CN113976371A - Photoresist spraying device and nozzle anti-crystallization method - Google Patents
Photoresist spraying device and nozzle anti-crystallization method Download PDFInfo
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- CN113976371A CN113976371A CN202111088057.8A CN202111088057A CN113976371A CN 113976371 A CN113976371 A CN 113976371A CN 202111088057 A CN202111088057 A CN 202111088057A CN 113976371 A CN113976371 A CN 113976371A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
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- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
The embodiment of the application discloses a photoresistance spraying device and a nozzle anti-crystallization method, wherein the photoresistance spraying device comprises: a nozzle for ejecting the photoresist; the first container is used for storing the sucked back photoresist; the back suction pipeline is connected with a first conveying pipeline and is connected with a second container through the first conveying pipeline, and the second container is used for providing light resistance for the nozzle through the first conveying pipeline; the power unit is arranged on the suction pipeline and is used for sucking the residual light resistance in the nozzle back to the first container along the suction pipeline; and the first valve is arranged on the back suction pipeline and used for opening and closing the back suction pipeline. The embodiment of the application is favorable for solving the problems of poor suck-back effect and blockage and waste caused by the fact that the photoresistance is left on the nozzle.
Description
Technical Field
The embodiment of the application relates to the technical field of semiconductor production equipment, in particular to a photoresist spraying device and a nozzle anti-crystallization method.
Background
Photoresist (liquid) spraying (Spray) plays a very important role in the field of semiconductor manufacturing. For example, in an etching process, the photoresist layer is used as a mask for the etched film to keep the desired pattern from being removed by the etching reaction. In the ion implantation process, the photoresist layer also has the function of a mask to dope only a predetermined region.
Photoresistance can leave over the photoresistance in the spraying, and the photoresistance resorption that current photoresistance spraying device will leave over usually is to the photoresistance source, but the resorption effect is not good for remaining photoresistance condenses easily and blocks up the nozzle, if direct washing will lead to extravagantly.
Disclosure of Invention
The embodiment of the application provides a photoresist spraying device and a nozzle anti-crystallization method, which are beneficial to solving the problems of poor resorption effect and blockage and waste caused by the fact that photoresist is left on a nozzle.
A first aspect of an embodiment of the present application provides a photoresist spraying apparatus, including:
a nozzle for ejecting the photoresist;
the first container is used for storing the sucked back photoresist;
the back suction pipeline is connected with a first conveying pipeline and is connected with a second container through the first conveying pipeline, and the second container is used for providing light resistance for the nozzle through the first conveying pipeline;
the power unit is arranged on the suction pipeline and is used for sucking the residual light resistance in the nozzle back to the first container along the suction pipeline;
and the first valve is arranged on the back suction pipeline and used for opening and closing the back suction pipeline.
In some embodiments, the photoresist sprayer further comprises:
the two ends of the second conveying pipeline are respectively connected with the nozzle and the first container;
the first container is also used for conveying the sucked back light resistance to the nozzle through the second conveying pipeline.
In some embodiments, the photoresist sprayer further comprises:
and the second valve is arranged on the second conveying pipeline and used for opening and closing the second conveying pipeline.
In some embodiments, the photoresist sprayer further comprises:
and the filter is arranged on the suction pipeline and used for filtering the light resistance passing through the suction pipeline so as to remove particles formed in the light resistance.
In some embodiments, the first container has a first air inlet and an air outlet;
the air outlet is used for exhausting air in the light resistor;
the first gas inlet is used for filling first gas into the first container according to first pressure so as to press the gas in the sucked back photoresist out of the gas outlet or press the sucked back photoresist into the second conveying pipeline.
In some embodiments, the photoresist sprayer further comprises:
and the third valve is arranged on the back suction pipeline and used for simultaneously opening and closing the back suction pipeline and the first conveying pipeline.
In some embodiments, the second container has a second air inlet thereon;
the second gas inlet is used for filling a second gas into the second container according to a second pressure so as to press the photoresist into the first conveying pipeline.
In some embodiments, the photoresist sprayer further comprises:
a third container for storing the first cleaning liquid;
and two ends of the third conveying pipeline are respectively connected with the nozzle and the third container and used for conveying the first cleaning liquid to the nozzle so as to clean the interior of the nozzle.
In some embodiments, the photoresist sprayer further comprises: and the third valve is arranged on the third conveying pipeline and used for opening and closing the third conveying pipeline.
In some embodiments, the third container has a third air inlet;
the third gas inlet is used for filling a third gas into the third container according to a third pressure so as to press the first cleaning liquid into the third conveying pipeline.
In some embodiments, the photoresist sprayer further comprises:
a fourth container for recovering waste liquid formed by cleaning the nozzle;
and the fourth conveying pipeline is connected with the fourth container and is used for discharging the waste liquid recovered by the fourth container.
In some embodiments, the photoresist sprayer further comprises:
the first spray head is used for spraying second cleaning liquid to clean the outlet of the spray nozzle;
a fifth container for storing the second cleaning liquid;
and two ends of the fifth conveying pipeline are respectively connected with the first spray head and the fifth container and are used for conveying the second cleaning liquid to the first spray head.
In some embodiments, the photoresist sprayer further comprises:
the second spray head is used for spraying dry gas to remove the first cleaning liquid and the second cleaning liquid remained on the spray nozzle;
a gas source for storing the dry gas;
and two ends of the sixth conveying pipeline are respectively connected with the second spray head and the gas source and are used for conveying the dry gas to the second spray head.
A second aspect of an embodiment of the present application provides a nozzle crystallization prevention method, including:
after the photoresist is sprayed by the photoresist spraying device according to any one of the embodiments of the first aspect, at least the residual photoresist in the nozzle is sucked back to the first container along the suction line.
In some embodiments, after the photoresist left in the nozzle is sucked back to the first container along the suck-back line, the method further comprises:
the sucked photoresist is conveyed to a nozzle.
In some embodiments, before delivering the sucked back photoresist to the nozzle, the method further comprises:
particles and/or gases in the photoresist are removed.
In some embodiments, before delivering the sucked back photoresist to the nozzle, the method further comprises:
performing a cleaning operation on the nozzle, the cleaning operation comprising:
cleaning the interior of the nozzle; and
cleaning the outlet of the nozzle; and
and drying the cleaned nozzle.
The technical scheme of the embodiment of the application has at least the following beneficial technical effects:
the embodiment of the application provides a photoresistance spraying device includes resorption pipeline and first container, can replace the photoresistance that the photoresistance source resorption left over in and the storage nozzle, avoids the direct pollution that a large amount of resorption photoresistances in photoresistance source lead to help improving the resorption effect, in addition, along with the improvement of resorption effect, the photoresistance of leaving over in the nozzle reduces, thereby help solving the photoresistance and leave over jam and the extravagant problem that leads to at the nozzle.
Drawings
FIG. 1 is a schematic structural diagram of a photoresist spraying apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of another photoresist spraying apparatus according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of another photoresist spraying apparatus according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a delivery path of a second cleaning fluid provided in accordance with an embodiment of the present application;
FIG. 5 is a schematic diagram of a conveying path of drying gas provided according to an embodiment of the present application;
fig. 6 is a flow chart of a nozzle crystallization prevention method provided according to an embodiment of the present application.
Reference numerals:
10. a nozzle; 11. a second container; 111. a second air inlet; 12. a first delivery line; 13. a buffer module; 14. a first power module; 15. a filtration module; 16. a second power module; 17. a third valve; 20. a suck-back line; 21. a first container; 211. a first air inlet; 212. an air outlet; 22. a power unit; 23. a first valve; 24. a filter; 30. a second delivery line; 31. a second valve; 40. a third container; 401. a third air inlet; 41. a third delivery line; 42. a fourth valve; 50. a fourth container; 51. a fourth delivery line; 52. a fifth valve; 60. a first nozzle; 61. a fifth container; 611. a fourth air inlet; 62. a fifth delivery line; 70. a second nozzle; 71. a gas source; 72. and a sixth delivery line.
Detailed Description
Photoresist (liquid) spraying (Spray) plays a very important role in the field of semiconductor manufacturing. For example, in an etching process, the photoresist layer is used as a mask for the etched film to keep the desired pattern from being removed by the etching reaction. In the ion implantation process, the photoresist layer also has the function of a mask to dope only a predetermined region.
The applicant finds that the photoresistance can be left in the nozzle of the photoresistance spraying device after the spraying is finished by knowing the photoresistance spraying process, the left photoresistance is easy to generate small particles and bubbles when being contacted with air, if a large amount of back suction is carried out, the small particles and the bubbles in the photoresistance can be led to enter the photoresistance source, so that the photoresistance source is polluted, if the back suction is not carried out or a small amount of back suction is carried out, the photoresistance can be condensed, the nozzle is blocked, if the photoresistance is directly cleaned, the waste can be caused, and the generation cost is increased.
In order to solve the above problem, an embodiment of the present application provides a photoresist spraying apparatus, including: a nozzle for ejecting the photoresist; the first container is used for storing the sucked back photoresist; the back suction pipeline is connected with a first conveying pipeline and is connected with the first container through the first conveying pipeline to form a back suction path; the power unit is arranged on the suction pipeline and is used for sucking the residual light resistance in the nozzle back to the first container along the suction pipeline; the first valve is arranged on the back suction pipeline and used for opening and closing the back suction pipeline; the suck-back pipeline is also connected with a second container through the first conveying pipeline, and the second container is used for providing light resistance for the nozzle through the first conveying pipeline.
That is to say, set up resorption pipeline and first container and can replace the photoresistance that the photoresistance source resorption nozzle left over, can avoid the direct pollution that a large amount of resorption photoresistances in the photoresistance source lead to help improving the resorption effect, in addition, along with the improvement of resorption effect, the photoresistance that leaves over in the nozzle reduces, thereby helps solving the photoresistance and leaves over jam and extravagant problem that leads to at the nozzle.
In order to make the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application are described in further detail below with reference to the accompanying drawings in combination with the detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the embodiments of the present application. Furthermore, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the embodiments of the present application.
Fig. 1 is a schematic structural diagram of a photoresist spraying apparatus according to an embodiment of the present application.
Referring to fig. 1, in some embodiments, a photoresist sprayer includes:
a nozzle 10 for ejecting a photoresist;
a first container 21 for storing the sucked back photoresist;
a suck-back pipeline 20, the suck-back pipeline 20 is connected with a first conveying pipeline 12, the suck-back pipeline 20 is connected with the first container 21 through the first conveying pipeline 12 to form a suck-back path;
a power unit 22 disposed on the suck-back line 20 for sucking back the photoresist left in the nozzle 10 to the first container 21 along the suck-back line;
a first valve 23, disposed on the suck-back line 20, for opening and closing the suck-back line 20;
the suck-back pipeline 20 is further connected to a second container 11 through the first delivery pipeline 12, and the second container 11 is used for providing the photoresist to the nozzle 10 through the first delivery pipeline 12.
Wherein, the resorption pipeline 20 with first container 21 can replace the photoresistance source, by resorption pipeline 20 resorption the photoresistance of leaving over in the nozzle 10 arrives in the first container 21, avoid the direct pollution that a large amount of resorption photoresistances in the photoresistance source lead to help improving the resorption effect, in addition, along with the improvement of resorption effect, the photoresistance of leaving over in the nozzle 10 reduces, thereby helps solving the jam and the extravagant problem that the photoresistance left over and lead to at the nozzle 10.
Illustratively, the nozzle 10 has a plurality of liquid inlets, wherein at least one liquid inlet is connected to the first delivery pipe 12, one end of the suck-back pipe 20 may be connected to the other liquid inlets of the nozzle 10, and may also be connected to the first delivery pipe 12, and the other end is connected to the first container 21. In this embodiment, when the first conveying pipeline 12 conveys the photoresist, the first valve 23 is closed, so that the photoresist is prevented from being shunted by the suck-back pipeline 20 in the photoresist spraying process, thereby affecting the spraying quality of the photoresist; when the suck-back pipeline 20 sucks back the photoresist, and the first valve 23 and the power unit 22 are both opened, the suck-back pipeline 20 can suck back the photoresist left in the nozzle 10 and at least part of the photoresist in the first conveying pipeline 12.
For example, the first delivery pipe 12 may be provided with a buffer module 13, a first power module 14, a filter module 15 and a second power module 16. The buffer module 13 can prevent the nozzle 10 from being continuously operated without photoresist ejection (i.e. idling) and causing damage after the photoresist in the second container 11 is used up; the first and second power modules 14, 16 may be magnetic pumps; the filter module 15 needs to be replaced after filtering the photoresist solution for a period of time, the replacement time of the filter module 15 may be a fixed frequency, and the filter module is replaced about once every three months, and the replacement frequency may also be adjusted according to actual conditions. The buffer module 13 may be a buffer container, which is disposed on an output path of the second container 11 and used for temporarily storing the photoresist conveyed by the first conveying pipeline 12 and eliminating an impact force of the photoresist; the first power module 14 is arranged on an output path of the buffer module 13 and used for generating first power so as to enable the photoresist stored in the buffer module 13 to continue to advance along the first conveying pipeline 12; the filtering module 15 is arranged on an output path of the first power module 14 and is used for filtering the passing photoresist to filter bubbles in the photoresist; the second power module 16 is disposed on an output path of the first filter module, and is used for generating a second power to make the photoresist passing through the first filter module reach the nozzle 10. Each of the output paths is a portion of the first delivery line 12. The second container 11 may be a narrow-mouth bottle or a wide-mouth bottle, for example, the second container 11 may be a wide-mouth bottle having a body diameter of 100mm and a height of 200mm, a mouth diameter of 60mm and a height of 30mm, and a neck height of 40 mm. The second container 11 may have a second gas inlet 111, and the second gas inlet 111 is used for filling the second container 11 with a second gas according to a second pressure so as to press the photoresist stored in the second container 11 into the first delivery pipe 12. In the present embodiment, the second gas may be an inert gas, such as helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), or the like. The second pressure may be a pressure of the second gas at the second gas inlet 111, for example, the second pressure may be 20 to 30 kPa.
In some embodiments, the photoresist sprayer further comprises: a second delivery pipe 30, both ends of the second delivery pipe 30 being connected to the nozzle 10 and the first container 21, respectively; the first container 21 is also used for delivering the sucked photoresist to the nozzle 10 through the second delivery pipe 30.
Fig. 2 is a schematic structural diagram of another photoresist spraying apparatus according to an embodiment of the present application.
Referring to fig. 2, in some embodiments, in order to recycle the sucked back photoresist and avoid waste, the sucked back photoresist may be used for spraying or pre-spraying, and therefore, the photoresist spraying apparatus further includes: and a second valve 31 disposed on the second delivery line 30 for opening and closing the second delivery line 30.
In some embodiments, in order to ensure the spraying quality during recycling, the photoresist needs to be filtered during the process of back suction and re-transportation to filter out the particles in the photoresist. Therefore, the method further comprises the following steps: and a filter 24 disposed on the suck-back line 20 for filtering the photoresist passing through the suck-back line 20 to remove particles formed in the photoresist.
In some embodiments, bubbles are easily generated in the photoresist during the transportation or the back suction process due to the bending and turning of the pipe and other factors during supplying the photoresist, so that the bubbles in the photoresist need to be removed before the back suction transportation of the photoresist to the nozzle 10 to ensure the spraying quality. Illustratively, the first container 21 has a first inlet 211 and an outlet 212; the air outlet 212 is used for exhausting air in the photoresist; the first gas inlet 211 is used for filling the first container 21 with a first gas according to a first pressure so as to press the gas in the sucked photoresist out of the gas outlet 212 or press the sucked photoresist into the second conveying pipeline 30. Wherein the first gas may be an inert gas such as helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), or the like, and the first pressure may be a pressure of the first gas at the first gas inlet 211, and for example, the first pressure may be 30 to 40 kPa.
For example, one end of the second delivery pipe 30 is connected to the first container 21, and the other end is connected to the other liquid inlet of the nozzle 10 or the first delivery pipe 12, when the second valve 31 is opened, the second delivery pipe 30 may be used to deliver the sucked photoresist to the nozzle 10 for recycling.
In some embodiments, the photoresist sprayer further comprises: and a third valve 17 disposed on the suck-back line 20 for opening and closing the suck-back line 20 and the first delivery line 12 at the same time. Illustratively, after the spraying and the suck-back are finished, the third valve 17 is closed to prevent the photoresist from flowing back to the first container or the second container along the first delivery line 12 during the process of recycling the sucked-back photoresist.
In some embodiments, the second container 11 has a second air inlet 111 thereon; the second gas inlet 111 is used for filling the second container 11 with a second gas according to a second pressure so as to press the photoresist into the first delivery pipe 12.
Fig. 3 is a schematic structural diagram of another photoresist spraying apparatus according to an embodiment of the present application.
Referring to fig. 3, in some embodiments, although the suck-back line may suck back a large amount of photoresist in the nozzle 10, there may be a residue in the nozzle, and in order to ensure the cleaning of the nozzle 10 and the quality of spraying, a cleaning unit may be provided to clean the nozzle 10. For example, the photoresist spraying apparatus further includes: a third container 40 for storing the first cleaning liquid; and a third conveying pipeline 41, wherein two ends of the third conveying pipeline 41 are respectively connected to the nozzle 10 and the third container 40, and the third conveying pipeline 41 is used for conveying the first cleaning liquid to the nozzle 10 so as to clean the interior of the nozzle 10.
Illustratively, the third container 40 may be a wide-necked bottle having a body diameter of 100mm, a height of 200mm, a neck diameter of 60mm, a height of 30mm, and a neck height of 40 mm. The third container 40 has a third gas inlet 401, and the third gas inlet 401 is used for filling the third container 40 with a third gas according to a third pressure so as to press the first cleaning liquid stored in the third container 40 into the third conveying pipe 41. The third gas may be an inert gas such as helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), or the like. The third pressure may be the pressure of the third gas at the third gas inlet 401, for example, the third pressure may be 20-30 kPa. The first cleaning solution may be a combination of alcohol amine, ester, non-ester solvent, for example, the combination is 1% -40% alcohol amine, 1% -40% ester, and the balance non-ester solvent.
In some embodiments, the photoresist sprayer further comprises: and a third valve 17 disposed on the third delivery line 41 for opening and closing the third delivery line 41.
In some embodiments, the third container 40 has a third air inlet 401; the third gas inlet 401 is used for filling the third container 40 with a third gas according to a third pressure to press the first cleaning liquid into the third conveying pipe 41.
The present embodiment is added with the third container 40 and the third delivery line 41 on the basis of the previous embodiment. After the suction line 20 sucks back the photoresist in the nozzle 10, the third valve 17 and the second valve 31 are closed, the third valve 42 is opened, the first cleaning solution stored in the third container 40 can be delivered to the nozzle 10 through the third delivery line 41, the interior of the nozzle 10 is cleaned, and the waste liquid generated by cleaning the nozzle 10 directly flows out from the outlet of the nozzle 10.
Referring to fig. 3, in some embodiments, in order to treat the waste liquid generated by the cleaning unit cleaning the nozzle 10, the photoresist spraying apparatus further includes: a fourth container 50 for recovering a waste liquid formed by cleaning the nozzle 10; and a fourth transfer line 51 connected to the fourth container 50 for discharging the waste liquid recovered by the fourth container 50.
In this embodiment, a fourth container 50 and a fourth conveying pipeline 51 are added on the basis of the foregoing embodiment, wherein the fourth conveying pipeline 51 may be a water containing tank, one end of the fourth conveying pipeline 51 is connected to the bottom of the water containing tank, and the water containing tank may contain waste liquid generated by cleaning the nozzle 10 with the first cleaning solution, and the waste liquid is discharged through the fourth conveying pipeline 51 connected to the bottom. In this embodiment, a fifth valve 52 may be disposed on the fourth conveying pipeline 51, and is used for opening and closing the fourth conveying pipeline 51.
FIG. 4 is a schematic diagram of a delivery path of a second cleaning liquid provided in accordance with an embodiment of the present application.
Referring to fig. 3 and 4, in some embodiments, the photoresist sprayer further includes: a first nozzle 10 for spraying a second cleaning liquid to clean an outlet of the nozzle 10; a fifth container 61 for storing the second cleaning liquid; and a fifth conveying pipeline 62, wherein two ends of the fifth conveying pipeline 62 are respectively connected with the first nozzle 10 and the fifth container 61, and are used for conveying the second cleaning liquid to the first nozzle 10.
In this embodiment, a first spray head 60, a fifth container 61 and a fifth delivery pipe 62 are added on the basis of the previous embodiment, wherein one end of the fifth delivery pipe 62 is connected with the fifth container 61, and the other end is connected with the first spray head 60. In this embodiment, when the fourth container 50 contains the waste liquid generated by cleaning the nozzle 10 with the first cleaning liquid, the fifth conveying pipeline 62 conveys the second cleaning liquid in the fifth container 61 to the first spray head 60, and the second cleaning liquid is sprayed from the first spray head 60 to the periphery of the outlet of the nozzle 10, so that the waste liquid is prevented from splashing outside the nozzle 10 to pollute the nozzle 10, and the nozzle 10 can be cleaned again. The second cleaning solution can be a combination of alcohol amine, ester, non-ester solvent, for example, the combination is 1% -40% alcohol amine, 1% -40% ester, and the balance non-ester solvent.
Illustratively, the fifth container 61 has the fourth gas inlet 611, and the fourth gas inlet 611 is used for filling the fifth container 61 with a fourth gas according to a fourth pressure so as to press the second cleaning liquid stored in the fifth container 61 into the fifth conveying pipeline 62; the first spray head 60 is disposed on an inner wall of the fourth container 50, and when the fifth transfer line 62 transfers the second cleaning liquid to the first spray head 60, the first spray head 60 sprays the second cleaning liquid around the outlet of the nozzle 10. The fourth gas described in this embodiment may be an inert gas, such as helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), or the like. The fourth pressure may be a pressure of the fourth gas at the fourth gas inlet 611, for example, the fourth pressure may be 20 to 30 kPa.
Fig. 5 is a schematic diagram of a conveying path of drying gas provided according to an embodiment of the present application.
Referring to fig. 3 and 5, in some embodiments, the photoresist sprayer further includes: the second nozzle 10 is used for ejecting dry gas to remove the first cleaning liquid and the second cleaning liquid remained in the nozzle 10; a gas source 71 for storing the dry gas; and a sixth conveying pipeline 72, wherein two ends of the sixth conveying pipeline 72 are respectively connected to the second nozzle 10 and the gas source 71, and are used for conveying the dry gas to the second nozzle 10.
In this embodiment, a second spray head 70, an air source 71 and a sixth conveying pipeline 72 are added on the basis of the foregoing embodiment, wherein one end of the sixth conveying pipeline 72 is connected with the air source 71, and the other end is connected with the second spray head 70; the second showerhead 70 is disposed on an inner wall of the fourth container 50, and when the sixth transfer line 72 transfers the dry gas to the second showerhead 70, the second showerhead 70 sprays the dry gas around the outlet of the nozzle 10. In this embodiment, after the nozzle 10 is cleaned, the sixth conveying pipeline 72 conveys the dry gas to the second spray head 70, and the dry gas is sprayed around the outlet of the nozzle 10 by the second spray head 70, so as to clean the first cleaning liquid and the second cleaning liquid remaining around the nozzle 10. The gas source 71 of the present embodiment may be a gas pump, the dry gas may be compressed air output by the gas pump, and in other embodiments, the dry gas may also be an inert gas, such as helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), or the like.
The embodiment of the present application further provides a method for preventing crystallization of a nozzle, in which after the photoresist spraying device according to any one of the embodiments of the first aspect is used for spraying the photoresist, at least the photoresist left in the nozzle is sucked back to the first container along the suck-back pipeline.
The method for preventing nozzle crystallization in this embodiment has the same technical effects as the photoresist spraying device in the foregoing embodiment, and details are not repeated here.
In some embodiments, after the photoresist left in the nozzle is sucked back to the first container along the suck-back line, the method further comprises:
the sucked photoresist is conveyed to a nozzle.
In some embodiments, before delivering the sucked back photoresist to the nozzle, the method further comprises:
particles and/or gases in the photoresist are removed.
In some embodiments, before delivering the sucked back photoresist to the nozzle, the method further comprises:
performing a cleaning operation on the nozzle, the cleaning operation comprising:
cleaning the interior of the nozzle; and
cleaning the outlet of the nozzle; and
and drying the cleaned nozzle.
Fig. 6 is a flow chart of a nozzle crystallization prevention method provided according to an embodiment of the present application.
Referring to fig. 6, exemplary, a nozzle anti-crystallization method includes:
s11, sucking back the residual photoresist in the nozzle;
s12, filtering the particles sucked back in the light resistance;
s13, recycling the filtered light resistance;
s14, exhausting the gas sucked back from the photoresist;
and S15, conveying the light resistor after the gas is exhausted to the nozzle.
In some embodiments, the photoresist spraying apparatus as shown in fig. 3 may perform operations such as photoresist suck-back using the nozzle anti-crystallization method. The device includes:
a nozzle 10 for ejecting a photoresist;
a second container 11, i.e., a photoresist source head, for storing photoresist, the second container 11 having a second gas inlet 111;
a first delivery pipe 12 respectively connected to the nozzle 10 and the second container 11 for delivering the photoresist in the second container 11 to the nozzle 10; the first conveying pipeline 12 is sequentially provided with a buffer module 13, a first power module 14, a filtering module 15, a second power module 16 and a third valve 17 along the conveying direction;
a first container 21 for storing the sucked back photoresist; the first container 21 has a first gas inlet 211 and a gas outlet 212;
a suck-back line 20 having one end connected to the first container 21 and the other end connected to a portion of the first delivery line 12 between the third valve 17 and the second power module 16, for sucking back the photoresist in the nozzle 10 to the first container 21; the back suction pipeline 20 is sequentially provided with a power unit 22, a filter 24 and a first valve 23 along the back suction direction;
a second delivery pipe 30 respectively connected to the nozzle 10 and the first container 21 for delivering the sucked photoresist to the nozzle 10; a second valve 31 is arranged on the second conveying pipeline 30;
a third container 40 for storing the first cleaning liquid;
a third delivery pipe 41 respectively connected to the nozzle 10 and the third container 40 for delivering the first cleaning liquid to the nozzle 10 to clean the inside of the nozzle 10; a third valve 42 is arranged on the third conveying pipeline 41;
a fourth container 50 for recovering a waste liquid formed by cleaning the nozzle 10; a fourth conveying pipeline 51 connected to the fourth container 50 for discharging the waste liquid sucked back from the fourth container 50, wherein the third container 40 has a third air inlet 401;
a first spray head 60 for spraying a second cleaning liquid to clean the outlet of the nozzle 10;
a fifth container 61 for storing the second cleaning liquid; a fifth delivery pipe 62, respectively connected to the first spray head 60 and the fifth container 61, for delivering the second cleaning solution to the first spray head 60;
a second spray head 70 for spraying a dry gas to remove the first cleaning liquid and the second cleaning liquid remaining in the nozzle 10;
a gas source 71 for storing the dry gas;
a sixth delivery line 72 for delivering the drying gas to the second showerhead 70.
The first valve 23, the third valve 42 and the second valve 31 are closed, the third valve 17 is opened, the second container 11 is filled with the second gas through the second gas inlet 111, the photoresist stored in the second container 11 is pressed into the buffer module 13 on the first conveying pipeline 12, the impact force is eliminated, the photoresist is sucked into the filter module under the action of the first power module 14, bubbles in the photoresist are filtered, and the photoresist is sent into the nozzle 10 under the action of the second power module 16, so that the photoresist can be sprayed.
Wherein, in S11-S13, the photoresist left in the nozzle is sucked back; filtering the particles in the sucked back light resistance; and recovering the filtered light resistance. Illustratively, after the photoresist spraying operation is finished, the second container 11 is stopped from being filled with the second gas, the first power module 14, the filter module 15 and the second power module 16 are closed, the first valve 23 is opened, the suck-back pipeline 20 sucks back the photoresist left in the nozzle 10 and the first conveying pipeline 12 under the action of the power unit 22, and the sucked-back photoresist passes through the filter 24 and enters the first container 21 after particles in the photoresist are filtered out.
Wherein, in S14, the gas in the sucked back photoresist is exhausted. Illustratively, after the photoresist is sucked back, the third valve 17 and the first valve 23 are closed, the first gas is filled into the first container 21 through the first gas inlet 211, the internal pressure of the first container 21 is gradually increased, so that the bubbles in the sucked photoresist are pressed out from the gas outlet 212, after the bubbles in the photoresist are pressed out, the first gas is stopped being filled into the first container 21, and the remained photoresist is ready for use.
Wherein the photoresist after the gas is discharged is delivered to the nozzle in S15. Illustratively, when a further spray is desired, the second valve 31 is opened and the first container 21 is filled with the first gas, causing the light block in the first container 21 to be pressed out and into the nozzle 10 through the second delivery line 30.
Optionally, before delivering the light block of exhaust gas to the nozzle, the method further comprises: cleaning the interior of the nozzle. Illustratively, after the photoresist is sucked back, the third valve 42 is opened, the third container 40 is filled with a third gas through the third gas inlet 401, so as to press out the first cleaning solution stored in the third container 40 and flow through the nozzle 10 through the third conveying pipeline 41, take away the residue in the nozzle 10, and the formed waste liquid flows into the fifth container 61 and flows into the waste liquid treatment or recovery system through the fifth conveying pipeline 62.
Optionally, before delivering the light block of exhaust gas to the nozzle, the method further comprises: cleaning the outlet of the nozzle. For example, after the nozzle 10 is cleaned by the first cleaning liquid, the third valve 42 is closed, and the second cleaning liquid is sprayed around the outlet of the nozzle 10 through the first spray head 60, so that the waste liquid can be prevented from splashing outside the nozzle 10 to contaminate the nozzle 10, and the nozzle 10 can be cleaned again.
Optionally, before delivering the light block of exhaust gas to the nozzle, the method further comprises: and drying the cleaned nozzle. For example, after the nozzle 10 is cleaned by the second cleaning liquid, the second nozzle 70 may eject the dry gas to clean the first cleaning liquid and the second cleaning liquid remained in the nozzle 10.
It is to be understood that the above-described embodiments of the present application are merely illustrative of or illustrative of the principles of the present application and are not to be construed as limiting the present application. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. Further, it is intended that the appended claims cover all such changes and modifications that fall within the scope and range of equivalents of the appended claims, or the equivalents of such scope and range.
Claims (17)
1. A photoresist spraying apparatus comprising:
a nozzle for ejecting the photoresist;
the first container is used for storing the sucked back photoresist;
the back suction pipeline is connected with a first conveying pipeline and is connected with a second container through the first conveying pipeline, and the second container is used for providing light resistance for the nozzle through the first conveying pipeline;
the power unit is arranged on the suction pipeline and is used for sucking the residual light resistance in the nozzle back to the first container along the suction pipeline;
and the first valve is arranged on the back suction pipeline and used for opening and closing the back suction pipeline.
2. The photoresist sprayer according to claim 1,
the two ends of the second conveying pipeline are respectively connected with the nozzle and the first container;
the first container is also used for conveying the sucked back light resistance to the nozzle through the second conveying pipeline.
3. The photoresist sprayer of claim 2, further comprising:
and the second valve is arranged on the second conveying pipeline and used for opening and closing the second conveying pipeline.
4. The photoresist sprayer according to claim 2,
and the filter is arranged on the suction pipeline and used for filtering the light resistance passing through the suction pipeline so as to remove particles formed in the light resistance.
5. The photoresist sprayer according to claim 4,
the first container has a first air inlet and an air outlet;
the air outlet is used for exhausting air in the light resistor;
the first gas inlet is used for filling first gas into the first container according to first pressure so as to press the gas in the sucked back photoresist out of the gas outlet or press the sucked back photoresist into the second conveying pipeline.
6. The photoresist sprayer according to claim 5,
and the third valve is arranged on the back suction pipeline and used for simultaneously opening and closing the back suction pipeline and the first conveying pipeline.
7. The photoresist sprayer according to claim 1,
the second container is provided with a second air inlet;
the second gas inlet is used for filling a second gas into the second container according to a second pressure so as to press the photoresist into the first conveying pipeline.
8. The photoresist sprayer apparatus of any one of claims 1-7, further comprising:
a third container for storing the first cleaning liquid;
and two ends of the third conveying pipeline are respectively connected with the nozzle and the third container and used for conveying the first cleaning liquid to the nozzle so as to clean the interior of the nozzle.
9. The photoresist sprayer according to claim 8,
and the third valve is arranged on the third conveying pipeline and used for opening and closing the third conveying pipeline.
10. The photoresist sprayer according to claim 8,
the third container having a third air inlet;
the third gas inlet is used for filling a third gas into the third container according to a third pressure so as to press the first cleaning liquid into the third conveying pipeline.
11. The photoresist sprayer apparatus of claim 8, further comprising:
a fourth container for recovering waste liquid formed by cleaning the nozzle;
and the fourth conveying pipeline is connected with the fourth container and is used for discharging the waste liquid recovered by the fourth container.
12. The photoresist sprayer apparatus of claim 11, further comprising:
the first spray head is used for spraying second cleaning liquid to clean the outlet of the spray nozzle;
a fifth container for storing the second cleaning liquid;
and two ends of the fifth conveying pipeline are respectively connected with the first spray head and the fifth container and are used for conveying the second cleaning liquid to the first spray head.
13. The photoresist sprayer apparatus of claim 12, further comprising:
the second spray head is used for spraying dry gas to remove the first cleaning liquid and the second cleaning liquid remained on the spray nozzle;
a gas source for storing the dry gas;
and two ends of the sixth conveying pipeline are respectively connected with the second spray head and the gas source and are used for conveying the dry gas to the second spray head.
14. A nozzle anti-crystallization method, comprising:
after spraying the photoresist using the photoresist spraying apparatus according to any one of claims 1 to 13, at least the photoresist remaining in the nozzle is sucked back to the first container along the suck-back line.
15. The nozzle anti-crystallization method according to claim 14, wherein after the photoresist left in the nozzle is sucked back to the first container along the suck-back line, the method further comprises:
the sucked photoresist is conveyed to a nozzle.
16. The nozzle anti-crystallization method according to claim 15, wherein the sucked back photoresist is delivered to the nozzle, the method further comprising:
particles and/or gases in the photoresist are removed.
17. The nozzle anti-crystallization method according to claim 16, wherein the sucked back photoresist is delivered to the nozzle, the method further comprising:
performing a cleaning operation on the nozzle, the cleaning operation comprising:
cleaning the interior of the nozzle; and
cleaning the outlet of the nozzle; and
and drying the cleaned nozzle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111088057.8A CN113976371B (en) | 2021-09-16 | 2021-09-16 | Photoresist spraying device and nozzle anti-crystallization method |
| PCT/CN2021/131991 WO2023040038A1 (en) | 2021-09-16 | 2021-11-22 | Photoresist spraying device and nozzle anti-crystallization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111088057.8A CN113976371B (en) | 2021-09-16 | 2021-09-16 | Photoresist spraying device and nozzle anti-crystallization method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113976371A true CN113976371A (en) | 2022-01-28 |
| CN113976371B CN113976371B (en) | 2022-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111088057.8A Active CN113976371B (en) | 2021-09-16 | 2021-09-16 | Photoresist spraying device and nozzle anti-crystallization method |
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| Country | Link |
|---|---|
| CN (1) | CN113976371B (en) |
| WO (1) | WO2023040038A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113976371B (en) | 2022-12-27 |
| WO2023040038A1 (en) | 2023-03-23 |
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