CN111739823A - Photoresist coating nozzle and photoresist coating equipment with same - Google Patents
Photoresist coating nozzle and photoresist coating equipment with same Download PDFInfo
- Publication number
- CN111739823A CN111739823A CN202010606025.1A CN202010606025A CN111739823A CN 111739823 A CN111739823 A CN 111739823A CN 202010606025 A CN202010606025 A CN 202010606025A CN 111739823 A CN111739823 A CN 111739823A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- organic solvent
- nozzle
- pipeline
- photoresist coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Abstract
The utility model belongs to the technical field of the photoresist coating, concretely relates to photoresist coating nozzle and have its photoresist coating equipment, this photoresist coating nozzle includes the nozzle body, this internal organic solvent pipeline and the photoresist pipeline that separates each other that is provided with of nozzle, organic solvent pipeline and organic solvent jar intercommunication for to waiting to scribble the piece on the spraying organic solvent, photoresist pipeline and photoresist bottle intercommunication, be used for at organic solvent spraying to waiting to scribble the piece on the back spout the photoetching glue. According to the photoresist coating nozzle, the organic solvent pipeline and the photoresist pipeline which are separated from each other are integrated in the nozzle body, the photoresist coating nozzle firstly sprays organic solvent to a piece to be coated through the organic solvent pipeline, then photoresist is sprayed to the piece to be coated through the photoresist pipeline in situ, the photoresist coating nozzle does not need to be moved in the spraying process, and therefore the phenomenon that photoresist drops on the piece to be coated in the moving process of the photoresist coating nozzle is reduced.
Description
Technical Field
The application belongs to the technical field of photoresist coating, and particularly relates to a photoresist coating nozzle and photoresist coating equipment with the same.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
As shown in fig. 1 and 2, the photoresist coating process is an important process in the semiconductor silicon wafer manufacturing process, and the conventional photoresist spraying process adopts an rrc (reduced Resist coating) photoresist coating process: firstly, a silicon wafer is placed on a clamp 40 ', an organic solvent similar to the thinner component of the photoresist is sprayed on the silicon wafer 30' before the photoresist is sprayed, the organic solvent forms a solvent layer 11 'on the silicon wafer, then the photoresist is sprayed on the silicon wafer 30', and the photoresist can be quickly paved on the surface of the silicon wafer 30 'to form a photoresist layer 21' due to the lubricating effect of the organic solvent, so that an ideal spraying effect is achieved.
Although the RRC photoresist coating process can achieve an ideal spraying effect, the RRC photoresist coating process requires RRC photoresist coating equipment equipped with an organic solvent spraying nozzle 10 'and a photoresist spraying nozzle 20'. The existing RRC photoresist coating equipment is generally provided with a special organic solvent spraying nozzle 10 'and a photoresist spraying nozzle 20', after the organic solvent spraying nozzle 10 'sprays the organic solvent on the silicon wafer 30', the RRC photoresist coating equipment moves the organic solvent spraying nozzle 10 'away from the silicon wafer 30', then moves the photoresist spraying nozzle 20 'to the upper part of the silicon wafer 30' to spray the photoresist, and the RRC photoresist coating equipment can enable the photoresist spraying nozzle 20 'to generate photoresist liquid drops 22' in the moving process, and the photoresist liquid drops 22 'to drop on the silicon wafer 30' to improve the bad occurrence rate of the RRC photoresist coating process.
In addition, since the number of the organic solvent spray nozzles 10' that can be installed on the RRC photoresist coating apparatus is only two, it is impossible to match all photoresists.
Disclosure of Invention
The purpose of the present application is to at least solve the problem of the moving of the photoresist coating nozzle causing the dripping of the photoresist liquid on the piece to be coated. The purpose is realized by the following technical scheme:
the first aspect of the present application provides a photoresist coating nozzle, photoresist coating nozzle is used for spraying the photoresist and with the organic solvent that the photoresist matches, and photoresist coating nozzle includes:
the spray nozzle comprises a nozzle body, wherein an organic solvent pipeline and a photoresist pipeline which are separated from each other are arranged in the nozzle body, the organic solvent pipeline is communicated with an organic solvent tank and is used for spraying an organic solvent on a piece to be coated, and the photoresist pipeline is communicated with a photoresist bottle and is used for spraying photoresist on the piece to be coated after the organic solvent is sprayed on the piece to be coated.
According to the photoresist coating nozzle provided by the embodiment of the application, the organic solvent pipeline and the photoresist pipeline which are separated from each other are integrated in the nozzle body, the photoresist coating nozzle sprays the organic solvent to the piece to be coated through the organic solvent pipeline, and the photoresist can be sprayed through the photoresist pipeline in situ after the organic solvent is sprayed, so that the photoresist coating nozzle does not need to be moved, and the phenomenon that the photoresist drops on the piece to be coated when the photoresist coating nozzle is moved is reduced.
The second aspect of the present application also proposes a photoresist coating apparatus comprising a plurality of photoresist coating nozzles, the photoresist coating nozzles being the photoresist coating nozzles according to the first aspect of the present application.
According to the photoresist coating equipment provided by the embodiment of the application, the phenomenon that the photoresist liquid drops on a piece to be coated when the photoresist coating nozzle is moved can be reduced, the working efficiency of the photoresist coating nozzle is improved, the number of organic solvent pipelines is increased, and an organic solvent similar to components of a photoresist thinner is generated through more organic solvent pipelines, so that the using amount of the photoresist is reduced, and the spraying effect of the photoresist is improved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the specific embodiments. The drawings are only for purposes of illustrating the particular embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:
FIG. 1 is a schematic structural diagram of a prior art RRC photoresist coating apparatus in a state of spraying an organic solvent;
FIG. 2 is a schematic structural diagram of the RRC photoresist coating apparatus shown in FIG. 1 in a state of spraying a photoresist;
FIG. 3 is a schematic structural view of a photoresist coating nozzle according to an embodiment of the present application;
FIG. 4 is a schematic structural view of the photoresist coating nozzle of FIG. 3 in a state of spraying an organic solvent;
FIG. 5 is a schematic view of the structure of the photoresist coating nozzle of FIG. 3 in a state of spraying a photoresist;
FIG. 6 is a schematic structural diagram of a photoresist coating apparatus according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a distribution structure of a plurality of photoresist coating nozzles according to an embodiment of the present application.
Reference numerals:
10', an organic solvent spraying nozzle; 11', a solvent layer;
20', a photoresist spray nozzle; 21', a photoresist layer; 22', a drop of photoresist;
30', a silicon wafer;
40', a clamp;
100. a photoresist coating nozzle; 101. a spout;
10. an organic solvent line; 11. an organic solvent coating;
20. a photoresist pipeline; 21. a photoresist coating;
30. a piece to be coated;
40. a clamp for a piece to be coated;
50. a photoresist bottle; 51. photoetching a rubber tube;
60. a solvent pump; 61. an organic solvent tube.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The photoresist spraying process adopts an RRC (reduced Resist coating) photoresist coating process, an organic solvent with similar components to a thinner of the photoresist is sprayed on a piece to be coated before the photoresist is sprayed on the piece to be coated of a silicon wafer, then the photoresist is sprayed on the piece to be coated, and the photoresist can quickly cover the surface of the piece to be coated due to the lubricating effect of the organic solvent, so that an ideal spraying effect is achieved. It should be noted that the to-be-coated member can be applied to semiconductor devices, displays, memories, processors and semiconductor devices, and for convenience of description, the to-be-coated member according to the embodiment of the present application is illustrated by taking a silicon wafer as an example.
As shown in fig. 3, in order to enable the photoresist coating apparatus to spray an organic solvent and a photoresist on a to-be-coated member 30, the present application provides a photoresist coating nozzle 100, the photoresist coating nozzle 100 is used for spraying a photoresist and an organic solvent matched with the photoresist, the photoresist coating nozzle 100 includes a nozzle body, an organic solvent pipeline 10 and a photoresist pipeline 20 are arranged in the nozzle body, the organic solvent pipeline 10 is communicated with an organic solvent tank and is used for spraying the organic solvent on the to-be-coated member 30, and the photoresist pipeline 20 is communicated with a photoresist bottle 50 and is used for spraying the photoresist on the to-be-coated member 30 after the organic solvent is sprayed on the to-be-coated member 30. As shown in fig. 4, by integrating an organic solvent pipeline 10 and a photoresist pipeline 20 which are separated from each other in a nozzle body, a photoresist coating apparatus sprays an organic solvent to a piece 30 to be coated through the organic solvent pipeline 10 in a photoresist coating nozzle 100, so that an organic solvent coating 11 is formed on the surface of the piece 30 to be coated, as shown in fig. 5, after the photoresist coating nozzle 100 sprays the organic solvent, a photoresist can be sprayed on the piece 30 to be coated through the photoresist pipeline 20 in situ, so that a photoresist coating 21 is formed on the surface of the piece 30 to be coated, and the photoresist coating nozzle 100 does not need to be moved, thereby reducing the phenomenon that a photoresist droplet drops on the piece 30 to be coated when the photoresist coating nozzle 100 is moved.
It should be noted that the organic solvent pipeline 10 and the photoresist pipeline 20 may be two identical pipelines that are distributed in parallel in the nozzle body, or one pipeline may be distributed along the axis of the nozzle body, and the other pipeline may be distributed around the axis of the nozzle body, and the specific distribution manner of the organic solvent pipeline 10 and the photoresist pipeline 20 in the nozzle body will be described in detail below.
Specifically, as shown in fig. 3, in some embodiments of the present application, a first pipeline distributed along the axis and a second pipeline distributed around the first pipeline are disposed in the nozzle body, the photoresist pipeline 20 is formed in the first pipeline, and the organic solvent pipeline 10 is formed in the second pipeline. The first pipeline may be an original pipeline in the photoresist coating nozzle 100, a second pipeline is formed by processing the periphery of the first pipeline, further, a first interface (not shown in the figure) communicated with the first pipeline and a second interface (not shown in the figure) communicated with the second pipeline are arranged at the top of the nozzle body, the first pipeline is communicated with the photoresist bottle 50 through the first interface, the second pipeline is communicated with the organic solvent tank through the second interface, when the piece 30 to be coated is sprayed, the photoresist coating nozzle 100 firstly sprays the organic solvent onto the piece 30 to be coated through the second pipeline, so that the organic solvent coating 11 is formed on the surface of the piece 30 to be coated, and then the photoresist coating nozzle 100 sprays the photoresist onto the piece 30 to be coated through the first pipeline, so that the photoresist coating 21 is formed on the surface of the piece 30 to be coated.
In other embodiments of the present application, a first pipeline distributed along the axis and a second pipeline distributed around the first pipeline are disposed in the nozzle body, the organic solvent pipeline 10 is formed in the first pipeline, and the photoresist pipeline 20 is formed in the second pipeline. The organic solvent pipeline 10 is formed in the first pipeline, and the photoresist pipeline 20 is formed in the second pipeline, so that the effect of spraying the organic solvent and the photoresist by the photoresist coating nozzle 100 can be achieved, and therefore, the structural adjustment belongs to the protection scope of the embodiment of the present application.
In some embodiments of the present application, a nozzle 101 located at the axial center is disposed at the bottom of the nozzle body, the second pipeline is collected at the nozzle 101, and the first pipeline and the second pipeline both spray the organic solvent and the photoresist through the nozzle 101. The first pipeline and the second pipeline share one nozzle 101, so that the organic solvent and the photoresist can be sprayed to the same position of the piece to be coated 30 while the photoresist coating nozzle 100 is not moved, and the phenomenon of spraying dislocation of the organic solvent and the photoresist on the piece to be coated 30 is reduced. Specifically, the second pipeline surrounds the periphery of the first pipeline, and the second pipeline extends from the bottom of the photoresist coating nozzle 100 to the axis of the photoresist coating nozzle 100, and finally converges below the first pipeline, and shares one nozzle 101 with the first pipeline.
Further, in some embodiments of the present application, referring to the photoresist coating nozzle 100 shown in fig. 3, the photoresist pipe 20 is formed in a first pipe, the organic solvent pipe 10 is formed in a second pipe, the bottom of the nozzle body is provided with a nozzle 101 located at the axial center, the outlet of the second pipe is higher than the nozzle 101 in the vertical direction, and the outlet of the first pipe is higher than the outlet of the second pipe in the vertical direction. Through setting up the export of second pipeline to be higher than spout 101 along vertical direction, can reduce organic solvent or the photoresist of spout 101 department and suck back to the second pipeline in, likewise, be higher than the export of second pipeline along vertical direction with the export of first pipeline, can reduce organic solvent or the photoresist of spout 101 department and suck back to the first pipeline in, simultaneously, can also reduce through the organic solvent of first pipeline spun and the photoresist suck back to the second pipeline in.
As shown in fig. 6, the present application also provides a photoresist coating apparatus comprising a plurality of photoresist coating nozzles 100, the photoresist coating nozzles 100 being the photoresist coating nozzles 100 according to the first aspect of the present application. According to the photoresist coating equipment provided by the embodiment of the application, the phenomenon that the photoresist liquid drops on the piece 30 to be coated when the photoresist coating nozzle 100 is moved can be reduced, and the number of the organic solvent pipelines 10 can be increased, so that the photoresist coating nozzle 100 does not need to be frequently moved to different positions of the piece 30 to be coated, and further, the organic solvent similar to the components of the thinner of the photoresist is generated through more organic solvent pipelines 10, so that the dosage of the photoresist is reduced, and the spraying effect of the photoresist is improved.
Specifically, as shown in fig. 7, in some embodiments of the present application, the number of the photoresist coating nozzles 100 may be flexibly set according to the area of the piece 30 to be coated, and the coverage area of a plurality of the photoresist coating nozzles 100 may cover the piece 30 to be coated in the length direction, for example, according to a preferred embodiment of the present application, the number of the photoresist coating nozzles 100 may be 12, the plurality of the photoresist coating nozzles 100 are distributed along a straight line, and the photoresist pipeline 20 and the organic solvent pipeline 10 are disposed in each of the photoresist coating nozzles 100. As shown in fig. 7, when spraying an organic solvent and a photoresist on a workpiece 30, firstly, the workpiece 30 is mounted on a workpiece fixture 40, the photoresist coating nozzle 100 sprays the organic solvent on the workpiece 30 through an organic solvent pipeline 10, the workpiece fixture 40 drives the workpiece 30 to rotate, so that the organic solvent is sprayed on the whole surface of the workpiece 30, and an organic solvent coating 11 is formed on the whole surface of the workpiece 30, then the photoresist coating nozzle 100 sprays the photoresist on the workpiece 30 through a photoresist pipeline 20, and the workpiece fixture 40 drives the workpiece 30 to rotate continuously, so that the photoresist coating nozzle 100 can spray the photoresist on the whole surface of the workpiece 30, and a photoresist coating 21 is formed on the whole surface of the workpiece 30.
Further, the organic solvent and the photoresist can be sprayed to the entire surface of the to-be-coated member 30 without moving the photoresist coating nozzle 100 by rotating the to-be-coated member clamp 40, thereby reducing the phenomenon that the photoresist drops on the to-be-coated member 30 during the movement of the photoresist coating nozzle 100.
As shown in fig. 6, in some embodiments of the present application, the photoresist coating apparatus further includes a plurality of photoresist bottles 50, the plurality of photoresist bottles 50 are respectively communicated with the plurality of photoresist pipelines 20 in the plurality of photoresist coating nozzles 100 one by one, each photoresist bottle 50 is provided with a photoresist tube 51 communicated with the corresponding photoresist pipeline 20 in the photoresist coating nozzle 100, the photoresist in the plurality of photoresist bottles 50 may be photoresist with different components, and the photoresist with different components can be introduced into the plurality of photoresist pipelines 20 in the plurality of photoresist coating nozzles 100 through the plurality of photoresist bottles 50. Further, the photoresist bottle 50 is communicated with the photoresist pipeline 20 through a photoresist pump (not shown in the figure), the photoresist pump is connected with a controller of the photoresist coating equipment, and the controller of the photoresist coating equipment controls the switch of the photoresist pipe 51 through the photoresist pump, so as to control the photoresist bottle 50 to spray photoresist on the piece 30 to be coated.
As shown in fig. 6, in some embodiments of the present application, the photoresist coating apparatus further includes a plurality of organic solvent tanks (not shown) respectively communicating with the plurality of organic solvent pipes 10 in the plurality of photoresist coating nozzles 100 one by one. The solvent in the organic solvent tanks can be organic solvents with different components, and the organic solvents with different components are introduced into the organic solvent pipelines 10 in the photoresist coating nozzles 100 through the organic solvent tanks, so that the organic solvent with the components similar to those of the thinner of the photoresist is generated on the surface of the piece 30 to be coated, the dosage of the photoresist is reduced, and the spraying effect of the photoresist is improved. Specifically, as the organic solvent, a compound having a component such as γ -butyrolactone, cyclohexane, propylene glycol methyl ether acetate, propylene glycol methyl ether, n-butanol, or dimethyl methanol, which meets the requirements of the resist, can be used.
Further, as shown in fig. 6, in some embodiments of the present application, each organic solvent tank is communicated with the corresponding organic solvent pipeline 10 through a solvent pump 60, and the solvent pump 60 is connected with a controller of the photoresist coating apparatus, and the controller of the photoresist coating apparatus controls the opening and closing of an organic solvent pipe 61 through the solvent pump 60, so as to control the organic solvent tank to spray the organic solvent to the piece to be coated 30.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Those skilled in the art can also devise methods that are not exactly the same as those described above in order to achieve the same objectives. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. A photoresist coating nozzle, wherein the photoresist coating nozzle is used for spraying photoresist and an organic solvent matched with the photoresist, and the photoresist coating nozzle comprises:
the spray nozzle comprises a nozzle body, wherein an organic solvent pipeline and a photoresist pipeline which are separated from each other are arranged in the nozzle body, the organic solvent pipeline is communicated with an organic solvent tank and is used for spraying an organic solvent on a piece to be coated, and the photoresist pipeline is communicated with a photoresist bottle and is used for spraying photoresist on the piece to be coated after the organic solvent is sprayed on the piece to be coated.
2. The nozzle according to claim 1, wherein the nozzle body has a first pipe disposed along an axis and a second pipe disposed around the first pipe, the photoresist pipe is formed in the first pipe, and the organic solvent pipe is formed in the second pipe.
3. The nozzle according to claim 1, wherein the nozzle body has a first pipe disposed along an axis and a second pipe disposed around the first pipe, the organic solvent pipe is formed in the first pipe, and the photoresist pipe is formed in the second pipe.
4. The nozzle according to claim 2 or 3, wherein a nozzle hole is formed at the bottom of the nozzle body, the nozzle hole is located at the axis, the second pipeline is collected at the nozzle hole, and the first pipeline and the second pipeline both spray the organic solvent and the photoresist through the nozzle hole.
5. The nozzle according to claim 2 or 3, wherein a top of the nozzle body is provided with a first port communicating with the first pipe and a second port communicating with the second pipe.
6. The nozzle according to claim 2 or 3, wherein the bottom of the nozzle body is provided with a spout at an axial center, and the outlet of the second pipe is vertically higher than the spout.
7. The photoresist coating nozzle of claim 6, wherein the outlet of the first pipe is vertically higher than the outlet of the second pipe.
8. A photoresist coating apparatus comprising a plurality of photoresist coating nozzles according to any one of claims 1 to 7.
9. The photoresist coating apparatus of claim 8, wherein the plurality of photoresist coating nozzles are distributed along a straight line.
10. The photoresist coating apparatus of claim 8, further comprising a plurality of photoresist bottles in one-to-one communication with the plurality of photoresist lines in the plurality of photoresist coating nozzles, respectively;
and/or the photoresist coating equipment further comprises a plurality of organic solvent tanks which are respectively communicated with the plurality of organic solvent pipelines in the photoresist coating nozzles one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010606025.1A CN111739823A (en) | 2020-06-29 | 2020-06-29 | Photoresist coating nozzle and photoresist coating equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010606025.1A CN111739823A (en) | 2020-06-29 | 2020-06-29 | Photoresist coating nozzle and photoresist coating equipment with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111739823A true CN111739823A (en) | 2020-10-02 |
Family
ID=72652157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010606025.1A Pending CN111739823A (en) | 2020-06-29 | 2020-06-29 | Photoresist coating nozzle and photoresist coating equipment with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111739823A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377906A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Photoresist distributor and semiconductor manufacturing equipment |
| CN114849990A (en) * | 2022-07-05 | 2022-08-05 | 宁波润华全芯微电子设备有限公司 | Photoresist nozzle device |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5392989A (en) * | 1993-01-13 | 1995-02-28 | Semiconductor Systems, Inc. | Nozzle assembly for dispensing liquid |
| TW336329B (en) * | 1996-08-30 | 1998-07-11 | Tokyo Electron Co Ltd | Semiconductor processing coating method and the coating device |
| JPH11128813A (en) * | 1997-10-31 | 1999-05-18 | Tokyo Electron Ltd | Coating method and coater |
| JP2000077326A (en) * | 1998-06-19 | 2000-03-14 | Tokyo Electron Ltd | Film forming method and apparatus therefor |
| US6376013B1 (en) * | 1999-10-06 | 2002-04-23 | Advanced Micro Devices, Inc. | Multiple nozzles for dispensing resist |
| US6383948B1 (en) * | 1999-12-20 | 2002-05-07 | Tokyo Electron Limited | Coating film forming apparatus and coating film forming method |
| CN101470353A (en) * | 2007-12-27 | 2009-07-01 | 细美事有限公司 | Chemical liquid supply unit, and substrate treating apparatus and method using the same |
| CN101762984A (en) * | 2008-12-25 | 2010-06-30 | 中芯国际集成电路制造(上海)有限公司 | Photoresist instillation system, photoresist nozzle and application method thereof |
| TW201029749A (en) * | 2009-02-04 | 2010-08-16 | Inotera Memories Inc | An fluid-supplying device and a method thereof |
| CN102294317A (en) * | 2010-06-28 | 2011-12-28 | 无锡华润上华半导体有限公司 | Photoresist spraying device and method |
| CN102527574A (en) * | 2010-12-08 | 2012-07-04 | 无锡华润上华科技有限公司 | Device and method for spraying photoresist |
| CN206440916U (en) * | 2017-01-23 | 2017-08-25 | 合肥鑫晟光电科技有限公司 | Frame enclosing gum coating apparatus |
| CN209433178U (en) * | 2019-03-28 | 2019-09-24 | 德淮半导体有限公司 | Photoresist spray nozzle device |
-
2020
- 2020-06-29 CN CN202010606025.1A patent/CN111739823A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5392989A (en) * | 1993-01-13 | 1995-02-28 | Semiconductor Systems, Inc. | Nozzle assembly for dispensing liquid |
| TW336329B (en) * | 1996-08-30 | 1998-07-11 | Tokyo Electron Co Ltd | Semiconductor processing coating method and the coating device |
| JPH11128813A (en) * | 1997-10-31 | 1999-05-18 | Tokyo Electron Ltd | Coating method and coater |
| JP2000077326A (en) * | 1998-06-19 | 2000-03-14 | Tokyo Electron Ltd | Film forming method and apparatus therefor |
| US6376013B1 (en) * | 1999-10-06 | 2002-04-23 | Advanced Micro Devices, Inc. | Multiple nozzles for dispensing resist |
| US6383948B1 (en) * | 1999-12-20 | 2002-05-07 | Tokyo Electron Limited | Coating film forming apparatus and coating film forming method |
| CN101470353A (en) * | 2007-12-27 | 2009-07-01 | 细美事有限公司 | Chemical liquid supply unit, and substrate treating apparatus and method using the same |
| CN101762984A (en) * | 2008-12-25 | 2010-06-30 | 中芯国际集成电路制造(上海)有限公司 | Photoresist instillation system, photoresist nozzle and application method thereof |
| TW201029749A (en) * | 2009-02-04 | 2010-08-16 | Inotera Memories Inc | An fluid-supplying device and a method thereof |
| CN102294317A (en) * | 2010-06-28 | 2011-12-28 | 无锡华润上华半导体有限公司 | Photoresist spraying device and method |
| CN102527574A (en) * | 2010-12-08 | 2012-07-04 | 无锡华润上华科技有限公司 | Device and method for spraying photoresist |
| CN206440916U (en) * | 2017-01-23 | 2017-08-25 | 合肥鑫晟光电科技有限公司 | Frame enclosing gum coating apparatus |
| CN209433178U (en) * | 2019-03-28 | 2019-09-24 | 德淮半导体有限公司 | Photoresist spray nozzle device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377906A (en) * | 2020-10-22 | 2022-04-22 | 中国科学院微电子研究所 | Photoresist distributor and semiconductor manufacturing equipment |
| CN114849990A (en) * | 2022-07-05 | 2022-08-05 | 宁波润华全芯微电子设备有限公司 | Photoresist nozzle device |
| CN114849990B (en) * | 2022-07-05 | 2022-09-23 | 宁波润华全芯微电子设备有限公司 | Photoresist nozzle device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111739823A (en) | Photoresist coating nozzle and photoresist coating equipment with same | |
| CN102294317A (en) | Photoresist spraying device and method | |
| JP6699996B2 (en) | Method and apparatus for liquid treatment of wafer-like articles | |
| CN102427047A (en) | Wafer back cleaning device and wafer back cleaning method | |
| CN101590474A (en) | Injection apparatus on the purging system | |
| US11504727B2 (en) | Spray device and cleaning apparatus | |
| US20170157625A1 (en) | Coating apparatus and method of forming coating film | |
| CN106057710A (en) | Device and method for improving gas and liquid two-phase atomization cleaning uniformity | |
| CN111640689A (en) | Cleaning device and cleaning chamber | |
| US10854477B2 (en) | Substrate processing apparatus and substrate processing method | |
| US20150179483A1 (en) | Photoresist nozzle device and photoresist supply system | |
| CN203631506U (en) | Cleaning device used for cleaning wafer | |
| CN202166827U (en) | Coating equipment | |
| CN204208853U (en) | Cleaning injection apparatus | |
| US20090269936A1 (en) | Substrate Processing Apparatus | |
| CN109772794B (en) | Substrate cleaning machine | |
| CN202307830U (en) | Monolithic wafer wet etching device | |
| CN107913886A (en) | A kind of rotatable glass substrate washing device of spray head | |
| CN103809388A (en) | Developing method | |
| CN206961798U (en) | Substrate board treatment and spray head cleaning device | |
| CN111352302A (en) | Photoresist distribution module, coating system and method for spin-coating photoresist on wafer | |
| US9776216B2 (en) | Dispensing apparatus and dispensing method | |
| CN209393478U (en) | A kind of automatic equipment for evenly dividing glue | |
| CN100404142C (en) | Thermal decomposing nozzle for ultrasonic spraying | |
| CN105929638A (en) | Ultrasonic photoresist spraying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201002 |