CN201017856Y

CN201017856Y - Ejection apparatus

Info

Publication number: CN201017856Y
Application number: CNU2007200676221U
Authority: CN
Inventors: 朱海青; 陈肖科
Original assignee: Semiconductor Manufacturing International Shanghai Corp
Current assignee: Semiconductor Manufacturing International Beijing Corp
Priority date: 2007-03-06
Filing date: 2007-03-06
Publication date: 2008-02-06
Anticipated expiration: 2017-03-06

Abstract

The utility model provides an injection device. The utility model comprises a first fluid pipe, and two injection pipes respectively connected with the first fluid pipe, three atomizing nozzles are distributed on the two injection pipes in a row, therein, at least one atomizing nozzle is arranged oppositely to the diameter of a wafer, and the injection scope of the atomizing nozzle can cover the diameter of the wafer. Compared with the existing technology, the injection scope of the atomizing nozzle in the injection device of the utility model covers the whole surface of the wafer, and therefore, even if the time for awaiting to enter the clearing process exceeds the expectation, the corrosion of the grinding fluid left on the surface to the wafer can be effectively prevented. In addition, a fluid pipe is increased in the utility model, 0.2% triazole toluene can be filled through the fluid pipe to better protect the surface of the wafer, and to reduce the probability of the corrosion to the wafer to the minimum.

Description

Injection apparatus

Technical field

The utility model relates to the conveyer of a kind of use behind the cmp processing procedure, specifically, relates to the injection apparatus in the conveyer.

Background technology

Wafer can enter manufacturing process for cleaning through cmp, before entering manufacturing process for cleaning, wafer can be waited in conveyer, present processing procedure, the time of waiting for was generally 80 seconds, in the process of waiting for, was provided with injection apparatus in the conveyer, this injection apparatus can be always sprays plasma water with the residual lapping liquid of dilution crystal column surface to the positive and negative of wafer, thereby avoids crystal column surface to be corroded.

See also Fig. 1 and Fig. 2, injection apparatus of the prior art comprises playpipe 1, liquid line 7 and the two fog discharge nozzles 3 that are distributed in wafer 5 two sides, every row is made up of three atomizers 3 respectively, three atomizers 3 all are that vertical wafer 5 surfaces are arranged on the playpipe 1, and playpipe 1 provides plasma water from liquid line 7 for nozzle 3.As can be seen from Figure 2, the scope that the atomizer 3 of existing injection apparatus sprays does not cover the first half of wafer 5, when more or equipment breaks down when the wafer that cleans, may need time of waiting for longer, wafer 5 the first half that are not directed onto plasma water will be left in top lapping liquid corrosion, thereby cause wafer loss.

The utility model content

The purpose of this utility model is to provide a kind of injection apparatus, and its spray regime can cover the wafer all surfaces.

For achieving the above object, the utility model provides a kind of injection apparatus, it comprises one first liquid line, two playpipes that are connected respectively to this first liquid line, three atomizers that are arranged in a row distribute on two playpipes, wherein, the diameter setting of the corresponding wafer of described at least one atomizer, the spray regime of this atomizer covers this diameter wafer.

Compared with prior art, the spray regime of the atomizer of injection apparatus has covered the wafer all surfaces in the utility model, like this, surpassed expection, can prevent effectively that also wafer is by the upward residual lapping liquid corrosion in its surface even wait for the time that enters manufacturing process for cleaning.In addition, the utility model is set up a liquid line, and this liquid line injects 0.2% 3 HR-001, can better protect crystal column surface, and the probability that wafer is corroded drops to minimum.

Description of drawings

To the description of the utility model one embodiment, can further understand its practical novel purpose, specific structural features and advantage by following in conjunction with its accompanying drawing.Wherein, accompanying drawing is:

Fig. 1 is the structural representation of injection apparatus in the prior art;

Fig. 2 is the working state schematic representation of injection apparatus in the prior art;

Fig. 3 is the structural representation of the utility model injection apparatus;

Fig. 4 is the working state schematic representation of the utility model injection apparatus.

Embodiment

See also Fig. 3, injection apparatus of the present utility model comprises two playpipes 1, first liquid line 7 of plasma water (DIW) is provided, provides second liquid line, 9, the first liquid lines 7 and second liquid line 9 of 0.2% 3 HR-001 (BTA) to be connected to one the 3rd liquid line 10 jointly.The 3rd liquid line 10 is connected respectively to two playpipes 1, provides the mixing material of plasma water and three HR-001s to give two playpipes 1.Three HR-001s can react with the copper (Cu) on wafer 5 surfaces and can prevent the diaphragm that wafer 5 is corroded to form.

Be distributed with three atomizers 3 on each playpipe 1, these three atomizers 3 are arranged in a row.Wafer 5 can place in the middle of two playpipes 1.Three atomizers 3 are respectively 31,32 and 33.Atomizer 32 correspondences the diameter of wafer 5,

atomizer

31 and 33 respectively corresponding the two edges of wafer 5.

See also Fig. 4, the respectively vertical wafers of

atomizer

31 and 33 5 surfaces are provided with, and the atomizer 32 in the middle of being positioned at is inclined upwardly, and and wafer between angle be acute angle so that the liquid of these atomizer 32 ejections can cover the diameter of wafer 5.

In other embodiment of the utility model, also can adjust the angle of

atomizer

31 and 33, as long as the liquid of three nozzle 3 injections can cover all surfaces of wafer 5.

In other embodiment of the utility model, three nozzles 3 also can be provided with perpendicular to wafer 5 surfaces, only need to change the shape of playpipe 1, and all surfaces that makes the spray regime that is installed in 1 three nozzles 3 of playpipe can cover wafer 5 gets final product.

The atomizer 32 of injection apparatus of the present utility model is inclined upwardly, thereby the spray regime that the surface that guarantees wafer 5 can injected device covers, prevent that the liquid that wafer 5 surfaces are corroded from having covered wafer 5 all surfaces, like this, surpassed expection even wait for the time that enters manufacturing process for cleaning, can prevent effectively that also wafer 5 is by the upward residual lapping liquid corrosion in its surface.In addition, the utility model is set up a liquid line 9, and this liquid line 9 injects 0.2% 3 HR-001, can better protect wafer 5 surfaces, and the probability that wafer 5 is corroded drops to minimum.

Claims

1. injection apparatus, it comprises one first liquid line, two playpipes that are connected respectively to this first liquid line, three atomizers that are arranged in a row distribute on two playpipes, it is characterized in that: the diameter setting of the corresponding wafer of described at least one atomizer, the spray regime of this atomizer covers the diameter of this wafer.

2. injection apparatus as claimed in claim 1 is characterized in that: the angle between at least one atomizer and the wafer is an acute angle, makes the spray regime of nozzle can cover the first half of wafer.

3. injection apparatus as claimed in claim 1, it is characterized in that: described injection apparatus also comprises one second liquid line, first liquid line and second liquid line are connected to one the 3rd liquid line jointly, the 3rd liquid line is connected respectively to two playpipes, to send the mixing material from first liquid line and second liquid line to two playpipes.

4. injection apparatus as claimed in claim 1 is characterized in that: first liquid line provides plasma liquid, and second liquid line provides 0.2% 3 HR-001.