CN111261577B - 阵列基板、显示面板及阵列基板的制作方法 - Google Patents

阵列基板、显示面板及阵列基板的制作方法 Download PDF

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CN111261577B
CN111261577B CN202010079497.6A CN202010079497A CN111261577B CN 111261577 B CN111261577 B CN 111261577B CN 202010079497 A CN202010079497 A CN 202010079497A CN 111261577 B CN111261577 B CN 111261577B
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王东雷
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Wuhan China Star Optoelectronics Technology Co Ltd
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Abstract

本发明提供一种阵列基板、显示面板及阵列基板的制作方法。显示面板包括阵列基板,阵列基板包括平坦层,平坦层在位于非显示区内设有环绕显示区的沟槽,沟槽包括下底面和两个侧斜面;下底面与侧斜面之间的夹角(Taper角)为30°‑45°。在制作所述沟槽时,通过间隔制作多个子侧斜面,多个子侧斜面相互连接形成侧斜面。本发明制作的侧斜面为光滑平面,减少了在沟槽的底部两侧形成光阻的总量,进而降低夹角,避免了在平坦有机层沟槽的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。

Description

阵列基板、显示面板及阵列基板的制作方法
技术领域
本发明涉及显示技术领域,特别是涉及一种阵列基板、显示面板及阵列基板的制作方法。
背景技术
基于低温多晶硅的显示面板设计需求,如图1所示,为现有的一种显示面板的结构示意图,在显示面板外围均有平坦有机层91,因其膜层较厚,业内一般条件为2um-3um,在其沟槽92位置易有后续膜层的残留,例如氧化铟锡等。残留的氧化铟锡93缩短了与阵列基板94的金属的间隔距离,残留的氧化铟锡93容易与阵列基板94的金属发生静电释放产生炸伤。
经分析,在制作氧化铟锡层时的图案化过程中,发现在光阻涂布时,在平坦有机层沟槽处的光阻层厚度较正常位置厚,一般正常位置厚度为1.5um,在沟槽位置达到2.8um,导致其在显影时无法将全部光阻洗掉,进而在图案化蚀刻光阻层时在沟槽位置处的氧化铟锡有光阻保护而无法完全去除。
通过上述现象不难分析出氧化铟锡残留的真实原因,即有平坦有机层较厚,导致在其沟槽处光阻涂布时有明显的堆积,导致在沟槽处的光阻层匹配曝光及显影条件无法有效感应而完全去除。
目前,沟槽的倾斜角(Taper角)约为45°-60°,若倾斜角降低可以减少光阻在沟槽的底部两侧堆积,达到根本性降低平坦有机层沟槽的底部两侧形成金属残留的目的。
发明内容
本发明的目的在于,提供一种阵列基板、显示面板及阵列基板的制作方法,解决了在曝光工艺中,光阻在挡墙底部堆积较厚难以有效被曝光显影去除导致光阻残留,从而避免了在平坦有机层沟槽的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
为实现上述目的,本发明提供一种阵列基板,包括平坦层,设有显示区和非显示区,所述平坦层在位于所述非显示区内设有环绕所述显示区的沟槽,所述沟槽包括下底面和位于所述下底面两侧的侧斜面;其中,所述下底面与所述侧斜面之间的夹角(Taper角)为30°-45°。
进一步地,所述下底面与所述侧斜面之间的夹角为30°-35°。
本发明还提供一种阵列基板的制作方法,包括步骤:
制作一平坦层,所述平坦层设有显示区和非显示区;以及
在位于所述非显示区内的所述平坦层上制作沟槽,所述沟槽环绕所述显示区设置,所述沟槽包括下底面和位于所述下底面两侧的侧斜面,所述下底面与所述侧斜面之间的夹角为30°-45°;
其中,在制作所述沟槽时,通过间隔制作多个子侧斜面,多个所述子侧斜面相互连接形成所述侧斜面。
进一步地,所述子侧斜面与所述下底面相连接的长度为1.3um-1.5um。
进一步地,任意相邻两个所述子侧斜面的间隔距离为1.0um-1.4um。
进一步地,任意相邻两个所述子侧斜面等距离间隔设置。
进一步地,所述子侧斜面的外形轮廓呈三角形、矩形、梯形中的一种或多种。
进一步地,所述子侧斜面的外形轮廓的高度为10um-15um。
进一步地,所述子侧斜面的外形轮廓为等腰梯形,所述等腰梯形包括上底边、下底边以及两个腰,所述上底边或所述下底边与所述下底面相连接。
进一步地,所述上底边的长度为1.0um-1.2um,所述下底边的长度为1.3um-1.4um。
本发明还提供一种显示装置,包括上述阵列基板。
本发明的有益效果在于,提供一种阵列基板、显示面板及阵列基板的制作方法,通过等距离间隔制作多个子侧斜面以形成平坦有机层沟槽的侧斜面,在综合曝光机的极限解析能力值为3.0um的情况下,实现仅能达成半解析的状况下制作的侧斜面为光滑平面,减少了在沟槽的底部两侧形成光阻的总量,进而降低夹角,解决了在曝光工艺中,光阻在挡墙底部堆积较厚难以有效被曝光显影去除导致光阻残留,从而避免了在平坦有机层沟槽的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为现有的一种显示面板的结构示意图;
图2为本发明实施例中一种阵列基板的结构示意图;
图3为图2中所述沟槽的俯视图;
图4为所述子侧斜面的外形轮廓的结构示意图;
图5为本发明实施例中一种阵列基板的制作方法的流程图;
图6为L=S=2.0um时的所述沟槽的制作后状态的俯视照片;
图7为L=S=1.0um时的所述沟槽的截面图。
附图中部分标识如下:
1、平坦层,2、沟槽,21、下底面,22、侧斜面,
100、阵列基板,101、显示区,102、非显示区,
211、长边,212、宽边,221、子侧斜面。
具体实施方式
以下参考说明书附图介绍本发明的优选实施例,用以举例证明本发明可以实施,这些实施例可以向本领域中的技术人员完整介绍本发明的技术内容,使得本发明的技术内容更加清楚和便于理解。然而本发明可以通过许多不同形式的实施例来得以体现,本发明的保护范围并非仅限于文中提到的实施例。
如图2所示,本发明实施例中提供一种阵列基板100,包括平坦层1,设有显示区101和非显示区102,所述平坦层1在位于所述非显示区102内设有沟槽2。如图3、图4所示,所述沟槽2包括下底面21和位于所述下底面21两侧的侧斜面22;其中,所述下底面21与所述侧斜面22之间的夹角α为30°-45°。
其中,所述侧斜面22为一光滑平面,在制作所述沟槽2的侧斜面22时,通过间隔制作多个子侧斜面221,即多个所述子侧斜面221相互连接形成所述侧斜面22,所述子侧斜面221外形轮廓优选呈梯形,可以理解的是多个梯形的所述子侧斜面221相互连接构成了所述侧斜面22,由于间隙很小,多个所述子侧斜面221融为一体形成的所述侧斜面22为一光滑平面,可通过显微镜等仪器在观察到该光滑平面。
本实施例中,所述下底面与所述侧斜面之间的夹角为30°-35°。
如图5所示,本发明实施例中还提供一种阵列基板100的制作方法,包括步骤:
S1、制作一平坦层1,所述平坦层1设有显示区101和非显示区102;以及
S2、在位于所述非显示区102内的所述平坦层1上制作沟槽2,所述沟槽2环绕所述显示区101设置,所述沟槽2包括下底面21和位于所述下底面21两侧的侧斜面22,所述侧斜面22为一光滑平面,所述下底面21与所述侧斜面22之间的夹角为30°-45°;
其中,在制作所述沟槽2时,通过间隔制作多个子侧斜面221,即多个所述子侧斜面221相互连接形成所述侧斜面22,所述子侧斜面221外形轮廓优选呈梯形,可以理解的是多个梯形的所述子侧斜面221相互连接构成了所述侧斜面22,由于间隙很小,多个所述子侧斜面221融为一体形成的所述侧斜面22为一光滑平面,可通过显微镜等仪器在观察到该光滑平面。
综合曝光机的极限解析能力值为3.0um,本实施例通过模糊曝光的方式制作多个所述子侧斜面221从而形成光滑平面的所述侧斜面22,达到夹角α降低的目的。本实施例即保证了所述沟槽2的平滑形态,又有效将夹角α由45°降低至30°左右。因此该设计在曝光机极限解析能力的43%-46%左右可达到目的性的模糊曝光,可将夹角α有效降低,确保在所述沟槽2的底部两侧无光阻残留,有效改善了因光阻残留导致在平坦有机层沟槽2的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
本实施例中,所述下底面21呈矩形环状,包括沿所述下底面21延伸方向的长边211,可以理解的是,所述显示区101呈矩形,所述下底面21环绕所述显示区101设置则呈矩形环状,即其在所述非显示区102内环绕整个阵列基板100的四周连续存在,在所述下底面21环绕所述显示区101的每一边的区域均可划分为一矩形平面,包括所述下底面211和垂直所述下底面211的宽边212;所述侧斜面22与所述下底面211相连接,所述子侧斜面221的其中一边与所述下底面211相连接。
如图3所示,本实施例中,所述子侧斜面221与所述下底面211相连接的长度S为1.3um-1.5um,优选S为1.3um-1.4um。任意相邻两个所述子侧斜面221的间隔距离L为1.0um-1.4um,优选L为1.3um-1.4um。优选任意相邻两个所述子侧斜面211等距离间隔设置。因为综合曝光机的极限解析能力值为3.0um,本实施例的极限解析能力值为1.0-1.5um,优选极限解析能力值为1.3um-1.4um,因此该设计在曝光机极限解析能力的43%-46%左右可达到目的性的模糊曝光,本实施例通过模糊曝光的方式在制作多个所述子侧斜面221从而形成光滑平面的所述侧斜面22,即保证了所述沟槽2的平滑形态,又有效将夹角α由45°降低至30°左右。通过将夹角α有效降低,确保在所述沟槽2的底部两侧无光阻残留,有效改善了因光阻残留导致在平坦有机层沟槽2的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
如图4所示,所述子侧斜面221的外形轮廓呈三角形、矩形、梯形中的一种或多种。
本实施例中,所述子侧斜面221的外形轮廓的高度为10um-15um;即所述侧斜面22的宽度为10um-15um。
本实施例中,所述子侧斜面221的外形轮廓为等腰梯形,所述等腰梯形包括上底边、下底边以及两个腰,所述上底边或所述下底边与所述下底面21相连接。
本实施例中,所述上底边的长度为1.0um-1.2um,所述下底边的长度为1.3um-1.4um。
在本实施例模糊曝光的验证中,所述模糊曝光为曝光机设计极限解析度的40%-50%左右。更具体的,本实施例中使用Nikon FX-66s曝光机的极限解析度为43%-46%,其最佳模糊曝光设计极限解析能力值为(3um*43%)-(3um*46%),即1.3um-1.4um;再如本实施例中使用Nikon FX-68曝光机的极限解析度为40%-50%,其极限解析能力值为1.5um,其模糊曝光设计极限解析能力值理论为(1.5um*40%)-(1.5um*50%),即0.6um-0.75um。
在产品上设计共计11组实验,其中任意相邻两个所述子侧斜面221的间隔距离L为1.0um,所述子侧斜面221与所述下底面211相连接的长度S为1.0um-2.0um,得到结果为:L≤1.5um且S≤1.5um时方可保证所述沟槽2的基本形态。
如图6所示,为L=S=2.0um时的所述沟槽2制作后状态的俯视照片,存在明显锯齿;其夹角α降低至20°左右。
如图7所示,为L=S=1.0um时的所述沟槽2的截面图,其夹角α基本无变化,夹角α维持在40°-60°,所述沟槽2为平滑形态且在所述侧斜面22与所述下底面211相连接位置边缘齐平。
综上可知,所述子侧斜面221与所述下底面211相连接的长度为1.3um-1.5um,优选为1.3um-1.4um。任意相邻两个所述子侧斜面221的间隔距离L为1.0um-1.4um。即保证了所述沟槽2的平滑形态,又有效将夹角α由45°降低至30°左右。因此该设计在曝光机极限解析能力的43%-46%左右可达到目的性的模糊曝光,可将夹角α有效降低,确保在所述沟槽2的底部两侧无光阻残留,有效改善了因光阻残留导致在平坦有机层沟槽2的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
本实施例中,所述子侧斜面221的外形轮廓呈三角形、矩形、梯形中的一种或多种。
本实施例中,所述子侧斜面221的外形轮廓的高度为10um-15um;即所述侧斜面22的宽度为10um-15um。
本实施例中,所述子侧斜面221的外形轮廓为等腰梯形,所述等腰梯形包括上底边、下底边以及两个腰,所述上底边或所述下底边与所述下底面21相连接。
本实施例中,所述上底边的长度为1.0um-1.2um,所述下底边的长度为1.3um-1.4um。
本发明还提供一种显示装置,包括上述阵列基板100。
本发明的有益效果在于,提供一种阵列基板、显示面板及阵列基板的制作方法,通过等距离间隔制作多个子侧斜面以形成平坦有机层沟槽的侧斜面,在综合曝光机的极限解析能力值为3.0um的情况下,实现仅能达成半解析的状况下制作的侧斜面为光滑平面,减少了在沟槽的底部两侧形成光阻的总量,进而降低夹角α,解决了在曝光工艺中,光阻在挡墙底部堆积较厚难以有效被曝光显影去除导致光阻残留,从而避免了在平坦有机层沟槽的底部两侧形成金属残留以致出现静电释放产生炸伤现象,提高了显示面板的良率。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (8)

1.一种阵列基板的制作方法,其特征在于,包括步骤:
制作一平坦层,所述平坦层设有显示区和非显示区;以及
在位于所述非显示区内的所述平坦层上制作沟槽,所述沟槽环绕所述显示区设置,所述沟槽包括下底面和位于所述下底面两侧的侧斜面,所述下底面与所述侧斜面之间的夹角为30°-45°;
其中,在制作所述沟槽时,通过间隔制作多个子侧斜面,多个所述子侧斜面相互连接形成所述侧斜面;
所述子侧斜面与所述下底面相连接的长度为1.3um-1.5um;
任意相邻两个所述子侧斜面的间隔距离为1.0um-1.4um。
2.根据权利要求1所述的阵列基板的制作方法,其特征在于,所述子侧斜面的外形轮廓呈三角形、矩形、梯形中的一种或多种。
3.根据权利要求2所述的阵列基板的制作方法,其特征在于,所述子侧斜面的外形轮廓的高度为10um-15um。
4.根据权利要求2所述的阵列基板的制作方法,其特征在于,所述子侧斜面的外形轮廓为等腰梯形,所述等腰梯形包括上底边、下底边以及两个腰,所述上底边或所述下底边与所述下底面相连接。
5.根据权利要求4所述的阵列基板的制作方法,其特征在于,所述上底边的长度为1.0um-1.2um,所述下底边的长度为1.3um-1.4um。
6.一种根据权利要求1-5任一项所述的阵列基板的制作方法制作的阵列基板,其特征在于,包括:
平坦层,设有显示区和非显示区,所述平坦层在位于所述非显示区内设有环绕所述显示区的沟槽,所述沟槽包括下底面和位于所述下底面两侧的侧斜面;
其中,所述下底面与所述侧斜面之间的夹角为30°-45°;所述侧斜面包括多个间隔设置的子侧斜面,多个所述子侧斜面相互连接形成所述侧斜面。
7.根据权利要求6所述的阵列基板,其特征在于,所述下底面与所述侧斜面之间的夹角为30°-35°。
8.一种显示装置,其特征在于,包括权利要求6或7所述的阵列基板。
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