CN111107958A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN111107958A
CN111107958A CN201880057913.3A CN201880057913A CN111107958A CN 111107958 A CN111107958 A CN 111107958A CN 201880057913 A CN201880057913 A CN 201880057913A CN 111107958 A CN111107958 A CN 111107958A
Authority
CN
China
Prior art keywords
transparent substrate
top plate
laser beam
processing apparatus
beam irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880057913.3A
Other languages
English (en)
Chinese (zh)
Inventor
和田浩光
村尾幸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Publication of CN111107958A publication Critical patent/CN111107958A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B23Q2703/04—Work clamping means using fluid means or a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
CN201880057913.3A 2017-11-15 2018-10-01 激光加工装置 Pending CN111107958A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-219803 2017-11-15
JP2017219803A JP6916718B2 (ja) 2017-11-15 2017-11-15 レーザ加工装置
PCT/JP2018/036723 WO2019097864A1 (ja) 2017-11-15 2018-10-01 レーザ加工装置

Publications (1)

Publication Number Publication Date
CN111107958A true CN111107958A (zh) 2020-05-05

Family

ID=66539565

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880057913.3A Pending CN111107958A (zh) 2017-11-15 2018-10-01 激光加工装置

Country Status (5)

Country Link
JP (1) JP6916718B2 (ja)
KR (1) KR20200081392A (ja)
CN (1) CN111107958A (ja)
TW (1) TWI763943B (ja)
WO (1) WO2019097864A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113305396A (zh) * 2021-07-30 2021-08-27 四川斯艾普电子科技有限公司 一种用于芯片级电路板的焊接夹持工装

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220132708A (ko) * 2021-03-23 2022-10-04 삼성디스플레이 주식회사 레이저 가공용 워크 테이블

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326337A (ja) * 1993-04-16 1994-11-25 Mitsubishi Heavy Ind Ltd レーザ加工装置
CN1810435A (zh) * 2005-01-26 2006-08-02 株式会社迪斯科 激光加工装置
CN1959534A (zh) * 2005-11-04 2007-05-09 株式会社Orc制作所 周边曝光装置及其方法
CN101170075A (zh) * 2006-10-27 2008-04-30 株式会社迪思科 晶片的分割方法以及分割装置
JP2013004926A (ja) * 2011-06-21 2013-01-07 Sumitomo Bakelite Co Ltd 回路基板の製造方法、回路基板の製造装置、及び、レーザ加工用治具
JP2013191712A (ja) * 2012-03-13 2013-09-26 Towa Corp 積層基板の切断方法および電子部品の製造方法
CN104159699A (zh) * 2012-03-05 2014-11-19 法国圣戈班玻璃厂 用于制造带有传感器窗的复合玻璃板的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6352790A (ja) 1986-08-21 1988-03-05 Mitsubishi Electric Corp レ−ザ加工装置
JP5194076B2 (ja) * 2010-08-27 2013-05-08 三星ダイヤモンド工業株式会社 レーザ割断装置
JP6430170B2 (ja) * 2014-08-12 2018-11-28 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置
CN108701639B (zh) * 2016-03-10 2022-09-16 三菱电机株式会社 基板吸附台、基板处理装置、基板处理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326337A (ja) * 1993-04-16 1994-11-25 Mitsubishi Heavy Ind Ltd レーザ加工装置
CN1810435A (zh) * 2005-01-26 2006-08-02 株式会社迪斯科 激光加工装置
CN1959534A (zh) * 2005-11-04 2007-05-09 株式会社Orc制作所 周边曝光装置及其方法
CN101170075A (zh) * 2006-10-27 2008-04-30 株式会社迪思科 晶片的分割方法以及分割装置
JP2013004926A (ja) * 2011-06-21 2013-01-07 Sumitomo Bakelite Co Ltd 回路基板の製造方法、回路基板の製造装置、及び、レーザ加工用治具
CN104159699A (zh) * 2012-03-05 2014-11-19 法国圣戈班玻璃厂 用于制造带有传感器窗的复合玻璃板的方法
JP2013191712A (ja) * 2012-03-13 2013-09-26 Towa Corp 積層基板の切断方法および電子部品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113305396A (zh) * 2021-07-30 2021-08-27 四川斯艾普电子科技有限公司 一种用于芯片级电路板的焊接夹持工装
CN113305396B (zh) * 2021-07-30 2021-10-29 四川斯艾普电子科技有限公司 一种用于芯片级电路板的焊接夹持工装

Also Published As

Publication number Publication date
KR20200081392A (ko) 2020-07-07
JP6916718B2 (ja) 2021-08-11
JP2019089103A (ja) 2019-06-13
WO2019097864A1 (ja) 2019-05-23
TW201922400A (zh) 2019-06-16
TWI763943B (zh) 2022-05-11

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