CN112020427A - 膜、金属包层层合体、柔性基板、膜的制造方法、金属包层层合体的制造方法和柔性基板的制造方法 - Google Patents

膜、金属包层层合体、柔性基板、膜的制造方法、金属包层层合体的制造方法和柔性基板的制造方法 Download PDF

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CN112020427A
CN112020427A CN202080002404.8A CN202080002404A CN112020427A CN 112020427 A CN112020427 A CN 112020427A CN 202080002404 A CN202080002404 A CN 202080002404A CN 112020427 A CN112020427 A CN 112020427A
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precursor
polyamic acid
film
layer
adhesive layer
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Chinese (zh)
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城野贵史
朴谆龙
朴永锡
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LG Chem Ltd
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LG Chem Ltd
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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CN202080002404.8A 2019-01-11 2020-01-09 膜、金属包层层合体、柔性基板、膜的制造方法、金属包层层合体的制造方法和柔性基板的制造方法 Pending CN112020427A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019003369A JP7195530B2 (ja) 2019-01-11 2019-01-11 フィルム、金属張積層板、フレキシブル基板、フィルムの製造方法、金属張積層板の製造方法、及びフレキシブル基板の製造方法
JP2019-003369 2019-02-20
PCT/KR2020/000409 WO2020145695A1 (ko) 2019-01-11 2020-01-09 필름, 금속박 적층판, 플렉시블 기판, 필름의 제조 방법, 금속박 적층판의 제조 방법, 및 플렉시블 기판의 제조 방법

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CN112020427A true CN112020427A (zh) 2020-12-01

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US (1) US11845246B2 (https=)
EP (1) EP3769959B1 (https=)
JP (1) JP7195530B2 (https=)
KR (1) KR102452787B1 (https=)
CN (1) CN112020427A (https=)
WO (1) WO2020145695A1 (https=)

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JP7637255B2 (ja) * 2021-09-29 2025-02-27 信越ポリマー株式会社 金属張積層板
US20250346718A1 (en) * 2021-11-22 2025-11-13 Pi Advanced Materials Co., Ltd. Polyimide precursor composition and polyimide film comprising same

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US20140023847A1 (en) * 2011-03-30 2014-01-23 Ube Industries, Ltd. Polyimide film and metal laminate using same
KR20150006304A (ko) * 2013-07-08 2015-01-16 주식회사 두산 연성 인쇄회로기판 형성용 절연 수지 시트 및 이의 제조방법, 이를 포함하는 인쇄회로기판
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TW201609867A (zh) * 2014-07-24 2016-03-16 宇部興產股份有限公司 多層聚醯亞胺膜、多層聚醯亞胺膜之製造方法、利用該多層聚醯亞胺膜之聚醯亞胺疊層體、及使用於前述聚醯亞胺膜與疊層體之共聚合聚醯亞胺
JP2018041961A (ja) * 2016-09-05 2018-03-15 荒川化学工業株式会社 フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板

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