CN110875217A - 基片处理装置和基片处理方法 - Google Patents

基片处理装置和基片处理方法 Download PDF

Info

Publication number
CN110875217A
CN110875217A CN201910789299.6A CN201910789299A CN110875217A CN 110875217 A CN110875217 A CN 110875217A CN 201910789299 A CN201910789299 A CN 201910789299A CN 110875217 A CN110875217 A CN 110875217A
Authority
CN
China
Prior art keywords
substrate
line
unit
processing apparatus
developing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910789299.6A
Other languages
English (en)
Chinese (zh)
Inventor
八寻俊一
梶原拓伸
坂井光广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN110875217A publication Critical patent/CN110875217A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
CN201910789299.6A 2018-08-30 2019-08-26 基片处理装置和基片处理方法 Pending CN110875217A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018160930A JP7232593B2 (ja) 2018-08-30 2018-08-30 基板処理装置および基板処理方法
JP2018-160930 2018-08-30

Publications (1)

Publication Number Publication Date
CN110875217A true CN110875217A (zh) 2020-03-10

Family

ID=69669221

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910789299.6A Pending CN110875217A (zh) 2018-08-30 2019-08-26 基片处理装置和基片处理方法

Country Status (3)

Country Link
JP (1) JP7232593B2 (ko)
KR (1) KR20200026084A (ko)
CN (1) CN110875217A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7405884B2 (ja) 2022-02-18 2023-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7350114B2 (ja) * 2022-03-03 2023-09-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270523A (ja) * 1997-03-21 1998-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置、並びに基板搬送装置及び基板移載装置
CN1978356A (zh) * 2005-12-05 2007-06-13 东京毅力科创株式会社 基板输送系统、基板输送装置及基板处理装置
CN101017329A (zh) * 2006-02-10 2007-08-15 东京毅力科创株式会社 基板处理系统、基板处理方法及计算机可读取的存储介质
JP2010087132A (ja) * 2008-09-30 2010-04-15 Tokyo Electron Ltd レジスト塗布現像処理システム
CN101840853A (zh) * 2009-03-13 2010-09-22 东京毅力科创株式会社 基板处理装置、基板处理方法、涂敷、显影装置、涂敷、显影方法和存储介质
CN101996867A (zh) * 2009-08-24 2011-03-30 东京毅力科创株式会社 涂敷显影装置和涂敷显影方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021735A (ja) 1998-07-07 2000-01-21 Sony Corp 塗布装置
JP4105443B2 (ja) 2002-02-04 2008-06-25 大日本スクリーン製造株式会社 基板処理装置
JP4531690B2 (ja) 2005-12-08 2010-08-25 東京エレクトロン株式会社 加熱処理装置
JP4584872B2 (ja) 2006-06-15 2010-11-24 東京エレクトロン株式会社 基板処理システムおよび基板搬送方法
KR20180024703A (ko) * 2016-08-31 2018-03-08 세메스 주식회사 기판 처리 장치 및 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270523A (ja) * 1997-03-21 1998-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置、並びに基板搬送装置及び基板移載装置
CN1978356A (zh) * 2005-12-05 2007-06-13 东京毅力科创株式会社 基板输送系统、基板输送装置及基板处理装置
CN101017329A (zh) * 2006-02-10 2007-08-15 东京毅力科创株式会社 基板处理系统、基板处理方法及计算机可读取的存储介质
JP2010087132A (ja) * 2008-09-30 2010-04-15 Tokyo Electron Ltd レジスト塗布現像処理システム
CN101840853A (zh) * 2009-03-13 2010-09-22 东京毅力科创株式会社 基板处理装置、基板处理方法、涂敷、显影装置、涂敷、显影方法和存储介质
CN101996867A (zh) * 2009-08-24 2011-03-30 东京毅力科创株式会社 涂敷显影装置和涂敷显影方法

Also Published As

Publication number Publication date
JP7232593B2 (ja) 2023-03-03
JP2020035884A (ja) 2020-03-05
KR20200026084A (ko) 2020-03-10

Similar Documents

Publication Publication Date Title
CN110875227A (zh) 基片处理装置和基片处理方法
JP4592787B2 (ja) 基板処理装置
JP4625441B2 (ja) フォト装置及び方法
WO2010150741A1 (ja) インプリントシステム、インプリント方法及びコンピュータ記憶媒体
JP4451385B2 (ja) 塗布処理装置及び塗布処理方法
JP4672538B2 (ja) 加熱処理装置
CN110875217A (zh) 基片处理装置和基片处理方法
CN111383975A (zh) 基片处理装置和基片处理方法
JP7142566B2 (ja) 基板処理装置および基板処理方法
JP5149244B2 (ja) インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
KR19980086815A (ko) 방전방법 및 방전기능을 갖는 처리장치
CN116705678B (zh) 基板处理装置以及基板处理方法
CN110610853A (zh) 基片处理装置和基片处理方法
CN116804827B (zh) 基板处理装置以及基板处理方法
CN112925178A (zh) 基片处理装置和基片处理方法
TW202013568A (zh) 基板處理裝置及基板處理方法
KR20190011682A (ko) 기판 처리 장치, 기판 처리 방법, 포토마스크 세정 방법 및 포토마스크 제조 방법
JP2023076278A (ja) 基板処理装置、および基板処理方法
KR20230124472A (ko) 기판 처리 장치 및 기판 처리 방법
JP2003309067A (ja) 塗布、現像装置及び塗布現像処理における基板再生システム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination