CN210575902U - 一种高散热扇出型三维异构双面塑封结构 - Google Patents
一种高散热扇出型三维异构双面塑封结构 Download PDFInfo
- Publication number
- CN210575902U CN210575902U CN201921652752.0U CN201921652752U CN210575902U CN 210575902 U CN210575902 U CN 210575902U CN 201921652752 U CN201921652752 U CN 201921652752U CN 210575902 U CN210575902 U CN 210575902U
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- Prior art keywords
- layer
- plastic package
- heat dissipation
- out type
- copper
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- 239000004033 plastic Substances 0.000 title claims abstract description 93
- 229920003023 plastic Polymers 0.000 title claims abstract description 93
- 230000017525 heat dissipation Effects 0.000 claims abstract description 93
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 54
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 151
- 238000000465 moulding Methods 0.000 description 13
- 239000013067 intermediate product Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000003292 glue Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 229920006336 epoxy molding compound Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- -1 methyl vinyl Chemical group 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
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CN201921652752.0U CN210575902U (zh) | 2019-09-29 | 2019-09-29 | 一种高散热扇出型三维异构双面塑封结构 |
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CN201921652752.0U CN210575902U (zh) | 2019-09-29 | 2019-09-29 | 一种高散热扇出型三维异构双面塑封结构 |
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CN210575902U true CN210575902U (zh) | 2020-05-19 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110571201A (zh) * | 2019-09-29 | 2019-12-13 | 广东佛智芯微电子技术研究有限公司 | 一种高散热扇出型三维异构双面塑封结构及其制备方法 |
-
2019
- 2019-09-29 CN CN201921652752.0U patent/CN210575902U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110571201A (zh) * | 2019-09-29 | 2019-12-13 | 广东佛智芯微电子技术研究有限公司 | 一种高散热扇出型三维异构双面塑封结构及其制备方法 |
CN110571201B (zh) * | 2019-09-29 | 2024-07-09 | 广东佛智芯微电子技术研究有限公司 | 一种高散热扇出型三维异构双面塑封结构及其制备方法 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high heat dissipation fan out three dimensional heterogeneous double sided plastic packaging structure Effective date of registration: 20201224 Granted publication date: 20200519 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd.|Guangdong Xinhua Microelectronics Technology Co.,Ltd. Registration number: Y2020980009995 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230412 Address after: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: Room A107, scientific research building, block a, neifo high tech think tank center, Nanhai Software Science Park, Shishan town, Nanhai District, Foshan City, Guangdong Province, 528225 Patentee before: Guangdong fozhixin microelectronics technology research Co.,Ltd. Patentee before: Guangdong Xinhua Microelectronics Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200519 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |