TW202027898A - 雷射加工裝置及聚光透鏡之髒污確認方法 - Google Patents

雷射加工裝置及聚光透鏡之髒污確認方法 Download PDF

Info

Publication number
TW202027898A
TW202027898A TW109100928A TW109100928A TW202027898A TW 202027898 A TW202027898 A TW 202027898A TW 109100928 A TW109100928 A TW 109100928A TW 109100928 A TW109100928 A TW 109100928A TW 202027898 A TW202027898 A TW 202027898A
Authority
TW
Taiwan
Prior art keywords
light
condenser lens
laser
lens
detection
Prior art date
Application number
TW109100928A
Other languages
English (en)
Chinese (zh)
Inventor
寺西俊輔
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202027898A publication Critical patent/TW202027898A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
TW109100928A 2019-01-11 2020-01-10 雷射加工裝置及聚光透鏡之髒污確認方法 TW202027898A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019003408A JP2020110823A (ja) 2019-01-11 2019-01-11 レーザー加工装置および集光レンズの確認方法
JP2019-003408 2019-01-11

Publications (1)

Publication Number Publication Date
TW202027898A true TW202027898A (zh) 2020-08-01

Family

ID=71581091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109100928A TW202027898A (zh) 2019-01-11 2020-01-10 雷射加工裝置及聚光透鏡之髒污確認方法

Country Status (5)

Country Link
JP (1) JP2020110823A (ko)
KR (1) KR20200087677A (ko)
CN (1) CN111434435A (ko)
SG (1) SG10201913058YA (ko)
TW (1) TW202027898A (ko)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066226A (ja) * 1983-09-21 1985-04-16 Matsushita Electric Ind Co Ltd レ−ザ加工装置のレンズ汚れ検出装置
CN101078691A (zh) * 2006-05-23 2007-11-28 山崎马扎克公司 激光加工机的聚光透镜的污垢检测方法及装置
JP5286039B2 (ja) * 2008-11-12 2013-09-11 株式会社ディスコ レーザ加工装置
JP2016010809A (ja) * 2014-06-30 2016-01-21 株式会社ディスコ レーザー加工装置
JP6327524B2 (ja) * 2015-01-28 2018-05-23 株式会社東京精密 レーザーダイシング装置
JP2017006930A (ja) * 2015-06-17 2017-01-12 株式会社ディスコ レーザー加工装置
KR20170015866A (ko) * 2015-07-09 2017-02-10 주식회사 이오테크닉스 레이저 가공장치
JP6906837B2 (ja) 2017-02-13 2021-07-21 株式会社ディスコ レーザー加工装置

Also Published As

Publication number Publication date
CN111434435A (zh) 2020-07-21
JP2020110823A (ja) 2020-07-27
SG10201913058YA (en) 2020-08-28
KR20200087677A (ko) 2020-07-21

Similar Documents

Publication Publication Date Title
JP5456510B2 (ja) レーザ加工装置
JP4684687B2 (ja) ウエーハのレーザー加工方法および加工装置
CN105081559B (zh) 激光加工装置
JP2014104484A (ja) レーザー加工装置
CN103212865B (zh) 脆性材料基板的激光加工方法以及激光加工装置
JP5985896B2 (ja) ウエーハの加工方法およびレーザー加工装置
JP4977432B2 (ja) ヒ化ガリウムウエーハのレーザー加工方法
JP6281328B2 (ja) レーザーダイシング装置及びレーザーダイシング方法
JP6054161B2 (ja) レーザ加工方法
WO2004062868A1 (ja) 脆性材料基板のスクライブ装置及びスクライブ方法並びに自動分断ライン
JP7214308B2 (ja) ウェーハの加工方法
CN106256476A (zh) 激光加工装置
JP4766258B2 (ja) 板状物品のピックアップ装置
JP2011173128A (ja) レーザ加工装置
JP2013102039A (ja) 半導体ウエーハの加工方法
TW202027898A (zh) 雷射加工裝置及聚光透鏡之髒污確認方法
JP2016207765A (ja) ウエーハの加工方法
JP5656690B2 (ja) レーザ加工装置
JP2015225909A (ja) ウエーハの加工方法
JP7417411B2 (ja) 確認方法
KR20170053113A (ko) 웨이퍼의 가공 방법
TWI843804B (zh) 確認方法
KR20130052062A (ko) 극초단 펄스 레이저의 단일광자 흡수를 이용한 레이저 가공장치
JP2012192415A (ja) レーザー加工装置
JP2013010124A (ja) レーザ加工装置