CN111434435A - 激光加工装置和聚光透镜的污染确认方法 - Google Patents

激光加工装置和聚光透镜的污染确认方法 Download PDF

Info

Publication number
CN111434435A
CN111434435A CN201911353186.8A CN201911353186A CN111434435A CN 111434435 A CN111434435 A CN 111434435A CN 201911353186 A CN201911353186 A CN 201911353186A CN 111434435 A CN111434435 A CN 111434435A
Authority
CN
China
Prior art keywords
condenser lens
unit
light
contamination
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911353186.8A
Other languages
English (en)
Chinese (zh)
Inventor
寺西俊辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111434435A publication Critical patent/CN111434435A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
CN201911353186.8A 2019-01-11 2019-12-25 激光加工装置和聚光透镜的污染确认方法 Pending CN111434435A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-003408 2019-01-11
JP2019003408A JP2020110823A (ja) 2019-01-11 2019-01-11 レーザー加工装置および集光レンズの確認方法

Publications (1)

Publication Number Publication Date
CN111434435A true CN111434435A (zh) 2020-07-21

Family

ID=71581091

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911353186.8A Pending CN111434435A (zh) 2019-01-11 2019-12-25 激光加工装置和聚光透镜的污染确认方法

Country Status (5)

Country Link
JP (1) JP2020110823A (ko)
KR (1) KR20200087677A (ko)
CN (1) CN111434435A (ko)
SG (1) SG10201913058YA (ko)
TW (1) TW202027898A (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066226A (ja) * 1983-09-21 1985-04-16 Matsushita Electric Ind Co Ltd レ−ザ加工装置のレンズ汚れ検出装置
CN101078691A (zh) * 2006-05-23 2007-11-28 山崎马扎克公司 激光加工机的聚光透镜的污垢检测方法及装置
CN105312777A (zh) * 2014-06-30 2016-02-10 株式会社迪思科 激光加工装置
CN106256476A (zh) * 2015-06-17 2016-12-28 株式会社迪思科 激光加工装置
TW201711779A (zh) * 2015-07-09 2017-04-01 Eo科技股份有限公司 雷射加工裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5286039B2 (ja) * 2008-11-12 2013-09-11 株式会社ディスコ レーザ加工装置
JP6327524B2 (ja) * 2015-01-28 2018-05-23 株式会社東京精密 レーザーダイシング装置
JP6906837B2 (ja) 2017-02-13 2021-07-21 株式会社ディスコ レーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066226A (ja) * 1983-09-21 1985-04-16 Matsushita Electric Ind Co Ltd レ−ザ加工装置のレンズ汚れ検出装置
CN101078691A (zh) * 2006-05-23 2007-11-28 山崎马扎克公司 激光加工机的聚光透镜的污垢检测方法及装置
CN105312777A (zh) * 2014-06-30 2016-02-10 株式会社迪思科 激光加工装置
CN106256476A (zh) * 2015-06-17 2016-12-28 株式会社迪思科 激光加工装置
TW201711779A (zh) * 2015-07-09 2017-04-01 Eo科技股份有限公司 雷射加工裝置

Also Published As

Publication number Publication date
TW202027898A (zh) 2020-08-01
JP2020110823A (ja) 2020-07-27
KR20200087677A (ko) 2020-07-21
SG10201913058YA (en) 2020-08-28

Similar Documents

Publication Publication Date Title
CN109202308B (zh) 激光加工装置和激光加工方法
JP6465722B2 (ja) 加工装置
JP5456510B2 (ja) レーザ加工装置
KR101752016B1 (ko) 광 디바이스 웨이퍼의 분할 방법
US8040520B2 (en) Device for detecting the edges of a workpiece, and a laser beam processing machine
CN105081559B (zh) 激光加工装置
KR20180100496A (ko) 반도체 잉곳의 검사 방법, 검사 장치 및 레이저 가공 장치
CN103212865B (zh) 脆性材料基板的激光加工方法以及激光加工装置
JP7254416B2 (ja) 被加工物の切削方法
JP4354262B2 (ja) レーザー加工された変質層の確認方法
JP4786997B2 (ja) レーザー加工装置
CN106256476A (zh) 激光加工装置
JP2012059907A (ja) 分割方法
KR20160086263A (ko) 웨이퍼의 가공 방법
CN111834254A (zh) 加工装置和被加工物的加工方法
US9149886B2 (en) Modified layer forming method
JP5683121B2 (ja) レーザ加工装置
JP5656690B2 (ja) レーザ加工装置
CN111434435A (zh) 激光加工装置和聚光透镜的污染确认方法
CN111564381A (zh) 确认方法
KR20200067248A (ko) 가공 방법
JP2019046923A (ja) ウエーハの加工方法
JP2012192415A (ja) レーザー加工装置
JP5466898B2 (ja) 撮像光学系及び加工装置
JP2022062899A (ja) レーザー加工装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200721