CN111063787A - 具有自对准预制透镜的发光设备 - Google Patents
具有自对准预制透镜的发光设备 Download PDFInfo
- Publication number
- CN111063787A CN111063787A CN201911355103.9A CN201911355103A CN111063787A CN 111063787 A CN111063787 A CN 111063787A CN 201911355103 A CN201911355103 A CN 201911355103A CN 111063787 A CN111063787 A CN 111063787A
- Authority
- CN
- China
- Prior art keywords
- light emitting
- cavity
- light
- lens structure
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461930586P | 2014-01-23 | 2014-01-23 | |
| US61/930586 | 2014-01-23 | ||
| CN201580005512.XA CN105940262B (zh) | 2014-01-23 | 2015-01-04 | 具有自对准预制透镜的发光设备 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580005512.XA Division CN105940262B (zh) | 2014-01-23 | 2015-01-04 | 具有自对准预制透镜的发光设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111063787A true CN111063787A (zh) | 2020-04-24 |
Family
ID=52396775
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911355103.9A Pending CN111063787A (zh) | 2014-01-23 | 2015-01-04 | 具有自对准预制透镜的发光设备 |
| CN201580005512.XA Active CN105940262B (zh) | 2014-01-23 | 2015-01-04 | 具有自对准预制透镜的发光设备 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580005512.XA Active CN105940262B (zh) | 2014-01-23 | 2015-01-04 | 具有自对准预制透镜的发光设备 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US10416356B2 (enExample) |
| EP (1) | EP3097351A1 (enExample) |
| JP (2) | JP2017504215A (enExample) |
| KR (1) | KR102217791B1 (enExample) |
| CN (2) | CN111063787A (enExample) |
| WO (1) | WO2015110927A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10895669B2 (en) | 2014-01-23 | 2021-01-19 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6645781B2 (ja) * | 2015-09-11 | 2020-02-14 | アルパッド株式会社 | 半導体発光装置 |
| US10340173B2 (en) * | 2016-10-11 | 2019-07-02 | Micron Technology, Inc. | System for handling semiconductor dies |
| DE102017122325A1 (de) * | 2017-09-26 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
| KR20190120715A (ko) * | 2018-04-16 | 2019-10-24 | 리지텍 일렉트로닉스 컴퍼니 리미티드 | 구조화된 광 투사 시스템 |
| EP3832199A1 (en) * | 2019-12-06 | 2021-06-09 | Marelli Automotive Lighting Italy S.p.A. | Automotive lighting and/or signaling device and related assembly method |
| WO2022015669A1 (en) * | 2020-07-14 | 2022-01-20 | Nlight, Inc. | Opto-mechanical mounting for optical components |
Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010026011A1 (en) * | 1999-03-15 | 2001-10-04 | Roberts John K. | Radiation emitter devices and method of making the same |
| US20020080615A1 (en) * | 2000-12-22 | 2002-06-27 | Thomas Marshall | LED collimation optics with improved performance and reduced size |
| US20020163810A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Side emitting LED |
| US20020163808A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Lens and Lens Cap with Sawtooth Portion for Light Emitting Diode |
| JP2005159149A (ja) * | 2003-11-27 | 2005-06-16 | Aoki Denki Kogyo Kk | 高輝度led発光部 |
| CN1726410A (zh) * | 2002-10-11 | 2006-01-25 | 光处方革新有限公司 | 密致折叠型光学元件照明透镜 |
| US20060078246A1 (en) * | 2004-10-07 | 2006-04-13 | Towa Corporation | Transparent member, optical device using transparent member and method of manufacturing optical device |
| JP2007059618A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led照明器具 |
| CN1934722A (zh) * | 2004-03-24 | 2007-03-21 | 东芝照明技术株式会社 | 照明装置 |
| US7349163B2 (en) * | 2001-12-06 | 2008-03-25 | Fraen Corporation S.R.L. | High-heat-dissipation lighting module |
| CN101240885A (zh) * | 2007-12-10 | 2008-08-13 | 王敏 | Led小角度远距离送光镜组及阵列 |
| US20080203415A1 (en) * | 2007-02-13 | 2008-08-28 | 3M Innovative Properties Company | Led devices having lenses and methods of making same |
| US20080283861A1 (en) * | 2004-06-04 | 2008-11-20 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| CN101636851A (zh) * | 2007-02-26 | 2010-01-27 | 皇家菲利浦电子有限公司 | 具有透镜中的磷光体片和过模压磷光体的led |
| JP2010170734A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Electric Works Co Ltd | Led照明装置 |
| US7874703B2 (en) * | 2008-08-28 | 2011-01-25 | Dialight Corporation | Total internal reflection lens with base |
| CN102017199A (zh) * | 2008-04-24 | 2011-04-13 | 松下电工株式会社 | 具有透镜的发光单元 |
| CN102052630A (zh) * | 2009-11-09 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 发光组件 |
| JP2011113755A (ja) * | 2009-11-25 | 2011-06-09 | Panasonic Electric Works Co Ltd | 発光装置 |
| CN102563525A (zh) * | 2010-11-10 | 2012-07-11 | 三星Led株式会社 | 闪光灯透镜和闪光灯模块 |
| CN102686935A (zh) * | 2009-12-21 | 2012-09-19 | 马丁专业公司 | 具有互补中心透镜和外围透镜的集光器 |
| CN102800797A (zh) * | 2011-05-24 | 2012-11-28 | 台湾积体电路制造股份有限公司 | 具有远离荧光结构的蝙蝠翼透镜 |
| US20130039050A1 (en) * | 2011-08-08 | 2013-02-14 | Quarkstar, Llc | Solid-State Luminaire |
| CN103196040A (zh) * | 2012-01-06 | 2013-07-10 | 扬升照明股份有限公司 | 透镜结构、光源装置以及光源模块 |
| US20130235581A1 (en) * | 2010-10-27 | 2013-09-12 | Dbm Reflex Enterprises Inc. | Lens array assembly for solid state light sources and method |
| US20140377894A1 (en) * | 2013-06-25 | 2014-12-25 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor light emitting device package |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO143045B (no) | 1975-05-16 | Kolbjoern Bjoershol | Apparat for kroksetting av en fiskeline. | |
| JPS5860954A (ja) * | 1981-10-07 | 1983-04-11 | Asahimatsu Shokuhin Kk | 大豆タンパク凍結変性物のゲル状食品製造法 |
| JPS5860954U (ja) * | 1981-10-19 | 1983-04-25 | 株式会社リコー | 発光素子取付構造 |
| JPH0561790U (ja) * | 1992-01-21 | 1993-08-13 | セイコーエプソン株式会社 | 操作パネル |
| JPH06104491A (ja) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | 発光ダイオードランプ |
| JPH11204841A (ja) | 1998-01-13 | 1999-07-30 | Nichia Chem Ind Ltd | 光半導体素子とその製造方法 |
| JP3349111B2 (ja) * | 1999-03-15 | 2002-11-20 | 株式会社シチズン電子 | 表面実装型発光ダイオード及びその製造方法 |
| JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
| US7465961B2 (en) * | 2003-03-25 | 2008-12-16 | Sharp Kabushiki Kaisha | Electronic equipment, backlight structure and keypad for electronic equipment |
| US7009213B2 (en) | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
| JP4444609B2 (ja) * | 2003-09-26 | 2010-03-31 | スタンレー電気株式会社 | Ledランプ及び製造方法 |
| US7452737B2 (en) | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
| KR100649640B1 (ko) * | 2005-02-03 | 2006-11-27 | 삼성전기주식회사 | 측면 방출형 발광다이오드 패키지 |
| TW200825529A (en) * | 2006-12-06 | 2008-06-16 | Chi Lin Technology Co Ltd | Light mixer and backlight module having it |
| US7993034B2 (en) * | 2007-09-21 | 2011-08-09 | Cooper Technologies Company | Reflector having inflection point and LED fixture including such reflector |
| CN101235953A (zh) | 2008-03-04 | 2008-08-06 | 友达光电股份有限公司 | 透镜结构与发光单元 |
| CN101978297A (zh) * | 2008-03-05 | 2011-02-16 | 奥利高级照明解决公司 | 照明装置及其形成方法 |
| DE102008025756B4 (de) * | 2008-05-29 | 2023-02-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiteranordnung |
| JP5512515B2 (ja) | 2008-05-30 | 2014-06-04 | シャープ株式会社 | 発光装置、面光源および液晶表示装置 |
| CN101936501B (zh) * | 2009-06-30 | 2013-04-24 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
| US8803171B2 (en) * | 2009-07-22 | 2014-08-12 | Koninklijke Philips N.V. | Reduced color over angle variation LEDs |
| US9385285B2 (en) * | 2009-09-17 | 2016-07-05 | Koninklijke Philips N.V. | LED module with high index lens |
| CN102062347A (zh) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | 发光二极管模组及其透镜 |
| JP5701502B2 (ja) | 2009-12-25 | 2015-04-15 | 日亜化学工業株式会社 | 発光装置 |
| JP5512262B2 (ja) * | 2009-12-26 | 2014-06-04 | 株式会社朝日ラバー | レンズアレイシート及びそれのダイシング方法 |
| JP5449039B2 (ja) | 2010-06-07 | 2014-03-19 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
| US8597988B2 (en) * | 2010-11-18 | 2013-12-03 | Bridgelux, Inc. | System for flash-free overmolding of led array substrates |
| TW201233940A (en) | 2010-11-30 | 2012-08-16 | Wintek Corp | Light source for crystal lamp |
| KR101561754B1 (ko) * | 2011-04-28 | 2015-10-19 | 가부시키가이샤 아사히 러버 | 렌즈 부착 광반도체 장치 및 그 제조방법 |
| KR20120133264A (ko) | 2011-05-31 | 2012-12-10 | 삼성전자주식회사 | 발광소자 렌즈, 이를 포함하는 발광소자 모듈 및 이를 이용한 발광소자 모듈의 제조방법 |
| WO2013084155A1 (en) | 2011-12-08 | 2013-06-13 | Koninklijke Philips Electronics N.V. | Forming thick metal layers on a semiconductor light emitting device |
| CN103187504A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| US9688035B2 (en) * | 2012-01-16 | 2017-06-27 | Dow Corning Corporation | Optical article and method of forming |
| KR101386710B1 (ko) | 2012-04-05 | 2014-04-18 | 건국대학교 산학협력단 | 비환식 석시노글리칸의 용도 |
| US9349929B2 (en) * | 2012-05-31 | 2016-05-24 | Cree, Inc. | Light emitter packages, systems, and methods |
| TW201431127A (zh) * | 2013-01-29 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | 發光二極體封裝結構及其製造方法 |
| US9318674B2 (en) * | 2013-02-05 | 2016-04-19 | Cree, Inc. | Submount-free light emitting diode (LED) components and methods of fabricating same |
| JP2017504215A (ja) | 2014-01-23 | 2017-02-02 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | セルフアライン式プリフォームレンズを有する発光デバイス |
| US10297731B2 (en) * | 2014-11-26 | 2019-05-21 | Bridgelux, Inc. | Light emitting diode constructions and methods for making the same |
| US10591134B2 (en) * | 2016-01-19 | 2020-03-17 | Lutron Ketra, Llc | Lens for improved color mixing and beam control of an LED light source |
| JP6104491B1 (ja) | 2017-01-20 | 2017-03-29 | 三菱日立パワーシステムズ株式会社 | 船舶用脱硫装置および該船舶用脱硫装置を搭載した船舶 |
-
2015
- 2015-01-04 JP JP2016547552A patent/JP2017504215A/ja active Pending
- 2015-01-04 KR KR1020167023018A patent/KR102217791B1/ko active Active
- 2015-01-04 CN CN201911355103.9A patent/CN111063787A/zh active Pending
- 2015-01-04 CN CN201580005512.XA patent/CN105940262B/zh active Active
- 2015-01-04 US US15/110,840 patent/US10416356B2/en active Active
- 2015-01-04 EP EP15701247.7A patent/EP3097351A1/en not_active Withdrawn
- 2015-01-04 WO PCT/IB2015/050050 patent/WO2015110927A1/en not_active Ceased
-
2019
- 2019-09-16 US US16/572,074 patent/US10895669B2/en active Active
-
2020
- 2020-09-30 JP JP2020164629A patent/JP2021002682A/ja active Pending
-
2021
- 2021-01-14 US US17/149,129 patent/US11313996B2/en active Active
Patent Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030168670A1 (en) * | 1999-03-15 | 2003-09-11 | Roberts John K. | Method of making radiation emitter devices |
| US20010026011A1 (en) * | 1999-03-15 | 2001-10-04 | Roberts John K. | Radiation emitter devices and method of making the same |
| US20020080615A1 (en) * | 2000-12-22 | 2002-06-27 | Thomas Marshall | LED collimation optics with improved performance and reduced size |
| CN1404630A (zh) * | 2000-12-22 | 2003-03-19 | 皇家菲利浦电子有限公司 | Led模块 |
| US20020163810A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Side emitting LED |
| US20020163808A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Lens and Lens Cap with Sawtooth Portion for Light Emitting Diode |
| US7349163B2 (en) * | 2001-12-06 | 2008-03-25 | Fraen Corporation S.R.L. | High-heat-dissipation lighting module |
| CN1726410A (zh) * | 2002-10-11 | 2006-01-25 | 光处方革新有限公司 | 密致折叠型光学元件照明透镜 |
| JP2005159149A (ja) * | 2003-11-27 | 2005-06-16 | Aoki Denki Kogyo Kk | 高輝度led発光部 |
| CN1934722A (zh) * | 2004-03-24 | 2007-03-21 | 东芝照明技术株式会社 | 照明装置 |
| US20080283861A1 (en) * | 2004-06-04 | 2008-11-20 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| US20060078246A1 (en) * | 2004-10-07 | 2006-04-13 | Towa Corporation | Transparent member, optical device using transparent member and method of manufacturing optical device |
