CN111656284B - 曝光装置及曝光方法 - Google Patents
曝光装置及曝光方法 Download PDFInfo
- Publication number
- CN111656284B CN111656284B CN201980009581.6A CN201980009581A CN111656284B CN 111656284 B CN111656284 B CN 111656284B CN 201980009581 A CN201980009581 A CN 201980009581A CN 111656284 B CN111656284 B CN 111656284B
- Authority
- CN
- China
- Prior art keywords
- wavelength
- light
- illumination
- ray
- illumination light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 32
- 238000005286 illumination Methods 0.000 claims abstract description 396
- 230000003287 optical effect Effects 0.000 claims abstract description 256
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 109
- 229910052753 mercury Inorganic materials 0.000 claims description 102
- 238000009826 distribution Methods 0.000 claims description 96
- 238000003384 imaging method Methods 0.000 claims description 36
- 210000001747 pupil Anatomy 0.000 claims description 33
- 238000004458 analytical method Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000003595 spectral effect Effects 0.000 abstract description 98
- 239000000284 extract Substances 0.000 abstract description 3
- 239000013307 optical fiber Substances 0.000 description 130
- 230000004907 flux Effects 0.000 description 49
- 239000010410 layer Substances 0.000 description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 35
- 239000010453 quartz Substances 0.000 description 33
- 230000004075 alteration Effects 0.000 description 31
- 238000010586 diagram Methods 0.000 description 29
- 239000010408 film Substances 0.000 description 25
- 230000004048 modification Effects 0.000 description 25
- 238000012986 modification Methods 0.000 description 25
- 238000001228 spectrum Methods 0.000 description 25
- 230000007246 mechanism Effects 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 9
- 238000010891 electric arc Methods 0.000 description 8
- 241000276498 Pollachius virens Species 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000010363 phase shift Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007261 regionalization Effects 0.000 description 5
- 230000004304 visual acuity Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 101100459440 Caenorhabditis elegans nac-3 gene Proteins 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 101100459438 Caenorhabditis elegans nac-1 gene Proteins 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000012887 quadratic function Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018009277 | 2018-01-24 | ||
JP2018-009277 | 2018-01-24 | ||
JP2018211010 | 2018-11-09 | ||
JP2018-211010 | 2018-11-09 | ||
PCT/JP2019/000934 WO2019146448A1 (fr) | 2018-01-24 | 2019-01-15 | Dispositif d'exposition et procédé d'exposition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111656284A CN111656284A (zh) | 2020-09-11 |
CN111656284B true CN111656284B (zh) | 2024-04-12 |
Family
ID=67394927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980009581.6A Active CN111656284B (zh) | 2018-01-24 | 2019-01-15 | 曝光装置及曝光方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JPWO2019146448A1 (fr) |
KR (2) | KR20230155617A (fr) |
CN (1) | CN111656284B (fr) |
TW (2) | TW202349136A (fr) |
WO (1) | WO2019146448A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7133744B1 (ja) * | 2019-08-27 | 2022-09-08 | シグニファイ ホールディング ビー ヴィ | アクアリウムを照らすための照明デバイス |
JP2021185393A (ja) | 2020-05-25 | 2021-12-09 | キヤノン株式会社 | 露光装置、露光方法、及び物品の製造方法 |
JP2023003153A (ja) | 2021-06-23 | 2023-01-11 | キヤノン株式会社 | 露光装置、露光方法および物品の製造方法 |
CN116921817B (zh) * | 2023-09-15 | 2023-12-15 | 中建安装集团有限公司 | 自动tig焊电弧聚集度在线监测及智能预警方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0486316A2 (fr) * | 1990-11-15 | 1992-05-20 | Nikon Corporation | Méthode et appareil de projection pour exposition |
JPH06318542A (ja) * | 1993-05-07 | 1994-11-15 | Nikon Corp | 投影露光装置 |
CN101286012A (zh) * | 2007-04-13 | 2008-10-15 | 株式会社Orc制作所 | 投影曝光装置 |
JP2014052614A (ja) * | 2012-09-10 | 2014-03-20 | Nikon Corp | マスク、マスクの製造方法、露光方法、デバイス製造方法及び露光装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669014B2 (ja) * | 1986-02-24 | 1994-08-31 | 株式会社ニコン | 露光装置 |
JP2522231Y2 (ja) * | 1988-04-01 | 1997-01-08 | 旭光学工業株式会社 | 縮小拡大写真製版システム |
JPH0644549B2 (ja) * | 1989-03-17 | 1994-06-08 | 株式会社日立製作所 | 投影露光法及び装置 |
JP3437314B2 (ja) * | 1995-03-16 | 2003-08-18 | 富士通株式会社 | 位相シフトマスク、パターン形成方法及び半導体装置の製造方法 |
JP3341767B2 (ja) * | 2001-10-10 | 2002-11-05 | 株式会社ニコン | 投影露光装置及び方法、並びに回路素子形成方法 |
JP2003203853A (ja) * | 2002-01-09 | 2003-07-18 | Nikon Corp | 露光装置及び方法並びにマイクロデバイスの製造方法 |
TW200301848A (en) * | 2002-01-09 | 2003-07-16 | Nikon Corp | Exposure apparatus and exposure method |
JP2003295459A (ja) * | 2002-04-02 | 2003-10-15 | Nikon Corp | 露光装置及び露光方法 |
JP2003257846A (ja) * | 2002-03-07 | 2003-09-12 | Nikon Corp | 光源ユニット、照明装置、露光装置及び露光方法 |
US6813098B2 (en) * | 2003-01-02 | 2004-11-02 | Ultratech, Inc. | Variable numerical aperture large-field unit-magnification projection system |
JP4474121B2 (ja) * | 2003-06-06 | 2010-06-02 | キヤノン株式会社 | 露光装置 |
JP2007059510A (ja) * | 2005-08-23 | 2007-03-08 | Nikon Corp | 照明光学装置、露光装置及びマイクロデバイスの製造方法 |
KR101399768B1 (ko) * | 2006-12-28 | 2014-05-27 | 칼 짜이스 에스엠티 게엠베하 | 기울어진 편향 미러를 갖는 반사굴절식 투영 대물렌즈, 투영 노광 장치, 투영 노광 방법 및 미러 |
JP5311757B2 (ja) * | 2007-03-29 | 2013-10-09 | キヤノン株式会社 | 反射光学素子、露光装置およびデバイス製造方法 |
JP5115953B2 (ja) * | 2007-03-30 | 2013-01-09 | Hoya株式会社 | フォトマスクブランク及びフォトマスク |
JP4936385B2 (ja) * | 2007-06-06 | 2012-05-23 | キヤノン株式会社 | 偏光素子及び露光装置 |
JP2009032749A (ja) * | 2007-07-24 | 2009-02-12 | Nikon Corp | 露光装置およびデバイス製造方法 |
JP2009288005A (ja) * | 2008-05-28 | 2009-12-10 | Asml Netherlands Bv | 検査方法および装置、リソグラフィ装置、リソグラフィ処理セルおよびデバイス製造方法 |
JP2010087388A (ja) * | 2008-10-02 | 2010-04-15 | Ushio Inc | 露光装置 |
JP2010103191A (ja) * | 2008-10-21 | 2010-05-06 | Fujitsu Microelectronics Ltd | 露光装置および露光方法 |
