CN110462107A - 锌或锌合金电镀方法和系统 - Google Patents

锌或锌合金电镀方法和系统 Download PDF

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Publication number
CN110462107A
CN110462107A CN201980001581.1A CN201980001581A CN110462107A CN 110462107 A CN110462107 A CN 110462107A CN 201980001581 A CN201980001581 A CN 201980001581A CN 110462107 A CN110462107 A CN 110462107A
Authority
CN
China
Prior art keywords
zinc
alloy electroplating
zinc alloy
alkaline
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980001581.1A
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English (en)
Chinese (zh)
Inventor
新鞍俊宽
桥本章
井上学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dipsol Chemicals Co Ltd
Original Assignee
Dipsol Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chemicals Co Ltd filed Critical Dipsol Chemicals Co Ltd
Publication of CN110462107A publication Critical patent/CN110462107A/zh
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/565Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201980001581.1A 2019-02-15 2019-02-15 锌或锌合金电镀方法和系统 Pending CN110462107A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/005548 WO2020166062A1 (fr) 2019-02-15 2019-02-15 Procédé et système d'électrodéposition de zinc ou d'alliage de zinc

Publications (1)

Publication Number Publication Date
CN110462107A true CN110462107A (zh) 2019-11-15

Family

ID=68095230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980001581.1A Pending CN110462107A (zh) 2019-02-15 2019-02-15 锌或锌合金电镀方法和系统

Country Status (5)

Country Link
US (1) US20200263314A1 (fr)
EP (1) EP3715506A4 (fr)
JP (1) JP6582353B1 (fr)
CN (1) CN110462107A (fr)
WO (1) WO2020166062A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111826691A (zh) * 2020-08-21 2020-10-27 东北大学 一种溶剂化离子液体制备锌钽合金的方法
CN116406432A (zh) * 2021-12-02 2023-07-07 迪普索股份公司 用金属对物品进行电镀的方法和系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021131340A1 (fr) * 2019-12-23 2021-07-01 ディップソール株式会社 Bain galvanoplastique au zinc nickel et procédé de placage faisant appel à celui-ci
WO2022145170A1 (fr) 2020-12-28 2022-07-07 ディップソール株式会社 Procédé et système de placage électrolytique d'un article avec un métal
WO2023100381A1 (fr) 2021-12-02 2023-06-08 ディップソール株式会社 Procédé et système de placage électrolytique d'un article avec un métal
JP7442866B1 (ja) 2022-11-25 2024-03-05 ディップソール株式会社 電気めっき用陽極並びに金属で物品を電気めっきする方法及びシステム

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298192A (ja) * 1988-05-27 1989-12-01 Ebara Yuujiraito Kk 亜鉛−ニッケル合金めっき液
JPH03240987A (ja) * 1990-02-16 1991-10-28 Tdk Corp 有機物電解用電極及びその製造方法
US6432293B1 (en) * 1999-03-03 2002-08-13 Permelec Electrode Ltd. Process for copper-plating a wafer using an anode having an iridium oxide coating
JP2004068153A (ja) * 2002-07-23 2004-03-04 Nippon Hyomen Kagaku Kk ジンケート浴亜鉛めっき方法
CN103827360A (zh) * 2011-09-13 2014-05-28 学校法人同志社 电解镀敷用阳极及使用该阳极的电解镀敷法
CN105189831A (zh) * 2013-03-21 2015-12-23 安美特德国有限公司 用于在工件上电解沉积金属层的装置和方法
CN106550607A (zh) * 2015-07-22 2017-03-29 迪普索股份公司 锌合金镀敷方法
CN106550606A (zh) * 2015-07-22 2017-03-29 迪普索股份公司 锌合金镀敷方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3658823B2 (ja) * 1995-11-30 2005-06-08 ダイソー株式会社 電解用電極およびその製造方法
DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US7247229B2 (en) * 1999-06-28 2007-07-24 Eltech Systems Corporation Coatings for the inhibition of undesirable oxidation in an electrochemical cell
EP1717353B1 (fr) 2005-04-26 2009-04-22 ATOTECH Deutschland GmbH Bain galvanique contenant une membrane de filtration
JP4738910B2 (ja) 2005-06-21 2011-08-03 日本表面化学株式会社 亜鉛−ニッケル合金めっき方法
JP5676515B2 (ja) * 2012-04-11 2015-02-25 マテックス・ジャパン株式会社 不溶性金属電極、電解装置、および、めっき方法
EP3358045A1 (fr) * 2017-02-07 2018-08-08 Dr.Ing. Max Schlötter GmbH & Co. KG Procédé de dépôt par placage de revêtements en zinc et en alliage de zinc à partir d'un bain de revêtement alcalin à élimination réduite des additifs de bain organiques

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298192A (ja) * 1988-05-27 1989-12-01 Ebara Yuujiraito Kk 亜鉛−ニッケル合金めっき液
JPH03240987A (ja) * 1990-02-16 1991-10-28 Tdk Corp 有機物電解用電極及びその製造方法
US6432293B1 (en) * 1999-03-03 2002-08-13 Permelec Electrode Ltd. Process for copper-plating a wafer using an anode having an iridium oxide coating
JP2004068153A (ja) * 2002-07-23 2004-03-04 Nippon Hyomen Kagaku Kk ジンケート浴亜鉛めっき方法
CN103827360A (zh) * 2011-09-13 2014-05-28 学校法人同志社 电解镀敷用阳极及使用该阳极的电解镀敷法
CN105189831A (zh) * 2013-03-21 2015-12-23 安美特德国有限公司 用于在工件上电解沉积金属层的装置和方法
CN106550607A (zh) * 2015-07-22 2017-03-29 迪普索股份公司 锌合金镀敷方法
CN106550606A (zh) * 2015-07-22 2017-03-29 迪普索股份公司 锌合金镀敷方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111826691A (zh) * 2020-08-21 2020-10-27 东北大学 一种溶剂化离子液体制备锌钽合金的方法
CN111826691B (zh) * 2020-08-21 2021-09-21 东北大学 一种溶剂化离子液体制备锌钽合金的方法
CN116406432A (zh) * 2021-12-02 2023-07-07 迪普索股份公司 用金属对物品进行电镀的方法和系统

Also Published As

Publication number Publication date
EP3715506A1 (fr) 2020-09-30
JP6582353B1 (ja) 2019-10-02
JPWO2020166062A1 (ja) 2021-02-25
EP3715506A4 (fr) 2021-04-14
WO2020166062A1 (fr) 2020-08-20
US20200263314A1 (en) 2020-08-20

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