rotation adjustment expansion of the Archimedes spiral structure.
  • FIG. 5 is a schematic diagram of the initial alignment of the first substrate and the second substrate.
  • FIG. 6 is a schematic diagram of the secondary alignment after the second substrate is rotated relative to the first substrate.
  • FIG. 7 is a schematic diagram of a first substrate and a second substrate in a bonding structure according to another embodiment of the present invention.
  • Figure 8 is a flow chart of a joining method of the joint structure.
  • an embodiment of the present invention provides an electronic device 100 .
  • the electronic device 100 is a flexible display device. It can be understood that the electronic device 100 can be other electronic devices, such as a non-flexible display device.
  • the electronic device 100 includes a bonding structure 10 including a first substrate 101 and a second substrate 103 that are bonded to each other.
  • the first substrate 101 and the second substrate 103 each include a bottom plate 11 and are disposed on At least one joint portion 13 on the bottom plate 11, the joint portion 13 of the first substrate 101 and the joint portion 13 of the corresponding second substrate 103 are joined and bonded together.
  • the first substrate 101 and the second substrate 103 are flexible substrates, wherein the first substrate 101 is a flexible display panel, and the second substrate 103 is a flexible circuit board. It can be understood that the first substrate 101 can be a rigid substrate, the second substrate 103 can be a rigid substrate, and electronic devices such as chips can be attached to the second substrate 103.
  • the joint portion 13 is a pad provided on the bottom plate 11, and the joint portion 13 of the first substrate 101 and the joint portion 13 of the corresponding second substrate 103 are attached together by welding bonding. It can be understood that in other embodiments, the joint portion 13 may be provided as an adhesive member, and the joint portion 13 may also be a hole or groove structure.
  • the material of the bottom plate 11 of the first substrate 101 is different from the material of the bottom plate 11 of the second substrate 103, and the first substrate 101 will be described in detail below.
  • the bottom plate 11 includes a first axis 201 and a second axis 203 that is perpendicular to the first axis 201.
  • the joint portion 13 is a partial Archimedes spiral structure.
  • the at least one joint portion 13 is aligned along the second axis 203.
  • the ⁇ is the angle of a point on the joint 13 with respect to the origin of the Archimedes spiral structure.
  • the spacing between each adjacent two joint portions 13 on the first substrate 101 is the same as the spacing between the corresponding adjacent two joint portions 13 on the second substrate 103 to ensure the joint accuracy.
  • the bottom plate 11 includes a first joint region 112 and a second joint region 114.
  • the first land 112 is located on one side of the first axis 201
  • the second land 114 is located on the other side of the first axis 201.
  • the first land 112 and the second land 114 are respectively located on the first axis 201. On both sides.
  • the at least one joint portion 13 includes at least one first joint portion 135 and at least one second joint portion 137.
  • the first joint portion 135 is located at the first joint region 112 and the second joint portion 137 is located at the second joint portion 114.
  • Each of the first engaging portions 135 and the corresponding second engaging portion 137 is center-symmetrical with respect to a point of intersection of the first axis 201 and the second axis 203.
  • the at least one first joint portion 135 and the at least one second joint portion 137 are arranged along the second axis 203.
  • the first bonding portion 135 of the first substrate 101 and the first bonding portion 135 of the corresponding second substrate 103 are bonded together, the second bonding portion 137 of the first substrate 101 and the second bonding portion 137 of the corresponding second substrate 103 Join together. Since the first bonding portion 135 on the same substrate is center-symmetrical with the corresponding second bonding portion 137, the alignment accuracy of the first substrate 101 and the second substrate 103 in alignment is further improved, thereby improving the precision of bonding.
  • the joint portion 13 of the same joint region on the same substrate for example, the first joint portion 135 on the first substrate 101 is located in the same Archimedes spiral structure, thereby improving the joint precision. It can be understood that when the number of the joint portions is more than one, the joint portions 13 on the same substrate may all be located on the same Archimedes spiral structure, for example, the first joint portion 135 on the first substrate 101 and the second joint. The portions 137 are all located on the same Archimedes spiral structure, and the first joint portion 135 and the second joint portion 137 are not centrally symmetric.
  • the bonding portion 13 of the two is retracted or expanded due to a high temperature (for example, 170 degrees to 200 degrees), so that the first substrate is required.