JP2011022529A (ja) * | 2009-07-21 | 2011-02-03 | Mejiro Precision:Kk | 光源装置及び露光装置 |
WO2012067246A1 (fr) * | 2010-11-19 | 2012-05-24 | Nskテクノロジー株式会社 | Dispositif et procédé d'exposition de proximité |
-
2019
- 2019-01-15 KR KR1020237037874A patent/KR20230155617A/ko active Application Filing
- 2019-01-15 CN CN201980009581.6A patent/CN111656284B/zh active Active
- 2019-01-15 KR KR1020207024073A patent/KR102604340B1/ko active IP Right Grant
- 2019-01-15 JP JP2019567007A patent/JPWO2019146448A1/ja active Pending
- 2019-01-15 WO PCT/JP2019/000934 patent/WO2019146448A1/fr active Application Filing
- 2019-01-22 TW TW112131695A patent/TW202349136A/zh unknown
- 2019-01-22 TW TW108102341A patent/TWI815848B/zh active
-
2022
- 2022-02-01 JP JP2022013907A patent/JP2022051810A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0486316A2 (fr) * | 1990-11-15 | 1992-05-20 | Nikon Corporation | Méthode et appareil de projection pour exposition |
JPH06318542A (ja) * | 1993-05-07 | 1994-11-15 | Nikon Corp | 投影露光装置 |
CN101286012A (zh) * | 2007-04-13 | 2008-10-15 | 株式会社Orc制作所 | 投影曝光装置 |
JP2014052614A (ja) * | 2012-09-10 | 2014-03-20 | Nikon Corp | マスク、マスクの製造方法、露光方法、デバイス製造方法及び露光装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20230155617A (ko) | 2023-11-10 |
WO2019146448A1 (fr) | 2019-08-01 |
KR20200108068A (ko) | 2020-09-16 |
JPWO2019146448A1 (ja) | 2021-01-07 |
CN111656284A (zh) | 2020-09-11 |
TW202349136A (zh) | 2023-12-16 |
TW201940986A (zh) | 2019-10-16 |
TWI815848B (zh) | 2023-09-21 |
KR102604340B1 (ko) | 2023-11-21 |
JP2022051810A (ja) | 2022-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111656284B (zh) | 曝光装置及曝光方法 | |
KR101944122B1 (ko) | Euv 투영 노광 시스템용 미러, 광학 시스템 및 부품을 생산하는 방법 | |
JP2006332586A (ja) | 測定装置、露光装置及び方法、並びに、デバイス製造方法 | |
KR101277430B1 (ko) | 노광 장치 | |
JP3937580B2 (ja) | 投影露光装置及びそれを用いたデバイスの製造方法 | |
KR20180097690A (ko) | 토포그래피 측정 시스템 | |
KR100756139B1 (ko) | 노광장치 및 그것을 이용한 디바이스의 제조방법 | |
JPH04273245A (ja) | 露光方法及び露光装置 | |
JP6651124B2 (ja) | 照明光学系、露光装置、およびデバイス製造方法 | |
TW201923484A (zh) | 修復用於euv裝置之照明系統的方法以及偵測器模組 | |
CN112771449A (zh) | 测量光瞳形状的方法和设备 | |
JP4280521B2 (ja) | 収差測定装置及び投影露光装置 | |
JP4838430B2 (ja) | 露光装置及びデバイス製造方法 | |
WO2009150913A1 (fr) | Appareil d’éclairage, appareil d’exposition et procédé de fabrication de dispositif | |
JP4581727B2 (ja) | 露光装置及びマイクロデバイスの製造方法 | |
JP7340167B2 (ja) | 照明光学系、露光装置、およびデバイス製造方法 | |
JP2007173689A (ja) | 光学特性計測装置、露光装置、及びデバイス製造方法 | |
JP5303886B2 (ja) | 光学特性計測装置、光学特性計測方法、露光装置、露光方法及びデバイスの製造方法 | |
JPH0620925A (ja) | 露光装置 | |
JP2005079470A (ja) | 照明光学系の調整方法、露光装置及び方法、並びにデバイス製造方法 | |
JP2007299891A (ja) | 光源ユニット、照明光学系、露光装置及びデバイスの製造方法 | |
JP2003344010A (ja) | 光学装置、位置検出装置、露光装置及びマイクロデバイスの製造方法 | |
JP3298585B2 (ja) | 投影露光装置及び方法 | |
JP2006019476A (ja) | 露光装置及びマイクロデバイスの製造方法 | |
JP2020074031A (ja) | 照明光学系、露光装置、およびデバイス製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |