WO2021042495A1 - 聚酰亚胺及其制备方法与柔性oled面板 - Google Patents

聚酰亚胺及其制备方法与柔性oled面板 Download PDF

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WO2021042495A1
WO2021042495A1 PCT/CN2019/115765 CN2019115765W WO2021042495A1 WO 2021042495 A1 WO2021042495 A1 WO 2021042495A1 CN 2019115765 W CN2019115765 W CN 2019115765W WO 2021042495 A1 WO2021042495 A1 WO 2021042495A1
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polyimide
temperature
preparation
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organic solvent
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汪亚民
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武汉华星光电半导体显示技术有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • C—CHEMISTRY; METALLURGY
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of OLED materials, in particular to a polyimide, a preparation method thereof, and a flexible OLED panel.
  • OLED display technology is the most active display panel development direction in recent years. It has excellent characteristics of light weight, bendable, foldable and even rollable. Among them, the flexible substrate as the support and protection component of the entire flexible device is not only for the display of the device. Quality has an important impact, and it will directly affect the life of the device.
  • Polyimide (PI) is a type of polymer material with imide ring repeating units. The rigid imide ring gives the material excellent comprehensive properties, making polyimide the first choice for flexible display substrates. .
  • the present invention provides a polyimide, the repeating unit of the polyimide includes an asymmetric structural group, and the asymmetric structural group includes a conjugated aromatic side group, and the conjugated aromatic side The group contains more than two benzene rings.
  • the asymmetric structure group is an asymmetric carbazolyl derivative.
  • the R is selected from The R 1 is a C 6-30 aryl group, a C 3-30 heteroaryl group, a C 6-30 halogenated aryl group, or a C 6-30 arylamino group;
  • the Ar is a C 6-30 aryl group, a C 12-30 aryl ketone group or a C 12-30 aryl ether group;
  • the n is any integer in the range of 1000-2500.
  • R 1 is selected from any one of the following:
  • the structure of Ar is selected from any one of the following:
  • the structure of the polyimide is selected from any one of the following:
  • the present invention also provides a preparation method of polyimide, including the following steps:
  • the R is selected from The R 1 is a C 6-30 aryl group, a C 3-30 heteroaryl group, a C 6-30 halogenated aryl group, or a C 6-30 arylamino group;
  • the molar ratio of the diaminocarbazole derivative to the dianhydride monomer is 1:(0.67-1.5 ).
  • the first temperature is 10-60° C.
  • the first time is 24-96 h.
  • the second temperature is 150-250°C
  • the second time is 4-6h
  • the third temperature It is 20-90°C.
  • the fourth temperature is 60-100°C, and the fourth temperature is 420-500°C.
  • the third time is 72-96 h
  • the sixth temperature is 60-80°C.
  • the first organic solvent is N-methylpyrrolidone.
  • the structure of R 1 is selected from any one of the following:
  • the second organic solvent is toluene.
  • the diaminocarbazole derivative in the step S1 includes the steps: under the protection of argon, the diaminocarbazole Dissolve the organic tin catalyst in anhydrous acetic acid, add R-Br, stir and react for 3-5h, use sodium hydroxide solution to adjust the pH to 12-13 after the end, wash the precipitated precipitate, purify it and dry it.
  • the R is selected from The R1 is a C 6-30 aryl group, a C 3-30 heteroaryl group, a C 6-30 halogenated aryl group, or a C 6-30 arylamino group.
  • the S3 step further includes: Feed the substrate at 100-140°C, let it stand for 20-60min, then repeat more than one time at a heating rate of 1-10°C/min to 180-380°C, bake for 10-60min, and then 1-10°C/ The heating rate is increased to 420-500°C for 20-90 minutes, and the temperature is lowered to below 180°C at a cooling rate of 1-10°C/min, and then the substrate is taken out.
  • the S3 step further includes: Feed the substrate at 100-140°C, let it stand for 20-60min, then heat up to 420-500°C at a heating rate of 1-10°C/min, bake for 40-90min, and finally at a cooling rate of 1-10°C/min After cooling to below 180°C, the substrate was taken out.
  • the present invention also provides a flexible OLED panel, wherein the flexible OLED panel includes the above-mentioned polyimide.
  • the present invention introduces an asymmetric structure and large conjugated aromatic side groups into the polyimide, so as to obtain excellent performance.
  • the introduction of this asymmetric structure reduces the regularity in the polymer chain, it effectively reduces the close packing of polymer chains and reduces chain interaction;
  • the benzene ring structure in the introduced aromatic side groups has It is beneficial to increase the refractive index of the overall structure, thereby increasing the light transmittance of the polymer; on the other hand, there is an asymmetric aromatic ring structure in the polymer, which can increase the content of aromatic units, thereby improving the thermal stability of the polymer .
  • a polyimide film with high transmittance, high stability and good mechanical properties is prepared, which can be used as an excellent OLED substrate material.
  • Example 1 is a schematic diagram of the steps of high-temperature baking of polyimide in Example 1 of the present invention
  • Example 2 is a schematic diagram of the steps of high-temperature baking of polyimide in Example 2 of the present invention.
  • Example 3 is a schematic diagram of the steps of high-temperature baking of polyimide in Example 3 of the present invention.
  • Example 4 is a fitting diagram of test data of polyimide transmittance in Example 1 of the present invention.
  • Fig. 5 is a graph of fitting data of polyimide thermal weight loss test in Example 1 of the present invention.
  • the synthetic route is as follows:
  • a large amount of gray precipitate precipitates out wash with distilled water, save the filter cake after suction filtration, and put it in a vacuum drying oven Dry for 8 hours at 60°C, add tetrahydrofuran (THF) to the dried filter cake and stir for 15 min, filter to obtain a brown filtrate, suspend the filtrate to solvent to obtain a gray solid, again with ethanol/water (volume ratio 1:1), Recrystallize under the protection of nitrogen, filter, and wash twice with ethanol, and finally the solid obtained is placed in a vacuum drying oven at 60°C for 24 hours to obtain compound C1;
  • THF tetrahydrofuran
  • the glass substrate with the film attached to it is sent to a high-temperature furnace, the sheet temperature is 120 °C, and the temperature is kept for 30 minutes, then the temperature is increased to 450 °C at a heating rate of 4 °C/min, and the temperature is baked for 60 minutes, and then 7 After cooling down to 120°C at a cooling rate of °C/min, the film is discharged (see Figure 1 for details of the high-temperature baking process). Then, the entire glass plate and film are immersed in deionized water for 72 hours, and the polyimide film is peeled off. It was dried at 80°C to finally obtain a polyimide film.
  • the transmittance test of the obtained polyimide film is shown in Figure 4.
  • the transmittance at a wavelength of 550nm is close to 80%;
  • the resulting polyimide film was subjected to a thermal weight loss test.
  • the test result is shown in Fig. 5, and the temperature when the weight loss is 1% is 576.6°C.
  • the synthetic route is as follows:
  • a large amount of gray precipitate precipitates out wash with distilled water, save the filter cake after suction filtration, and put it in a vacuum drying oven Dry at 60°C for 10 hours, add tetrahydrofuran (THF) to the dried filter cake and stir for 15 min, filter to obtain a brown filtrate, suspend the filtrate to solvent to obtain a gray solid, again with ethanol/water (volume ratio 9:1), Recrystallize under the protection of nitrogen, filter, and wash twice with ethanol, and finally the solid obtained is placed in a vacuum drying oven at 60°C for 30 h to obtain compound C2;
  • THF tetrahydrofuran
  • the glass substrate with the film attached to it is sent to a high-temperature furnace, the feeding temperature is 120°C, and the temperature is kept for 30 minutes, then the temperature is raised to 475°C at a heating rate of 4°C/min, and it is baked at a constant temperature for 60 minutes. After cooling down to 120°C at a cooling rate of °C/min, the film is discharged (see Figure 2 for details of the high-temperature baking process). Then, the entire glass plate and film are immersed in deionized water for 82 hours, and the polyimide film is peeled off. It was dried at 80°C to finally obtain a polyimide film.
  • the thermal weight loss test was performed on the obtained polyimide film, and the temperature when the weight loss mass was 1% was 579.2°C;
  • the transmittance test of the obtained polyimide film shows that the transmittance at a wavelength of 550 nm is close to 80%.
  • the synthetic route is as follows:
  • a large amount of gray precipitate precipitates out wash with distilled water, save the filter cake after suction filtration, and put it in a vacuum drying oven Dry for 9 hours at 60°C, add tetrahydrofuran (THF) to the dried filter cake and stir for 15 minutes, filter to obtain a brown filtrate, and suspend the filtrate to solvent to obtain a gray solid.
  • THF tetrahydrofuran
  • the glass substrate with the film attached to it is sent into a high-temperature furnace, the sheet feeding temperature is 120°C, and the temperature is kept for 30 minutes, and then the temperature is raised to 180°C with a heating time of 20 minutes, and the temperature is kept for 20 minutes, and then the temperature is raised with a heating time of 40 minutes.
  • the sheet feeding temperature is 120°C
  • the temperature is kept for 30 minutes
  • the temperature is raised to 180°C with a heating time of 20 minutes
  • the temperature is kept for 20 minutes
  • the temperature is raised with a heating time of 40 minutes.
  • To 350°C let stand for 20 minutes, and then heat up to 450°C with a heating time of 30 minutes, bake for 40 minutes, and finally cool to 120°C with a cooling time of 48 minutes, and then release the film (see Figure 3 for the high-temperature baking process), and then, Soak the whole glass plate and film in deionized water for 96 hours, peel off the polyimide film, and then dry it at 80° C. to finally obtain the
  • the thermal weight loss test was performed on the obtained polyimide film, and the temperature when the weight loss mass was 1% was 573.9°C;
  • the transmittance test of the obtained polyimide film shows that the transmittance at a wavelength of 550 nm is close to 80%.
  • the polyimide of the present invention has higher transmittance and thermal stability, and is suitable for application in the field of flexible OLED panels.

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Abstract

本发明公开了一种聚酰亚胺及其制备方法与柔性OLED面板。提供一种聚酰亚胺，聚酰亚胺的重复单元中包括不对称结构基团，且不对称结构基团包括共轭的芳香侧基，共轭的芳香侧基包括两个以上的苯环。

Description

聚酰亚胺及其制备方法与柔性OLED面板 技术领域
本发明涉及OLED材料领域，具体涉及一种聚酰亚胺及其制备方法与柔性OLED面板。
背景技术
OLED显示技术的为近年来最为活跃的显示面板发展方向，具有轻质、可弯曲、可折叠甚至可卷曲的优良特性，这其中，柔性基板作为整个柔性器件的支撑和保护组件不仅对器件的显示品质有着重要的影响，而且会直接影响到器件的寿命。聚酰亚胺(Polyimide，PI)是一类具有酰亚胺环重复单元的高分子材料，刚性的酰亚胺环赋予材料优异的综合性能，从而使得聚酰亚胺成为柔性显示基板的首选材料。
技术问题
常规的聚酰亚胺材料常常具有较密集的刚性结构以及很强的分子间相互作用最终导致加工性能差、颜色深等方面的特点，限制了聚酰亚胺的广泛应用。目前，改善聚酰亚胺加工方面性能的方法主要侧重于结构修饰，例如引入长脂族链、庞大氟侧基团、引入不对称结构破坏规整性，但在大多数情况下，随着其透光率的提高，总是会使得热性能和机械性能下降。
技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种聚酰亚胺，所述聚酰亚胺的重复单元 中包括不对称结构基团，且所述不对称结构基团包括共轭的芳香侧基，所述共轭的芳香侧基包含两个以上的苯环。
在本申请实施例所提供的聚酰亚胺中，所述不对称结构基团为不对称咔唑基衍生物。
在本申请实施例所提供的聚酰亚胺中，所述聚酰亚胺的结构由式(1)表示:
Figure PCTCN2019115765-appb-000001
其中，所述R选自
Figure PCTCN2019115765-appb-000002
所述R 1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基；
所述Ar为C 6-30的芳基、C 12-30的芳酮基或C 12-30的芳醚基；
所述n为1000-2500中的任意整数。
在本申请实施例所提供的聚酰亚胺中，所述R 1的结构选自如下任意一者：
Figure PCTCN2019115765-appb-000003
在本申请实施例所提供的聚酰亚胺中，所述Ar的结构选自如下任意一者：
Figure PCTCN2019115765-appb-000004
Figure PCTCN2019115765-appb-000005
在本申请实施例所提供的聚酰亚胺中，所述聚酰亚胺的结构选自如下任意一者：
Figure PCTCN2019115765-appb-000006
本发明还提供一种聚酰亚胺的制备方法，包括如下步骤：
S1:在氩气保护下，将二胺基咔唑衍生物
Figure PCTCN2019115765-appb-000007
与二酐单体
Figure PCTCN2019115765-appb-000008
溶解于第一有机溶剂中，第一温度下搅拌反应第一时间，得到第一反应液，
其中，所述R选自
Figure PCTCN2019115765-appb-000009
所述R 1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基；
S2:取第一反应液，向其中加入第二有机溶剂，在氩气保护下，升温至第二温度反应第二时间，然后降温至第三温度，再使用有机滤膜对所得反应液进行过滤，得到滤液；
S3:将所述滤液涂覆于基板上，再在第四温度的真空环境下干燥，除去60-80wt％的所述第一有机溶剂与所述第二有机溶剂，然后再送入高温炉于第五温度环境中烘烤，得到有薄膜附着的基板；
S4:将所述有薄膜附着的基板浸泡于去离子水中第三时间，揭下基板上附着的薄膜，再将所述薄膜在第六温度下干燥，即得聚酰亚胺膜。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S1步骤中，所述二胺基咔唑衍生物与所述二酐单体的摩尔比为1:(0.67-1.5)。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S1步骤中，所述第一温度为10-60℃，所述第一时间为24-96h。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S2步骤中，所述第二温度为150-250℃，所述第二时间为4-6h，所述第三温度为20-90℃。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S3步骤中，所述第四温度为60-100℃，所述第四温度 为420-500℃。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S4步骤中，所述第三时间为72-96h，所述第六温度为60-80℃。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S1步骤中，所述第一有机溶剂为N-甲基吡咯烷酮。
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S1步骤中，所述R 1的结构选自如下任意一者：
Figure PCTCN2019115765-appb-000010
在本申请实施例所提供的聚酰亚胺的制备方法中，在所述S2步骤中，所述第二有机溶剂为甲苯。
在本申请实施例所提供的聚酰亚胺的制备方法中，所述S1步骤中的所述二胺基咔唑衍生物
Figure PCTCN2019115765-appb-000011
的制备方法包括步骤：在氩气保护下，将二胺基咔唑
Figure PCTCN2019115765-appb-000012
与有机锡催化剂溶解于无水乙酸中，加入R-Br，搅拌反应3-5h，结束后使用氢氧化钠溶液调节pH至12-13，将析出的沉淀洗涤、提纯后干燥即得；
其中，所述R选自
Figure PCTCN2019115765-appb-000013
所述R1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基。
在本申请实施例所提供的聚酰亚胺的制备方法中，在除去60-80wt％的所述第一有机溶剂及所述第二有机溶剂后，所述S3步骤还包括：在高温炉温度为100-140℃时送入基板，静置20-60min，然后重复1次以上以1-10℃/min的升温速率升温至180-380℃烘烤10-60min，再以1-10℃/min的升温速率升温至420-500℃烘烤20-90min，最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
在本申请实施例所提供的聚酰亚胺的制备方法中，在除去60-80wt％的所述第一有机溶剂及所述第二有机溶剂后，所述S3步骤还包括：在高温炉温度为100-140℃时送入基板，静置20-60min，再以1-10℃/min的升温速率升温至420-500℃烘烤40-90min，最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
本发明还提供了一种柔性OLED面板，其中，所述柔性OLED面板包括上述的聚酰亚胺。
有益效果
本发明的有益效果为：本发明在聚酰亚胺中引入不对称结构与大共轭的芳香侧基，以此获得优良的性能。其一，因为引入这种不对称结构使得聚合物链中的规整性降低，从而有效减少聚合物链的紧密堆积，降低链的相互作用； 其二，引入的芳香侧基中的苯环结构有利于提高整体结构的折射率，从而增加了聚合物的透光率；另一方面，聚合物中存在不对称的芳环结构，可以提高芳香族单元的含量，进而可以提高聚合物的热稳定性。由此制备了一种高透过率、高稳定性，良好机械性能的聚酰亚胺薄膜，可作为优异的OLED衬底材料。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例1中聚酰亚胺高温烘烤的步骤示意图；
图2是本发明实施例2中聚酰亚胺高温烘烤的步骤示意图；
图3是本发明实施例3中聚酰亚胺高温烘烤的步骤示意图；
图4是本发明实施例1中聚酰亚胺透过率测试数据拟合图；
图5是本发明实施例1中聚酰亚胺热失重测试数据拟合图。
本发明的最佳实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保 护的范围。
实施例1：制备聚酰亚胺1，结构式如下：
Figure PCTCN2019115765-appb-000014
合成路线如下：
Figure PCTCN2019115765-appb-000015
合成步骤如下：
1、在氩气的保护下，向反应装置中加入化合物A1(10mol)，二月桂酸二丁基锡(6mol)，再加入无水乙酸将其溶解，待固体溶解澄清后，缓慢加入化合物B1(11mol)，然后在200rpm的转速搅拌下反应5h，反应结束，冷却至室温，再用NaOH溶液调节pH＝12，大量灰色沉淀析出，用蒸馏水洗涤，抽滤之后保存滤饼，放入真空干燥箱中60℃干燥8h，干燥后的滤饼中加入四氢呋喃(THF)并搅 拌15min，过滤得到棕色滤液，将滤液进行悬蒸溶剂得到灰色固体，再次用乙醇/水(体积比为1:1)，在氮气保护下重结晶，过滤，用乙醇洗涤2次，最终得到的固体放入真空干燥箱中60℃烘干24h，得到化合物C1；
2、在氩气保护下，将化合物C1(1mol)完全溶解于溶剂N-甲基吡咯烷酮(NMP)中，再加入化合物D1(1mol)二酐单体，在常温下不断的搅拌使其反应24h，得到聚合物E1溶液；
3、向得到的聚合物E1溶液中加入甲苯(10mL)，在氩气的氛围下升温到150℃进行反应6h，然后降温到80℃，再使用有机滤膜对所得溶液进行过滤，得到的滤液悬涂在玻璃基板上，再在80℃真空环境下恒温0.5h，除去70％的NMP溶剂；
4、将附着有薄膜的玻璃基板其送入高温炉，进片温度为120℃，并恒温静置30min，然后以4℃/min的升温速率升温至450℃，恒温烘烤60min，再以7℃/min的降温速率降温至120℃后出片(该高温烘烤过程详见图1)，接着，将整块玻璃板和膜浸泡在去离子水中72h，揭下聚酰亚胺薄膜，再在80℃下干燥，最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行透过率测试，测试结果如图4所示，在550nm波长下的透过率接近80％；
对所得聚酰亚胺薄膜进行热失重测试，测试结果如图 5所示，失重质量为1％时的温度为576.6℃。
实施例2：制备聚酰亚胺2，结构式如下：
Figure PCTCN2019115765-appb-000016
合成路线如下：
Figure PCTCN2019115765-appb-000017
合成步骤如下：
1、在氩气的保护下，向反应装置中加入化合物A2(10mol)，二月桂酸二丁基锡(5mol)，再加入无水乙酸将其溶解，待固体溶解澄清后，缓慢加入化合物B2(15mol)，然后在400rpm的转速搅拌下反应4h，反应结束，冷却至室温，再用NaOH溶液调节pH＝13，大量灰色沉淀析出，用蒸馏水洗涤，抽滤之后保存滤饼，放入真空干燥箱中 60℃干燥10h，干燥后的滤饼中加入四氢呋喃(THF)并搅拌15min，过滤得到棕色滤液，将滤液进行悬蒸溶剂得到灰色固体，再次用乙醇/水(体积比为9:1)，在氮气保护下重结晶，过滤，用乙醇洗涤2次，最终得到的固体放入真空干燥箱中60℃烘干30h，得到化合物C2；
2、在氩气保护下，将化合物C1(1mol)完全溶解于溶剂N-甲基吡咯烷酮中，再加入化合物D2(1.5mol)二酐单体，在常温下不断的搅拌使其反应48h，得到聚合物E2溶液；
3、向得到的聚合物E2溶液中加入甲苯(8mL)，在氩气的氛围下升温到200℃进行反应5h，然后降温到80℃，再使用有机滤膜对所得溶液进行过滤，得到的滤液悬涂在玻璃基板上，再在80℃真空环境下恒温1h，除去70％的NMP溶剂；
4、将附着有薄膜的玻璃基板其送入高温炉，进片温度为120℃，并恒温静置30min，然后以4℃/min的升温速率升温至475℃，恒温烘烤60min，再以7℃/min的降温速率降温至120℃后出片(该高温烘烤过程详见图2)，接着，将整块玻璃板和膜浸泡在去离子水中82h，揭下聚酰亚胺薄膜，再在80℃下干燥，最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行热失重测试，失重质量为1％时的温度为579.2℃；
对所得聚酰亚胺薄膜进行透过率测试，在550nm波长下的透过率接近80％。
实施例3；制备聚酰亚胺3，结构式如下：
Figure PCTCN2019115765-appb-000018
合成路线如下：
Figure PCTCN2019115765-appb-000019
合成步骤如下：
1、在氩气的保护下，向反应装置中加入化合物A3(15mol)，二月桂酸二丁基锡(7mol)，再加入无水乙酸将其溶解，待固体溶解澄清后，缓慢加入化合物B3(10mol)，然后在500rpm的转速搅拌下反应3h，反应结束，冷却至室温，再用NaOH溶液调节pH＝12.5，大量灰色沉淀析出， 用蒸馏水洗涤，抽滤之后保存滤饼，放入真空干燥箱中60℃干燥9h，干燥后的滤饼中加入四氢呋喃(THF)并搅拌15min，过滤得到棕色滤液，将滤液进行悬蒸溶剂得到灰色固体，再次用乙醇/水(体积比为1:9)，在氮气保护下重结晶，过滤，用乙醇洗涤2次，最终得到的固体放入真空干燥箱中60℃烘干48h，得到化合物C3；
2、在氩气保护下，将化合物C3(1.5mol)完全溶解于溶剂N-甲基吡咯烷酮中，再加入化合物D3(1mol)二酐单体，在常温下不断的搅拌使其反应96h，得到聚合物E3溶液；
3、向得到的聚合物E2溶液中加入甲苯(7mL)，在氩气的氛围下升温到250℃进行反应4h，然后降温到80℃，再使用有机滤膜对所得溶液进行过滤，得到的滤液悬涂在玻璃基板上，再在80℃真空环境下恒温1h，除去70％的NMP溶剂；
4、将附着有薄膜的玻璃基板其送入高温炉，进片温度为120℃，并恒温静置30min，然后以升温时间20min恒温升温至180℃，静置20min，再以升温时间40min恒温升温至350℃，静置20min，再以升温时间30min恒温升温至450℃，烘烤40min，最后以降温时间48min恒温降温至120℃后出片(该高温烘烤过程详见图3)，接着，将整块玻璃板和膜浸泡在去离子水中96h，揭下聚酰亚胺 薄膜，再在80℃下干燥，最终得到聚酰亚胺膜。
对所得聚酰亚胺薄膜进行热失重测试，失重质量为1％时的温度为573.9℃；
对所得聚酰亚胺薄膜进行透过率测试，在550nm波长下的透过率接近80％。
由上述实施例可判定，本发明所述的聚酰亚胺具有较高的透过率与热稳定性，适合应用于柔性OLED面板领域。
以上对本发明实施例所提供的一种聚酰亚胺及其制备方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (19)

  1. 一种聚酰亚胺，其中，所述聚酰亚胺的重复单元中包括不对称结构基团，且所述不对称结构基团包括共轭的芳香侧基，所述共轭的芳香侧基包含两个以上的苯环。
  2. 如权利要求1所述的聚酰亚胺，其中，所述不对称结构基团为不对称咔唑基衍生物。
  3. 如权利要求1所述的聚酰亚胺，其中，所述聚酰亚胺的结构由式(1)表示:
    Figure PCTCN2019115765-appb-100001
    其中，所述R选自
    Figure PCTCN2019115765-appb-100002
    所述R 1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基；
    所述Ar为C 6-30的芳基、C 12-30的芳酮基或C 12-30的芳醚基；
    所述n为1000-2500中的任意整数。
  4. 如权利要求3所述的聚酰亚胺，其中，所述R 1选自下列结构式中任意一者：
    Figure PCTCN2019115765-appb-100003
  5. 如权利要求3所述的聚酰亚胺，其中，所述Ar选自下列结构式中任意一者：
    Figure PCTCN2019115765-appb-100004
  6. 如权利要求3所述的聚酰亚胺，其中，所述聚酰亚胺选自下列结构式中任意一者：
    Figure PCTCN2019115765-appb-100005
  7. 一种聚酰亚胺的制备方法，其中，包括如下步骤：
    S1:在氩气保护下，将二胺基咔唑衍生物
    Figure PCTCN2019115765-appb-100006
    与二酐单体
    Figure PCTCN2019115765-appb-100007
    溶解于第一有机溶剂中，第一温度下搅拌反应第一时间，得到第一反应液，
    其中，所述R选自
    Figure PCTCN2019115765-appb-100008
    所述R 1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基；
    S2:取第一反应液，向其中加入第二有机溶剂，在氩气保护下，升温至第二温度反应第二时间，然后降温至第三温度，再使用有机滤膜对所得反应液进行过滤，得到滤液；
    S3:将所述滤液涂覆于基板上，再在第四温度的真空环境下干燥，除去60-80wt％的所述第一有机溶剂与所述第二有机溶剂，然后再送入高温炉于第五温度环境中烘烤，得到有薄膜附着的基板；
    S4:将所述有薄膜附着的基板浸泡于去离子水中第三时间，揭下基板上附着的薄膜，再将所述薄膜在第六温度下干燥，即得聚酰亚胺膜。
  8. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S1步骤中，所述二胺基咔唑衍生物与所述二酐单体的摩尔比为1:(0.67-1.5)。
  9. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S1步骤中，所述第一温度为10-60℃，所述第一时间为24-96h。
  10. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S2步骤中，所述第二温度为150-250℃，所述第二 时间为4-6h，所述第三温度为20-90℃。
  11. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S3步骤中，所述第四温度为60-100℃，所述第四温度为420-500℃。
  12. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S4步骤中，所述第三时间为72-96h，所述第六温度为60-80℃。
  13. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S1步骤中，所述第一有机溶剂为N-甲基吡咯烷酮。
  14. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S1步骤中，所述R 1选自下列结构式中任意一者：
    Figure PCTCN2019115765-appb-100009
  15. 如权利要求7所述的聚酰亚胺的制备方法，其中，在所述S2步骤中，所述第二有机溶剂为甲苯。
  16. 如权利要求7所述的聚酰亚胺的制备方法，其中，所述S1步骤中的所述二胺基咔唑衍生物
    Figure PCTCN2019115765-appb-100010
    的制备方法包括步骤：在氩气保护下，将二胺基咔唑
    Figure PCTCN2019115765-appb-100011
    与有机锡催化剂溶解于无水乙酸中，加入R-Br，搅拌反应3-5h，结束后使用氢氧化钠溶液调节pH至12-13，将析出的沉淀洗涤、提纯后干燥即得；
    其中，所述R选自
    Figure PCTCN2019115765-appb-100012
    所述R1为C 6-30的芳基、C 3-30的杂芳基、C 6-30的卤代芳基或C 6-30的芳胺基。
  17. 根据权利要求7所述的聚酰亚胺的制备方法，其中，在除去60-80wt％的所述第一有机溶剂及所述第二有机溶剂后，所述S3步骤还包括：在高温炉温度为100-140℃时送入基板，静置20-60min，然后重复1次以上以1-10℃/min的升温速率升温至180-380℃烘烤10-60min，再以1-10℃/min的升温速率升温至420-500℃烘烤20-90min，最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
  18. 根据权利要求7所述的聚酰亚胺的制备方法，其中，在除去60-80wt％的所述第一有机溶剂及所述第二有机溶剂后，所述S3步骤还包括：在高温炉温度为100-140℃时送入基板，静置20-60min，再以1-10℃/min的升温速率升温至420-500℃烘烤40-90min，最后以1-10℃/min的降温速率降温至180℃以下后取出基板。
  19. 一种柔性OLED面板，其中，所述柔性OLED面板包括如权利要求1所述的聚酰亚胺。
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