CN110577643B - 聚酰亚胺及其制备方法与柔性oled面板 - Google Patents
聚酰亚胺及其制备方法与柔性oled面板 Download PDFInfo
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 50
- 239000004642 Polyimide Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 125000003118 aryl group Chemical group 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 27
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 239000003960 organic solvent Substances 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 15
- 239000000706 filtrate Substances 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 13
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- VESMRDNBVZOIEN-UHFFFAOYSA-N 9h-carbazole-1,2-diamine Chemical class C1=CC=C2C3=CC=C(N)C(N)=C3NC2=C1 VESMRDNBVZOIEN-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 239000002244 precipitate Substances 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 5
- 239000012974 tin catalyst Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 150000008378 aryl ethers Chemical class 0.000 claims description 2
- -1 aryl ketone Chemical class 0.000 claims description 2
- 150000001716 carbazoles Chemical class 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
- 125000000468 ketone group Chemical group 0.000 claims description 2
- 239000012295 chemical reaction liquid Substances 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 description 15
- 239000011521 glass Substances 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 6
- 239000012975 dibutyltin dilaurate Substances 0.000 description 6
- 239000012065 filter cake Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- 238000001291 vacuum drying Methods 0.000 description 6
- 230000004580 weight loss Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000012300 argon atmosphere Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000967 suction filtration Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- SFHYNDMGZXWXBU-LIMNOBDPSA-N 6-amino-2-[[(e)-(3-formylphenyl)methylideneamino]carbamoylamino]-1,3-dioxobenzo[de]isoquinoline-5,8-disulfonic acid Chemical compound O=C1C(C2=3)=CC(S(O)(=O)=O)=CC=3C(N)=C(S(O)(=O)=O)C=C2C(=O)N1NC(=O)N\N=C\C1=CC=CC(C=O)=C1 SFHYNDMGZXWXBU-LIMNOBDPSA-N 0.000 description 2
- 125000005264 aryl amine group Chemical group 0.000 description 2
- 150000003949 imides Chemical group 0.000 description 2
- NSGDYZCDUPSTQT-UHFFFAOYSA-N N-[5-bromo-1-[(4-fluorophenyl)methyl]-4-methyl-2-oxopyridin-3-yl]cycloheptanecarboxamide Chemical compound Cc1c(Br)cn(Cc2ccc(F)cc2)c(=O)c1NC(=O)C1CCCCCC1 NSGDYZCDUPSTQT-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Abstract
本发明公开了一种聚酰亚胺及其制备方法与柔性OLED面板。提供一种聚酰亚胺,所述聚酰亚胺的重复单元中包括不对称结构基团,且所述不对称结构基团包括共轭的芳香侧基,所述共轭的芳香侧基包括两个以上的苯环,该种聚酰亚胺展现出高透过率、高稳定性及良好机械性能的优良特性,可应用于柔性OLED面板领域。
Description
技术领域
本发明涉及OLED材料领域,具体涉及一种聚酰亚胺及其制备方法与柔性OLED面板。
背景技术
OLED显示技术的为近年来最为活跃的显示面板发展方向,具有轻质、可弯曲、可折叠甚至可卷曲的优良特性,这其中,柔性基板作为整个柔性器件的支撑和保护组件不仅对器件的显示品质有着重要的影响,而且会直接影响到器件的寿命。聚酰亚胺(Polyimide,PI)是一类具有酰亚胺环重复单元的高分子材料,刚性的酰亚胺环赋予材料优异的综合性能,从而使得聚酰亚胺成为柔性显示基板的首选材料。
常规的聚酰亚胺材料常常具有较密集的刚性结构以及很强的分子间相互作用最终导致加工性能差、颜色深等方面的特点,限制了聚酰亚胺的广泛应用。目前,改善聚酰亚胺加工方面性能的方法主要侧重于结构修饰,例如引入长脂族链、庞大氟侧基团、引入不对称结构破坏规整性,但在大多数情况下,随着其透光率的提高,总是会使得热性能和机械性能的下降。
发明内容
为了克服现有技术中存在的问题,本发明提供一种高透过率、高稳定性,良好机械性能的聚酰亚胺薄膜。
为解决上述问题,第一方面,本申请提供一种聚酰亚胺,所述聚酰亚胺的重复单元中包括不对称结构基团,且所述不对称结构基团包括共轭的芳香侧基,所述共轭的芳香侧基包含两个以上的苯环。
进一步地,所述不对称结构基团为不对称咔唑基衍生物。
进一步地,所述聚酰亚胺的结构由式(1)表示:
所述Ar为C6-30的芳基、C12-30的芳酮基或C12-30的芳醚基;
所述n为1000-2500中的任意整数。
进一步地,所述R1选自如下任意一种:
进一步地,所述Ar选自如下任意一种:
第二方面,本发明还提供了一种聚酰亚胺的制备方法,包括如下步骤:
S2:取第一反应液,向其中加入第二有机溶剂,在氩气保护下,升温至150-250℃反应4-6h,然后降温至20-90℃,再使用有机滤膜对所得反应液进行过滤,得到滤液;
S3:将所述滤液涂覆与基板上,再在60-100℃的真空环境下干燥,除去60-80wt%的所述第一有机溶剂与所述第二有机溶剂,然后再送入高温炉于420-500℃环境中烘烤,得到有薄膜附着的基板;
S4:将所述有薄膜附着的基板浸泡于去离子水中72-96h,揭下基板上附着的薄膜,再将所述薄膜在60-80℃下干燥,即得聚酰亚胺膜,
所述Ar为C6-30的芳基、C12-30的芳酮基或C12-30的芳醚基。
进一步地,所述S1步骤中的所述二胺基咔唑衍生物的制备方法包括步骤:在氩气保护下,将二胺基咔唑与有机锡催化剂溶解于无水乙酸中,加入R-Br,搅拌反应3-5h,结束后使用氢氧化钠溶液调节pH至12-13,将析出的沉淀洗涤、提纯后干燥即得;
进一步地,在除去60%-80%的所述第一有机溶剂及所述第二有机溶剂后,所述S3步骤还包括:在高温炉温度为100-140℃时送入基板,静置20-60min,然后重复1次以上以1-10℃/min的升温速率升温至180-380℃烘烤10-60min,再以1-10℃/min的升温速率升温至420-500℃烘烤20-90min,最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
进一步地,在除去60%-80%的所述第一有机溶剂及所述第二有机溶剂后,所述S3步骤还包括:在高温炉温度为100-140℃时送入基板,静置20-60min,再以1-10℃/min的升温速率升温至420-500℃烘烤40-90min,最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
第三方面,本发明还提供了一种柔性OLED面板,所述柔性OLED面板包括上述的聚酰亚胺。
有益效果:本专利在聚酰亚胺中引入不对称结构与大共轭的芳香侧基,以此获得优良的性能。其一,因为引入这种不对称结构使得聚合物链中的规整性降低,从而有效减少聚合物链的紧密堆积,降低链的相互作用;其二,引入的芳香侧基中的的苯环结构有利于提高整体结构的折射率,从而增加了聚合物的透光率;另一方面,聚合物中存在不对称的芳环结构,可以提高芳香族单元的含量,进而可以提高聚合物的热稳定性。由此制备了一种高透过率、高稳定性,良好机械性能的聚酰亚胺薄膜,可作为优异的OLED衬底材料。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明实施例1中聚酰亚胺高温烘烤的步骤示意图;
图2是本发明实施例2中聚酰亚胺高温烘烤的步骤示意图;
图3是本发明实施例3中聚酰亚胺高温烘烤的步骤示意图;
图4是本发明实施例1中聚酰亚胺透过率测试数据拟合图;
图5是本发明实施例1中聚酰亚胺热失重测试数据拟合图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1:制备聚酰亚胺1,结构式如下:
合成路线如下:
合成步骤如下:
1、在氩气的保护下,向反应装置中加入化合物A1(10mol),二月桂酸二丁基锡(6mol),再加入无水乙酸将其溶解,待固体溶解澄清后,缓慢加入化合物B1(11mol),然后在200rpm的转速搅拌下反应5h,反应结束,冷却至室温,再用NaOH溶液调节pH=12,大量灰色沉淀析出,用蒸馏水洗涤,抽滤之后保存滤饼,放入真空干燥箱中60℃干燥8h,干燥后的滤饼中加入四氢呋喃(THF)并搅拌15min,过滤得到棕色滤液,将滤液进行悬蒸溶剂得到灰色固体,再次用乙醇/水(体积比为1:1),在氮气保护下重结晶,过滤,用乙醇洗涤2次,最终得到的固体放入真空干燥箱中60℃烘干24h,得到化合物C1;
2、在氩气保护下,将化合物C1(1mol)完全溶解于溶剂N-甲基吡咯烷酮(NMP)中,再加入化合物D1(1mol)二酐单体,在常温下不断的搅拌使其反应24h,得到聚合物E1溶液;
3、向得到的聚合物E1溶液中加入甲苯(10mL),在氩气的氛围下升温到150℃进行反应6h,然后降温到80℃,再使用有机滤膜对所得溶液进行过滤,得到的滤液悬涂在玻璃基板上,再在80℃真空环境下恒温0.5h,除去70%的NMP溶剂;
4、将附着有薄膜的玻璃基板其送入高温炉,进片温度为120℃,并恒温静置30min,然后以4℃/min的升温速率升温至450℃,恒温烘烤60min,再以7℃/min的降温速率降温至120℃后出片(该高温烘烤过程详见图1),接着,将整块玻璃板和膜浸泡在去离子水中72h,揭下聚酰亚胺薄膜,再在80℃下干燥,最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行透过率测试,测试结果如图4所示,在550nm波长下的透过率接近80%;
对所得聚酰亚胺薄膜进行热失重测试,测试结果如图5所示,失重质量为1%时的温度为576.6℃。
实施例2:制备聚酰亚胺2,结构式如下:
合成路线如下:
合成步骤如下:
1、在氩气的保护下,向反应装置中加入化合物A2(10mol),二月桂酸二丁基锡(5mol),再加入无水乙酸将其溶解,待固体溶解澄清后,缓慢加入化合物B2(15mol),然后在400rpm的转速搅拌下反应4h,反应结束,冷却至室温,再用NaOH溶液调节pH=13,大量灰色沉淀析出,用蒸馏水洗涤,抽滤之后保存滤饼,放入真空干燥箱中60℃干燥10h,干燥后的滤饼中加入四氢呋喃(THF)并搅拌15min,过滤得到棕色滤液,将滤液进行悬蒸溶剂得到灰色固体,再次用乙醇/水(体积比为9:1),在氮气保护下重结晶,过滤,用乙醇洗涤2次,最终得到的固体放入真空干燥箱中60℃烘干30h,得到化合物C2;
2、在氩气保护下,将化合物C1(1mol)完全溶解于溶剂N-甲基吡咯烷酮中,再加入化合物D2(1.5mol)二酐单体,在常温下不断的搅拌使其反应48h,得到聚合物E2溶液;
3、向得到的聚合物E2溶液中加入甲苯(8mL),在氩气的氛围下升温到200℃进行反应5h,然后降温到80℃,再使用有机滤膜对所得溶液进行过滤,得到的滤液悬涂在玻璃基板上,再在80℃真空环境下恒温1h,除去70%的NMP溶剂;
