CN111106090A - 基于刚性框架的tmv扇出型封装结构及其制备方法 - Google Patents
基于刚性框架的tmv扇出型封装结构及其制备方法 Download PDFInfo
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- CN111106090A CN111106090A CN202010007837.4A CN202010007837A CN111106090A CN 111106090 A CN111106090 A CN 111106090A CN 202010007837 A CN202010007837 A CN 202010007837A CN 111106090 A CN111106090 A CN 111106090A
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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CN202010007837.4A CN111106090A (zh) | 2020-01-06 | 2020-01-06 | 基于刚性框架的tmv扇出型封装结构及其制备方法 |
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CN202010007837.4A CN111106090A (zh) | 2020-01-06 | 2020-01-06 | 基于刚性框架的tmv扇出型封装结构及其制备方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668106A (zh) * | 2020-05-08 | 2020-09-15 | 上海兆芯集成电路有限公司 | 芯片封装方法 |
CN113299569A (zh) * | 2021-06-11 | 2021-08-24 | 广东佛智芯微电子技术研究有限公司 | 大板级扇出基板倒装芯片封装结构的制备方法 |
WO2022012498A1 (zh) * | 2020-07-13 | 2022-01-20 | 矽磐微电子(重庆)有限公司 | 芯片封装结构及其制作方法 |
-
2020
- 2020-01-06 CN CN202010007837.4A patent/CN111106090A/zh active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668106A (zh) * | 2020-05-08 | 2020-09-15 | 上海兆芯集成电路有限公司 | 芯片封装方法 |
CN111668106B (zh) * | 2020-05-08 | 2022-05-03 | 上海兆芯集成电路有限公司 | 芯片封装方法 |
WO2022012498A1 (zh) * | 2020-07-13 | 2022-01-20 | 矽磐微电子(重庆)有限公司 | 芯片封装结构及其制作方法 |
CN113299569A (zh) * | 2021-06-11 | 2021-08-24 | 广东佛智芯微电子技术研究有限公司 | 大板级扇出基板倒装芯片封装结构的制备方法 |
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