CN110952077B - 金属膜形成方法 - Google Patents
金属膜形成方法 Download PDFInfo
- Publication number
- CN110952077B CN110952077B CN201911347903.6A CN201911347903A CN110952077B CN 110952077 B CN110952077 B CN 110952077B CN 201911347903 A CN201911347903 A CN 201911347903A CN 110952077 B CN110952077 B CN 110952077B
- Authority
- CN
- China
- Prior art keywords
- metal film
- forming
- metal
- carrier gas
- mist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/25—Metals
- C03C2217/251—Al, Cu, Mg or noble metals
- C03C2217/253—Cu
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/112—Deposition methods from solutions or suspensions by spraying
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Vapour Deposition (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-176648 | 2014-08-29 | ||
| JP2014176648 | 2014-08-29 | ||
| JP2015108025A JP6945120B2 (ja) | 2014-08-29 | 2015-05-27 | 金属膜形成方法 |
| JP2015-108025 | 2015-05-27 | ||
| CN201510540239.2A CN105386008B (zh) | 2014-08-29 | 2015-08-28 | 金属膜形成方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510540239.2A Division CN105386008B (zh) | 2014-08-29 | 2015-08-28 | 金属膜形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110952077A CN110952077A (zh) | 2020-04-03 |
| CN110952077B true CN110952077B (zh) | 2022-09-13 |
Family
ID=54251921
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911347903.6A Active CN110952077B (zh) | 2014-08-29 | 2015-08-28 | 金属膜形成方法 |
| CN201510540239.2A Active CN105386008B (zh) | 2014-08-29 | 2015-08-28 | 金属膜形成方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510540239.2A Active CN105386008B (zh) | 2014-08-29 | 2015-08-28 | 金属膜形成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9828694B2 (https=) |
| EP (1) | EP2990503B1 (https=) |
| JP (1) | JP6945120B2 (https=) |
| KR (1) | KR101807544B1 (https=) |
| CN (2) | CN110952077B (https=) |
| TW (1) | TWI597381B (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017154937A1 (ja) * | 2016-03-11 | 2017-09-14 | 株式会社ニコン | ミスト発生装置、成膜装置、ミスト発生方法、成膜方法、および、デバイス製造方法 |
| CN107371338B (zh) * | 2016-05-13 | 2019-08-20 | 苏州卫鹏机电科技有限公司 | 一种超薄金属层的印刷线路板的制备方法 |
| WO2018004009A1 (ja) | 2016-06-30 | 2018-01-04 | 株式会社Flosfia | p型酸化物半導体及びその製造方法 |
| CN109417037B (zh) | 2016-06-30 | 2024-03-15 | 株式会社Flosfia | 氧化物半导体膜及其制造方法 |
| JP2018019052A (ja) * | 2016-07-30 | 2018-02-01 | 株式会社Flosfia | インダクタの製造方法 |
| JP2018019050A (ja) * | 2016-07-30 | 2018-02-01 | 株式会社Flosfia | 抵抗体の製造方法 |
| JP6879483B2 (ja) * | 2016-07-30 | 2021-06-02 | 株式会社Flosfia | コンデンサの製造方法 |
| JP7064723B2 (ja) * | 2017-03-31 | 2022-05-11 | 株式会社Flosfia | 成膜方法 |
| CN109628910B (zh) | 2017-10-07 | 2023-06-30 | 株式会社Flosfia | 形成膜的方法 |
| JP2019119931A (ja) * | 2017-12-29 | 2019-07-22 | 株式会社Flosfia | 処理方法 |
| JP6875336B2 (ja) * | 2018-08-27 | 2021-05-26 | 信越化学工業株式会社 | 成膜方法 |
| JP7031564B2 (ja) * | 2018-11-14 | 2022-03-08 | トヨタ自動車株式会社 | 燃料電池用セパレータの製造方法 |
| JP2020092125A (ja) * | 2018-12-03 | 2020-06-11 | トヨタ自動車株式会社 | 成膜装置 |
| CN110318021B (zh) * | 2019-07-26 | 2020-08-25 | 中国科学技术大学 | 一种晶圆级二氧化钒薄膜的制备方法 |
| JP7261410B2 (ja) * | 2019-09-02 | 2023-04-20 | 信越化学工業株式会社 | 金属膜形成方法 |
| US11244803B2 (en) | 2020-01-23 | 2022-02-08 | Hitachi High-Tech Corporation | Plasma processing apparatus and operating method of plasma processing apparatus |
| CN111364020B (zh) * | 2020-04-10 | 2022-01-28 | 南昌航空大学 | 一种气溶胶传输辅助装置及输送方法 |
| JP7380432B2 (ja) * | 2020-06-02 | 2023-11-15 | 株式会社ニコン | ミスト発生装置、薄膜製造装置、及び薄膜製造方法 |
| US12434257B2 (en) * | 2020-08-05 | 2025-10-07 | Shin-Etsu Chemical Co., Ltd. | Film-forming atomizer, film-forming apparatus, and film-forming method |
| CN112813406B (zh) * | 2020-12-30 | 2023-07-14 | 武汉工程大学 | 基于cvd技术在异形件表面制备三维金属单质薄膜的设备及方法 |
| TWI911390B (zh) * | 2021-03-02 | 2026-01-11 | 日商信越化學工業股份有限公司 | 製膜方法及製膜裝置 |
| KR102726925B1 (ko) * | 2022-08-25 | 2024-11-11 | 한국표준과학연구원 | 에어로졸 촉매를 이용하여 2차원 나노소재의 결정립을 조절하는 방법 |
| CN115894392B (zh) * | 2022-12-02 | 2024-11-12 | 中国科学院福建物质结构研究所 | (c3h8n6i6)·3h2o化合物、双折射晶体及其制法和用途 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5034372A (en) * | 1987-12-07 | 1991-07-23 | Mitsubishi Denki Kabushiki Kaisha | Plasma based method for production of superconductive oxide layers |
| EP0848658B1 (en) * | 1995-08-04 | 2006-10-11 | nGimat Co. | Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions |
| US6010969A (en) * | 1996-10-02 | 2000-01-04 | Micron Technology, Inc. | Method of depositing films on semiconductor devices by using carboxylate complexes |
| US6482374B1 (en) | 1999-06-16 | 2002-11-19 | Nanogram Corporation | Methods for producing lithium metal oxide particles |
| KR100460746B1 (ko) * | 1999-04-13 | 2004-12-09 | 주식회사 하이닉스반도체 | 반도체 소자의 구리 금속 배선 형성 방법 |
| JP3638487B2 (ja) | 1999-12-10 | 2005-04-13 | 株式会社荏原製作所 | 半導体素子の実装方法 |
| JP4781571B2 (ja) * | 2001-07-31 | 2011-09-28 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| WO2003032084A2 (en) | 2001-10-05 | 2003-04-17 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| JP2004277585A (ja) | 2003-03-17 | 2004-10-07 | Canon Inc | 有機顔料分散体製造方法および有機顔料分散体、水性着色液ならびにインクジェット記録用液 |
| DE102004001095A1 (de) * | 2004-01-05 | 2005-07-28 | Blue Membranes Gmbh | Hochfrequenzzerstäubungsvorrichtung |
| JP4841338B2 (ja) * | 2005-07-14 | 2011-12-21 | 株式会社野田スクリーン | 成膜方法、および装置 |
| CN101351868B (zh) * | 2005-12-29 | 2013-03-13 | 3M创新有限公司 | 使用涂覆工艺雾化材料的方法 |
| US8801971B2 (en) | 2007-12-18 | 2014-08-12 | Hitachi Chemical Company, Ltd. | Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution |
| JP2009167522A (ja) * | 2007-12-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 銅膜の形成方法 |
| KR100976264B1 (ko) | 2008-03-31 | 2010-08-18 | 주식회사 잉크테크 | 금속 박막 형성 장치 및 이를 이용한 금속 박막 형성 방법 |
| US20150004326A1 (en) * | 2008-05-07 | 2015-01-01 | Isaiah O. Oladeji | Apparatus and method for depositing alkali metals |
| US20110151619A1 (en) * | 2008-09-24 | 2011-06-23 | Toshiba Mitsubishi-Electric Industrial Sys. Corp. | Method of forming metal oxide film and apparatus for forming metal oxide film |
| JP5659495B2 (ja) | 2010-01-26 | 2015-01-28 | 三菱マテリアル株式会社 | 電極又は配線パターンの形成方法 |
| DE112010005624T5 (de) * | 2010-06-01 | 2013-03-21 | Kyoto University | Anlage zur Bildung eines Metalloxidfilmes, Verfahren zur Bildung eines Metalloxidfilmes und Metalloxidfilm |
| JP2013129887A (ja) | 2011-12-22 | 2013-07-04 | Nitto Denko Corp | 複合電極の形成方法 |
| JP5343224B1 (ja) * | 2012-09-28 | 2013-11-13 | Roca株式会社 | 半導体装置および結晶 |
| MX374974B (es) * | 2012-10-12 | 2025-03-06 | Vitro Vidrio Y Cristal S A De C V | Un recubrimiento con propiedades de control solar para un substrato y, un metodo y sistema para depositar dicho recubrimiento sobre el substrato. |
-
2015
- 2015-05-27 JP JP2015108025A patent/JP6945120B2/ja active Active
- 2015-08-27 US US14/838,126 patent/US9828694B2/en not_active Expired - Fee Related
- 2015-08-27 KR KR1020150121117A patent/KR101807544B1/ko active Active
- 2015-08-27 TW TW104128055A patent/TWI597381B/zh active
- 2015-08-27 EP EP15182652.6A patent/EP2990503B1/en active Active
- 2015-08-28 CN CN201911347903.6A patent/CN110952077B/zh active Active
- 2015-08-28 CN CN201510540239.2A patent/CN105386008B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201608048A (zh) | 2016-03-01 |
| EP2990503B1 (en) | 2022-01-12 |
| CN105386008A (zh) | 2016-03-09 |
| CN110952077A (zh) | 2020-04-03 |
| JP2016050357A (ja) | 2016-04-11 |
| KR20160026761A (ko) | 2016-03-09 |
| US9828694B2 (en) | 2017-11-28 |
| JP6945120B2 (ja) | 2021-10-06 |
| EP2990503A1 (en) | 2016-03-02 |
| CN105386008B (zh) | 2020-01-21 |
| US20160060788A1 (en) | 2016-03-03 |
| TWI597381B (zh) | 2017-09-01 |
| KR101807544B1 (ko) | 2017-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110952077B (zh) | 金属膜形成方法 | |
| JP2016146442A (ja) | 成膜装置および成膜方法 | |
| JP7014355B2 (ja) | 積層構造体および半導体装置 | |
| KR102775972B1 (ko) | 갈륨 전구체의 제조 방법 및 이것을 사용한 적층체의 제조 방법 | |
| JP2018060992A (ja) | 半導体装置 | |
| JP2021009880A (ja) | エッチング処理方法およびエッチング処理装置 | |
| JP7731995B2 (ja) | 成膜方法及び成膜装置 | |
| JP7240654B2 (ja) | 金属膜形成方法 | |
| JP2025102965A (ja) | 積層構造体、半導体装置及び下地基板 | |
| JP6547930B2 (ja) | 金属膜形成方法 | |
| JP6999106B2 (ja) | 半導体装置 | |
| TW202332813A (zh) | 積層體的製造方法、積層體的製造裝置、積層體以及半導體裝置 | |
| JP6533982B2 (ja) | 量子井戸構造、積層構造体および半導体装置 | |
| JP6999105B2 (ja) | 半導体装置の製造方法 | |
| JP6999103B2 (ja) | 半導体装置 | |
| TWI891832B (zh) | 成膜用摻雜原料溶液之製造方法、層積體之製造方法、成膜用摻雜原料溶液及半導體膜 | |
| JP7011207B2 (ja) | 成膜用ドーピング原料溶液の製造方法、積層体の製造方法、成膜用ドーピング原料溶液及び半導体膜 | |
| JP6849874B2 (ja) | 積層構造体の製造方法 | |
| TW202531886A (zh) | 層積體及使用此之半導體裝置以及層積體之製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |