CN111630213B - 单晶4H-SiC生长用籽晶及其加工方法 - Google Patents

单晶4H-SiC生长用籽晶及其加工方法 Download PDF

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Publication number
CN111630213B
CN111630213B CN201880087282.XA CN201880087282A CN111630213B CN 111630213 B CN111630213 B CN 111630213B CN 201880087282 A CN201880087282 A CN 201880087282A CN 111630213 B CN111630213 B CN 111630213B
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CN
China
Prior art keywords
crystal
sic
seed crystal
single crystal
diameter
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CN201880087282.XA
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English (en)
Chinese (zh)
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CN111630213A (zh
Inventor
贵堂高德
长屋正武
鹰羽秀隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Resonac Holdings Corp
Resonac Corp
Original Assignee
Showa Denko KK
Denso Corp
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Publication of CN111630213A publication Critical patent/CN111630213A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/025—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN201880087282.XA 2018-01-24 2018-12-21 单晶4H-SiC生长用籽晶及其加工方法 Active CN111630213B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018009989A JP6960866B2 (ja) 2018-01-24 2018-01-24 単結晶４Ｈ−ＳｉＣ成長用種結晶及びその加工方法
JP2018-009989 2018-01-24
PCT/JP2018/047225 WO2019146336A1 (ja) 2018-01-24 2018-12-21 単結晶４Ｈ－ＳｉＣ成長用種結晶及びその加工方法

Publications (2)

Publication Number Publication Date
CN111630213A CN111630213A (zh) 2020-09-04
CN111630213B true CN111630213B (zh) 2022-01-18

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US (1) US11781244B2 (https=)
JP (1) JP6960866B2 (https=)
CN (1) CN111630213B (https=)
WO (1) WO2019146336A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) * 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JP7321649B2 (ja) * 2019-10-16 2023-08-07 株式会社ディスコ 研削方法
TWI777692B (zh) * 2020-08-17 2022-09-11 環球晶圓股份有限公司 碳化矽晶圓及其製備方法
KR102283879B1 (ko) * 2021-01-14 2021-07-29 에스케이씨 주식회사 탄화규소 웨이퍼의 제조방법, 탄화규소 웨이퍼 및 웨이퍼 제조용 시스템
TWI762351B (zh) * 2021-06-08 2022-04-21 環球晶圓股份有限公司 碳化矽晶圓及其研磨方法
EP4424870A4 (en) * 2021-10-28 2025-10-08 Tokai Carbon Kk POLYCRYSTALLINE SIC MOLDED BODY AND ITS MANUFACTURING METHOD
JP7736528B2 (ja) * 2021-11-11 2025-09-09 株式会社ディスコ ＳｉＣ基板の製造方法
JP7268784B1 (ja) * 2022-05-31 2023-05-08 株式会社レゾナック ＳｉＣ基板及びＳｉＣエピタキシャルウェハ
EP4324961A1 (en) * 2022-08-17 2024-02-21 SiCrystal GmbH Method for producing a bulk sic single crystal with improved quality using a sic seed crystal with a temporary protective oxide layer, and sic seed crystal with protective oxide layer
CN116525426A (zh) * 2023-03-27 2023-08-01 湖州东尼半导体科技有限公司 一种降低碳化硅衬底片翘曲度的方法
CN117564838A (zh) * 2024-01-02 2024-02-20 嘉兴市耐思威精密机械有限公司 一种提高陶瓷工件平面度的磨削工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002308697A (ja) * 2001-04-05 2002-10-23 Nippon Steel Corp 炭化珪素単結晶インゴット及びその製造方法並びに炭化珪素単結晶育成用種結晶の装着方法
JP2004168649A (ja) * 2002-11-08 2004-06-17 Neomax Co Ltd ＳｉＣ基板およびＳｉＣ基板の製造方法
JP2011222750A (ja) * 2010-04-09 2011-11-04 Nippon Steel Corp 炭化珪素単結晶ウェハの製造方法及びこの方法で得られた炭化珪素単結晶ウェハ
JP2014210687A (ja) * 2013-04-19 2014-11-13 新日鐵住金株式会社 炭化珪素単結晶育成用種結晶基板
CN104813439A (zh) * 2012-10-26 2015-07-29 道康宁公司 平坦的SiC半导体基板
JP2017065954A (ja) * 2015-09-29 2017-04-06 新日鐵住金株式会社 炭化珪素単結晶インゴットの製造方法
CN107002281A (zh) * 2014-12-05 2017-08-01 新日铁住金株式会社 碳化硅单晶的制造方法及碳化硅单晶基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3055401B2 (ja) * 1994-08-29 2000-06-26 信越半導体株式会社 ワークの平面研削方法及び装置
JP4224755B2 (ja) 2001-10-16 2009-02-18 株式会社デンソー 種結晶の固定方法
US20040134418A1 (en) 2002-11-08 2004-07-15 Taisuke Hirooka SiC substrate and method of manufacturing the same
JP4494856B2 (ja) 2004-04-28 2010-06-30 新日本製鐵株式会社 炭化珪素単結晶成長用種結晶とその製造方法及びそれを用いた結晶成長方法
JP4663362B2 (ja) * 2005-03-18 2011-04-06 株式会社ディスコ ウエーハの平坦加工方法
JP2007284283A (ja) * 2006-04-14 2007-11-01 Hitachi Cable Ltd ＧａＮ単結晶基板の加工方法及びＧａＮ単結晶基板
JP4499698B2 (ja) 2006-10-04 2010-07-07 昭和電工株式会社 炭化珪素単結晶の製造方法
US8690636B2 (en) * 2009-05-26 2014-04-08 Hitachi Cable, Ltd. Compound semiconductor substrate production method
JP5678653B2 (ja) * 2010-12-28 2015-03-04 三菱化学株式会社 六方晶系半導体板状結晶の製造方法
JP6106419B2 (ja) * 2012-12-12 2017-03-29 昭和電工株式会社 ＳｉＣ基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002308697A (ja) * 2001-04-05 2002-10-23 Nippon Steel Corp 炭化珪素単結晶インゴット及びその製造方法並びに炭化珪素単結晶育成用種結晶の装着方法
JP2004168649A (ja) * 2002-11-08 2004-06-17 Neomax Co Ltd ＳｉＣ基板およびＳｉＣ基板の製造方法
JP2011222750A (ja) * 2010-04-09 2011-11-04 Nippon Steel Corp 炭化珪素単結晶ウェハの製造方法及びこの方法で得られた炭化珪素単結晶ウェハ
CN104813439A (zh) * 2012-10-26 2015-07-29 道康宁公司 平坦的SiC半导体基板
JP2014210687A (ja) * 2013-04-19 2014-11-13 新日鐵住金株式会社 炭化珪素単結晶育成用種結晶基板
CN107002281A (zh) * 2014-12-05 2017-08-01 新日铁住金株式会社 碳化硅单晶的制造方法及碳化硅单晶基板
JP2017065954A (ja) * 2015-09-29 2017-04-06 新日鐵住金株式会社 炭化珪素単結晶インゴットの製造方法

Also Published As

Publication number Publication date
US11781244B2 (en) 2023-10-10
CN111630213A (zh) 2020-09-04
US20210047750A1 (en) 2021-02-18
WO2019146336A1 (ja) 2019-08-01
JP6960866B2 (ja) 2021-11-05
JP2019127415A (ja) 2019-08-01

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Address after: Tokyo, Japan

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Patentee after: DENSO Corp.

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Patentee before: SHOWA DENKO Kabushiki Kaisha

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