CN111200415B - 声表面波器件 - Google Patents
声表面波器件 Download PDFInfo
- Publication number
- CN111200415B CN111200415B CN201911104936.8A CN201911104936A CN111200415B CN 111200415 B CN111200415 B CN 111200415B CN 201911104936 A CN201911104936 A CN 201911104936A CN 111200415 B CN111200415 B CN 111200415B
- Authority
- CN
- China
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- region
- bus bar
- acoustic wave
- surface acoustic
- propagation velocity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 148
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 244000126211 Hericium coralloides Species 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910013641 LiNbO 3 Inorganic materials 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 239000010408 film Substances 0.000 description 106
- 239000000463 material Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000005284 excitation Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- -1 PAiD Chemical compound 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14517—Means for weighting
- H03H9/1452—Means for weighting by finger overlap length, apodisation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14517—Means for weighting
- H03H9/14529—Distributed tap
- H03H9/14532—Series weighting; Transverse weighting
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14552—Transducers of particular shape or position comprising split fingers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/1457—Transducers having different finger widths
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-215986 | 2018-11-16 | ||
JP2018215986A JP7178881B2 (ja) | 2018-11-16 | 2018-11-16 | 弾性表面波素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111200415A CN111200415A (zh) | 2020-05-26 |
CN111200415B true CN111200415B (zh) | 2024-05-10 |
Family
ID=70726931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911104936.8A Active CN111200415B (zh) | 2018-11-16 | 2019-11-13 | 声表面波器件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11683019B2 (zh) |
JP (2) | JP7178881B2 (zh) |
CN (1) | CN111200415B (zh) |
TW (1) | TWI762832B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12095446B2 (en) | 2018-06-15 | 2024-09-17 | Murata Manufacturing Co., Ltd. | Transversely-excited film bulk acoustic resonator with optimized electrode thickness, mark, and pitch |
JP2020145567A (ja) * | 2019-03-06 | 2020-09-10 | 株式会社村田製作所 | 弾性波装置 |
US11652466B2 (en) * | 2019-08-29 | 2023-05-16 | Skyworks Solutions, Inc. | Suppression of transverse mode spurious signals in surface acoustic wave devices utilizing a dense film above gap region of interdigital transducer electrodes |
US11848658B2 (en) | 2019-10-24 | 2023-12-19 | Skyworks Solutions, Inc. | Acoustic wave resonator with mass loading strip for suppression of hyperbolic mode |
US11936367B2 (en) * | 2019-10-31 | 2024-03-19 | Skyworks Solutions, Inc. | Acoustic wave device with velocity reduction cover |
US20210344322A1 (en) * | 2020-04-30 | 2021-11-04 | RF360 Europe GmbH | Surface acoustic wave electroacoustic device for reduced transversal modes |
JP7499624B2 (ja) * | 2020-06-30 | 2024-06-14 | NDK SAW devices株式会社 | 弾性表面波素子 |
US11405017B2 (en) | 2020-10-05 | 2022-08-02 | Resonant Inc. | Acoustic matrix filters and radios using acoustic matrix filters |
JP2022171054A (ja) * | 2021-04-30 | 2022-11-11 | 太陽誘電株式会社 | 弾性波共振器、フィルタ、およびマルチプレクサ |
US20220352867A1 (en) * | 2021-04-30 | 2022-11-03 | Resonant Inc. | Transversely-excited film bulk acoustic resonator with oxide strip acoustic confinement structures |
CN113839648B (zh) * | 2021-09-14 | 2023-08-29 | 常州承芯半导体有限公司 | 声表面波谐振装置及形成方法、滤波装置及射频前端装置 |
TWI789913B (zh) * | 2021-09-16 | 2023-01-11 | 台灣嘉碩科技股份有限公司 | 利用有效反射結構的表面聲波諧振器及濾波器 |
WO2024043342A1 (ja) * | 2022-08-26 | 2024-02-29 | 株式会社村田製作所 | 弾性波装置 |
WO2024043346A1 (ja) * | 2022-08-26 | 2024-02-29 | 株式会社村田製作所 | 弾性波装置 |
CN115473506B (zh) * | 2022-09-16 | 2023-08-22 | 南通大学 | 一种减小声表面波器件体积的方法 |
CN116208115A (zh) * | 2023-02-07 | 2023-06-02 | 锐石创芯(重庆)科技有限公司 | 弹性波装置、弹性波装置的制作方法、滤波器及电子设备 |
Citations (8)
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JP2003087083A (ja) * | 2001-07-04 | 2003-03-20 | Murata Mfg Co Ltd | 弾性表面波用のくし型電極部、弾性表面波装置、通信装置 |
CN101154935A (zh) * | 2006-09-29 | 2008-04-02 | Tdk株式会社 | 弹性表面波滤波器以及弹性表面波共振器 |
JP2009077209A (ja) * | 2007-09-21 | 2009-04-09 | Seiko Epson Corp | 弾性表面波共振子 |
US7576471B1 (en) * | 2007-09-28 | 2009-08-18 | Triquint Semiconductor, Inc. | SAW filter operable in a piston mode |
JP2012227626A (ja) * | 2011-04-15 | 2012-11-15 | Panasonic Corp | 弾性表面波素子 |
JP2016184951A (ja) * | 2011-03-25 | 2016-10-20 | スカイワークスフィルターソリューションズジャパン株式会社 | 高次横モード波を抑制した弾性波デバイス |
JP2017199984A (ja) * | 2016-04-25 | 2017-11-02 | 株式会社村田製作所 | 弾性波装置 |
WO2018003282A1 (ja) * | 2016-06-28 | 2018-01-04 | 株式会社村田製作所 | 弾性波装置 |
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JPS5221616U (zh) | 1975-08-04 | 1977-02-16 | ||
JPS553020U (zh) | 1978-06-22 | 1980-01-10 | ||
JP3412611B2 (ja) * | 2000-09-25 | 2003-06-03 | 株式会社村田製作所 | 弾性表面波装置 |
JP3498215B2 (ja) * | 2001-04-09 | 2004-02-16 | 株式会社村田製作所 | 弾性表面波フィルタ、弾性表面波装置および通信装置 |
JP3929415B2 (ja) | 2003-04-23 | 2007-06-13 | 富士通メディアデバイス株式会社 | 弾性表面波デバイス |
JP5115184B2 (ja) * | 2007-12-25 | 2013-01-09 | パナソニック株式会社 | 弾性境界波デバイス、及びそれを用いたフィルタ、アンテナ共用器 |
JP5392255B2 (ja) * | 2008-06-06 | 2014-01-22 | パナソニック株式会社 | 弾性波共用器 |
US7939989B2 (en) | 2009-09-22 | 2011-05-10 | Triquint Semiconductor, Inc. | Piston mode acoustic wave device and method providing a high coupling factor |
DE102010005596B4 (de) | 2010-01-25 | 2015-11-05 | Epcos Ag | Elektroakustischer Wandler mit verringerten Verlusten durch transversale Emission und verbesserter Performance durch Unterdrückung transversaler Moden |
JP5797979B2 (ja) | 2011-08-31 | 2015-10-21 | 太陽誘電株式会社 | 弾性波デバイス |
CN105284047B (zh) * | 2013-05-29 | 2018-10-12 | 株式会社村田制作所 | 弹性波装置 |
EP3007358B1 (en) * | 2013-05-29 | 2019-10-23 | Murata Manufacturing Co., Ltd. | Elastic wave filter device |
JP6494447B2 (ja) * | 2015-01-20 | 2019-04-03 | 太陽誘電株式会社 | 弾性波デバイス |
FR3042648B1 (fr) * | 2015-10-20 | 2018-09-07 | Soitec Silicon On Insulator | Dispositif a ondes acoustiques de surface et procede de fabrication associe |
JP6483073B2 (ja) * | 2015-12-14 | 2019-03-13 | 太陽誘電株式会社 | 弾性波共振器、フィルタおよびデュプレクサ |
JP6415469B2 (ja) * | 2016-03-22 | 2018-10-31 | 太陽誘電株式会社 | 弾性波共振器、フィルタおよびマルチプレクサ並びに弾性波共振器の製造方法 |
JP6954799B2 (ja) * | 2017-10-20 | 2021-10-27 | 株式会社村田製作所 | 弾性波装置 |
-
2018
- 2018-11-16 JP JP2018215986A patent/JP7178881B2/ja active Active
-
2019
- 2019-11-13 CN CN201911104936.8A patent/CN111200415B/zh active Active
- 2019-11-15 TW TW108141644A patent/TWI762832B/zh active
- 2019-11-15 US US16/684,607 patent/US11683019B2/en active Active
-
2022
- 2022-06-29 JP JP2022104962A patent/JP7377920B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003087083A (ja) * | 2001-07-04 | 2003-03-20 | Murata Mfg Co Ltd | 弾性表面波用のくし型電極部、弾性表面波装置、通信装置 |
CN101154935A (zh) * | 2006-09-29 | 2008-04-02 | Tdk株式会社 | 弹性表面波滤波器以及弹性表面波共振器 |
JP2009077209A (ja) * | 2007-09-21 | 2009-04-09 | Seiko Epson Corp | 弾性表面波共振子 |
US7576471B1 (en) * | 2007-09-28 | 2009-08-18 | Triquint Semiconductor, Inc. | SAW filter operable in a piston mode |
JP2016184951A (ja) * | 2011-03-25 | 2016-10-20 | スカイワークスフィルターソリューションズジャパン株式会社 | 高次横モード波を抑制した弾性波デバイス |
JP2012227626A (ja) * | 2011-04-15 | 2012-11-15 | Panasonic Corp | 弾性表面波素子 |
JP2017199984A (ja) * | 2016-04-25 | 2017-11-02 | 株式会社村田製作所 | 弾性波装置 |
WO2018003282A1 (ja) * | 2016-06-28 | 2018-01-04 | 株式会社村田製作所 | 弾性波装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI762832B (zh) | 2022-05-01 |
US11683019B2 (en) | 2023-06-20 |
JP7178881B2 (ja) | 2022-11-28 |
TW202021271A (zh) | 2020-06-01 |
CN111200415A (zh) | 2020-05-26 |
US20200162052A1 (en) | 2020-05-21 |
JP2022126852A (ja) | 2022-08-30 |
JP7377920B2 (ja) | 2023-11-10 |
JP2020088459A (ja) | 2020-06-04 |
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