  • the size of the joint portion 13 of the 101 and the joint portion 13 of the corresponding second substrate 103 is corrected.
  • FIG. 3 is a schematic diagram of an Archimedes spiral structure in which the junction of the Archimedes spiral structure of the first substrate 101 and the corresponding second substrate 103 is located, wherein A1 represents the first An Archimedes spiral structure in which a joint portion 13 of a substrate 101 is located, and A2 represents an Archimedes spiral structure in which the joint portion 13 of the corresponding second substrate 101 is located.
  • the second substrate 103 is rotated by a first angle ⁇ around the center point to enable the second substrate.
  • the joint portion 13 of the 103 is aligned with the joint portion 13 of the corresponding first substrate 101.
  • the center point is the intersection of the first axis 201 of the second substrate 103 and the second axis 203 of the second substrate 103, and the center point is also the first axis 201 of the first substrate 101 and The intersection of the second axis 203 of the first substrate 101.
  • the first substrate 101 and the second substrate 103 are first aligned, specifically: the second substrate 103 is An axis 201 corresponds to the first axis 201 of the first substrate 101, and a second axis 203 of the second substrate 103 corresponds to the second axis 203 of the first substrate 101.
  • the second substrate 103 is rotated twice by the first angle ⁇ around the center point. In the present embodiment, the position of the first substrate 101 is maintained during the secondary alignment process.
  • the joint portion 13 of the first substrate 101 and the joint portion 13 of the corresponding second substrate 103 are bonded and bonded together. It can be understood that, in the secondary alignment, the second substrate 103 is rotated about the center point relative to the first substrate 101 by the first angle ⁇ .
  • FIG. 4 is a schematic diagram of the rotation adjustment expansion of the Archimedes spiral structure, wherein B1 represents expansion, B2 represents expansion, and B3 represents rotation.
  • B1 represents expansion
  • B2 represents expansion
  • B3 represents rotation.
  • the joint portion 13 of the first substrate 101 and the joint portion 13 of the second substrate 103 are both partial Archimedes spiral arc structures, the first substrate 101 is bonded after being rotated twice.
  • the joint portion 13 of the portion 13 and the corresponding second substrate 103 can be joined together well.
  • the expansion coefficient of the bottom plate 11 of the first substrate 101 is smaller than the expansion coefficient of the bottom plate 11 of the second substrate 103, referring to FIG. 5, in the initial alignment, it is apparent that the first substrate 101 is bonded.
  • the joint portion 13 of the portion 13 and the second substrate 103 may be misaligned. The greater the degree of misalignment between the joint portion 13 on the second substrate 103 having a larger distance from the first axis 201 and the joint portion 13 on the corresponding first substrate 101 .
  • the second substrate 103 is rotated clockwise around the center point by the first angle ⁇ .
  • the second substrate 103 rotates the first angle ⁇ counterclockwise around the center point.
  • the material of the first substrate 101 is the same as the material of the second substrate 103, but may be affected by other external factors such as the manufacturing process of the first substrate 101 and the second substrate 103.
  • the first substrate 101 and the second substrate 103 need to be corrected before being joined.
  • the joint portions 13 on the first substrate 101 and the second substrate 103 are both partial Archimedes spiral structures, if the joint portions 13 on the first substrate 101 and the second substrate 103 are contracted or expanded due to thermal expansion, When the alignment is performed, one of the first substrate 101 and the second substrate 103 is rotated by a certain angle to perform fine adjustment, thereby avoiding the misalignment of the joint, thereby improving the joint binding precision. Since the Archimedes spiral structure has a feature that the distance increases as the angle increases, the alignment adjustment can be performed by the rotation angle, and the alignment difference caused by the thermal expansion of the first substrate 101 and the second substrate 103 can be corrected.
  • FIG. 7 is a bonding structure 70 according to another embodiment of the present invention.
  • the bonding structure 70 includes a first substrate 701 and a second substrate 703.
  • the first substrate 701 and the second substrate 703 each include a bottom plate 71 and at least one joint portion 73 disposed on the bottom plate 71.
  • the bonding portion 73 of the substrate 701 is bonded and bonded to the corresponding bonding portion 73 of the second substrate 703.
  • the second substrate 703 and the second substrate 103 of the first embodiment are The structure is the same, that is, the joint portion 73 of the second substrate 703 is a partial Archimedes spiral structure, and the structure of the first substrate 701 is substantially the same as that of the first substrate 101 described in the first embodiment, the first The substrate 701 is different from the first substrate 101 in that the joint portion 73 of the first substrate 701 has a non-partial Archimedes spiral structure, and the joint portion 73 of the first substrate 701 has an elliptical structure.
  • joint portion 73 of the first substrate 701 is obliquely arranged along the second axis 803. It can be understood that the joint portion 73 of the first substrate 701 can also be a circular shape, a partial arc structure, or the like, which is not limited herein.
  • the spacing between each adjacent two bonding portions 73 on the first substrate 701 is the same as the spacing between the corresponding adjacent two bonding portions 73 on the second substrate 703 to ensure the bonding accuracy.
  • the present invention further provides a bonding method of a bonding structure, the bonding structure including a first substrate and a second substrate, and the bonding method includes the following steps:
  • Step 201 Perform initial alignment of the second substrate and the first substrate.
  • the first axis of the second substrate corresponds to the first axis of the first substrate
  • the second axis of the second substrate corresponds to the second axis of the first substrate for initial alignment.
  • Step 202 Perform secondary alignment on the second substrate.
  • the second substrate is rotated twice by a first angle around a center point, where the center point is an intersection of a first axis of the second substrate and a second axis of the second substrate;
  • Step 203 joins the joint portion of the first substrate and the joint portion of the corresponding second substrate.
  • the second Rotating the first angle clockwise around the center point of the substrate, and rotating the second substrate counterclockwise around the center point when the expansion coefficient of the bottom plate of the first substrate is greater than the expansion coefficient of the bottom plate of the second substrate The first angle.
  • the joint portion of the first substrate is a partial Archimedes spiral structure
  • the joint portion of the second substrate is a partial Archimedes spiral structure
  • the first angle Where ⁇ L is the distance between the joint portion of the first substrate and the joint portion on the corresponding second substrate along the second axis in the initial alignment
  • b is a real number.
  • the joint portion of the second substrate is a partial Archimedes spiral structure
  • the joint portion of the first substrate is a non-partial Archimedes spiral structure.
  • the joint portion of the first substrate is It may also be an elliptical shape, a circular shape, a partial arc structure, or the like, which is not limited herein.
  • the joint portions of the first substrate are obliquely arranged along the second axis.
  • the spacing between each adjacent two joints on the first substrate is the same as the spacing between the corresponding two adjacent joints on the second substrate to ensure the joint accuracy.
  • the method for bonding a substrate, an electronic device and a substrate provided by the present invention, when a substrate needs to be bonded to another substrate or an electronic device, since the joint portion on the substrate has an arc structure, the substrate can be rotated and adjusted to avoid bonding on the substrate.
  • the problem of misalignment due to factors such as thermal expansion improves the alignment accuracy of the substrate and further improves the bonding progress of the substrate.
  • the first bonding portion on the same substrate is symmetric with the corresponding second bonding portion, thereby further improving the alignment accuracy of the substrate and the second substrate, thereby improving the bonding precision, and improving the production yield of the electronic device and Use reliability.

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明公开一种基板，包括底板及设于所述底板上的至少一个接合部，所述接合部为部分阿基米德螺旋结构。由于基板上的接合部为部分阿基米德螺旋结构，可将基板旋转调整，避免基板上的接合部因热膨胀等因素造成错位的问题，提高了基板的对位精度，进而提高所述基板的接合进度。本发明还提供一种电子装置、接合结构及其接合方法。

Description

基板、电子装置、接合结构及其接合方法 技术领域
本发明涉及显示技术领域，特别涉及一种基板、电子装置、接合结构及其接合方法。
背景技术
电子产业中，基板之间的接合是较为常见的工序，例如，在柔性显示装置中，将柔性线路板(FPC：Flexible Printed Circuit)接合/绑定(bonding)到柔性显示面板的基板实现电信号的输入。然而，在接合过程中，不同的材质之间的热膨胀系数不同，易造成错位，导致接合不良。
发明内容
为解决上述问题，本发明实施例公开一种基板、电子装置、接合结构及其接合方法。
一种基板，包括底板及设于所述底板上的至少一个接合部，所述接合部为部分阿基米德螺旋结构。
进一步地，所述基板包括第一轴线，所述接合部包括至少一个第一接合部及至少一个第二接合部，所述至少一个第一接合部位于所述第一轴线的一侧，所述至少一个第二接合部位于所述第一轴线的另一侧。
进一步地，所述至少一个第一接合部与所述至少一个第二接合部沿第二轴线间隔排列，所述第一轴线与所述第二轴线相交。
进一步地，每个第一接合部与一个第二接合部对应设置，每个第一接合部与其对应的第二接合部关于所述第一轴线与所述第二轴线的相交点呈中心对称。
进一步地，所述第一轴线与所述第二轴线垂直。
进一步地，所述第一接合部的数量大于一个时，所有的第一接合部均位于同一个阿基米德螺旋结构。
进一步地，所述基板为柔性基板。
一种接合结构，其包括相接合的第一基板及第二基板，所述第一基板及所述第二基板均包括底板及设于所述底板上的至少一个接合部，第一基板的接合部与所述第二基板上对应的接合部接合绑定于一起，所述第一基板及所述第二基板两者中的至少其中之一为如上所述的基板。
进一步地，所述第一基板上每相邻的两个接合部之间的间距与所述第二基板上对应的相邻两个接合部之间的间距相同。
进一步地，所述第一基板及所述第二基板两者中的其中一个基板的接合部为部分阿基米德螺旋结构，另外一个基板的接合部包括弧形结构。
进一步地，所述第一基板为柔性显示面板，所述第二基板为柔性线路板。
一种电子装置，其包括如上所述的接合结构。
一种如上所述接合结构的接合方法，包括以下步骤：
将所述第二基板与所述第一基板进行初次对位；
将所述第二基板进行二次对位；
将所述第一基板的接合部与对应的第二基板上接合部接合于一起。
进一步地，所述“将所述第二基板与所述第一基板进行初次对位”中，将所述第二基板的底板的第一轴线对应所述第一基板的底板的第一轴线，所述第二基板的底板的第二轴线对应所述第一基板的底板的第二轴线，进行初次对位。
进一步地，所述“将所述第二基板进行二次对位”中，将所述第二基板绕中心点旋转第一角度进行二次对位，所述中心点为所述第二基板的第一轴线与所述第二基板的第二轴线的相交点。
进一步地，沿所述第一基板的第二轴线的平行方向，设所述第一基板的接合部因热膨胀造成的差异为L；沿第二基板的第二轴线的平行方向，设所述第二基板的接合部因热膨胀造成的差异为L’，所述第一角度
Figure PCTCN2018085115-appb-000001
其中，ΔL＝L-L，b为实数。
本发明提供的基板、电子装置、接合结构及其接合方法，由于基板上的接合部呈部分阿基米德螺旋结构，基板之间需接合时，可将基板旋转调整，避免 基板上的接合部因热膨胀等因素造成错位的问题，提高了基板的对位精度，进而提高所述基板的接合进度。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的电子装置的示意图。
图2为图1所示电子装置中的接合结构的分解示意图。
图3为第一基板的一接合部所在的阿基米德螺旋结构与第二基板上对应的接合部在膨胀后所在的阿基米德螺旋结构的示意图。
图4为阿基米德螺旋结构旋转调整膨胀示意图。
图5为第一基板与第二基板的初次对位示意图。
图6为第二基板相对第一基板旋转后的二次对位示意图。
图7为本发明另一实施方式提供的接合结构中的第一基板与第二基板的示意图。
图8为接合结构的接合方法的流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明一实施方式提供一种电子装置100。本实施方式中，电子装置100为柔性显示装置。可以理解，所述电子装置100可以为其他电子装置，如非柔性显示装置。
请参阅图2，所述电子装置100包括接合结构10，所述接合结构10包括相接合的第一基板101及第二基板103，第一基板101及第二基板103均包括底板11及设于所述底板11上的至少一个接合部13，第一基板101的接合部13与对应的第二基板103的接合部13接合绑定于一起。
本实施方式中，第一基板101与第二基板103为柔性基板，其中第一基板101为柔性显示面板，第二基板103为柔性线路板。可以理解，第一基板101可以为刚性基板，第二基板103可以为刚性基板，所述第二基板103上可以贴附芯片等电子器件。
所述接合部13为设于底板11上的焊垫(pad)，所述第一基板101的接合部13与对应的第二基板103的接合部13通过焊接绑定贴附于一起。可以理解，在其它实施例中，所述接合部13可以设置成粘贴件，所述接合部13亦可以为孔或沟槽结构。
本实施方式中，第一基板101的底板11的材质不同于第二基板103的底板11的材质，以下以第一基板101作详细说明。
在一具体实施例中，所述底板11包括第一轴线201及与所述第一轴线201垂直的第二轴线203。
在本实施方式中，所述接合部13为部分阿基米德螺旋结构。
所述至少一个接合部13沿所述第二轴线203排列。取其中一个接合部13，根据阿基米德螺线极坐标公式：
r＝a+bθ        (1)，
其中，a和b均为实数；
将(1)转换成笛卡尔坐标系为：
x＝(α+βθ)cosθ       (2)，
y＝(α+βθ)sinθ         (3)，
则
Figure PCTCN2018085115-appb-000002
所述θ即为所述接合部13上的某个点相对于所在阿基米德螺旋结构原点的角度。
所述第一基板101上每相邻的两个接合部13之间的间距与第二基板103上对应的相邻两个接合部13之间的间距相同，以保障接合准度。
进一步地，所述底板11包括第一接合区112及第二接合区114。第一接合区112位于第一轴线201的一侧，第二接合区114位于第一轴线201的另一侧，换句话说，第一接合区112与第二接合区114分别位于第一轴线201的两侧。
所述至少一个接合部13包括至少一个第一接合部135及至少一个第二接合部137。第一接合部135位于第一接合区112，第二接合部137位于第二接合区114。每个第一接合部135与对应的第二接合部137呈关于所述第一轴线201与所述第二轴线203的相交点中心对称。
进一步地，所述至少一个第一接合部135及所述至少一个第二接合部137沿第二轴线203排列。
第一基板101的第一接合部135与对应的第二基板103的第一接合部135接合于一起，第一基板101的第二接合部137与对应的第二基板103的第二接合部137接合于一起。由于同一基板上的第一接合部135与对应的第二接合部137呈中心对称，进一步提高第一基板101与第二基板103对位时的对位精度，进而提高接合的精度。
在一实施方式中，同一个基板上同一接合区的接合部13，例如，第一基板101上的第一接合部135位于同一个阿基米德螺旋结构，从而提高接合精度。可以理解，所述接合部的数量大于一个时，同一基板上的接合部13可均位于同一个阿基米德螺旋结构上，例如，第一基板101上的第一接合部135与第二接合部137均位于同一个阿基米德螺旋结构上，此时第一接合部135与第二接合部137不呈中心对称。
由于第一基板101与第二基板103的材质不同，在绑定接合时，由于高温(例如170度～200度)会造成两者的接合部13内缩或外扩，从而需要对第一基板101的接合部13与对应的第二基板103的接合部13的尺寸进行修正。
沿所述第一基板101的第二轴线203的平行方向，设第一基板101的接合部13因热膨胀造成的差异(内缩或者外扩)为L；沿第二基板101的第二轴线203的平行方向，设第二基板103的接合部13因热膨胀造成的差异(内缩 或者外扩)为L’。由于第一基板101与第二基板103之间的材料膨胀系数的差异，L≠L’。因此，在沿所述第一基板101的第二轴线203的平行方向，修正量为ΔL＝L-L’。可以理解，L与L’可以依据实际测量、实验或计算模拟等方式获取。
请参阅图3，为第一基板101的一接合部13所在的阿基米德螺旋结构与对应的第二基板103的接合部13所在的阿基米德螺旋结构的示意图，其中，A1代表第一基板101的一接合部13所在的阿基米德螺旋结构，A2代表对应的第二基板101的接合部13所在的阿基米德螺旋结构。
由于第一基板101的接合部13与第二基板103的接合部13均为部分阿基米德螺旋结构，将所述第二基板103绕中心点旋转第一角度Δσ，方能使第二基板103的接合部13与对应的第一基板101的接合部13对准。所述中心点为所述第二基板103的第一轴线201与所述第二基板103的第二轴线203的相交点，所述中心点亦为所述第一基板101的第一轴线201与所述第一基板101的第二轴线203的相交点。
ΔL＝L-L’
＝R2-R1
＝a+bσ2-(a+bσ1)
＝bΔσ         (5)，
则第一角度
Figure PCTCN2018085115-appb-000003
第一基板101的接合部13与对应的第二基板103的接合部13接合时，先对第一基板101与第二基板103进行初次对位，具体的：将所述第二基板103的第一轴线201对应所述第一基板101的第一轴线201，所述第二基板103的第二轴线203对应所述第一基板101的第二轴线203。其次，将所述第二基板103绕所述中心点旋转所述第一角度Δσ进行二次对位，本实施方式中，在二次对位过程中保持第一基板101的位置不变。最后，将所述第一基板101的接合部13与对应的第二基板103上接合部13接合绑定于一起。可以理解，在二次对位中，第二基板103绕所述中心点相对所述第一基板101旋转所述第一角 度Δσ即可。
请参阅图4，图4为阿基米德螺旋结构旋转调整膨胀示意图，其中B1代表膨胀前，B2代表膨胀后，B3代表旋转后。显然，由于所述第一基板101的接合部13与所述第二基板103的接合部13均为部分阿基米德螺旋弧形结构，经旋转二次对位后，第一基板101的接合部13与对应的第二基板103的接合部13能够很好的接合于一起。
进一步地，当所述第一基板101的底板11的膨胀系数小于所述第二基板103的底板11的膨胀系数时，请参阅图5，在初次对位中，显然，第一基板101的接合部13与第二基板103的接合部13会有错位的情形，第二基板103上与其第一轴线201间距越大的接合部13与对应的第一基板101上的接合部13错位程度越大。请参阅图6，将所述第二基板103绕中心点顺时针旋转所述第一角度Δσ。
当所述第一基板101的底板11的膨胀系数大于所述第二基板103的底板11的膨胀系数时，所述第二基板103绕中心点逆时针旋转所述第一角度Δσ。
可以理解，所述第一基板101的材质与所述第二基板103的材质相同，但可能由于所述第一基板101与所述第二基板103的制造工艺等其他外在因素的影响，致使所述第一基板101与所述第二基板103接合前需进行修正。
由于第一基板101及第二基板103上的接合部13均为部分阿基米德螺旋结构，若第一基板101与第二基板103上的接合部13因热膨胀出现收缩或外扩的现象，在对位时，通过将第一基板101与第二基板103其中之一旋转一定角度进行微调，避免接合错位，从而提高接合绑定精度。由于阿基米德螺旋结构随角度增大距离变大的特征，所以可以通过旋转角度进行对位调整，修正第一基板101与第二基板103因热膨胀造成的对位差异。
请参阅图7，为本发明另一实施方式提供的接合结构70。接合结构70包括相接合的第一基板701及第二基板703，所述第一基板701及所述第二基板703均包括底板71及设于所述底板71上的至少一个接合部73，第一基板701的接合部73与所述第二基板703上对应的接合部73接合绑定于一起，本实施方式中，所述第二基板703与第一实施方式所述的第二基板103的结构相同，即所述第二基板703的接合部73为部分阿基米德螺旋结构，所述第一基板701 的结构大致与第一实施方式所述的第一基板101相同，所述第一基板701与第一基板101的区别在于：所述第一基板701的接合部73非部分阿基米德螺旋结构，所述第一基板701的接合部73为椭圆形结构。
进一步地，所述第一基板701的接合部73沿第二轴线803倾斜排列。可以理解，所述第一基板701的接合部73还可以为圆形、部分圆弧结构等等，在此不作限定。
所述第一基板701上每相邻的两个接合部73间的间距与第二基板703上对应的相邻两个接合部73之间的间距相同，以保障接合准度。
请参阅图8，本发明还提供一种接合结构的接合方法，所述接合结构包括第一基板及第二基板，所述接合方法包括以下步骤：
步骤201，将所述第二基板与所述第一基板进行初次对位。
具体的，将所述第二基板的第一轴线对应所述第一基板的第一轴线，所述第二基板的第二轴线对应所述第一基板的第二轴线，进行初次对位。
步骤202，将所述第二基板进行二次对位。
具体的，将所述第二基板绕中心点旋转第一角度进行二次对位，所述中心点为所述第二基板的第一轴线与所述第二基板的第二轴线的相交点；
步骤203将所述第一基板的接合部与对应的第二基板的接合部接合于一起。
进一步地，所述“将所述第二基板绕中心点旋转第一角度”中，当所述第一基板的底板的膨胀系数小于所述第二基板的底板的膨胀系数时，所述第二基板绕中心点顺时针旋转所述第一角度，当所述第一基板的底板的膨胀系数大于所述第二基板的底板的膨胀系数时，所述第二基板绕中心点逆时针旋转所述第一角度。
进一步地，所述第一基板的接合部为部分阿基米德螺旋结构，所述第二基板的接合部为部分阿基米德螺旋结构，所述第一角度
Figure PCTCN2018085115-appb-000004
其中，ΔL为在初次对位中，所述第一基板的接合部与对应的第二基板上的接合部沿所述第二轴线上的距离，b为实数。
可选的，所述第二基板的接合部为部分阿基米德螺旋结构，所述第一基板的接合部为非部分阿基米德螺旋结构，可以理解，所述第一基板的接合部还可以为椭圆形、圆形、部分圆弧结构等等，在此不作限定。
进一步地，所述第一基板的接合部沿第二轴线倾斜排列。所述第一基板上每相邻的两个接合部间的间距与第二基板上对应的相邻两个接合部之间的间距相同，以保障接合准度。
本发明提供的基板、电子装置及基板的接合方法，在一基板与另一基板或电子器件需接合时，由于基板上的接合部呈弧形结构，可将基板旋转调整，避免基板上的接合部因热膨胀等因素造成错位的问题，提高了基板的对位精度，进而提高所述基板的接合进度。进一步地，同一基板上的第一接合部与对应的第二接合部呈中心对称，进一步提高基板与第二基板的对位精度，进而提高接合的精度，有利于提高电子装置的生产良率及使用可靠性。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (15)

  1. 一种基板，其特征在于，包括底板及设于所述底板上的至少一个接合部，所述接合部为部分阿基米德螺旋结构。
  2. 如权利要求1所述的基板，其特征在于，所述基板包括第一轴线，所述接合部包括至少一个第一接合部及至少一个第二接合部，所述至少一个第一接合部位于所述第一轴线的一侧，所述至少一个第二接合部位于所述第一轴线的另一侧。
  3. 如权利要求2所述的基板，其特征在于，所述至少一个第一接合部与所述至少一个第二接合部沿第二轴线间隔排列，所述第一轴线与所述第二轴线相交。
  4. 如权利要求3所述的基板，其特征在于，每个所述第一接合部与一个第二接合部对应设置，每个第一接合部与其对应的第二接合部关于所述第一轴线与所述第二轴线的相交点呈中心对称。
  5. 如权利要求4所述的基板，其特征在于，所述第一接合部的数量大于一个时，所有的第一接合部均位于同一个阿基米德螺旋结构。
  6. 如权利要求1-5项任意一项所述的基板，其特征在于，所述基板为柔性基板。
  7. 一种接合结构，其特征在于，包括相接合的第一基板及第二基板，所述第一基板及所述第二基板均包括底板及设于所述底板上的至少一个接合部，所述第一基板的接合部与所述第二基板上对应的接合部接合绑定于一起，所述第一基板及所述第二基板两者中的至少其中之一为如权利要求1-6任意一项所述的基板。
  8. 如权利要求7所述的接合结构，其特征在于，所述第一基板上每相邻的两个接合部之间的间距与所述第二基板上对应的相邻两个接合部之间的间距相同。
  9. 如权利要求7所述的接合结构，其特征在于，所述第一基板为柔性显示面板，所述第二基板为柔性线路板。
  10. 一种电子装置，其包括权利要求7-9任意一项所述的接合结构。
  11. 一种如权利要求7-9项任意一项所述的接合结构的接合方法，其特征在于，所述接合方法包括以下步骤：
    将所述第二基板与所述第一基板进行初次对位；
    将所述第二基板进行二次对位；
    将所述第一基板的接合部与对应的第二基板上接合部接合于一起。
  12. 如权利要求11所述的接合方法，其特征在于，所述“将所述第二基板与所述第一基板进行初次对位”中，将所述第二基板的底板的第一轴线对应所述第一基板的底板的第一轴线，所述第二基板的底板的第二轴线对应所述第一基板的底板的第二轴线，进行初次对位。
  13. 如权利要求11所述的接合方法，其特征在于，所述“将所述第二基板进行二次对位”中，将所述第二基板绕中心点旋转第一角度进行二次对位，所述中心点为所述第二基板的第一轴线与所述第二基板的第二轴线的相交点。
  14. 如权利要求13所述的接合方法，其特征在于，所述“将所述第二基板绕中心点旋转第一角度”中，当所述第一基板的底板的膨胀系数小于所述第二基板的底板的膨胀系数时，所述第二基板绕中心点顺时针旋转所述第一角度，当所述第一基板的底板的膨胀系数大于所述第二基板的底板的膨胀系数时，所述第二基板绕中心点逆时针旋转所述第一角度。
  15. 如权利要求14所述的接合方法，其特征在于，沿所述第一基板的第二轴线的平行方向，设所述第一基板的接合部因热膨胀造成的差异为L；沿所述第二基板的第二轴线的平行方向，设所述第二基板的接合部因热膨胀造成的差异为L’，所述第一角度
    Figure PCTCN2018085115-appb-100001
    其中，ΔL＝L-L，b为实数。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102364679A (zh) * 2011-10-10 2012-02-29 常熟市广大电器有限公司 一种芯片封装结构
US20120251757A1 (en) * 2009-10-19 2012-10-04 Tesa Se Method for Producing Bonds
CN103983688A (zh) * 2014-04-14 2014-08-13 北京理工大学 用于叶片类曲面裂纹检测的嵌入式平面线圈阵列传感器
CN206608789U (zh) * 2017-03-09 2017-11-03 广州市中昊装饰材料有限公司 一种led无驱动变光变功率一体化铝基板灯

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2765027B1 (fr) * 1997-06-23 1999-09-10 Framatome Sa Dispositif de reconstitution d'assemblages de combustible d'un reacteur nucleaire
US7275562B2 (en) * 2001-10-17 2007-10-02 Agilent Technologies, Inc. Extensible spiral for flex circuit
JP2005032842A (ja) * 2003-07-08 2005-02-03 Ibiden Co Ltd 電極構造およびセラミック接合体
JP2008047839A (ja) * 2006-08-21 2008-02-28 Ricoh Co Ltd 妨害電磁波低減装置
CN101383446B (zh) * 2008-10-21 2012-07-04 厦门大学 三频光子带隙介电常数渐变陶瓷阿基米德螺旋天线
IT1395809B1 (it) * 2009-09-28 2012-10-26 Wam Spa Coclea di tipo perfezionato
CN104022360B (zh) * 2014-04-24 2016-06-08 江苏科技大学 复合结构平面螺旋天线
WO2016067269A1 (en) * 2014-10-30 2016-05-06 Uti Limited Partnership Null forming in circularly polarized antenna patterns using reactive loading of multi-arm spiral antenna
CN107431059B (zh) * 2015-01-02 2020-03-17 亚利桑那州立大学董事会 用于可变形电子装置的阿基米德螺线设计
CN104953260B (zh) * 2015-06-16 2019-01-11 华北电力大学（保定） 一种检测电气设备局部放电的宽带平面螺旋天线及其设计方法
EP3338022B1 (en) * 2015-08-20 2019-01-30 Philips Lighting Holding B.V. Board mounted led array
FR3049212B1 (fr) * 2016-03-22 2018-08-17 Rsi Compacteur de produits comportant une phase liquide
JP6723067B2 (ja) * 2016-05-13 2020-07-15 三菱電機株式会社 ロック装置及びホーム柵

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120251757A1 (en) * 2009-10-19 2012-10-04 Tesa Se Method for Producing Bonds
CN102364679A (zh) * 2011-10-10 2012-02-29 常熟市广大电器有限公司 一种芯片封装结构
CN103983688A (zh) * 2014-04-14 2014-08-13 北京理工大学 用于叶片类曲面裂纹检测的嵌入式平面线圈阵列传感器
CN206608789U (zh) * 2017-03-09 2017-11-03 广州市中昊装饰材料有限公司 一种led无驱动变光变功率一体化铝基板灯

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