CN111886545B - 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 - Google Patents

光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 Download PDF

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Publication number
CN111886545B
CN111886545B CN201980020641.4A CN201980020641A CN111886545B CN 111886545 B CN111886545 B CN 111886545B CN 201980020641 A CN201980020641 A CN 201980020641A CN 111886545 B CN111886545 B CN 111886545B
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China
Prior art keywords
mass
drying
polymer
carboxyl group
radical polymerizable
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CN201980020641.4A
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English (en)
Chinese (zh)
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CN111886545A (zh
Inventor
工藤知哉
冈田和也
植田千穗
岛田沙和子
伊藤信人
吉田雅年
前田顺启
大槻信章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Nippon Shokubai Co Ltd
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Publication of CN111886545A publication Critical patent/CN111886545A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN201980020641.4A 2018-03-29 2019-03-14 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 Active CN111886545B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018065923A JP7216480B2 (ja) 2018-03-29 2018-03-29 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板
JP2018-065923 2018-03-29
PCT/JP2019/010702 WO2019188376A1 (ja) 2018-03-29 2019-03-14 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板

Publications (2)

Publication Number Publication Date
CN111886545A CN111886545A (zh) 2020-11-03
CN111886545B true CN111886545B (zh) 2024-07-05

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CN201980020641.4A Active CN111886545B (zh) 2018-03-29 2019-03-14 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板

Country Status (5)

Country Link
JP (1) JP7216480B2 (enExample)
KR (1) KR20200138286A (enExample)
CN (1) CN111886545B (enExample)
TW (1) TW201942674A (enExample)
WO (1) WO2019188376A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030445A1 (ja) * 2020-08-03 2022-02-10 株式会社日本触媒 共重合体、共重合体溶液、感光性樹脂組成物、硬化物、共重合体の製造方法、及び、共重合体溶液の製造方法
JP2023123014A (ja) * 2022-02-24 2023-09-05 三菱ケミカル株式会社 重合体の製造方法、レジスト組成物の製造方法、及びパターンが形成された基板の製造方法
CN115160495B (zh) * 2022-08-15 2024-05-14 四川华造宏材科技有限公司 含马来酰亚胺结构的光刻胶成膜树脂及其制备方法
WO2025225325A1 (ja) * 2024-04-26 2025-10-30 株式会社日本触媒 重合体、硬化性樹脂組成物、及び、重合体の製造方法
CN119535893A (zh) * 2024-12-31 2025-02-28 广州亦盛环保科技有限公司 一种黑色光刻胶组合物及其使用方法

Citations (2)

* Cited by examiner, † Cited by third party
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JP2010128275A (ja) * 2008-11-28 2010-06-10 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性フィルム及び永久レジスト
JP2017119819A (ja) * 2015-12-24 2017-07-06 株式会社日本触媒 重合体および該重合体を含んでなる樹脂組成物

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US5990202A (en) * 1997-10-31 1999-11-23 Hewlett-Packard Company Dual encapsulation technique for preparing ink-jets inks
JP2001048495A (ja) 1999-08-05 2001-02-20 Toyota Autom Loom Works Ltd フォークリフト及びその移載方法
US6294014B1 (en) * 1999-12-16 2001-09-25 Ppg Industries Ohio, Inc. Pigment dispersions containing dispersants prepared by controlled radical polymerization and having pendent hydrophilic polymeric segments
JP2002062651A (ja) * 2000-08-18 2002-02-28 Mitsubishi Chemicals Corp 光重合性組成物及びそれを用いたカラーフィルタ
JP2006023716A (ja) * 2004-06-08 2006-01-26 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2011039165A (ja) * 2009-08-07 2011-02-24 Hitachi Chem Co Ltd アルカリ可溶性光硬化型組成物、該組成物を使用した硬化塗膜及び透明部材
JP5626574B2 (ja) * 2010-10-27 2014-11-19 日立化成株式会社 感光性樹脂組成物並びにこれを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP2013003508A (ja) * 2011-06-21 2013-01-07 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP5909468B2 (ja) * 2012-08-31 2016-04-26 富士フイルム株式会社 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子
JP6723788B2 (ja) * 2016-03-31 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2018043218A1 (ja) * 2016-08-30 2018-03-08 富士フイルム株式会社 感光性組成物、硬化膜、光学フィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置および赤外線センサ

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JP2017119819A (ja) * 2015-12-24 2017-07-06 株式会社日本触媒 重合体および該重合体を含んでなる樹脂組成物

Non-Patent Citations (1)

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Also Published As

Publication number Publication date
KR20200138286A (ko) 2020-12-09
WO2019188376A1 (ja) 2019-10-03
CN111886545A (zh) 2020-11-03
TW201942674A (zh) 2019-11-01
JP7216480B2 (ja) 2023-02-01
JP2019174761A (ja) 2019-10-10

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