JP5656690B2 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
- Publication number
- JP5656690B2 JP5656690B2 JP2011045131A JP2011045131A JP5656690B2 JP 5656690 B2 JP5656690 B2 JP 5656690B2 JP 2011045131 A JP2011045131 A JP 2011045131A JP 2011045131 A JP2011045131 A JP 2011045131A JP 5656690 B2 JP5656690 B2 JP 5656690B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- wafer
- laser processing
- processing apparatus
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012545 processing Methods 0.000 title claims description 56
- 238000005259 measurement Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 description 24
- 238000001514 detection method Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 7
- 230000010355 oscillation Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000003331 infrared imaging Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- -1 gallium nitride compound Chemical class 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
28 チャックテーブル
29 吸引部
31 枠体
31a 枠体上面
36 集光器
62 光学系
64 加工用レーザ発振器
70 集光レンズ
72 センシング用レーザ発振器
76 シリンドリカルレンズ
82 凹凸
84 変質層
86 傾斜面
Claims (3)
- 被加工物を保持する保持部と該保持部を囲繞する金属製の枠体とを含むチャックテーブルと、
該チャックテーブルに保持された被加工物の上面に真上から測定用レーザビームを照射し、被加工物の上面で真上に反射した該測定用レーザビームの反射光の受光によって被加工物の上面高さ位置を検出する検出手段と、を備えたレーザ加工装置であって、
該金属製の枠体は真上から該測定用レーザビームが照射されても真上への反射を抑制する処理が施されていることを特徴とするレーザ加工装置。 - 該枠体の上面に凹凸が形成されている請求項1記載のレーザ加工装置。
- 該枠体の上面には該枠体の内側から外側へ向けて下に傾斜する傾斜面が形成されている請求項1記載のレーザ加工装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011045131A JP5656690B2 (ja) | 2011-03-02 | 2011-03-02 | レーザ加工装置 |
KR1020120020987A KR20120100770A (ko) | 2011-03-02 | 2012-02-29 | 레이저 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011045131A JP5656690B2 (ja) | 2011-03-02 | 2011-03-02 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012179644A JP2012179644A (ja) | 2012-09-20 |
JP5656690B2 true JP5656690B2 (ja) | 2015-01-21 |
Family
ID=47011331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011045131A Active JP5656690B2 (ja) | 2011-03-02 | 2011-03-02 | レーザ加工装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5656690B2 (ja) |
KR (1) | KR20120100770A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014229806A (ja) * | 2013-05-24 | 2014-12-08 | 株式会社ディスコ | レーザー加工装置及びウエーハのレーザー加工方法 |
JP6441056B2 (ja) * | 2014-12-10 | 2018-12-19 | 株式会社ディスコ | 研削装置 |
JP6707278B2 (ja) * | 2015-09-04 | 2020-06-10 | 株式会社ディスコ | 研削ホイール及び被加工物の研削方法 |
CN109108518A (zh) * | 2018-09-05 | 2019-01-01 | 广东工业大学 | 一种激光焊驼峰缺陷的在线检测方法及装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8025A (en) * | 1851-04-08 | Apparatus eor boltiitg flouk | ||
US6012A (en) * | 1849-01-09 | Lithographing co | ||
JPS6372496A (ja) * | 1986-09-16 | 1988-04-02 | Toyoda Mach Works Ltd | レ−ザ加工機 |
JP2749712B2 (ja) * | 1990-08-29 | 1998-05-13 | 古河電気工業株式会社 | レーザー加工における被加工物位置合わせ方法 |
JPH07178577A (ja) * | 1993-12-21 | 1995-07-18 | Murata Mfg Co Ltd | レーザーマーキング用マスク |
JP4743985B2 (ja) * | 2001-03-30 | 2011-08-10 | 三洋電機株式会社 | 電池の製造方法 |
JP2005116208A (ja) * | 2003-10-03 | 2005-04-28 | Nec Tokin Corp | 二次電池及びその製造方法 |
JP4598407B2 (ja) * | 2004-01-09 | 2010-12-15 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP5198203B2 (ja) * | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | 加工装置 |
-
2011
- 2011-03-02 JP JP2011045131A patent/JP5656690B2/ja active Active
-
2012
- 2012-02-29 KR KR1020120020987A patent/KR20120100770A/ko active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
JP2012179644A (ja) | 2012-09-20 |
KR20120100770A (ko) | 2012-09-12 |
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