| JP2007059618A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led照明器具 |
| US20080203415A1 (en) * | 2007-02-13 | 2008-08-28 | 3M Innovative Properties Company | Led devices having lenses and methods of making same |
| CN101636851A (zh) * | 2007-02-26 | 2010-01-27 | 皇家菲利浦电子有限公司 | 具有透镜中的磷光体片和过模压磷光体的led |
| CN101240885A (zh) * | 2007-12-10 | 2008-08-13 | 王敏 | Led小角度远距离送光镜组及阵列 |
| CN102017199A (zh) * | 2008-04-24 | 2011-04-13 | 松下电工株式会社 | 具有透镜的发光单元 |
| US7874703B2 (en) * | 2008-08-28 | 2011-01-25 | Dialight Corporation | Total internal reflection lens with base |
| JP2010170734A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Electric Works Co Ltd | Led照明装置 |
| CN102052630A (zh) * | 2009-11-09 | 2011-05-11 | 富准精密工业(深圳)有限公司 | 发光组件 |
| JP2011113755A (ja) * | 2009-11-25 | 2011-06-09 | Panasonic Electric Works Co Ltd | 発光装置 |
| CN102686935A (zh) * | 2009-12-21 | 2012-09-19 | 马丁专业公司 | 具有互补中心透镜和外围透镜的集光器 |
| US20130235581A1 (en) * | 2010-10-27 | 2013-09-12 | Dbm Reflex Enterprises Inc. | Lens array assembly for solid state light sources and method |
| CN102563525A (zh) * | 2010-11-10 | 2012-07-11 | 三星Led株式会社 | 闪光灯透镜和闪光灯模块 |
| CN102800797A (zh) * | 2011-05-24 | 2012-11-28 | 台湾积体电路制造股份有限公司 | 具有远离荧光结构的蝙蝠翼透镜 |
| US20130039050A1 (en) * | 2011-08-08 | 2013-02-14 | Quarkstar, Llc | Solid-State Luminaire |
| CN103196040A (zh) * | 2012-01-06 | 2013-07-10 | 扬升照明股份有限公司 | 透镜结构、光源装置以及光源模块 |
| US20140377894A1 (en) * | 2013-06-25 | 2014-12-25 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor light emitting device package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10895669B2 (en) | 2014-01-23 | 2021-01-19 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
| US11313996B2 (en) | 2014-01-23 | 2022-04-26 | Lumileds Llc | Light emitting device with self-aligning preformed lens |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105940262A (zh) | 2016-09-14 |
| US10895669B2 (en) | 2021-01-19 |
| CN105940262B (zh) | 2020-01-07 |
| US10416356B2 (en) | 2019-09-17 |
| US11313996B2 (en) | 2022-04-26 |
| KR102217791B1 (ko) | 2021-02-22 |
| JP2017504215A (ja) | 2017-02-02 |
| KR20160113198A (ko) | 2016-09-28 |
| WO2015110927A1 (en) | 2015-07-30 |
| US20210132263A1 (en) | 2021-05-06 |
| US20160341852A1 (en) | 2016-11-24 |
| JP2021002682A (ja) | 2021-01-07 |
| US20200116902A1 (en) | 2020-04-16 |
| EP3097351A1 (en) | 2016-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11313996B2 (en) | Light emitting device with self-aligning preformed lens | |
| US9018663B2 (en) | Lens-equipped optical semiconductor device and method for manufacturing the same | |
| JP4744573B2 (ja) | 電子装置の製造方法 | |
| EP2666193B1 (en) | Led package comprising encapsulation | |
| TWI408835B (zh) | 發光二極體晶粒上之上層模製 | |
| CN102484191B (zh) | 带高折射率透镜的led模块 | |
| KR101219106B1 (ko) | 발광소자 패키지 및 그 제조방법 | |
| EP2503606B1 (en) | Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof | |
| TW201042780A (en) | Compact molded LED module | |
| US20150287891A1 (en) | LED Packaging Structure Using Distant Fluorescent Powder Layer and Manufacturing Method Thereof | |
| CN105706237A (zh) | 用于倒装芯片led的基于框架的封装 | |
| CN102655189B (zh) | 光电部件制造方法、光电部件制造系统和光电部件 | |
| KR102176383B1 (ko) | 하부 반사기를 가지는 led 렌즈의 캡슐화 | |
| CN106469776A (zh) | 电子装置与其制造方法 | |
| JP4773580B2 (ja) | 発光装置及びその製造方法 | |
| TW201507207A (zh) | 具有圓頂狀的晶片級發光裝置封裝 | |
| CN112106207A (zh) | 光电模块及用于制造光电模块的晶片级方法 | |
| US8828754B2 (en) | Method for manufacturing LED | |
| JP5189925B2 (ja) | レンズ部材の製造方法 | |
| KR100796670B1 (ko) | 발광다이오드 및 그 제조방법 | |
| CN102194709A (zh) | 发光二极管封装元件及其制造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200424 |
|
| WD01 | Invention patent application deemed withdrawn after publication |