CN110592515A - 一种热浸镀锡铜材及其制造方法 - Google Patents
一种热浸镀锡铜材及其制造方法 Download PDFInfo
- Publication number
- CN110592515A CN110592515A CN201910942112.1A CN201910942112A CN110592515A CN 110592515 A CN110592515 A CN 110592515A CN 201910942112 A CN201910942112 A CN 201910942112A CN 110592515 A CN110592515 A CN 110592515A
- Authority
- CN
- China
- Prior art keywords
- hot
- copper
- dip
- layer
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 title claims abstract description 131
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 95
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 239000000463 material Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 28
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910018471 Cu6Sn5 Inorganic materials 0.000 claims abstract description 17
- 229910018082 Cu3Sn Inorganic materials 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000012298 atmosphere Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 abstract description 14
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- 229910052718 tin Inorganic materials 0.000 description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 20
- 238000007747 plating Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
- C21D9/54—Furnaces for treating strips or wire
- C21D9/663—Bell-type furnaces
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910942112.1A CN110592515B (zh) | 2019-09-30 | 2019-09-30 | 一种热浸镀锡铜材及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910942112.1A CN110592515B (zh) | 2019-09-30 | 2019-09-30 | 一种热浸镀锡铜材及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110592515A true CN110592515A (zh) | 2019-12-20 |
CN110592515B CN110592515B (zh) | 2022-06-17 |
Family
ID=68865263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910942112.1A Active CN110592515B (zh) | 2019-09-30 | 2019-09-30 | 一种热浸镀锡铜材及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110592515B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113061827A (zh) * | 2021-02-25 | 2021-07-02 | 宁波博威合金板带有限公司 | 一种热浸镀锡银合金涂层及其制备方法和应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0533187A (ja) * | 1991-07-25 | 1993-02-09 | Mitsui Mining & Smelting Co Ltd | スズメツキホイスカーの抑制方法 |
CN1455829A (zh) * | 2001-01-19 | 2003-11-12 | 古河电气工业株式会社 | 电镀材料及其制造方法、使用了该材料的电气电子部件 |
JP2005286240A (ja) * | 2004-03-30 | 2005-10-13 | Dowa Mining Co Ltd | 半導体装置部品およびその製造方法ならびにこれを用いた半導体装置 |
US20090236123A1 (en) * | 2008-03-24 | 2009-09-24 | Fujikura Ltd. | Plated flat conductor and flexible flat cable therewith |
CN102570109A (zh) * | 2010-12-07 | 2012-07-11 | 株式会社神户制钢所 | Pcb端子及其制造方法 |
CN107587095A (zh) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带(河南)有限公司 | 一种环保铜及铜合金板带表面热浸镀锡方法 |
CN110177904A (zh) * | 2017-01-17 | 2019-08-27 | 三菱伸铜株式会社 | 连接器用端子材料及其制造方法 |
-
2019
- 2019-09-30 CN CN201910942112.1A patent/CN110592515B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0533187A (ja) * | 1991-07-25 | 1993-02-09 | Mitsui Mining & Smelting Co Ltd | スズメツキホイスカーの抑制方法 |
CN1455829A (zh) * | 2001-01-19 | 2003-11-12 | 古河电气工业株式会社 | 电镀材料及其制造方法、使用了该材料的电气电子部件 |
JP2005286240A (ja) * | 2004-03-30 | 2005-10-13 | Dowa Mining Co Ltd | 半導体装置部品およびその製造方法ならびにこれを用いた半導体装置 |
US20090236123A1 (en) * | 2008-03-24 | 2009-09-24 | Fujikura Ltd. | Plated flat conductor and flexible flat cable therewith |
CN102570109A (zh) * | 2010-12-07 | 2012-07-11 | 株式会社神户制钢所 | Pcb端子及其制造方法 |
CN110177904A (zh) * | 2017-01-17 | 2019-08-27 | 三菱伸铜株式会社 | 连接器用端子材料及其制造方法 |
CN107587095A (zh) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带(河南)有限公司 | 一种环保铜及铜合金板带表面热浸镀锡方法 |
Non-Patent Citations (2)
Title |
---|
ANONYMOUS: ""Hot-dip tinned copper and copper alloy strip"", 《CATEGORY: BUSINESS, MANAGEMENT》 * |
N.D.MEEKS: ""Tin-rich surfaces on bronze-some experimental and archaeological considerations"", 《ARCHAEOMETRY》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113061827A (zh) * | 2021-02-25 | 2021-07-02 | 宁波博威合金板带有限公司 | 一种热浸镀锡银合金涂层及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
CN110592515B (zh) | 2022-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Lu Changjian Inventor after: Jiang Yanxu Inventor after: Shen Chaohui Inventor after: Chen Jianyong Inventor after: Liu Aikui Inventor after: Liu Dong Inventor after: Lv Gang Inventor after: Liu Guowei Inventor after: Zhang Ying Inventor after: Duan Guangchao Inventor after: Wang Shizhong Inventor after: Zhao Hongsheng Inventor before: Lu Changjian Inventor before: Will continue Inventor before: Shen Chaohui Inventor before: Chen Jianyong Inventor before: Liu Aikui Inventor before: Liu Dong Inventor before: Lv Gang Inventor before: Liu Guowei Inventor before: Zhang Ying Inventor before: Duan Guangchao Inventor before: Wang Shizhong Inventor before: Zhao Hongsheng |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A hot dip tin plated copper material and its manufacturing method Effective date of registration: 20231121 Granted publication date: 20220617 Pledgee: China Construction Bank Corporation Xinxiang Branch Pledgor: KMD PRECISE COPPER STRIP HENAN LTD. Registration number: Y2023980066437 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220617 Pledgee: China Construction Bank Corporation Xinxiang Branch Pledgor: KMD PRECISE COPPER STRIP HENAN LTD. Registration number: Y2023980066437 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |