CN111164236A - 化学镀钯液及化学镀钯膜 - Google Patents

化学镀钯液及化学镀钯膜 Download PDF

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Publication number
CN111164236A
CN111164236A CN201880064756.9A CN201880064756A CN111164236A CN 111164236 A CN111164236 A CN 111164236A CN 201880064756 A CN201880064756 A CN 201880064756A CN 111164236 A CN111164236 A CN 111164236A
Authority
CN
China
Prior art keywords
plating film
plating
electroless
palladium plating
electroless palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880064756.9A
Other languages
English (en)
Chinese (zh)
Inventor
前田刚志
田边克久
和田真辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Publication of CN111164236A publication Critical patent/CN111164236A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CN201880064756.9A 2017-10-06 2018-10-03 化学镀钯液及化学镀钯膜 Pending CN111164236A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017195651A JP7149061B2 (ja) 2017-10-06 2017-10-06 無電解パラジウムめっき液
JP2017-195651 2017-10-06
PCT/JP2018/036970 WO2019069964A1 (ja) 2017-10-06 2018-10-03 無電解パラジウムめっき液、及び無電解パラジウムめっき皮膜

Publications (1)

Publication Number Publication Date
CN111164236A true CN111164236A (zh) 2020-05-15

Family

ID=65994683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880064756.9A Pending CN111164236A (zh) 2017-10-06 2018-10-03 化学镀钯液及化学镀钯膜

Country Status (7)

Country Link
US (1) US20200248312A1 (ja)
EP (1) EP3693495A4 (ja)
JP (1) JP7149061B2 (ja)
KR (1) KR20200062265A (ja)
CN (1) CN111164236A (ja)
TW (1) TWI829653B (ja)
WO (1) WO2019069964A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572376B1 (ja) * 2018-11-30 2019-09-11 上村工業株式会社 無電解めっき浴

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804410A (en) * 1986-03-04 1989-02-14 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
JPH08269727A (ja) * 1995-03-30 1996-10-15 C Uyemura & Co Ltd 無電解パラジウムめっき液及びめっき方法
CN102449192A (zh) * 2009-05-08 2012-05-09 小岛化学药品株式会社 无电解钯镀液
CN103857826A (zh) * 2011-10-12 2014-06-11 安美特德国有限公司 无电钯镀浴组合物
CN106480437A (zh) * 2015-08-31 2017-03-08 比亚迪股份有限公司 一种离子钯还原液、制备方法及一种非金属化学镀的方法
TW201723226A (zh) * 2015-11-27 2017-07-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3418143A (en) * 1967-08-15 1968-12-24 Burroughs Corp Bath for the electroless deposition of palladium
JP2000256866A (ja) 1999-03-10 2000-09-19 Hideo Honma 無電解ニッケルめっき浴
JP2007009305A (ja) 2005-07-04 2007-01-18 Japan Pure Chemical Co Ltd 無電解パラジウムめっき液及びそれを用いて形成された３層めっき被膜端子
JP4596553B2 (ja) 2005-07-20 2010-12-08 Ｊｘ日鉱日石金属株式会社 無電解パラジウムめっき液
JP4974332B2 (ja) 2005-09-07 2012-07-11 一般財団法人電力中央研究所 ナノ構造体およびその製造方法
JP5843249B2 (ja) 2010-04-19 2016-01-13 奥野製薬工業株式会社 無電解パラジウムめっき又は無電解パラジウム合金めっきの前処理用活性化液
TWI479048B (zh) * 2011-10-24 2015-04-01 Kojima Chemicals Co Ltd 無電解鈀敷液
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
JP6635304B2 (ja) 2016-04-18 2020-01-22 株式会社オートネットワーク技術研究所 リレー装置及び車載システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804410A (en) * 1986-03-04 1989-02-14 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
JPH08269727A (ja) * 1995-03-30 1996-10-15 C Uyemura & Co Ltd 無電解パラジウムめっき液及びめっき方法
CN102449192A (zh) * 2009-05-08 2012-05-09 小岛化学药品株式会社 无电解钯镀液
CN103857826A (zh) * 2011-10-12 2014-06-11 安美特德国有限公司 无电钯镀浴组合物
CN106480437A (zh) * 2015-08-31 2017-03-08 比亚迪股份有限公司 一种离子钯还原液、制备方法及一种非金属化学镀的方法
TW201723226A (zh) * 2015-11-27 2017-07-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法

Also Published As

Publication number Publication date
WO2019069964A1 (ja) 2019-04-11
JP2019070172A (ja) 2019-05-09
EP3693495A1 (en) 2020-08-12
JP7149061B2 (ja) 2022-10-06
KR20200062265A (ko) 2020-06-03
TWI829653B (zh) 2024-01-21
TW201925531A (zh) 2019-07-01
US20200248312A1 (en) 2020-08-06
EP3693495A4 (en) 2021-09-29

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