CN111247206A - 密封用树脂组合物和半导体装置 - Google Patents
密封用树脂组合物和半导体装置 Download PDFInfo
- Publication number
- CN111247206A CN111247206A CN201880067422.7A CN201880067422A CN111247206A CN 111247206 A CN111247206 A CN 111247206A CN 201880067422 A CN201880067422 A CN 201880067422A CN 111247206 A CN111247206 A CN 111247206A
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- CN
- China
- Prior art keywords
- resin composition
- sealing
- sealing resin
- mass
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-200110 | 2017-10-16 | ||
JP2017200110 | 2017-10-16 | ||
PCT/JP2018/037240 WO2019078024A1 (ja) | 2017-10-16 | 2018-10-04 | 封止用樹脂組成物および半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111247206A true CN111247206A (zh) | 2020-06-05 |
Family
ID=66173687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880067422.7A Pending CN111247206A (zh) | 2017-10-16 | 2018-10-04 | 密封用树脂组合物和半导体装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6628010B2 (ja) |
KR (1) | KR102166183B1 (ja) |
CN (1) | CN111247206A (ja) |
TW (1) | TW201927895A (ja) |
WO (1) | WO2019078024A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7170240B2 (ja) * | 2018-07-27 | 2022-11-14 | パナソニックIpマネジメント株式会社 | 半導体封止用樹脂組成物、半導体装置、及び半導体装置の製造方法 |
JP7302300B2 (ja) * | 2019-06-03 | 2023-07-04 | 住友ベークライト株式会社 | 封止樹脂組成物およびアルミニウム電解コンデンサ |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015036410A (ja) * | 2013-08-15 | 2015-02-23 | 信越化学工業株式会社 | 高誘電率エポキシ樹脂組成物および半導体装置 |
CN105899569A (zh) * | 2014-01-08 | 2016-08-24 | 信越化学工业株式会社 | 半导体密封用液体环氧树脂组合物和树脂密封半导体装置 |
JP2017179185A (ja) * | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959769A (ja) * | 1982-09-29 | 1984-04-05 | Meisei Chiyaachiru Kk | 構造用接着剤 |
JPH0472360A (ja) * | 1990-07-11 | 1992-03-06 | Sumitomo Chem Co Ltd | 半導体封止用熱硬化性樹脂組成物 |
JP2000007894A (ja) * | 1998-06-24 | 2000-01-11 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2000169676A (ja) * | 1998-12-03 | 2000-06-20 | Sumitomo Bakelite Co Ltd | エポキシ樹脂成形材料の製造方法及び半導体装置 |
JP2003337129A (ja) * | 2002-05-17 | 2003-11-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物の選定方法及び該組成物中のカーボンブラック粗粒分の検出方法 |
JP5509514B2 (ja) | 2005-11-21 | 2014-06-04 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP5411497B2 (ja) * | 2006-03-08 | 2014-02-12 | 電気化学工業株式会社 | 無機質中空粉体、その製造方法及び該無機質中空粉体を含有する組成物 |
JP5275297B2 (ja) * | 2010-07-28 | 2013-08-28 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び該液状エポキシ樹脂組成物を硬化させた硬化物で封止された半導体装置 |
JP2012082281A (ja) * | 2010-10-08 | 2012-04-26 | Shin-Etsu Chemical Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
KR20120078174A (ko) * | 2010-12-31 | 2012-07-10 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
JP6772946B2 (ja) * | 2017-04-26 | 2020-10-21 | 信越化学工業株式会社 | 低温硬化型液状エポキシ樹脂組成物 |
JP6724854B2 (ja) * | 2017-04-26 | 2020-07-15 | 信越化学工業株式会社 | 熱硬化性エポキシ樹脂組成物 |
-
2018
- 2018-10-04 KR KR1020207013624A patent/KR102166183B1/ko active IP Right Grant
- 2018-10-04 WO PCT/JP2018/037240 patent/WO2019078024A1/ja active Application Filing
- 2018-10-04 JP JP2019525037A patent/JP6628010B2/ja active Active
- 2018-10-04 CN CN201880067422.7A patent/CN111247206A/zh active Pending
- 2018-10-09 TW TW107135492A patent/TW201927895A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015036410A (ja) * | 2013-08-15 | 2015-02-23 | 信越化学工業株式会社 | 高誘電率エポキシ樹脂組成物および半導体装置 |
CN105899569A (zh) * | 2014-01-08 | 2016-08-24 | 信越化学工业株式会社 | 半导体密封用液体环氧树脂组合物和树脂密封半导体装置 |
JP2017179185A (ja) * | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
Non-Patent Citations (1)
Title |
---|
(加)GEORGE WYPYCH编,程斌等译: "《填料手册》", 28 February 2003, 中国石化出版社 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2019078024A1 (ja) | 2019-11-14 |
KR20200058566A (ko) | 2020-05-27 |
JP6628010B2 (ja) | 2020-01-08 |
TW201927895A (zh) | 2019-07-16 |
WO2019078024A1 (ja) | 2019-04-25 |
KR102166183B1 (ko) | 2020-10-15 |
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