CN114377906A - Photoresist distributor and semiconductor manufacturing equipment - Google Patents
Photoresist distributor and semiconductor manufacturing equipment Download PDFInfo
- Publication number
- CN114377906A CN114377906A CN202011140748.3A CN202011140748A CN114377906A CN 114377906 A CN114377906 A CN 114377906A CN 202011140748 A CN202011140748 A CN 202011140748A CN 114377906 A CN114377906 A CN 114377906A
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- CN
- China
- Prior art keywords
- unit
- photoresist
- nozzle
- bottle
- assembled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a photoresist distributor and semiconductor manufacturing equipment, which relate to the technical field of semiconductors and comprise: the nozzle shell is provided with a plurality of inner cavities, each inner cavity is correspondingly provided with a nozzle, and the nozzles are assembled on the outer wall of the nozzle shell and are communicated with the corresponding inner cavities; the unit spraying components correspond to the inner cavities one by one; the unit spraying assembly comprises a unit bottle and a driving device, the unit bottle is assembled in the inner cavity and communicated with the nozzle, and the driving device is assembled with the unit bottle in a driving mode so as to drive photoresist in the unit bottle to flow out along the nozzle. In the above technical solution, if the photoresist needs to be replaced, only different unit spray assemblies in the photoresist distributor need to be moved to corresponding positions of the semiconductor, and different loaded photoresists are continuously coated. Therefore, the whole photoresist replacing process does not need to change the mechanical structure, and only different unit spraying assemblies in the photoresist distributor are selected to correspondingly carry out coating operation.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a photoresist distributor and semiconductor manufacturing equipment.
Background
In the process of photoresist coating of semiconductors, the photoresist used for different layers of semiconductors and different semiconductor products is different. In the prior art, when different photoresists are replaced, devices for loading different photoresists need to be replaced, and a great deal of time is consumed in the replacement process, so that the gluing work efficiency is reduced.
Disclosure of Invention
The invention aims to provide a photoresist distributor and semiconductor manufacturing equipment, which aim to solve the technical problem of low photoresist coating working efficiency in the prior art.
The invention provides a photoresist distributor, comprising:
the nozzle comprises a nozzle shell, a nozzle body and a nozzle body, wherein a plurality of inner cavities are formed in the nozzle shell, each inner cavity is correspondingly provided with a nozzle, and the nozzles are assembled on the outer wall of the nozzle shell and are communicated with the corresponding inner cavities;
the unit spraying components correspond to the inner cavities one by one; the unit spraying assembly comprises a unit bottle and a driving device, the unit bottle is assembled in the inner cavity and communicated with the nozzle, and the driving device is assembled with the unit bottle in a driving mode so as to drive the photoresist in the unit bottle to flow out along the nozzle.
Further, the driving device is a driving pump.
Further, the unit spray assembly further comprises:
and the driving pump is assembled with the unit bottle in a driving mode through the driving pipeline.
Furthermore, the nozzle shell is composed of a plurality of unit shells, and each unit shell is provided with one inner cavity; the unit shell is a prism structure with a rectangular cross section, and adjacent outer side walls of adjacent unit shells are oppositely attached to form the nozzle shell; the nozzle is installed at the bottom end of the unit case.
Further, a plurality of the unit cases are assembled in a linear bundle.
Further, the unit bottle is assembled on the inner cavity side wall of the nozzle shell.
Further, the unit bottle and the nozzle housing are detachably connected.
Further, the capacity of the unit bottle is below 1000 ml.
The invention also provides semiconductor manufacturing equipment comprising the photoresist distributor.
Further, the number of the photoresist distributors is greater than or equal to 2.
In the above technical solution, if the photoresist needs to be replaced, only different unit spray assemblies in the photoresist distributor need to be moved to corresponding positions of the semiconductor, and different loaded photoresists are continuously coated. Therefore, the whole photoresist replacing process does not need to change the mechanical structure, and only different unit spraying assemblies in the photoresist distributor are selected to correspondingly carry out coating operation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view 1 of a unit spray assembly provided in accordance with one embodiment of the present invention;
FIG. 2 is an internal block diagram of the unit spray assembly shown in FIG. 1;
FIG. 3 is a front view 2 of a unit spray assembly provided in accordance with one embodiment of the present invention;
FIG. 4 is a front view of a photoresist dispenser provided in accordance with one embodiment of the present invention;
FIG. 5 is a diagram illustrating a state of use of a photoresist dispenser according to one embodiment of the present invention.
Reference numerals:
1. a unit spray assembly; 2. photoresist;
11. a cell case; 12. a nozzle; 13. a unit bottle; 14. a drive device; 15. the pipeline is driven.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 5, the present embodiment provides a photoresist dispenser, including:
the nozzle comprises a nozzle shell, a plurality of inner cavities are formed in the nozzle shell, each inner cavity is correspondingly provided with a nozzle 12, and the nozzles 12 are assembled on the outer wall of the nozzle shell and are communicated with the corresponding inner cavities;
the unit spraying components 1 correspond to the inner cavities one by one; wherein, the unit spraying assembly 1 comprises a unit bottle 13 and a driving device 14, the unit bottle 13 is assembled in the inner cavity and communicated with the nozzle 12, and the driving device 14 is assembled with the unit bottle 13 in a driving way so as to drive the photoresist 2 in the unit bottle 13 to flow out along the nozzle 12.
Referring to fig. 4, the photoresist dispenser is bundled with a plurality of unit spray assemblies 1, and the plurality of unit spray assemblies 1 can be loaded with different kinds of photoresist 2 through unit bottles 13 inside thereof. Therefore, when the photoresist 2 is coated on the semiconductor, the photoresist distributor can be used for coating, the corresponding unit spraying assemblies 1 are used for coating the corresponding photoresist 2 on the layer corresponding to the semiconductor, and if the photoresist 2 needs to be replaced, the different unit spraying assemblies 1 in the photoresist distributor only need to be moved to the corresponding positions of the semiconductor, and the loaded different photoresists 2 are continuously coated. Therefore, the whole replacement process of the photoresist 2 does not need to change the mechanical structure, and only different unit spraying assemblies 1 in the photoresist distributor need to be selected to correspondingly perform coating work. Wherein the capacity of the unit bottle 13 is below 1000ml, so as to ensure that each unit bottle 13 can be loaded with enough photoresist 2 without causing the structure volume of the whole photoresist distributor to be overlarge.
Referring to fig. 1 to 3, in each unit spray assembly 1, a corresponding driving device 14 is assembled in a driving manner opposite to a corresponding unit bottle 13, and photoresist 2 in the unit bottle 13 can flow from the unit bottle 13 to a nozzle 12 through the driving device 14 and then flow out through the nozzle 12, so that the corresponding unit spray assembly 1 can realize the spray operation of the photoresist 2. Wherein the driving device 14 can be selected as a driving pump, and the driving pump is in driving assembly with the unit bottle 13, so that the driving pump can drive the photoresist 2 in the unit bottle 13 to form a flow, so as to flow to the nozzle 12 and flow out from the nozzle 12. Besides, the unit spray assembly 1 further comprises a driving pipeline 15, the driving pump is in driving assembly with the unit bottle 13 through the driving pipeline 15, at this time, the driving pipeline 15 can enable the relative assembly between the driving pump and the unit bottle 13 to be more flexible, and when a plurality of unit spray assemblies 1 are relatively bundled, interference between adjacent driving pumps cannot occur.
Referring to fig. 1 to 3, the nozzle housing is formed by a plurality of unit housings 11, and each unit housing 11 is provided with one inner cavity; the unit shell 11 is a prism structure with a rectangular cross section, and adjacent outer side walls of adjacent unit shells 11 are oppositely attached to form the nozzle shell; the nozzle 12 is installed at the bottom end of the unit case 11. Therefore, the prism structure of the unit shells 11 and the rectangular cross-sectional structure thereof can ensure that the adjacent unit shells 11 can be assembled regularly in a cluster, and the nozzle shell can form a stable and firm assembly structure only by relatively attaching the outer side walls of the adjacent unit shells 11. For example, a plurality of the unit spray assemblies 1 are assembled in a linear bundle based on the structure of the nozzle housing. Therefore, when the unit spraying component moving mechanism is used, the unit spraying component 1 can be directly moved to the working position along the straight line, the operation is very convenient, and the moving accuracy and the moving efficiency of the unit spraying component 1 can be ensured.
Referring to fig. 2, the unit bottle 13 is fitted to the inner cavity side wall of the nozzle housing. At this time, when the unit bottle 13 is fitted to the inner cavity side wall of the nozzle housing, the unit bottle 13 can be fitted against one side of the nozzle housing. When a plurality of unit spray assemblies 1 are assembled in a bundling manner by attaching the outer side walls, enough space can be reserved between the adjacent unit bottles 13, and the adjacent unit bottles 13 are prevented from being too close to each other. Wherein the unit bottle 13 and the nozzle housing are detachably connected. For example, the unit bottle 13 may be assembled with the nozzle housing by means of a plug-in, snap-in, etc., without limitation.
The invention also provides semiconductor manufacturing equipment comprising the photoresist distributor. Since the detailed structure, functional principle and technical effect of the photoresist distributor have been described in detail in the foregoing, detailed description is omitted here. The number of the photoresist distributors is greater than or equal to 2, for example, 2, 3 or 4 photoresist distributors can be arranged in each semiconductor manufacturing equipment according to requirements, which is not limited herein.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A photoresist dispenser, comprising:
the nozzle comprises a nozzle shell, a nozzle body and a nozzle body, wherein a plurality of inner cavities are formed in the nozzle shell, each inner cavity is correspondingly provided with a nozzle, and the nozzles are assembled on the outer wall of the nozzle shell and are communicated with the corresponding inner cavities;
the unit spraying components correspond to the inner cavities one by one; the unit spraying assembly comprises a unit bottle and a driving device, the unit bottle is assembled in the inner cavity and communicated with the nozzle, and the driving device is assembled with the unit bottle in a driving mode so as to drive the photoresist in the unit bottle to flow out along the nozzle.
2. The photoresist dispenser of claim 1, wherein the drive device is a drive pump.
3. The photoresist dispenser of claim 2, wherein the unit spray assembly further comprises:
and the driving pump is assembled with the unit bottle in a driving mode through the driving pipeline.
4. The photoresist dispenser of claim 1, wherein the nozzle housing is formed by a plurality of unit shells, each of the unit shells defining one of the internal chambers; the unit shell is a prism structure with a rectangular cross section, and adjacent outer side walls of adjacent unit shells are oppositely attached to form the nozzle shell; the nozzle is installed at the bottom end of the unit case.
5. The photoresist dispenser of claim 4, wherein a plurality of the cell housings are assembled in a linear bundle.
6. The photoresist dispenser of any one of claims 1 to 5, wherein the unit bottle is fitted to an inner cavity sidewall of the nozzle housing.
7. The photoresist dispenser of claim 6, wherein the unit bottle and the nozzle housing are removably connected.
8. The photoresist dispenser of claim 6, wherein the unit bottle has a capacity of less than 1000 ml.
9. A semiconductor manufacturing apparatus comprising the photoresist dispenser of any one of claims 1 to 8.
10. The semiconductor manufacturing apparatus according to claim 9, wherein the number of the photoresist dispensers is 2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140748.3A CN114377906B (en) | 2020-10-22 | 2020-10-22 | Photoresist dispenser and semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140748.3A CN114377906B (en) | 2020-10-22 | 2020-10-22 | Photoresist dispenser and semiconductor manufacturing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114377906A true CN114377906A (en) | 2022-04-22 |
| CN114377906B CN114377906B (en) | 2023-05-16 |
Family
ID=81194780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011140748.3A Active CN114377906B (en) | 2020-10-22 | 2020-10-22 | Photoresist dispenser and semiconductor manufacturing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114377906B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141653A (en) * | 2000-11-07 | 2002-05-17 | Yamaha Motor Co Ltd | Coating device |
| JP2004087355A (en) * | 2002-08-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | Pattern forming apparatus and forming method of panel |
| CN203084376U (en) * | 2013-03-04 | 2013-07-24 | 京东方科技集团股份有限公司 | Color film repairing device |
| CN203275872U (en) * | 2013-05-07 | 2013-11-06 | 京东方科技集团股份有限公司 | Photoresist coating device and photoresist coating system |
| CN111090219A (en) * | 2018-10-23 | 2020-05-01 | 长鑫存储技术有限公司 | Photoresist discharge system and photoresist discharge method |
| CN111739823A (en) * | 2020-06-29 | 2020-10-02 | 中国科学院微电子研究所 | Photoresist coating nozzle and photoresist coating equipment with same |
-
2020
- 2020-10-22 CN CN202011140748.3A patent/CN114377906B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141653A (en) * | 2000-11-07 | 2002-05-17 | Yamaha Motor Co Ltd | Coating device |
| JP2004087355A (en) * | 2002-08-28 | 2004-03-18 | Matsushita Electric Ind Co Ltd | Pattern forming apparatus and forming method of panel |
| CN203084376U (en) * | 2013-03-04 | 2013-07-24 | 京东方科技集团股份有限公司 | Color film repairing device |
| CN203275872U (en) * | 2013-05-07 | 2013-11-06 | 京东方科技集团股份有限公司 | Photoresist coating device and photoresist coating system |
| CN111090219A (en) * | 2018-10-23 | 2020-05-01 | 长鑫存储技术有限公司 | Photoresist discharge system and photoresist discharge method |
| CN111739823A (en) * | 2020-06-29 | 2020-10-02 | 中国科学院微电子研究所 | Photoresist coating nozzle and photoresist coating equipment with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114377906B (en) | 2023-05-16 |
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