CN111226308A - 一种具有高稳定性粘结层的半导体装置及其制备方法 - Google Patents
一种具有高稳定性粘结层的半导体装置及其制备方法 Download PDFInfo
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- CN111226308A CN111226308A CN201880067522.XA CN201880067522A CN111226308A CN 111226308 A CN111226308 A CN 111226308A CN 201880067522 A CN201880067522 A CN 201880067522A CN 111226308 A CN111226308 A CN 111226308A
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Abstract
本申请实施例公开了一种半导体装置(400)及其制备方法,该半导体装置(400)中,用于粘结半导体芯片(41)和基板(42)的粘结层(43)由高导电和导热的金属粉末烧结工艺制成的烧结金属构成。并且,在本申请实施例中,存在于烧结金属内部的至少部分空洞(431)内填充有特定材料。如此,空洞(431)被特定材料填充后,有利于减少潮气的容纳,因而减少了当半导体装置(400)经过回流焊贴装到印刷线路板上时,引起的芯片(41)和基板(42)的分层的可能性。另外,填充后的空洞(431)不会干扰分层的检测结果,因而提高了半导体装置(400)分层检测结果的准确性。
Description
PCT国内申请,说明书已公开。
Claims (13)
- PCT国内申请,权利要求书已公开。
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PCT/CN2018/075947 WO2019153230A1 (zh) | 2018-02-09 | 2018-02-09 | 一种具有高稳定性粘结层的半导体装置及其制备方法 |
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US (1) | US20200365547A1 (zh) |
EP (1) | EP3723116A4 (zh) |
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CN117182227A (zh) * | 2023-11-08 | 2023-12-08 | 日月新检测科技(苏州)有限公司 | 集成电路检测方法 |
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US20210249330A1 (en) * | 2020-02-06 | 2021-08-12 | Intel Corporation | Composite thermal matrix |
CN112992699B (zh) * | 2021-02-01 | 2024-03-22 | 上海易卜半导体有限公司 | 半导体封装方法、半导体组件以及包含其的电子设备 |
CN113691229B (zh) * | 2021-08-25 | 2023-11-28 | 北京超材信息科技有限公司 | 声学装置封装结构 |
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JP2014027095A (ja) * | 2012-07-26 | 2014-02-06 | Denso Corp | 電子装置およびその製造方法 |
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JP2892348B1 (ja) * | 1998-06-04 | 1999-05-17 | 松下電器産業株式会社 | 半導体ユニットおよび半導体素子の実装方法 |
DE10009678C1 (de) * | 2000-02-29 | 2001-07-19 | Siemens Ag | Wärmeleitende Klebstoffverbindung und Verfahren zum Herstellen einer wärmeleitenden Klebstoffverbindung |
JP5123633B2 (ja) * | 2007-10-10 | 2013-01-23 | ルネサスエレクトロニクス株式会社 | 半導体装置および接続材料 |
JP2010171271A (ja) * | 2009-01-23 | 2010-08-05 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP5156658B2 (ja) * | 2009-01-30 | 2013-03-06 | 株式会社日立製作所 | Lsi用電子部材 |
JP2011165871A (ja) * | 2010-02-09 | 2011-08-25 | Denso Corp | 電子装置およびその製造方法 |
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CN203179944U (zh) * | 2013-02-21 | 2013-09-04 | 深圳市瑞丰光电子股份有限公司 | 一种led灯 |
JP5975911B2 (ja) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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2018
- 2018-02-09 WO PCT/CN2018/075947 patent/WO2019153230A1/zh unknown
- 2018-02-09 EP EP18905755.7A patent/EP3723116A4/en not_active Withdrawn
- 2018-02-09 CN CN201880067522.XA patent/CN111226308A/zh active Pending
-
2020
- 2020-08-04 US US16/984,805 patent/US20200365547A1/en not_active Abandoned
Patent Citations (1)
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JP2014027095A (ja) * | 2012-07-26 | 2014-02-06 | Denso Corp | 電子装置およびその製造方法 |
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CN117182227A (zh) * | 2023-11-08 | 2023-12-08 | 日月新检测科技(苏州)有限公司 | 集成电路检测方法 |
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US20200365547A1 (en) | 2020-11-19 |
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EP3723116A1 (en) | 2020-10-14 |
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