CN111057364B - 一种可拼接高回弹地垫 - Google Patents
一种可拼接高回弹地垫 Download PDFInfo
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Abstract
本发明公开了一种可拼接高回弹地垫,其原料按重量份计组成为:A组分100份,B组分30‑40份,有机增韧剂3‑8份,第一无机增强增韧剂3‑5份,第二无机增强增韧剂1‑3份,海螵蛸粉5‑10份。本发明高回弹,与地面的吸附力强,拼接接口处强度和韧性好,产品硬度和支撑力适中。
Description
技术领域
本发明涉及一种地垫,特别涉及一种可拼接高回弹地垫。
背景技术
发泡材料地垫用途广泛,如地板衬垫、体育运动地垫、儿童游戏地垫等。较薄的地垫一般为整张,不用时可以卷起。而较厚的整张地垫无法卷起,必须采用块状单元拼接的模式,即使用时拼接成地垫,不用时将其拆成单元堆叠。现有常见的拼接地垫材料为EVA发泡材料,聚氨酯较少见,聚氨酯发泡材料做靠垫会更多点。
聚氨酯有聚酯型和聚醚型二大类。他们可制成聚氨酯塑料(以泡沫塑料为主)、聚氨酯纤维(中国称为氨纶)、聚氨酯橡胶及弹性体。软质聚氨酯(PU)主要是具有热塑性的线性结构,它比PVC发泡材料有更好的稳定性、耐化学性、回弹性和力学性能,具有更小的压缩变型性。隔热、隔音、抗震、防毒性能良好。因此用作包装、隔音、过滤材料。硬质PU塑料质轻、隔音、绝热性能优越、耐化学药品,电性能好,易加工,吸水率低。它主要用于建筑、汽车、航空工业、保温隔热的结构材料。聚氨酯弹性体性能介于塑料和橡胶之间,耐油,耐磨,耐低温,耐老化,硬度高,有弹性。主要用于制鞋工业和医疗业。聚氨酯还可以制作粘合剂、涂料、合成革等。
聚氨酯制成可拼接地垫,主要面料两个主要问题,一是聚氨酯发泡材料的强度和韧性不足,这样使得地垫的拼接处易于破损,二是聚氨酯发泡材料制备中采用的异氰酸酯和胺类交联剂的存在,使得产品会有一定异味,影响使用。此外,聚氨酯地垫的防滑性也不足。
发明内容
本发明的目的在于提供一种可拼接高回弹地垫,高回弹,与地面的吸附力强,拼接接口处强度和韧性好,产品硬度和支撑力适中。
本发明解决其技术问题所采用的技术方案是:
一种可拼接高回弹地垫,其原料按重量份计组成为:A组分100份,B组分30-40份,有机增韧剂3-8份,第一无机增强增韧剂3-5份,第二无机增强增韧剂1-3份,海螵蛸粉5-10份;按重量份计,A组分的组成为:聚醚多元醇330N 100份,聚合物多元醇3630 8-12份,催化剂A33 0.2-0.3份,催化剂A300 0.2-0.3份,硅油0.2-0.3份,交联剂1-1.2份,起始剂1-1.5份,水1.5-2份,开孔剂2-2.3份,硅酮表面活性剂1-1.2份;
按重量百分比计,B组分的组成为:二苯甲烷二异氰酸酯55-65%,2,6-二氟苯甲酰异氰酸酯35-45%。
所述有机增韧剂为蚕丝蛋白。
所述第一无机增强增韧剂为四针状纳米氧化锌晶须。
所述第二无机增强增韧剂为硫酸钙晶须。
针对拼接地垫接口处容易破损的问题,本发明在聚氨酯发泡原料中添加了有机增韧剂、第一无机增强增韧剂和第二无机增强增韧剂进行原位发泡,采用原位发泡,有机增韧剂、第一无机增强增韧剂和第二无机增强增韧剂与聚氨酯发泡原料混合均匀,结合好,发挥作用效果好。通过有机增韧剂、第一无机增强增韧剂和第二无机增强增韧剂的配合,有机和无机共作用改善,能够明显改善聚氨酯发泡材料的性能,使得拼接接口处强度和韧性好,不易破损。同时,第一无机增强增韧剂和第二无机增强增韧剂能够调节产品的硬度,使得产品硬度和支撑力适中。
针对聚氨酯发泡材料的异味问题,本发明在聚氨酯发泡原料中添加海螵蛸粉,海螵蛸粉具有较强的吸附能力,与在聚氨酯发泡原料一起原位发泡,能均匀分布且将异味吸附,防止扩散。同时,海螵蛸粉的三维多孔结构,能够使得产品表面粗糙度提高且能建立吸附孔道,使得产品与地面的吸附力增强,从而防止产品在使用时容易滑动。
所述起始剂为甘油。
所述交联剂为二乙醇胺。
所述开孔剂型号为ALLCHEM 3350。
所述第一无机增强增韧剂为经硅烷偶联剂KH550处理后使用。
所述第二无机增强增韧剂为经硅烷偶联剂KH550处理后使用。
第一无机增强增韧剂、第二无机增强增韧剂采用相同的硅烷偶联剂KH550处理方法,具体为:将第一无机增强增韧剂或第二无机增强增韧剂按照1g:5-10mL的量加入到硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2-3分钟,离心甩干即可。硅烷偶联剂KH550的丙酮溶液质量浓度为3-5%。
本发明的有益效果是:高回弹,回弹率在60-65%,与地面的吸附力强,拼接接口处强度和韧性好,产品硬度和支撑力适中。
具体实施方式
下面通过具体实施例,对本发明的技术方案作进一步的具体说明。
本发明中,若非特指,所采用的原料和设备等均可从市场购得或是本领域常用的。下述实施例中的方法,如无特别说明,均为本领域的常规方法。
实施例1:
一种可拼接高回弹地垫,其原料按重量份计组成为:A组分100份,B组分30份,有机增韧剂(蚕丝蛋白)3份,第一无机增强增韧剂(四针状纳米氧化锌晶须)5份,第二无机增强增韧剂(硫酸钙晶须)1份,海螵蛸粉5份;
按重量份计,A组分的组成为:聚醚多元醇330N(市售)100份,聚合物多元醇3630(市售)8份,催化剂A33(市售)0.2份,催化剂A300(市售)0.2份,硅油0.2份,交联剂(二乙醇胺)1份,起始剂(甘油)1份,水1.5份,开孔剂(型号为ALLCHEM 3350,市售)2份,硅酮表面活性剂(市售)1份;
按重量百分比计,B组分的组成为:二苯甲烷二异氰酸酯55%,2,6-二氟苯甲酰异氰酸酯45%。
所述第一无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第一无机增强增韧剂按照1g:5mL的量加入到质量浓度为3%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2分钟,离心甩干即可。所述第二无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第二无机增强增韧剂按照1g:5mL的量加入到质量浓度为3%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2分钟,离心甩干即可。
实施例2:
一种可拼接高回弹地垫,其原料按重量份计组成为:A组分100份,B组分40份,有机增韧剂(蚕丝蛋白)8份,第一无机增强增韧剂(四针状纳米氧化锌晶须)3份,第二无机增强增韧剂(硫酸钙晶须)3份,海螵蛸粉10份;
按重量份计,A组分的组成为:聚醚多元醇330N(市售)100份,聚合物多元醇3630(市售)12份,催化剂A33(市售)0.3份,催化剂A300(市售)0.3份,硅油0.3份,交联剂(二乙醇胺)1.2份,起始剂(甘油)1.5份,水2份,开孔剂(型号为ALLCHEM 3350,市售)2.3份,硅酮表面活性剂(市售)1.2份;
按重量百分比计,B组分的组成为:二苯甲烷二异氰酸酯65%,2,6-二氟苯甲酰异氰酸酯35%。
所述第一无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第一无机增强增韧剂按照1g:10mL的量加入到质量浓度为5%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡3分钟,离心甩干即可。所述第二无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第二无机增强增韧剂按照1g:10mL的量加入到质量浓度为5%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡3分钟,离心甩干即可。
实施例3:
一种可拼接高回弹地垫,其原料按重量份计组成为:A组分100份,B组分35份,有机增韧剂(蚕丝蛋白)5份,第一无机增强增韧剂(四针状纳米氧化锌晶须)4份,第二无机增强增韧剂(硫酸钙晶须)2份,海螵蛸粉8份;
按重量份计,A组分的组成为:聚醚多元醇330N(市售)100份,聚合物多元醇3630(市售)10份,催化剂A33(市售)0.25份,催化剂A300(市售)0.25份,硅油0.25份,交联剂(二乙醇胺)1.1份,起始剂(甘油)1.2份,水1.8份,开孔剂(型号为ALLCHEM 3350,市售)2.1份,硅酮表面活性剂(市售)1.1份;
按重量百分比计,B组分的组成为:二苯甲烷二异氰酸酯60%,2,6-二氟苯甲酰异氰酸酯40%。
所述第一无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第一无机增强增韧剂按照1g:8mL的量加入到质量浓度为4%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2.5分钟,离心甩干即可。所述第二无机增强增韧剂为经硅烷偶联剂KH550处理后使用,将第二无机增强增韧剂按照1g:8mL的量加入到质量浓度为4%的硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2.5分钟,离心甩干即可。
制备方法如下:
(1)将A组分的各成分在100转/min下搅拌混合均匀,
(2)加入有机增韧剂、第一无机增强增韧剂、第二无机增强增韧剂及海螵蛸粉在100转/min下继续搅拌,混合均匀;
(3)将B组分的各成分在85转/min下搅拌混合均匀;
(4)将步骤(2)得到的物料与B组分混合均匀,控制温度70℃,反应8-10分钟即可。
地垫的厚度规格可选择2.5cm、3cm、3.5cm、4cm、4.5cm、5cm,冲裁成型(如30*30cm,60*60cm)后得可拼接地垫,地垫表面还可印制各种图案和花纹等。
对比例,采用实施例3的工艺,与实施例3的区别在于未加入有机增韧剂、第一无机增强增韧剂及第二无机增强增韧剂。实施例1-3的产品与对比例的产品的检测数据见下表:
以上所述的实施例只是本发明的一种较佳的方案,并非对本发明作任何形式上的限制,在不超出权利要求所记载的技术方案的前提下还有其它的变体及改型。
Claims (4)
1.一种可拼接高回弹地垫,其特征在于,其原料按重量份计组成为: A组分100份,B组分30-40份,有机增韧剂3-8份,第一无机增强增韧剂3-5份,第二无机增强增韧剂1-3份,海螵蛸粉5-10份;
按重量份计,A组分的组成为:聚醚多元醇330N 100份,聚合物多元醇3630 8-12份,催化剂A33 0.2-0.3份,催化剂A300 0.2-0.3份,硅油0.2-0.3份,交联剂1-1.2份,起始剂1-1.5份,水1.5-2份,开孔剂2-2.3份,硅酮表面活性剂1-1.2份;
按重量百分比计,B组分的组成为:二苯甲烷二异氰酸酯55-65%,2,6-二氟苯甲酰异氰酸酯35-45%;
所述有机增韧剂为蚕丝蛋白;所述第一无机增强增韧剂为四针状纳米氧化锌晶须;所述第二无机增强增韧剂为硫酸钙晶须;
所述起始剂为甘油;所述交联剂为二乙醇胺;所述开孔剂型号为ALLCHEM 3350。
2.根据权利要求1所述的一种可拼接高回弹地垫,其特征在于:所述第一无机增强增韧剂为经硅烷偶联剂KH550处理后使用。
3.根据权利要求1所述的一种可拼接高回弹地垫,其特征在于:所述第二无机增强增韧剂为经硅烷偶联剂KH550处理后使用。
4.根据权利要求2或3所述的一种可拼接高回弹地垫,其特征在于:第一无机增强增韧剂、第二无机增强增韧剂采用相同的硅烷偶联剂KH550处理方法,具体为:将第一无机增强增韧剂或第二无机增强增韧剂按照1g:5-10mL的量加入到硅烷偶联剂KH550的丙酮溶液中,漩涡震荡2-3分钟,离心甩干即可。
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