4、将附着有薄膜的玻璃基板其送入高温炉,进片温度为120℃,并恒温静置30min,然后以4℃/min的升温速率升温至475℃,恒温烘烤60min,再以7℃/min的降温速率降温至120℃后出片(该高温烘烤过程详见图2),接着,将整块玻璃板和膜浸泡在去离子水中82h,揭下聚酰亚胺薄膜,再在80℃下干燥,最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行热失重测试,失重质量为1%时的温度为579.2℃;
对所得聚酰亚胺薄膜进行透过率测试,在550nm波长下的透过率接近80%。
实施例3;制备聚酰亚胺3,结构式如下:
合成路线如下:
合成步骤如下:
1、在氩气的保护下,向反应装置中加入化合物A3(15mol),二月桂酸二丁基锡(7mol),再加入无水乙酸将其溶解,待固体溶解澄清后,缓慢加入化合物B3(10mol),然后在500rpm的转速搅拌下反应3h,反应结束,冷却至室温,再用NaOH溶液调节pH=12.5,大量灰色沉淀析出,用蒸馏水洗涤,抽滤之后保存滤饼,放入真空干燥箱中60℃干燥9h,干燥后的滤饼中加入四氢呋喃(THF)并搅拌15min,过滤得到棕色滤液,将滤液进行悬蒸溶剂得到灰色固体,再次用乙醇/水(体积比为1:9),在氮气保护下重结晶,过滤,用乙醇洗涤2次,最终得到的固体放入真空干燥箱中60℃烘干48h,得到化合物C3;
2、在氩气保护下,将化合物C3(1.5mol)完全溶解于溶剂N-甲基吡咯烷酮中,再加入化合物D3(1mol)二酐单体,在常温下不断的搅拌使其反应96h,得到聚合物E3溶液;
3、向得到的聚合物E2溶液中加入甲苯(7mL),在氩气的氛围下升温到250℃进行反应4h,然后降温到80℃,再使用有机滤膜对所得溶液进行过滤,得到的滤液悬涂在玻璃基板上,再在80℃真空环境下恒温1h,除去70%的NMP溶剂;
4、将附着有薄膜的玻璃基板其送入高温炉,进片温度为120℃,并恒温静置30min,然后以升温时间20min恒温升温至180℃,静置20min,再以升温时间40min恒温升温至350℃,静置20min,再以升温时间30min恒温升温至450℃,烘烤40min,最后以降温时间48min恒温降温至120℃后出片(该高温烘烤过程详见图3),接着,将整块玻璃板和膜浸泡在去离子水中96h,揭下聚酰亚胺薄膜,再在80℃下干燥,最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行热失重测试,失重质量为1%时的温度为573.9℃;
对所得聚酰亚胺薄膜进行透过率测试,在550nm波长下的透过率接近80%。
由上述实施例可判定,本发明所述的聚酰亚胺具有较高的透过率与热稳定性,适合应用于柔性OLED面板领域。
以上对本发明实施例所提供的一种聚酰亚胺及其制备方法进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。
Claims (7)
3.一种聚酰亚胺的制备方法,其特征在于,包括如下步骤:
S2:取第一反应液,向其中加入第二有机溶剂,在氩气保护下,升温至150-250℃反应4-6h,然后降温至20-90℃,再使用有机滤膜对所得反应液进行过滤,得到滤液;
S3:将所述滤液涂覆与基板上,再在60-100℃的真空环境下干燥,除去60-80wt%的所述第一有机溶剂与所述第二有机溶剂,然后再送入高温炉于420-500℃环境中烘烤,得到有薄膜附着的基板;
S4:将所述有薄膜附着的基板浸泡于去离子水中72-96h,揭下基板上附着的薄膜,再将所述薄膜在60-80℃下干燥,即得聚酰亚胺膜,
所述Ar为C6-30的芳基、C12-30的芳酮基或C12-30的芳醚基。
5.如权利要求3或4所述的制备方法,其特征在于,在除去60%-80%的所述第一有机溶剂及所述第二有机溶剂后,所述S3步骤还包括:在高温炉温度为100-140℃时送入基板,静置20-60min,然后重复1次以上以1-10℃/min的升温速率升温至180-380℃烘烤10-60min,再以1-10℃/min的升温速率升温至420-500℃烘烤20-90min,最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
6.如权利要求3或4所述的制备方法,其特征在于,在除去60%-80%的所述第一有机溶剂及所述第二有机溶剂后,所述S3步骤还包括:在高温炉温度为100-140℃时送入基板,静置20-60min,再以1-10℃/min的升温速率升温至420-500℃烘烤40-90min,最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
7.一种柔性OLED面板,其特征在于,所述柔性OLED面板包括如权利要求1或2任意一项所述的聚酰亚胺。
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