CN209433178U - Photoresist spray nozzle device - Google Patents
Photoresist spray nozzle device Download PDFInfo
- Publication number
- CN209433178U CN209433178U CN201920414839.8U CN201920414839U CN209433178U CN 209433178 U CN209433178 U CN 209433178U CN 201920414839 U CN201920414839 U CN 201920414839U CN 209433178 U CN209433178 U CN 209433178U
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- Prior art keywords
- photoresist
- spray nozzle
- nozzle device
- cleaning
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 133
- 239000007921 spray Substances 0.000 title claims abstract description 73
- 238000004140 cleaning Methods 0.000 claims abstract description 85
- 238000010926 purge Methods 0.000 claims abstract description 22
- 238000001179 sorption measurement Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 238000005507 spraying Methods 0.000 abstract description 17
- 238000005345 coagulation Methods 0.000 abstract description 9
- 230000015271 coagulation Effects 0.000 abstract description 9
- 239000000243 solution Substances 0.000 description 81
- 235000012431 wafers Nutrition 0.000 description 20
- 238000000034 method Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a kind of photoresist spray nozzle device, and the photoresist spray nozzle device includes: nozzle, sprays photoresist solution to wafer by the nozzle；Feeding structure, the feeding structure include feed control valve, and the feeding structure is connected with the nozzle, provide the photoresist solution by the feeding structure for the nozzle；Cleaning structure, the cleaning structure include purge control valve, provide cleaning solution by the cleaning structure for the nozzle.The photoresist spray nozzle device of the utility model can remove the coagulation of the photoresist solution and photoresist solution in the nozzle by cleaning structure, to can be improved, photoresist spraying uniformity, to reduce spraying bad, to reduce rework, reduces cost, improves yield rate；And by the resorption of return adsorption structure and mobile photoresist spray nozzle device, product yield can be further improved.
Description
Technical field
The utility model belongs to field of semiconductor devices, is related to a kind of photoresist spray nozzle device.
Background technique
In semiconductor integrated circuit field, photoetching process have always been considered as be most critical in IC manufacturing step
Suddenly, it needs to be used multiple times in entire technical process, there is important influence to the quality of product.
In existing photolithography process, the method for being coated with photoresist usually uses method of spin coating, i.e., by being located at wafer
The nozzle of top sprays photoresist solution to wafer, and by the rotation of wafer so that photoresist solution even spread；The rotation of photoresist solution
After painting, soft baking (PAB) need to be carried out, so that solvent in photoresist solution component etc. is volatilized, then be exposed.Therefore, photoresist solution
The material of a kind of volatile and easy dry condensation need to be selected.Usual photoresist solution is by resin, solvent, emulsion and additive etc.
Composition.In process of production, after the completion of in order to avoid spraying, the water clock of the photoresist solution on nozzle is usually matched on feeder sleeve
Return suction system (Suck back) is had, after the completion of spraying, is operated by the resorption of return suction system, can avoid the light in nozzle
Solution water clock is hindered on wafer.But since the solvent in photoresist solution is volatile, the solvent in photoresist solution can be gradually decreased,
The photoresist solution that will cause resorption simultaneously by the way of resorption is condensed in nozzle, generates coagulation, and be attached in nozzle,
It when nozzle sprays photoresist solution again, may cause: 1) due to the blocking of coagulation, will affect the stability of spraying process,
Spraying process is caused to be not in good state, photoresist solution is unevenly coated on wafer；2) when the condensation of photoresist solution is serious, it will cause spray
Mouth crystallization, coagulation fall to the surface of wafer due to the impact by photoresist solution, cause product defects, influence product matter
Amount.Due in spraying process, being unable to monitor the state of nozzle, thus caused defect and exception can not be controlled at the first time
System, therefore increase rework cost to a certain extent, reduce yield rate.
Therefore it provides a kind of photoresist spray nozzle device, to solve the volatilization due to the photoresist solution in nozzle, generation is coagulated
The above problem brought by object is tied, is necessary.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of photoresist spray nozzle device,
For solving that it is equal to generate photoresist solution spraying brought by coagulation due to the volatilization of the photoresist solution in nozzle in the prior art
Even property is poor, spraying is bad, increases the low problem of rework cost, yield rate.
In order to achieve the above objects and other related objects, the utility model provides a kind of photoresist spray nozzle device, the photoresist
Spray nozzle device includes:
Nozzle sprays photoresist solution to wafer by the nozzle；
Feeding structure, the feeding structure include feed control valve, and the feeding structure is connected with the nozzle, passes through
The feeding structure provides the photoresist solution for the nozzle；
Cleaning structure, the cleaning structure include purge control valve, are provided clearly by the cleaning structure for the nozzle
Dilution.
Optionally, the feed control valve and the purge control valve include one of shut-off valve, check-valves or combination.
Optionally, the cleaning structure is directly connected to the nozzle.
Optionally, the cleaning structure is connected with the feeder sleeve between the feed control valve and the nozzle
It connects.
Optionally, the cleaning solution includes one of OK73, PGMEA, PGME and deionized water or combination.
Optionally, the photoresist spray nozzle device further includes return adsorption structure.
Optionally, pass through the resorption of the return adsorption structure, the model of resorption distance of the photoresist solution in the nozzle
It encloses including 2mm~3mm.
Optionally, the regulative mode of the feed control valve and the purge control valve includes manually adjusting and automatically adjusting
One of or combination.
Optionally, the cleaning structure further includes power unit.
Optionally, the photoresist spray nozzle device includes in fixed photoresist spray nozzle device and mobile photoresist spray nozzle device
It is a kind of.
As described above, the photoresist spray nozzle device of the utility model can remove and be located in the nozzle by cleaning structure
The coagulation of photoresist solution and photoresist solution, thus can be improved photoresist spraying uniformity, reduce spraying it is bad, with reduce
Rework reduces cost, improves yield rate；It, can be further and by the resorption of return adsorption structure and mobile photoresist spray nozzle device
Raising product yield.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the photoresist spray nozzle device in embodiment one.
Fig. 2 is shown as the structural schematic diagram of the photoresist spray nozzle device in embodiment two.
Component label instructions
10 wafers
100,110 nozzle
200,210 feeding structure
201,211 feeder sleeve
202,212 feed control valve
203,213 photoresist solution storage tank
300,310 cleaning structure
301,311 cleaning pipe
302,312 purge control valve
303,313 cleaning solution storage tank
400,410 photoresist solution
500,510 cleaning solution
610 return adsorption structures
H resorption distance
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Fig. 1 is please referred to Fig. 2.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, is not intended to limit the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model
Revealed technology contents obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model
Scope.
Embodiment one
Such as Fig. 1, the utility model provides a kind of photoresist spray nozzle device, and the photoresist spray nozzle device includes:
Nozzle 100 sprays photoresist solution 400 to wafer 10 by the nozzle 100；
Feeding structure 200, the feeding structure 200 include feed control valve 202, the feeding structure 200 and the spray
Mouth 100 is connected, and is that the nozzle 100 provides the photoresist solution 400 by the feeding structure 200；
Cleaning structure 300, the cleaning structure 300 include purge control valve 302, are institute by the cleaning structure 300
It states nozzle 100 and cleaning solution 500 is provided.
The present embodiment can remove by the cleaning structure 300 with the purge control valve 302 and be located at the nozzle
The coagulation of the photoresist solution 400 and the photoresist solution 400 in 100 sprays so that the photoresist solution 400 can be improved
Uniformity, reduce spraying it is bad, to reduce rework, reduce cost, and yield rate can be improved.
Specifically, the feeding structure 200 includes that feeder sleeve 201, feed control valve 202 and photoresist are molten in the present embodiment
Liquid storage tank 203.The photoresist solution storage tank 203 is to store the photoresist solution 400；The feeder sleeve 201 with it is described
Photoresist solution storage tank 203 is connected, and is connected with the nozzle 100, so that it is logical to provide operation for the photoresist solution 400
Road；The feed control valve 202 is located on the feeder sleeve 201, molten to control the photoresist by the feed control valve 202
The operation of liquid 400, the size including switch state and flow.The cleaning structure 300 includes cleaning pipe 301, purge control valve
302 and cleaning solution storage tank 303.The cleaning solution storage tank 303 is to store the cleaning solution 500；The cleaning
Pipe 301 is connected with the cleaning solution storage tank 303, to provide operation channel for the cleaning solution 500；The cleaning
Control valve 302 is located in the cleaning pipe 301, and the fortune of the cleaning solution 500 is controlled by the purge control valve 302
Row, the size including switch state and flow.
As the further embodiment of the embodiment, the feed control valve 202 and the purge control valve 302 include cutting
Only one of valve, check-valves or combination.
Specifically, the feed control valve 202 uses shut-off valve in the present embodiment, the purge control valve 302, which uses, to be stopped
Valve is returned, however, it is not limited to this.Wherein, by the shut-off valve, it can control the operation of the photoresist solution 400, by described
Check-valves can only allow the cleaning solution 500 to flow out from the cleaning solution storage tank 303, by the cleaning pipe 301 to
One direction flowing, into the nozzle 100, to clean the nozzle 100, to can effectively be prevented by the check-valves
The opposite direction flowing of liquid, to prevent the photoresist solution 400 from entering in the cleaning pipe 301, therefore, the purge control valve
302 use check-valves, can control the operation of the cleaning solution 500 on one side, on the other hand also can ensure that the cleaning is molten
Liquid 500 is not contaminated, so that the cleaning solution 500 can be improved to the cleaning effect of the nozzle 100.The shut-off valve and institute
It states the specific type of check-valves herein with no restriction, can be selected as needed.
As the further embodiment of the embodiment, the cleaning structure 300 and the nozzle 100 include be directly connected to and
It one of is indirectly connected with or combination.
Specifically, in the present embodiment, the cleaning structure 300 uses indirect connections with the nozzle 100 such as Fig. 1,
The i.e. described cleaning structure 300 is connected with the feeder sleeve 201 between the feed control valve 202 and the nozzle 100
It connects, so as to while not changing the structure of the nozzle 100, achieve the purpose that the cleaning nozzle 100, described in expanding
The scope of application of photoresist spray nozzle device.However, it is not limited to this, in another embodiment, the cleaning structure 300 and the spray
The mode being directly connected to can also be used in mouth 100, i.e., is directly connected to the cleaning pipe 301 and the nozzle 100, does not limit herein
System.
As the further embodiment of the embodiment, the cleaning solution 500 includes OK73, PGMEA, PGME and deionization
One of water or combination.
Specifically, the specific type of the cleaning solution 500 can carry out phase according to the specific ingredient of the photoresist solution 400
The selection answered, to effectively remove the condensation of the photoresist solution 400 or the photoresist solution 400 that are located in the nozzle 100
Object, herein with no restriction, in the present embodiment, the cleaning solution 500 is preferably more for the specific type of the cleaning solution 500
Common OK73, in order to improve the convenience of operation.
As the further embodiment of the embodiment, the adjusting of the feed control valve 202 and the purge control valve 302
Mode includes one of manually adjusting and automatically adjusting or combine.
Specifically, the photoresist spray nozzle device may also include controller (not shown), the controller and the feed are controlled
Valve 202 and the purge control valve 302 electrical connection processed.It can be realized by the controller to the feed control valve 202 and institute
The automatic adjustment of purge control valve 302 is stated, to improve the operation feed control valve 202 and the purge control valve 302
Convenience, accuracy, to further increase cleaning effect.The cleaning of the also settable cleaning structure 300 of the controller
Period, to carry out periodically automatic cleaning to the nozzle 100.Certainly, the feed control valve 202 and cleaning control
The mode manually adjusted can also be used in the regulative mode of valve 302 processed, so that the cost of the photoresist spray nozzle device is reduced, according to tool
Body needs to be adjusted at any time, to improve the timeliness of manipulation；Or the feed control valve 202 and the purge control valve
The mode for manually adjusting and automatically adjusting and be combined also can be used in 302 regulative mode, herein with no restriction.
As the further embodiment of the embodiment, the cleaning structure 300 may also include power unit (not shown).
Specifically, the power unit can provide enough power for the cleaning structure 300, so as to further mention
The cleaning effect of the high cleaning structure 300.The power unit may include such as pump, cylinder, herein with no restriction.
As the further embodiment of the embodiment, the photoresist spray nozzle device includes fixed photoresist spray nozzle device.
Specifically, the photoresist spray nozzle device uses fixed photoresist spray nozzle device, i.e., the described photoresist spray in the present embodiment
The position of mouth device is constant, and operating the photoresist spray nozzle device can comprise the following steps that
When normally spraying the photoresist solution 400, the feed control valve 202 is in the open state, the cleaning control
Valve 302 processed is in close state, so that the photoresist solution 400 be prevented to be in contact with the cleaning solution 500；
When cleaning the nozzle 100, the feed control valve 202 is in close state, preferably by the wafer 10
The mode shifted, to avoid polluting or damaging the wafer 10 in the process of cleaning, however, it is not limited to this, then described
Purge control valve 302 is in the open state, so that the cleaning solution 500 flows into the nozzle 100, to be cleaned.When
Mobile photoresist spray nozzle device can also be used in the right photoresist spray nozzle device, herein with no restriction.
Embodiment two
Such as Fig. 2, the utility model also provides the photoresist spray nozzle device of another movable type, described in embodiment one
Photoresist spray nozzle device, in the present embodiment, the photoresist spray nozzle device further includes return adsorption structure 610.The nozzle, feeding structure and
Cleaning structure is as in the first embodiment, details are not described herein again.
Specifically, the photoresist spray nozzle device includes: nozzle 110, feeding structure 210, cleaning structure 310 and return adsorption structure
610.Photoresist solution 410 is sprayed to the wafer 10 by the nozzle 110；The feeding structure 210 includes feed control valve
212, the feeding structure 210 is connected with the nozzle 110, provides institute by the feeding structure 210 for the nozzle 110
State photoresist solution 410；The cleaning structure 310 includes purge control valve 312, is the nozzle by the cleaning structure 310
110 provide cleaning solution 510；The return adsorption structure 610 can resorption be located at the photoresist solution 410 in the nozzle 110, from
And it can avoid on 410 water clock of photoresist solution to the wafer 10.
The present embodiment can remove by the cleaning structure 310 with the purge control valve 312 and be located at the nozzle
The coagulation of the photoresist solution 410 and the photoresist solution 410 in 110 sprays so that the photoresist solution 410 can be improved
Uniformity, to reduce spraying bad, to reduce rework, reduce cost, improve yield rate；And pass through the return adsorption structure 610,
Also can avoid when being cleaned to the nozzle 110, on 410 water clock of photoresist solution to the wafer 10, so as into
One step improves the quality of the wafer 10 of subsequent preparation.
As the further embodiment of the embodiment, resorption distance H of the photoresist solution 410 in the nozzle 110
Range include 2mm~3mm.
Specifically, such as Fig. 2, when the nozzle 110 is cleaned, the return adsorption structure 610 can be started, described time
Inhaling structure 610 makes the range of resorption distance H of the photoresist solution 410 in the nozzle 110 include 2mm~3mm, such as
2.5mm, to avoid on 410 water clock of photoresist solution to the wafer 10.
As the further embodiment of the embodiment, the photoresist spray nozzle device further includes mobile photoresist spray nozzle device.
Specifically, the photoresist spray nozzle device is using mobile photoresist spray nozzle device, i.e., the described photoresist spray in the present embodiment
The position of mouth device is variable, and operating the photoresist spray nozzle device can comprise the following steps that
When normally spraying the photoresist solution 410, the feed control valve 212 is in the open state, the cleaning control
Valve 312 processed is in close state, so that the photoresist solution 410 be prevented to be in contact with the cleaning solution 510；It is described simultaneously to return
Structure 610 is inhaled to be in close state；
When cleaning the nozzle 110, the feed control valve 212 is in close state, and the return adsorption structure 610 is in
Opening state avoids water clock with the photoresist solution 410 in nozzle 110 described in resorption；Pass through the movement photoresist nozzle dress
It sets, the photoresist spray nozzle device is transferred to 10 outside of wafer, then closes the return adsorption structure 610, then open described
Purge control valve 312, so that the cleaning solution 510 flows into the nozzle 110, to be cleaned.It can be kept away using which
Exempt from the photoresist solution 410 wafer 10, and without shifting the wafer 10, so as to reduce to the wafer
10 influence.Fixed photoresist spray nozzle device can also be used in certain photoresist spray nozzle device, herein with no restriction.
In conclusion the photoresist spray nozzle device of the utility model can remove and be located in the nozzle by cleaning structure
The coagulation of photoresist solution and photoresist solution, thus can be improved photoresist spraying uniformity, reduce spraying it is bad, with reduce
Rework reduces cost, improves yield rate；It, can be further and by the resorption of return adsorption structure and mobile photoresist spray nozzle device
Raising product yield.So the utility model effectively overcomes various shortcoming in the prior art and has high industrial utilization
Value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of photoresist spray nozzle device, which is characterized in that the photoresist spray nozzle device includes:
Nozzle sprays photoresist solution to wafer by the nozzle；
Feeding structure, the feeding structure include feed control valve, and the feeding structure is connected with the nozzle, by described
Feeding structure provides the photoresist solution for the nozzle；
Cleaning structure, the cleaning structure include purge control valve, by the cleaning structure for the nozzle provide cleaning it is molten
Liquid.
2. photoresist spray nozzle device according to claim 1, it is characterised in that: the feed control valve and the cleaning control
Valve includes one of shut-off valve, check-valves or combination.
3. photoresist spray nozzle device according to claim 1, it is characterised in that: the cleaning structure directly connects with the nozzle
It connects.
4. photoresist spray nozzle device according to claim 1, it is characterised in that: the cleaning structure is controlled with the feed is located at
The feeder sleeve between valve processed and the nozzle is connected.
5. photoresist spray nozzle device according to claim 1, it is characterised in that: the cleaning solution include OK73, PGMEA,
One of PGME and deionized water or combination.
6. photoresist spray nozzle device according to claim 1, it is characterised in that: the photoresist spray nozzle device further includes resorption knot
Structure.
7. photoresist spray nozzle device according to claim 6, it is characterised in that: described by the resorption of the return adsorption structure
The range of resorption distance of the photoresist solution in the nozzle includes 2mm~3mm.
8. photoresist spray nozzle device according to claim 1, it is characterised in that: the feed control valve and the cleaning control
The regulative mode of valve includes one of manually adjusting and automatically adjusting or combine.
9. photoresist spray nozzle device according to claim 1, it is characterised in that: the cleaning structure further includes power unit.
10. photoresist spray nozzle device according to claim 1, it is characterised in that: the photoresist spray nozzle device includes fixed
One of photoresist spray nozzle device and mobile photoresist spray nozzle device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920414839.8U CN209433178U (en) | 2019-03-28 | 2019-03-28 | Photoresist spray nozzle device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920414839.8U CN209433178U (en) | 2019-03-28 | 2019-03-28 | Photoresist spray nozzle device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209433178U true CN209433178U (en) | 2019-09-24 |
Family
ID=67978984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920414839.8U Expired - Fee Related CN209433178U (en) | 2019-03-28 | 2019-03-28 | Photoresist spray nozzle device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209433178U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739823A (en) * | 2020-06-29 | 2020-10-02 | 中国科学院微电子研究所 | Photoresist coating nozzle and photoresist coating equipment with same |
| CN113976371A (en) * | 2021-09-16 | 2022-01-28 | 长鑫存储技术有限公司 | Photoresist spraying device and nozzle anti-crystallization method |
-
2019
- 2019-03-28 CN CN201920414839.8U patent/CN209433178U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111739823A (en) * | 2020-06-29 | 2020-10-02 | 中国科学院微电子研究所 | Photoresist coating nozzle and photoresist coating equipment with same |
| CN113976371A (en) * | 2021-09-16 | 2022-01-28 | 长鑫存储技术有限公司 | Photoresist spraying device and nozzle anti-crystallization method |
| CN113976371B (en) * | 2021-09-16 | 2022-12-27 | 长鑫存储技术有限公司 | Photoresist spraying device and nozzle anti-crystallization method |
| WO2023040038A1 (en) * | 2021-09-16 | 2023-03-23 | 长鑫存储技术有限公司 | Photoresist spraying device and nozzle anti-crystallization method |
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Granted publication date: 20190924 |