CN109772794B - Substrate cleaning machine - Google Patents
Substrate cleaning machine Download PDFInfo
- Publication number
- CN109772794B CN109772794B CN201910126483.2A CN201910126483A CN109772794B CN 109772794 B CN109772794 B CN 109772794B CN 201910126483 A CN201910126483 A CN 201910126483A CN 109772794 B CN109772794 B CN 109772794B
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- CN
- China
- Prior art keywords
- cleaning
- cover plate
- unit
- water
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 190
- 239000000758 substrate Substances 0.000 title claims abstract description 73
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 123
- 239000007921 spray Substances 0.000 claims abstract description 24
- 238000005406 washing Methods 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 241000894006 Bacteria Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a substrate cleaning machine, which comprises a water washing unit, wherein the water washing unit comprises: the device comprises a water knife unit, a brush unit and a cover plate cleaning unit, wherein the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of a substrate; the cover plate cleaning unit is used for washing the dead water of the water knife cover plate, so that when the water knife unit cleans the base plate, the condition that the dead water drips on the base plate cannot exist on the water knife cover plate, and the technical problem that the base plate is not clean due to the fact that the dead water drips on the water knife cover plate of an existing base plate cleaning machine falls on the base plate is solved.
Description
Technical Field
The invention relates to the field of display panel processing, in particular to a substrate cleaning machine.
Background
A substrate cleaning machine such as indium tin oxide cleaning is used for cleaning ITO before and after film coating, and is put into post-processing after being detected to be qualified by a testing machine.
As shown in fig. 1, the water knife cover plate 102 of the substrate cleaning machine is susceptible to water vapor and the like, the water knife cover plate 102 is susceptible to residual stagnant water, a large amount of bacteria are remained in the stagnant water, and in the substrate conveying process, the stagnant water on the water knife cover plate drips on the surface of the substrate S, so that the substrate cannot be cleaned, and the substrate is not clean and the quality is affected.
The existing substrate cleaning machine has the technical problem that the substrate is not clean.
Disclosure of Invention
The invention provides a substrate cleaning machine, which aims to solve the technical problem that the substrate cannot be cleaned cleanly because dead water on a water knife cover plate drops on the substrate in the conventional substrate cleaning machine.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the embodiment of the invention provides a substrate cleaning machine, which comprises a water washing unit, wherein the water washing unit comprises:
the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of the substrate;
a brush unit for removing particles from the surface of the substrate;
and the cover plate cleaning unit is used for cleaning the surface of the water knife cover plate by using a cleaning solution.
In the substrate cleaning machine of the present invention, the cover plate cleaning unit includes a cleaning nozzle for spraying a cleaning solution to clean the surface of the water-jet cutting cover plate.
In the substrate cleaning machine of the present invention, the cleaning nozzle is a nozzle.
In the substrate cleaning machine of the present invention, the cleaning nozzles are arranged in an array.
In the substrate cleaning machine of the present invention, the cleaning head is disposed in a direction in which the water jet head is away from the substrate.
The substrate cleaning machine further comprises a cleaning pipeline connected with the cleaning spray head, and a check valve is arranged on the cleaning pipeline.
In the substrate cleaning machine of the present invention, the cover plate cleaning unit includes a first cover plate cleaning unit and a second cover plate cleaning unit, the first cover plate cleaning unit is disposed in the water knife unit, and the second cover plate cleaning unit is disposed in the brush unit.
In the substrate cleaning machine of the present invention, the first cover cleaning unit is disposed in a direction in which the second cover cleaning unit is away from the substrate.
In the substrate cleaning machine of the present invention, the second cover cleaning unit is disposed in a direction in which the first cover cleaning unit is away from the substrate.
In the substrate cleaning machine of the present invention, the cleaning solvent used by the first cover cleaning unit is pure water, and the cleaning solvent used by the second cover cleaning unit is circulating water.
The invention has the beneficial effects that: the invention provides a substrate cleaning machine, which comprises a water washing unit, wherein the water washing unit comprises: the device comprises a water knife unit, a brush unit and a cover plate cleaning unit, wherein the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of a substrate; the cover plate cleaning unit is used for washing the dead water of the water knife cover plate, so that when the water knife unit cleans the base plate, the condition that the dead water drips on the base plate cannot exist on the water knife cover plate, and the technical problem that the base plate is not clean due to the fact that the dead water drips on the water knife cover plate of an existing base plate cleaning machine falls on the base plate is solved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a prior art substrate cleaning machine;
FIG. 2 is a schematic cross-sectional view of a first substrate cleaning machine according to the present invention;
FIG. 3 is a schematic cross-sectional view of a second substrate cleaning machine according to the present invention;
FIG. 4 is a schematic cross-sectional view of a third substrate cleaning machine according to the present invention;
FIG. 5 is a schematic cross-sectional view of a fourth embodiment of the substrate cleaning apparatus according to the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention aims at the technical problem that the substrate is not clean because dead water on the water knife cover plate drops on the substrate in the existing substrate cleaning machine; the embodiment of the invention can solve the defect.
In one embodiment, as shown in fig. 5, the substrate cleaning machine provided by the present invention includes a water washing unit including:
the water knife unit comprises a water knife spray head 103 and a water knife cover plate 102 and is used for cleaning the surface of the substrate;
a brush unit 101 for removing particles from the surface of the substrate;
a cover plate cleaning unit 104 (including 104a and 104b in fig. 2) for cleaning the water-jet cover plate surface with a cleaning solution.
The embodiment provides a substrate cleaning machine, it includes the washing unit, the washing unit includes: the device comprises a water knife unit, a brush unit and a cover plate cleaning unit, wherein the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of a substrate; the cover plate cleaning unit is used for washing the dead water of the water knife cover plate, so that when the water knife unit cleans the substrate, the condition that the dead water drips on the substrate cannot exist on the water knife cover plate, and the technical problem that the substrate is not clean due to the fact that the dead water drips on the water knife cover plate of the existing substrate cleaning machine drips on the substrate is solved.
In one embodiment, as shown in fig. 2, the cover cleaning unit 104 includes a cleaning nozzle 1041 for spraying a cleaning solution to clean the surface of the water knife cover 102, the nozzle being disposed at an angle to clean the surface of the water knife cover 102.
In one embodiment, the cleaning spray head is a nozzle, the cross section of the nozzle is circular, and when the cross section of the nozzle is circular, the circular nozzle can better clean the water jet cutter cover plate under the condition of preset flow, so that the dead water of the water jet cutter cover plate is effectively relieved from dripping.
In one embodiment, the cleaning spray head is a nozzle, the cross section of the nozzle is in an oval shape, the whole surface of the water knife cover plate can be cleaned through the design of the nozzle, and the oval design of the cross section of the nozzle can realize the characteristic that the volume of the sprayed cleaning solvent is increased from two sides of the oval towards the middle in sequence when the nozzle sprays the cleaning solvent, so that the aim of intensively cleaning a part of the cover plate can be fulfilled.
In one embodiment, the cleaning spray head is a nozzle, and the cross section of the nozzle is in a trapezoid shape.
In one embodiment, the cleaning spray head is a nozzle, the cross section of the nozzle is rectangular, trapezoidal or triangular, and the cross section of the nozzle is designed to be rectangular, trapezoidal or triangular, so that the processing is convenient, and the requirement on the mold is not high.
In an embodiment, as shown in fig. 3, the cleaning nozzles are arranged in an array, the nozzles arranged in the array can be sequentially arranged in a direction away from the substrate, the array of nozzles can effectively enhance the surface cleaning effect on the water knife cover plate, when the nozzles arranged in the array are sequentially arranged in a direction away from the substrate, if some nozzles of the cover plate cleaning unit are not operated or are not clean, the design can be used for simultaneously cleaning through a plurality of nozzles, thereby effectively alleviating the influence caused by the fact that some nozzles are not operated, and effectively alleviating the condition that the water knife cover plate is not clean.
In an embodiment, as shown in fig. 3, the cleaning nozzles are arranged in an array, the nozzles arranged in the array can be sequentially arranged on a plane parallel to the substrate, and since some areas of the water-jet blade cover plate can be prone to depositing dead water, we adopt the nozzles of the cover plate cleaning units arranged in parallel at the same height, this embodiment can perform heavy cleaning on the areas of the water-jet blade cover plate with a certain height where dead water is prone to depositing
In one embodiment, as shown in fig. 2, the cleaning nozzle is disposed in a direction away from the substrate of the water jet nozzle 103, so as to better clean the water jet cover plate 102.
In an embodiment, as shown in fig. 2, the cover plate cleaning unit 104 further includes a cleaning pipe 1042 connected to the cleaning nozzle 1041, the cleaning pipe 1042 is provided with a check valve 1043 for carrying a cleaning solution, and the check valve is used for preventing the cleaning solution from flowing back to affect the purity of the cleaning solution.
In one embodiment, as shown in fig. 2, the cap cleaning unit includes a first cap cleaning unit 104a and a second cap cleaning unit 104b, the first cap cleaning unit 104a is disposed in the water knife unit, and the second cap cleaning unit 104b is disposed in the brush unit 101.
In one embodiment, as shown in fig. 2, the cover plate cleaning unit includes a first cover plate cleaning unit 104a and a second cover plate cleaning unit 104b, the first cover plate cleaning unit 104a is disposed in the water knife unit, the second cover plate cleaning unit 104b is disposed in the brush unit 101, and the first cover plate cleaning unit 104a and the second cover plate cleaning unit 104b are disposed opposite to each other.
In one embodiment, as shown in fig. 4, the first cover plate cleaning unit 104a is disposed in a direction in which the second cover plate cleaning unit 104b is away from the substrate, the second cover plate cleaning unit 104b is below the first cover plate cleaning unit 104a, and the first cover plate cleaning unit 104a is used for secondary washing of the water knife cover plate 102.
In one embodiment, as shown in fig. 4, the second cover plate cleaning unit 104b is disposed in a direction in which the first cover plate cleaning unit 104a is away from the substrate, the first cover plate cleaning unit 104a is below the second cover plate cleaning unit 104b, and the second cover plate cleaning unit 104b is used for secondary washing of the water knife cover plate 102.
In one embodiment, the cleaning solvent used by the first cover plate cleaning unit 104a is pure water, and the cleaning solvent used by the second cover plate cleaning unit 104b is circulating water, and at this time, the first cover plate cleaning unit 104a is disposed in a direction away from the substrate of the second cover plate cleaning unit 104b, so as to ensure that the first cover plate cleaning is performed with pure water for the second cleaning.
In an embodiment, as shown in fig. 5, the cover plate cleaning unit is disposed in the water knife unit, and the cover plate cleaning unit includes only one spray head.
In an embodiment, as shown in fig. 5, the cover plate cleaning unit is arranged in the water jet unit, the spray head of the cover plate cleaning unit is a spray nozzle, the whole surface of the water jet cover plate can be cleaned by the design of the spray nozzle, the cover plate cleaning unit is arranged in the water jet unit, the dead water deposition phenomenon caused by the water jet unit can be effectively relieved, the cover plate cleaning unit needs to be arranged in the direction that the water jet spray head of the water jet unit is far away from the cover plate, and thus the dead water deposited by the operation of the water jet spray head can be better cleaned.
In an embodiment, as shown in fig. 5, the cover plate cleaning unit is disposed in the water jet cutter unit, the cross-sectional shape of the nozzle of the cover plate cleaning unit is circular, the cross-sectional shape of the nozzle is designed to be circular, so that the processing is convenient, the requirement on the mold is not high, when the cross-sectional shape of the nozzle is circular, the circular nozzle can better clean the water jet cutter cover plate under the condition of preset flow, and the dripping of the dead water of the water jet cutter cover plate is effectively relieved.
In one embodiment, as shown in fig. 5, the cover plate cleaning unit is arranged in the water jet cutter unit, the cross section of the nozzle of the cover plate cleaning unit is elliptical, and the elliptical design of the cross section of the nozzle can realize that when the nozzle sprays the cleaning solvent, the volume of the sprayed cleaning solvent has the characteristic of increasing from two sides of the ellipse to the middle in sequence, and the aim of intensively cleaning a certain part of the cover plate can be realized.
In one embodiment, as shown in fig. 5, the cover plate cleaning unit is arranged in the water jet scalpel unit, the cross section of the nozzle of the cover plate cleaning unit is rectangular, trapezoidal or triangular, and the cross section of the nozzle is designed to be rectangular, trapezoidal or triangular, so that the processing is convenient, and the requirement on the mold is not high.
In one embodiment, as shown in fig. 5, the cover plate cleaning unit is disposed in the water knife unit, and the cross-sectional shape of the nozzle of the cover plate cleaning unit is a trapezoid.
In one embodiment, as shown in fig. 5, the cover plate cleaning unit is disposed in the brush unit 101, and the cover plate cleaning unit may be a spray head disposed separately or may be disposed in an array.
In one embodiment, the flow rate of the pipeline is reasonable in design, the flow rate of each position of the pipeline needs to be kept consistent, when the cleaning solvent is sprayed, the flow rates of the first cover plate cleaning unit 104a, the second cover plate cleaning unit 104b and the water jet nozzle need to be controlled to be a preset value, and therefore the cleaning solvent is uniformly sprayed on the premise that the balance of the cleaning solvent in normal production is not affected.
In an embodiment, use modes such as welding to fix the pipeline, the pipeline junction utilizes the sticky tape encapsulation fixed firm, and waterproof sealing adhesive tape needs to be chooseed for use to the sticky tape, can not produce the phenomenon of revealing like this, and the pipeline can adopt integrated into one piece's technology more simultaneously, avoids too many junctions, because of reasons such as sealed, pressure is too big at the junction, leads to leaking, and the effectual phenomenon of revealing of having alleviated has reduced work such as subsequent maintenance, has practiced thrift manpower and materials, saves the cost.
According to the above embodiments:
the invention provides a substrate cleaning machine, which comprises a water washing unit, wherein the water washing unit comprises: the device comprises a water knife unit, a brush unit and a cover plate cleaning unit, wherein the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of a substrate; the cover plate cleaning unit is used for washing the dead water of the water knife cover plate, so that when the water knife unit cleans the base plate, the condition that the dead water drips on the base plate cannot exist on the water knife cover plate, and the technical problem that the base plate is not clean due to the fact that the dead water drips on the water knife cover plate of an existing base plate cleaning machine falls on the base plate is solved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (7)
1. The substrate cleaning machine is characterized by comprising a water washing unit, wherein the water washing unit comprises:
the water knife unit comprises a water knife spray head and a water knife cover plate and is used for cleaning the surface of the substrate;
a brush unit for removing particles from the surface of the substrate;
a cover plate cleaning unit for cleaning the surface of the water jet cover plate by using a cleaning solution;
the cover plate cleaning unit comprises a first cover plate cleaning unit and a second cover plate cleaning unit, the first cover plate cleaning unit is arranged in the water knife unit, and the second cover plate cleaning unit is arranged in the hairbrush unit;
the cover plate cleaning unit comprises a cleaning spray head, and the cleaning spray head is used for spraying a cleaning solution to clean the surface of the water jet cutter cover plate;
the cleaning spray head is a nozzle;
the cross-sectional shape of the nozzle is circular or oval.
2. The substrate cleaning machine of claim 1, wherein the cleaning jets are arranged in an array.
3. The substrate cleaning machine of claim 1, wherein the cleaning nozzle is disposed in a direction in which the water jet nozzle is away from the substrate.
4. The substrate cleaning machine of claim 1, further comprising a cleaning conduit connected to the cleaning nozzle, the cleaning conduit having a check valve disposed thereon.
5. The substrate cleaning machine of claim 1, wherein the first cover plate cleaning unit is disposed in a direction in which the second cover plate cleaning unit is away from the substrate.
6. The substrate cleaning machine according to claim 1, wherein the second cover plate cleaning unit is disposed in a direction in which the first cover plate cleaning unit is away from the substrate.
7. The substrate cleaning machine according to claim 1, wherein the cleaning solvent used by the first cover cleaning unit is pure water, and the cleaning solvent used by the second cover cleaning unit is circulating water.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910126483.2A CN109772794B (en) | 2019-02-20 | 2019-02-20 | Substrate cleaning machine |
| PCT/CN2019/109863 WO2020168724A1 (en) | 2019-02-20 | 2019-10-08 | Substrate cleaner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910126483.2A CN109772794B (en) | 2019-02-20 | 2019-02-20 | Substrate cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109772794A CN109772794A (en) | 2019-05-21 |
| CN109772794B true CN109772794B (en) | 2020-12-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910126483.2A Active CN109772794B (en) | 2019-02-20 | 2019-02-20 | Substrate cleaning machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109772794B (en) |
| WO (1) | WO2020168724A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109772794B (en) * | 2019-02-20 | 2020-12-04 | 深圳市华星光电技术有限公司 | Substrate cleaning machine |
| CN111547511B (en) * | 2020-06-11 | 2021-10-15 | 深圳市晖通货运代理有限公司 | Transport device capable of rapidly cleaning, cutting and polishing glass and increasing friction |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104646337A (en) * | 2013-11-19 | 2015-05-27 | 三星显示有限公司 | Substrate cleaning apparatus |
| CN206613314U (en) * | 2017-04-12 | 2017-11-07 | 江门市力龙环保设备有限公司 | A kind of block water plate structure that can be cleaned automatically |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5125980A (en) * | 1989-09-08 | 1992-06-30 | Hughes Aircraft Company | Optical fiber cleaner |
| JP2854213B2 (en) * | 1993-03-19 | 1999-02-03 | シャープ株式会社 | Cleaning equipment |
| JPH11179299A (en) * | 1997-12-25 | 1999-07-06 | Toray Ind Inc | Cleaner |
| TW587290B (en) * | 2001-03-21 | 2004-05-11 | Macronix Int Co Ltd | Wafer cleaning device |
| JP4091357B2 (en) * | 2002-06-28 | 2008-05-28 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate cleaning method |
| JP2004074021A (en) * | 2002-08-19 | 2004-03-11 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate cleaning unit |
| JP4495618B2 (en) * | 2004-03-29 | 2010-07-07 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
| CN103752571B (en) * | 2013-12-27 | 2017-08-08 | 深圳市华星光电技术有限公司 | Base plate cleaning device |
| CN108933092A (en) * | 2017-05-26 | 2018-12-04 | 弘塑科技股份有限公司 | Substrate board treatment, spray head cleaning device and spray head cleaning method |
| CN109772794B (en) * | 2019-02-20 | 2020-12-04 | 深圳市华星光电技术有限公司 | Substrate cleaning machine |
-
2019
- 2019-02-20 CN CN201910126483.2A patent/CN109772794B/en active Active
- 2019-10-08 WO PCT/CN2019/109863 patent/WO2020168724A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104646337A (en) * | 2013-11-19 | 2015-05-27 | 三星显示有限公司 | Substrate cleaning apparatus |
| CN206613314U (en) * | 2017-04-12 | 2017-11-07 | 江门市力龙环保设备有限公司 | A kind of block water plate structure that can be cleaned automatically |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109772794A (en) | 2019-05-21 |
| WO2020168724A1 (en) | 2020-08-27 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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