CN111133558B - 用钴填充基板特征的方法与设备 - Google Patents
用钴填充基板特征的方法与设备 Download PDFInfo
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- CN111133558B CN111133558B CN201880061451.2A CN201880061451A CN111133558B CN 111133558 B CN111133558 B CN 111133558B CN 201880061451 A CN201880061451 A CN 201880061451A CN 111133558 B CN111133558 B CN 111133558B
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/711,169 | 2017-09-21 | ||
| US15/711,169 US10304732B2 (en) | 2017-09-21 | 2017-09-21 | Methods and apparatus for filling substrate features with cobalt |
| PCT/US2018/051509 WO2019060296A1 (en) | 2017-09-21 | 2018-09-18 | METHODS AND APPARATUS USED TO FILL SUBSTRATE CHARACTERISTICS WITH COBALT |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111133558A CN111133558A (zh) | 2020-05-08 |
| CN111133558B true CN111133558B (zh) | 2024-04-02 |
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| US11410891B2 (en) | 2019-08-26 | 2022-08-09 | International Business Machines Corporation | Anomaly detection and remedial recommendation |
| US11164815B2 (en) | 2019-09-28 | 2021-11-02 | International Business Machines Corporation | Bottom barrier free interconnects without voids |
| US11776980B2 (en) * | 2020-03-13 | 2023-10-03 | Applied Materials, Inc. | Methods for reflector film growth |
| CN211879343U (zh) * | 2020-04-10 | 2020-11-06 | 北京北方华创微电子装备有限公司 | 一种半导体加工设备 |
| US11527437B2 (en) | 2020-09-15 | 2022-12-13 | Applied Materials, Inc. | Methods and apparatus for intermixing layer for enhanced metal reflow |
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| KR20200045563A (ko) | 2020-05-04 |
| US20190088540A1 (en) | 2019-03-21 |
| US10304732B2 (en) | 2019-05-28 |
| JP2020534702A (ja) | 2020-11-26 |
| JP7309697B2 (ja) | 2023-07-18 |
| TW201925532A (zh) | 2019-07-01 |
| KR102572732B1 (ko) | 2023-08-29 |
| WO2019060296A1 (en) | 2019-03-28 |
| TWI782094B (zh) | 2022-11-01 |
| CN111133558A (zh) | 2020-05-08 |
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