EP3693495A4 - PALLADIUM AUTOCATALYTIC DEPOSITION SOLUTION, AND PALLADIUM AUTOCATALYTIC DEPOSITION COATING FILM - Google Patents

PALLADIUM AUTOCATALYTIC DEPOSITION SOLUTION, AND PALLADIUM AUTOCATALYTIC DEPOSITION COATING FILM Download PDF

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Publication number
EP3693495A4
EP3693495A4 EP18864662.4A EP18864662A EP3693495A4 EP 3693495 A4 EP3693495 A4 EP 3693495A4 EP 18864662 A EP18864662 A EP 18864662A EP 3693495 A4 EP3693495 A4 EP 3693495A4
Authority
EP
European Patent Office
Prior art keywords
electroless palladium
plating solution
plated coating
electroless
palladium plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18864662.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3693495A1 (en
Inventor
Tsuyoshi Maeda
Katsuhisa Tanabe
Shinsuke Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Publication of EP3693495A1 publication Critical patent/EP3693495A1/en
Publication of EP3693495A4 publication Critical patent/EP3693495A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
EP18864662.4A 2017-10-06 2018-10-03 PALLADIUM AUTOCATALYTIC DEPOSITION SOLUTION, AND PALLADIUM AUTOCATALYTIC DEPOSITION COATING FILM Pending EP3693495A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017195651A JP7149061B2 (ja) 2017-10-06 2017-10-06 無電解パラジウムめっき液
PCT/JP2018/036970 WO2019069964A1 (ja) 2017-10-06 2018-10-03 無電解パラジウムめっき液、及び無電解パラジウムめっき皮膜

Publications (2)

Publication Number Publication Date
EP3693495A1 EP3693495A1 (en) 2020-08-12
EP3693495A4 true EP3693495A4 (en) 2021-09-29

Family

ID=65994683

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18864662.4A Pending EP3693495A4 (en) 2017-10-06 2018-10-03 PALLADIUM AUTOCATALYTIC DEPOSITION SOLUTION, AND PALLADIUM AUTOCATALYTIC DEPOSITION COATING FILM

Country Status (7)

Country Link
US (1) US20200248312A1 (ja)
EP (1) EP3693495A4 (ja)
JP (1) JP7149061B2 (ja)
KR (1) KR20200062265A (ja)
CN (1) CN111164236A (ja)
TW (1) TWI829653B (ja)
WO (1) WO2019069964A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572376B1 (ja) * 2018-11-30 2019-09-11 上村工業株式会社 無電解めっき浴

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120118196A1 (en) * 2009-05-08 2012-05-17 Kojima Chemicals Co., Ltd. Electroless palladium plating solution
CN106480437A (zh) * 2015-08-31 2017-03-08 比亚迪股份有限公司 一种离子钯还原液、制备方法及一种非金属化学镀的方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3418143A (en) * 1967-08-15 1968-12-24 Burroughs Corp Bath for the electroless deposition of palladium
US4804410A (en) * 1986-03-04 1989-02-14 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
JP3204035B2 (ja) * 1995-03-30 2001-09-04 上村工業株式会社 無電解パラジウムめっき液及びめっき方法
JP2000256866A (ja) 1999-03-10 2000-09-19 Hideo Honma 無電解ニッケルめっき浴
JP2007009305A (ja) 2005-07-04 2007-01-18 Japan Pure Chemical Co Ltd 無電解パラジウムめっき液及びそれを用いて形成された３層めっき被膜端子
JP4596553B2 (ja) 2005-07-20 2010-12-08 Ｊｘ日鉱日石金属株式会社 無電解パラジウムめっき液
JP4974332B2 (ja) 2005-09-07 2012-07-11 一般財団法人電力中央研究所 ナノ構造体およびその製造方法
JP5843249B2 (ja) 2010-04-19 2016-01-13 奥野製薬工業株式会社 無電解パラジウムめっき又は無電解パラジウム合金めっきの前処理用活性化液
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
TWI479048B (zh) * 2011-10-24 2015-04-01 Kojima Chemicals Co Ltd 無電解鈀敷液
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
JP6635304B2 (ja) 2016-04-18 2020-01-22 株式会社オートネットワーク技術研究所 リレー装置及び車載システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120118196A1 (en) * 2009-05-08 2012-05-17 Kojima Chemicals Co., Ltd. Electroless palladium plating solution
CN106480437A (zh) * 2015-08-31 2017-03-08 比亚迪股份有限公司 一种离子钯还原液、制备方法及一种非金属化学镀的方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019069964A1 *

Also Published As

Publication number Publication date
WO2019069964A1 (ja) 2019-04-11
JP2019070172A (ja) 2019-05-09
EP3693495A1 (en) 2020-08-12
CN111164236A (zh) 2020-05-15
JP7149061B2 (ja) 2022-10-06
KR20200062265A (ko) 2020-06-03
TWI829653B (zh) 2024-01-21
TW201925531A (zh) 2019-07-01
US20200248312A1 (en) 2020-08-06

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