CN111032925B - 电镀夹盘 - Google Patents

电镀夹盘 Download PDF

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CN111032925B
CN111032925B CN201780094366.1A CN201780094366A CN111032925B CN 111032925 B CN111032925 B CN 111032925B CN 201780094366 A CN201780094366 A CN 201780094366A CN 111032925 B CN111032925 B CN 111032925B
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substrate
cover plate
chuck
plating
seal
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CN111032925A (zh
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王晖
王坚
贾照伟
杨宏超
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ACM Research Shanghai Inc
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Abstract

本发明揭示了一种在电镀工艺期间用于保持基板的电镀夹盘。基板包括缺口区域(3031)及邻近缺口区域(3031)的图形区域(3032)。电镀夹盘包括盖板(3033)，该盖板(3033)被配置为遮盖基板的缺口区域(3031)，当基板被电镀时屏蔽缺口区域(3031)的电场。

Description

电镀夹盘
技术领域
本发明涉及一种在基板上沉积金属薄膜的电镀装置，更具体地，涉及一种在电镀工艺中保持基板的电镀夹盘，其能够提高基板上缺口区域附近的镀层均匀性。
背景技术
在半导体器件制造过程中，电镀是一种常用的在基板上沉积金属薄膜的方法。尤其是，在先进封装技术中，通常采用电镀在基板上形成铜柱、焊点等实现芯片基板互连，原因在于电镀具有工艺简单、成本低、易于批量生产等优点。
在晶圆级封装的批量生产中，提供的产品基板在其边缘具有缺口区域。缺口区域覆盖着光刻胶，因此缺口区域不导电，所以在电镀过程中不能够被电镀。虽然缺口区域不能被电镀对缺口区域而言并不是一个问题，但问题是缺口区域缺乏电镀会导致邻近缺口区域的图形区域过度电镀，最终导致邻近缺口区域的图形区域的镀柱高度高于目标值。
如图19A和图19B所示的两种典型的缺口区域。具体地，图19A示意了基板513具有拱形的缺口区域5131和邻近缺口区域5131的图形区域5132，图19B示意了基板713具有基本呈方形的缺口区域7131和邻近缺口区域7131的图形区域7132。在电镀过程中，由于缺口区域5131,7131不能被电镀，图形区域5132,7132的电场会增强，从而导致在图形区域5132,7132的电沉积量高于基板513,713其他图形区域的电沉积量，因此图形区域5132,7132处的镀柱高度超出了工艺要求。如图20A所示，图20A揭示了为什么邻近缺口区域的图形区域会过度电镀的基本原理。由于缺口区域2031是不导电的，在电镀过程中，电力线从与缺口区域2031相对应的虚拟阳极2001传输到邻近缺口区域2031的图形区域2032，导致图形区域2032的过度电镀。
发明内容
因此，本发明的主旨是提供一种在电镀工艺中用于保持基板的电镀夹盘。基板包括缺口区域和邻近缺口区域的图形区域。电镀夹盘包括盖板，该盖板被配置为遮盖基板的缺口区域，以在基板被电镀时屏蔽缺口区域的电场。
在电镀过程中，本发明利用盖板来遮盖基板的缺口区域，因此，与缺口区域相对应的虚拟阳极的电力线被屏蔽，减弱了对邻近缺口区域的图形区域的影响，因此，进一步降低了邻近缺口区域的图形区域的镀层厚度，提高了基板镀层的均匀性。较佳地，盖板也遮盖部分邻近缺口区域的图形区域，来减弱邻近缺口区域的图形区域的电场，进而降低邻近缺口区域的图形区域的镀层厚度。
附图说明
图1揭示了本发明用于保持基板的装置的透视图。
图2揭示了本发明保持基板的装置的顶视图。
图3揭示了图2中沿A-A的剖视图。
图4揭示了图3中D部位的局部放大图。
图5揭示了图4中H部位的局部放大图。
图6揭示了装置的杯形夹盘、接触环和密封件的爆炸图。
图7揭示了装置的密封件的透视图。
图8揭示了密封件的顶视图。
图9揭示了图8中沿B-B的剖视图。
图10揭示了图9中F部位的局部放大图。
图11揭示了装置的接触环的剖视图。
图12揭示了图11中G部位的局部放大图。
图13揭示了本发明的另一实施例的压板和导电环的透视图。
图14揭示了压板和导电环的顶视图。
图15揭示了图14中沿C-C的剖视图。
图16揭示了图15中J部位的局部放大图。
图17a-17f揭示了各种形状的基板。
图18揭示了疏水性的基本原理。
图19A及图19B揭示了两种典型的缺口区域。
图20A揭示了在现有技术中为什么邻近缺口区域的图形区域会被过度电镀的基本原理。
图20B揭示了本发明的基本原理。
图21揭示了效果对比图。
图22揭示了根据本发明一实施例的电镀夹盘的底视图。
图23揭示了电镀夹盘的剖视图。
图24揭示了图23的局部放大图。
图25揭示了电镀夹盘的护罩的透视图。
图26揭示了根据本发明的另一实施例的护罩的透视图。
图27揭示了根据本发明的另一实施例的密封件的透视图。
图28揭示了图27所示的密封件的剖视图。
图29揭示了图28的局部放大图。
图30揭示了根据本发明的又一实施例的密封件的透视图。
图31揭示了图30所示的密封件的剖视图。
图32揭示了图31的局部放大图。
图33A至图33H揭示了本发明的各种形状的盖板。
具体实施方式
本发明提出了一种在基板处理过程中固持基板的基板保持装置，例如，将基板浸没在电解液中电镀。当基板浸没在电解液中以在基板的正面电镀金属层时，基板正面的边缘和基板背面需要被保护，避免接触到电解液。因此，与现有技术的区别在于，当基板浸没在电解液中电镀时，本发明的基板保持装置利用密封件来阻止电解液接触基板正面的边缘和基板背面，且该密封件是可替换的。
参考图1至图6所示，为本发明的基板保持装置100。该基板保持装置100包括杯形夹盘101和夹盘板102。杯形夹盘101包括杯形的基部1011，基部1011围成穿透的接收空间1012。基部1011具有底壁、侧壁的外表面和侧壁的内表面。基部1011的侧壁的内表面是倾斜的，有利于装载基板113。基部1011的上端向外延伸形成边沿1013。基部1011的侧壁的内表面倾斜的向上突出形成支撑部1014，该支撑部1014位于基部1011的下端。当基板113被放入接收空间1012内时，支撑部1014承载基板113。基部1011的下端开设有凹槽1015。杯形夹盘101由金属或碳化纤维材料制成，如不锈钢、钛、钽、铝合金等。
夹盘板102通过万向轴105与竖直驱动装置103相连。竖直驱动装置103驱动夹盘板102上升或下降。当基板113装载到接收空间1012并由支撑部1014支撑时，竖直驱动装置103驱动夹盘板102下降并压在基板113的背面，因此，基板113被杯形夹盘101和夹盘板102夹持。基板113的正面裸露以便进行工艺加工。工艺结束后，竖直驱动装置103驱动夹盘板102上升，夹盘板102离开基板113的背面，然后基板113从接收空间1012中取出。竖直驱动装置103可以是汽缸或马达。夹盘板102与基板113背面接触的一面设有多个狭槽1021，当夹盘板102离开基板113的背面时，空气很容易通过狭槽1021进入夹盘板102和基板113背面之间的空间，从而使基板113能轻易脱离夹盘板102。为了使基板113更容易的脱离夹盘板102，可以通过设置在万向轴105内的气体管道107向基板113的背面通氮气。夹盘板102由聚丙烯(PP)、聚偏二氟乙烯(PVDF)、聚醚醚酮(PEEK)或聚对苯二甲酸乙二醇酯(PET)等材料制成。
夹盘板102和杯形夹盘101之间设有O型密封圈108，当夹盘板102在竖直驱动装置103的驱动下下降以夹持基板113时，O型密封圈108起到缓冲作用。除此以外，当基板113浸入电解液中电镀时，O型密封圈108可以阻止电解液进入接收空间1012。为了满足不同工艺需求，该基板保持装置100还包括角度控制驱动装置104和旋转驱动装置106。当夹盘板102和杯形夹盘101固定基板113以进行工艺加工时，角度控制驱动装置104驱动夹盘板102和杯形夹盘101倾斜一角度。当夹盘板102和杯形夹盘101固定基板113以进行工艺加工时，旋转驱动装置106驱动夹盘板102和杯形夹盘101旋转。
参考图7至图10所示，示意了基板保持装置100的密封件111。密封件111包括底部1111、外壁1112和内壁1114。外壁1112的顶端设有突起1113。内壁1114弯曲形成唇形密封部1115。内壁1114与唇形密封部1115相连的末端水平延伸形成固定部1116。密封件111包裹杯形夹盘101。具体地，如图4和图5所示，密封件111的底部1111包裹杯形夹盘101基部1011的底壁，密封件111的外壁1112包裹杯形夹盘101基部1011的侧壁的外表面，唇形密封部1115包裹杯形夹盘101的支撑部1014。密封件111的固定部1116位于杯形夹盘101的凹槽1015内。为了将密封件111和杯形夹盘101固定在一起，杯形夹盘101的边沿1013的底部设有固定环109。固定环109挤压密封件111的突起1113，然后通过多个螺丝110将固定环109固定在杯形夹盘101边沿1013的底部。密封件111的厚度为0.1mm-2mm，较佳为0.3mm-1mm。在湿法工艺过程中，密封件111的唇形密封部1115密封基板113正面的边缘，使化学液体无法接触到基板113正面的边缘和基板113的背面。因此，湿法工艺完成后，基板113正面的边缘和基板113的背面是干的。除此以外，由于密封件111包裹杯形夹盘101，密封件111保护杯形夹盘101并防止杯形夹盘101接触到化学液体，避免杯形夹盘101被化学液体腐蚀。有了密封件111的保护，该基板保持装置100承载的基板113可以浸没到化学液体中加工，如电镀。为了避免化学液体腐蚀固定环109和螺丝110，化学液体的液面低于固定环109。
密封件111为一体成型，制成密封件111的材料可以是橡胶，如氟橡胶、硅橡胶、丁腈橡胶。制成密封件111的材料还可以是塑料，如聚四氟乙烯。用来制造密封件111的材料是柔软的并具有一定硬度，材料的硬度为硬度计检测出的20-70，较佳为40-60。制成密封件111的材料具有疏水性，并且材料表面粗糙度Ra<8μm。如图18所示，当液滴301和基板313之间的接触角Ф大于90°，则基板313具有疏水性，接触角Ф与材料表面粗糙度有关。当材料表面粗糙度增加，则接触角Ф变小。如果材料表面过于粗糙，大于8μm，那么密封效果会变差。因此，为了达到良好的密封效果，材料表面粗糙度最好小于5μm。
密封件111的内壁1114相对于水平面倾斜有一定角度α，α小于90°。当基板113需要被浸入电解液中电镀时，该基板保持装置100承载基板113，然后基板保持装置100从装载或卸载位置移动到工艺位置。基板113完全浸没在电解液中。在电镀过程中，基板保持装置100旋转，转速为3-200rpm。在基板113浸入电解液的过程中，空气可以顺着密封件111的内壁1114排出。另一方面，在电镀过程中，基板113正面会产生氢气，气泡也能顺着密封件111的内壁1114排出，否则，空气或气泡会引起沉积的金属存在空洞的问题。
当使用该基板保持装置100在基板113正面电镀金属层时，接触环112用来传导电流。如图11和图12所示，接触环112包括主体部1121、多个第一指形部1122和多个第二指形部1123。为了安装接触环112，杯形夹盘101基部1011的下端为可拆卸的。为了更清楚地说明，在本文中，杯形夹盘101基部1011的下端被命名为底座。底座的底部设有多个第一螺孔1016，接触环112的主体部1121设有多个第二螺孔1124。多个螺丝114穿过第一螺孔1016和第二螺孔1124将接触环112的主体部1121、杯形夹盘101的底座与杯形夹盘101的基部1011固定在一起。多个第一指形部1122接触基板113正面边缘处的种子层，且接触点位于距基板113的外边缘小于2mm处。在电镀过程中，基板113与电源电极相连，通过接触环112传导电流。杯形夹盘101由导电材料制成以传导电流。多个第二指形部1123紧压密封件111的固定部1116，将密封件111的固定部1116固定在杯形夹盘101的凹槽1015内，避免密封件111从杯形夹盘101上脱落。第一指形部1122和第二指形部1123交替设置。对于300mm的基板来说，第一指形部1122的数量应该不小于200个。如果第一指形部1122的数量太少，会导致基板113上的电流分布不均匀，进而导致基板113上的沉积速率不均匀。接触环112由导电材料制成，例如不锈钢、铜、钛、铱、钽、金、银、铂金和其他类似合金。接触环112也可以由具有铂金涂层或金涂层的不锈钢、钛、钽、铝制成。接触环112还可以由其他高导电性的材料制成。较佳的，接触环112由弹簧钢制成。
如图17a-17f所示，基板113的形状可以是圆形、椭圆形、三角形、正方形、长方形、八边形等。相应的，杯形夹盘101和夹盘板102设计成与基板113相匹配的形状。
为了装配密封件111和接触环112，首先，从杯形夹盘101的基部1011上拆下基座，然后密封件111的唇形密封部1115包裹杯形夹盘101的支撑部1014，且密封件111的固定部1116位于杯形夹盘101的凹槽1015内。使用多个螺丝将接触环112的主体部1121固定在杯形夹盘101的底座上，接触环112的第二指形部1123将密封件111的固定部1116紧压在杯形夹盘101的凹槽1015内。然后，多个螺丝114穿过杯形夹盘101上的第一螺孔1016和接触环112上的第二螺孔1124以将基座和杯形夹盘101的基部1011固定在一起。随后，密封件111的底部1111和外壁1112分别包裹杯形夹盘101基部1011的底壁和侧壁的外表面。最后，固定环109通过多个螺丝110固定在杯形夹盘101的边沿1013的底部，且固定环109紧压密封件111的突起1113。
使用该基板保持装置100进行电镀工艺包括以下步骤：
步骤1：将基板保持装置100移动到装载或卸载位置。
步骤2：竖直驱动装置103驱动夹盘板102上升。
步骤3：将基板113装载在密封件111的唇形密封部1115上，基板113正面朝下裸露出来。
步骤4：竖直驱动装置103驱动夹盘板102下降夹持基板113，密封件111的唇形密封部1115密封基板113正面的边缘，接触环112的多个第一指形部1112接触基板113正面边缘处的种子层。
步骤5：角度控制驱动装置104驱动夹盘板102和杯形夹盘101倾斜一定角度。
步骤6：旋转驱动装置106驱动夹盘板102和杯形夹盘101以预设的旋转速度转动，同时，基板保持装置100移动到工艺位置，在工艺位置，基板113浸没在电解液中。
步骤7：角度控制驱动装置104驱动夹盘板102和杯形夹盘101转动，使夹盘板102和杯形夹盘101保持垂直状态。
步骤8：打开电源，在基板113的正面电镀金属层。
步骤9：电镀工艺完成后，基板保持装置100移动到冲洗位置，然后高速旋转，将基板113表面的电解液冲洗掉。
步骤10：基板保持装置100移动到卸载位置，向基板113的背面通氮气，竖直驱动装置103驱动夹盘板102上升，然后将基板113从密封件111的唇形密封部1115上取走。
综上所述，本发明的基板保持装置100利用密封件111包裹杯形夹盘101，当使用该基板保持装置100固持基板113并将基板113浸没在电解液中电镀时，密封件111保护基板113正面的边缘、基板113的背面和杯形夹盘101内的接触环112，避免基板113正面的边缘、基板113的背面和杯形夹盘101内的接触环112接触电解液。密封件111是柔软的，且制成杯形夹盘101的材料的硬度比密封件111的硬度高，当密封件111包裹杯形夹盘101时，杯形夹盘101不会变形。因此，夹持基板113后，密封件111轻柔地密封基板表面而不会对基板表面造成损伤。密封件111具有良好的密封效果。此外，密封件111的厚度较厚，因此，密封件111的使用寿命长。另外，在该基板保持装置100使用一段时间后，只需要更换接触环112和密封件111，基板保持装置100的其他部件都不需要更换，降低了生产成本。
如图13至图16所示，在另一个具体实施方式中，提供了传导电流的导电环201和固定密封件111的压板202。导电环201和压板202组合后的功能与接触环112的功能相同，因此，导电环201和压板202的组合可以代替接触环112。当进行化学镀层时，可以省略导电环201。导电环201包括多个接触基板113正面边缘的指形部2011，压板202具有与导电环201的指形部2011相匹配的斜坡2021。为了安装密封件111，首先，从杯形夹盘101的基部1011上拆下底座，然后，密封件111的唇形密封部1115包裹杯形夹盘101的支撑部1014，密封件111的固定部1116位于杯形夹盘101的凹槽1015内。第一组螺丝将压板202和杯形夹盘101的底座固定在一起，压板202将密封件111的固定部1116固定在杯形夹盘101的凹槽1015内。然后，第二组螺丝将杯形夹盘101的底座、压板202和导电环201与杯形夹盘101的基部1011固定。随后，密封件111的底部1111和外壁1112分别包裹杯形夹盘101基部1011的底壁和侧壁的外表面。最后，固定环109通过多个螺丝110固定在杯形夹盘101边沿1013的底部，固定环109紧压密封件111的突起1113。
参考图20B所示，图20B揭示了本发明的基本原理。为了提高基板缺口区域附近镀层的均匀性，盖板被配置为遮盖基板的缺口区域，在基板进行电镀时屏蔽缺口区域的电场。如图20B所示，在电镀过程中，因为盖板3033被配置为遮盖基板的缺口区域3031，与缺口区域3031相对应的虚拟阳极3001发出的电力线被屏蔽，减弱了对邻近缺口区域3031的图形区域3032的影响，因此，降低了邻近缺口区域3031的图形区域3032的镀层的厚度，提高了基板镀层的均匀性。较佳地，盖板3033也遮盖部分邻近缺口区域3031的图形区域3032，来减弱图形区域3032的电场，进而降低图形区域3032的镀层的厚度。参考图21所示，图21是效果对比图。在图21中，线1对应的是没有缺口区域的基板的电镀数据，这样整个基板在电镀过程中被电镀。没有缺口区域的整个基板的镀柱高度是均匀的。线2对应的是有缺口区域的基板但是在电镀过程中没有盖板遮盖缺口区域的电镀数据。在邻近缺口区域的图形区域的镀柱高度逐渐增高。线3对应的是有缺口区域的基板且在电镀过程中有盖板遮盖缺口区域的电镀数据。邻近缺口区域的图形区域的镀柱高度降低至趋近线1。从图21中可以知道，有盖板的电镀效果明显优于没有盖板的电镀效果。
参考图22至图25所示，揭示了根据本发明的一个实施例的电镀夹盘。电镀夹盘200与装置100相类似，电镀夹盘200与装置100之间的主要区别是电镀夹盘200包括护罩2040。电镀夹盘200与装置100相类似的结构以下将不再详细描述。接下来将主要介绍护罩2040。
如图25所示，护罩2040具有底壁2041、从底壁2041向上延伸的侧壁2042、从侧壁2042顶部向外延伸的顶壁2043。底壁2041水平突出形成盖板2044。在一个实施例中，在盖板2044上设有开口2045。开口2045是一个狭长的切口。开口2045靠近底壁2041。护罩2040可以由塑料、橡胶或者具有绝缘涂层的金属制成。
在组装时，护罩2040的底壁2041紧贴着密封件111的底部1111且包裹部分密封件111的底部1111，例如包裹大约三分之二的密封件111的底部1111.护罩2040的侧壁2042紧贴着密封件111的外壁1112。护罩2040的顶壁2043紧贴着杯形夹盘101的边沿1013并通过多个如螺丝钉的固定件固定在杯形夹盘101的边沿1013。采取这种方式，护罩2040的顶壁2043能够取代固定环109来挤压密封件111的突起1113，进而固定密封件111。因此，在该实施例中，固定环109可以取消。护罩2040的盖板2044被配置为遮盖基板213的缺口区域，电镀夹盘200保持基板213以进行电镀工艺。基板213与护罩2040的盖板2044之间存在一定距离，该距离大于盖板2044的形变量，以避免盖板2044接触到基板213。该距离在0.5mm至8mm，较佳地为4mm。
电镀时，护罩2040的盖板2044遮盖基板213的缺口区域，因此来自虚拟阳极的且对应基板213的缺口区域的电力线被屏蔽，减弱了对邻近基板213的缺口区域的图形区域的影响，因此，进一步降低了邻近基板213的缺口区域的图形区域的镀层厚度，提高了基板213上镀层的均匀性。较佳地，护罩2040的盖板2044也遮盖部分邻近缺口区域的图形区域来减弱图形区域的电场，以此来减少图形区域的镀层厚度。基板213和护罩2040的盖板2044之间的电镀液通过护罩2040的开口2045形成流动的电镀液。由于电镀夹盘200具有盖板2044来遮盖基板213的缺口区域，在电镀工艺中，具有盖板2044的护罩2040随着电镀夹盘200一起旋转。保持基板213的电镀夹盘200在基板进行电镀加工中以恒速或非恒速旋转，电镀效果将不会被影响。
参考图26所示，揭示了根据本发明另一实施例的护罩2640。护罩2640包括底壁2641、从底壁2641向上延伸的侧壁2642、从侧壁2642的顶部向外延伸的顶壁2643。底壁2641水平突出形成盖板2644。在该实施例中，盖板2644上设有多个孔2645。护罩2640的盖板2644在基板电镀过程中遮盖基板的缺口区域。较佳地，护罩2640的盖板2644也遮盖部分邻近基板的缺口区域的图形区域。基板和护罩2640的盖板2644之间的电镀液通过护罩2640上的多个孔2645形成流动的电镀液。护罩2640可以由塑料、橡胶或者具有绝缘涂层的金属制成。
参考图27至图29所示，揭示了本发明的另一实施例。揭示了电镀夹盘的密封件2711。密封件2711包括底部27111、外壁27112及内壁27114。外壁27112的顶端设有突起27113。内壁27114弯曲形成唇形密封部27115。内壁27114与唇形密封部27115相连的末端水平延伸形成固定部27116。内壁27114水平突出形成盖板27117。在该实施例中，盖板27117上设有开口27118。开口27118是一个狭长的切口。开口27118靠近内壁27114。也有其他方法可以形成盖板27117。所需形状的盖板27117可以用胶水水平固定在内壁27114上。在电镀过程中，盖板27117遮盖基板的缺口区域。较佳地，盖板27117也遮盖部分邻近基板缺口区域的图形区域。基板和盖板27117之间的电镀液通过开口27118形成流动的电镀液。
参考图30至图32所示，揭示了本发明的又一实施例。揭示了电镀夹盘的密封件3011。密封件3011包括底部30111、外壁30112及内壁30114。外壁30112的顶端设有突起30113。内壁30114弯曲形成唇形密封部30115。内壁30114与唇形密封部30115相连的末端水平延伸形成固定部30116。内壁30114水平突出形成盖板30117。在该实施例中，盖板30117上设有多个孔30118。在电镀过程中，盖板30117遮盖基板的缺口区域。较佳地，盖板30117也遮盖部分邻近基板缺口区域的图形区域。基板和盖板30117之间的电镀液通过该多个孔30118形成流动的电镀液。
参考图33A至图33H所示，揭示了不同形状的盖板。在这些图示中，黑色部分分别表示盖板。从这些图示中可以看出盖板是可以关于穿过基板中心和基板缺口的轴对称或不对称。盖板上离基板缺口区域较远的边为直线或弧线，盖板上离基板缺口区域较近的边为直线或折线或弧线。盖板的形状根据缺口的形状来调整。
由于本发明采用盖板遮盖基板的缺口区域，在电镀过程中，盖板随着电镀夹盘一起转动。保持基板的电镀夹盘在电镀过程中以匀速或非匀速转动，且电镀效果将不会被影响。
综上所述，本发明通过上述实施方式及相关图式说明，己具体、详实的揭露了相关技术，使本领域的技术人员可以据以实施。而以上所述实施例只是用来说明本发明，而不是用来限制本发明的，本发明的权利范围，应由本发明的权利要求来界定。至于本文中所述元件数目的改变或等效元件的代替等仍都应属于本发明的权利范围。

Claims (13)

1.一种用于保持基板的电镀夹盘，该基板包括缺口区域及邻近缺口区域的图形区域，其特征在于，电镀夹盘包括：
盖板，被配置为遮盖基板的缺口区域，当基板被电镀时屏蔽缺口区域的电场，所述缺口区域覆盖光刻胶且不被电镀。
2.根据权利要求1所述的电镀夹盘，其特征在于，所述盖板遮盖部分邻近基板缺口区域的图形区域。
3.根据权利要求1所述的电镀夹盘，其特征在于，进一步包括护罩，该护罩包括底壁、从底壁向上延伸的侧壁及从侧壁顶部向外延伸的顶壁，底壁水平突出形成盖板。
4.根据权利要求3所述的电镀夹盘，其特征在于，所述盖板上设有开口。
5.根据权利要求3所述的电镀夹盘，其特征在于，所述盖板上设有多个孔。
6.根据权利要求1所述的电镀夹盘，其特征在于，进一步包括密封件，密封件包括底部、外壁及内壁，内壁弯曲形成唇形密封部，内壁水平突出形成盖板。
7.根据权利要求6所述的电镀夹盘，其特征在于，所述盖板上设有开口。
8.根据权利要求6所述的电镀夹盘，其特征在于，所述盖板上设有多个孔。
9.根据权利要求1所述的电镀夹盘，其特征在于，所述盖板的形状根据缺口区域的形状调整。
10.根据权利要求1所述的电镀夹盘，其特征在于，所述盖板上离基板缺口区域较远的边为直线或弧线，盖板上离基板缺口区域较近的边为直线、折线或弧线。
11.根据权利要求1所述的电镀夹盘，其特征在于，所述盖板关于通过基板中心及基板缺口的轴对称或不对称。
12.根据权利要求1所述的电镀夹盘，其特征在于，基板与盖板之间存在一定距离，该距离大于盖板的形变量，以避免盖板接触到基板。
13.根据权利要求1所述的电镀夹盘，其特征在于，所述盖板的材料是塑料、橡胶、具有绝缘涂层的金属。
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