CN110461945A - 聚氨酯树脂组合物以及密封物 - Google Patents
聚氨酯树脂组合物以及密封物 Download PDFInfo
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- CN110461945A CN110461945A CN201880022461.5A CN201880022461A CN110461945A CN 110461945 A CN110461945 A CN 110461945A CN 201880022461 A CN201880022461 A CN 201880022461A CN 110461945 A CN110461945 A CN 110461945A
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- Prior art keywords
- polyurethane resin
- resin composition
- mass parts
- antioxidant
- mass
- Prior art date
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- 239000012948 isocyanate Substances 0.000 claims abstract description 20
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 18
- 125000004414 alkyl thio group Chemical group 0.000 claims abstract description 16
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Abstract
为了防止结露或免受污染,通常使用聚氨酯树脂组合物对电气电子元件等对象物进行密封。这样的聚氨酯树脂组合物也多在高温环境下使用。因此,本发明提供具有高耐热性的聚氨酯树脂组合物。聚氨酯树脂组合物是通过使含羟基化合物(A)与含异氰酸酯基化合物(B)反应而得到的聚氨酯树脂组合物,并且该聚氨酯树脂组合物包含具有烷硫基的抗氧化剂(C)。
Description
技术领域
本发明涉及聚氨酯树脂组合物和密封物。
背景技术
为了防止结露或免受污染,通常使用聚氨酯树脂组合物对电气电子元件等对象物进行密封(专利文献1)。这样的聚氨酯树脂组合物也多在高温环境下使用。
现有技术文献
专利文献
专利文献1:日本特开2008-231348号公报
专利文献2:日本特开2001-352156号公报
发明内容
发明欲解决的技术问题
然而,在暴露于高温环境的情况下,聚氨酯树脂组合物一旦软化或熔解,有时无法适当保护密封对象物。
该发明为了解决上述问题而完成,其目的在于提供一种具有高耐热性的聚氨酯树脂组合物。
用于解决问题的技术手段
本发明的发明人等为了解决上述问题而反复深入研究,结果发现通过使用具有某种结构的原料能够解决上述问题,至此完成了本发明。
即,本发明的聚氨酯树脂组合物是通过使含羟基化合物(A)与含异氰酸酯基化合物(B)反应而得到的聚氨酯树脂组合物,并且,所述聚氨酯树脂组合物包含具有烷硫基的抗氧化剂(C)。
在本发明中,聚氨酯树脂组合物包括利用含羟基化合物(A)与含异氰酸酯基化合物(B)的反应而固化中的物质以及固化后的物质。
发明效果
根据本发明,能够得到具有高耐热性的聚氨酯树脂组合物。
具体实施方式
首先,阐述本发明的实施方式的内容。
(1)本发明的实施方式涉及的聚氨酯树脂组合物是通过使含羟基化合物(A)与含异氰酸酯基化合物(B)反应而得到的聚氨酯树脂组合物,其中,包含具有烷硫基的抗氧化剂(C)。通过这样的构成,能够提高聚氨酯树脂组合物的耐热性。
(2)优选地,所述抗氧化剂(C)是具有所述烷硫基的苯酚化合物。通过这样的构成,能够进一步提高聚氨酯树脂组合物的耐热性。
(3)优选地,所述聚氨酯树脂组合物还包含无机填充剂(D),所述无机填充剂(D)的钠含量以Na2O换算为所述无机填充剂(D)的0.15质量%以下。通过这样的构成,能够进一步提高聚氨酯树脂组合物的耐热性。
(4)优选地,所述聚氨酯树脂组合物还包含无机填充剂(D),所述聚氨酯树脂组合物中,相对于100质量份的所述聚氨酯树脂组合物,包含20质量份~80质量份的所述无机填充剂(D)。根据这样的构成,例如能够对聚氨酯树脂组合物赋予高的导热性,并且能够将制备聚氨酯树脂组合物时的混合粘度控制在适于使用的范围。
(5)优选地,所述聚氨酯树脂组合物中,相对于100质量份的所述聚氨酯树脂组合物,包含0.05质量份~2.0质量份的所述抗氧化剂(C)。根据这样的构成,能够抑制聚氨酯树脂组合物的劣化并防止抗氧化剂向聚氨酯树脂组合物表面析出。
(6)本发明的实施方式涉及的密封物已由上述(1)~(5)中任一项所述的聚氨酯树脂组合物进行密封。通过这样的构成,能够利用耐热性高的聚氨酯树脂组合物适当保护密封对象物。
以下,详细说明本发明的实施方式。
作为本实施方式的含羟基化合物(A),没有特别限制,例如能够使用:蓖麻油系多元醇、聚醚多元醇、聚合物多元醇、低分子量二醇、聚酯多元醇、聚丁二烯多元醇、聚异戊二烯多元醇、二聚酸多元醇、氢化聚丁二烯多元醇或氢化聚异戊二烯多元醇等。另外,可以将它们中的2种以上组合使用。
作为含羟基化合物(A),从提高耐热性的观点考虑,优选包含蓖麻油系多元醇。在并用蓖麻油系多元醇与其他多元醇的情况下,蓖麻油系多元醇的配合量优选是所使用的全部多元醇的60质量%以上,更优选为70质量%以上,进一步优选为80质量%以上。
作为蓖麻油系多元醇,没有特别限制,能够使用:蓖麻油、氢化蓖麻油、蓖麻油与其他油脂的酯交换物、蓖麻油与多元醇的反应物、蓖麻油脂肪酸与多元醇的酯化反应物、对它们加成聚合了环氧烷而得到的物质等。另外,可以将它们中的2种以上组合使用。
作为聚醚多元醇,没有特别限制,例如能够使用:以水、丙二醇、乙二醇、丙三醇、三羟甲基丙烷、己三醇、三乙醇胺、二聚丙三醇、季戊四醇、乙二胺、甲基葡萄糖苷、芳香族二胺、山梨糖醇、蔗糖、磷酸等作为引发剂并且通过环氧烷(以下有时称为“AO”)的开环聚合而得到的物质等。另外,可以将它们中的2种以上组合使用。作为引发剂,优选以水、丙二醇、乙二醇、丙三醇、三羟甲基丙烷、己三醇作为起始物质的引发剂,作为AO,优选环氧乙烷、环氧丙烷和环氧丁烷。
作为聚合物多元醇,没有特别限制,例如能够使用:使所述聚醚多元醇与乙烯性不饱和单体(例如丁二烯、丙烯腈、苯乙烯等)在自由基聚合催化剂的存在下反应而得到的聚合物多元醇等。另外,可以将它们中的2种以上组合使用。
作为低分子量二醇,没有特别限制,例如能够使用:乙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、新戊二醇、二乙二醇、三乙二醇、四乙二醇、二丙二醇、三丙二醇、3-甲基-1,5-戊二醇、2-丁基-2-乙基-1,3-丙二醇、2-甲基-1,3-丙二醇等脂肪族二醇类;1,4-环己二醇、1,4-环己烷二甲醇、氢化双酚A等脂环族二醇类;丙三醇、三羟甲基丙烷、季戊四醇等3官能以上的含羟基化合物等。另外,可以将它们中的2种以上组合使用。
作为聚酯多元醇,没有特别限制,例如能够使用:含多羟基化合物与多元羧酸(芳香族多元羧酸和脂肪族多元羧酸)或酸酐及其低级烷基(烷基的碳原子数为1~4)酯等酯形成性衍生物(邻苯二甲酸酐二甲酯及对苯二甲酸二甲酯等)之间的缩合反应生成物;聚内酯多元醇;聚碳酸酯多元醇;以及蓖麻油衍生物[蓖麻油脂肪酸与多元醇或聚氧亚烷基多元醇形成的聚酯多元醇(蓖麻油脂肪酸的单甘油酯或二甘油酯;蓖麻油脂肪酸与三羟甲基丙烷的单酯、二酯或三酯;蓖麻油脂肪酸与聚氧丙二醇的单酯或二酯等);对蓖麻油加成了环氧烷(碳原子数2~4)后的产物;由蓖麻油与二苯甲烷二异氰酸酯衍生得到的羟基末端预聚物等]等。另外,可以将它们中的2种以上组合使用。
作为二聚酸多元醇,没有特别限制,例如能够使用二醇、三醇、聚亚烷基二醇或聚亚烷基三醇与二聚酸的反应生成物等。另外,可以将它们中的2种以上组合使用。二聚酸多元醇的重均分子量(Mw)优选为300~50000。另外,二聚酸多元醇的每1分子的平均官能团数优选为2~4。二聚酸多元醇的羟值优选为2mgKOH/g以上,更优选为30mgKOH/g以上。另外,二聚酸多元醇的羟值优选为800mgKOH/g以下,更优选为500mgKOH/g以下,进一步优选为300mgKOH/g以下。
作为聚丁二烯多元醇、聚异戊二烯多元醇、氢化聚丁二烯多元醇及氢化聚异戊二烯多元醇,没有特别限制,能够使用聚氨酯树脂组合物中通常使用的这些。
在本实施方式中,含羟基化合物(A)例如也可以是通过使含羟基化合物与含异氰酸酯基化合物反应而得到的羟基末端氨酯预聚物。
从成型体的成型性的观点考虑,相对于100质量份的聚氨酯树脂组合物,含羟基化合物(A)的含量优选为5质量份以上,更优选为10质量份以上,进一步优选为20质量份以上。另外,从成型体的成型性的观点考虑,相对于100质量份的聚氨酯树脂组合物,含羟基化合物(A)的含量优选为80质量份以下,更优选为70质量份以下,进一步优选为60质量份以下。
作为本实施方式的含异氰酸酯基化合物(B),没有特别限制,例如能够使用脂肪族多异氰酸酯化合物、脂环族多异氰酸酯化合物、芳香族多异氰酸酯化合物、芳香脂肪族多异氰酸酯化合物或者这些异氰酸酯化合物的改性体。另外,可以将它们中的2种以上组合使用。作为含异氰酸酯基化合物(B),优选脂肪族多异氰酸酯化合物、芳香族多异氰酸酯化合物或这些异氰酸酯化合物的改性体。
作为脂肪族多异氰酸酯化合物,能够使用四亚甲基二异氰酸酯、十二亚甲基二异氰酸酯、六亚甲基二异氰酸酯(HDI)、2,2,4-三甲基六亚甲基二异氰酸酯、2,4,4-三甲基六亚甲基二异氰酸酯、赖氨酸二异氰酸酯、2-甲基戊烷-1,5-二异氰酸酯、3-甲基戊烷-1,5-二异氰酸酯等。另外,可以将它们中的2种以上组合使用。
作为脂环族多异氰酸酯化合物,能够使用异佛尔酮二异氰酸酯、氢化苯二亚甲基二异氰酸酯(水添キシリレンジイソシアネート)、4,4’-二环己基甲烷二异氰酸酯、1,4-环己烷二异氰酸酯、甲基亚环己基二异氰酸酯、1,3-双(异氰酸酯甲基)环己烷等。另外,可以将它们中的2种以上组合使用。
作为芳香族多异氰酸酯化合物,能够使用二烷基二苯基甲烷二异氰酸酯、甲苯二异氰酸酯、2,2’-二苯基甲烷二异氰酸酯、2,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯(单体MDI)、多亚甲基多苯基多异氰酸酯(聚合MDI)、4,4’-二苄基二异氰酸酯、1,5-萘二异氰酸酯、1,3-苯二异氰酸酯、1,4-苯二异氰酸酯等。另外,可以将它们中的2种以上组合使用。
作为芳香脂肪族多异氰酸酯化合物,能够使用苯二亚甲基二异氰酸酯(日语:キシリレンジイソシアネート)、四烷基二苯基甲烷二异氰酸酯、α,α,α,α-四甲基苯二亚甲基二异氰酸酯(日语:α,α,α,α-テトラメチルキシリレンジイソシアネート)等。另外,可以将它们中的2种以上组合使用。
作为多异氰酸酯化合物的改性体,能够使用异氰脲酸酯改性体、双缩脲改性体、加成改性体、碳化二亚胺改性体、二官能改性体等。另外,可以将它们中的2种以上组合使用。
另外,在本实施方式中,含异氰酸酯基化合物(B)例如也可以是通过使含羟基化合物与含异氰酸酯基化合物反应而得到的异氰酸酯基末端氨基甲酸酯预聚物。
从成型体的成型性的观点考虑,相对于100质量份的聚氨酯树脂组合物,含异氰酸酯基化合物(B)的含量优选为0.5质量份以上,更优选为1质量份以上,进一步优选为1.5质量份以上。另外,从成型体的成型性的观点考虑,相对于100质量份的聚氨酯树脂组合物,含异氰酸酯基化合物(B)的含量优选为80质量份以下,更优选为70质量份以下,进一步优选为60质量份以下,进一步优选为50质量份以下。
在本实施方式中,含羟基化合物(A)的羟基与含异氰酸酯基化合物(B)的异氰酸酯基的摩尔比(NCO/OH)优选为0.6以上,更优选为0.8以上。当该摩尔比小于该范围时,可能产生固化不良以及得到的树脂的耐热性降低。另外,该摩尔比优选为1.5以下,更优选为1.3以下。当该摩尔比大于该范围时,有时会产生固化不良。
本实施方式中的抗氧化剂(C)具有烷硫基。从聚氨酯树脂组合物的耐热性的观点考虑,烷硫基中的碳原子数优选为6以上,更优选为7以上,进一步优选为8以上。作为具有烷硫基的抗氧化剂(C),例如能够使用:双[3-(十二烷硫基)丙酸]2,2-双[[3-(十二烷硫基)-1-丙酰氧基]甲基]-1,3-丙二醇酯(住友化学株式会社制、SUMILIZER TP-D)、2,4-双(辛硫基甲基)-6-甲基苯酚(BASF公司制、IRGANOX 1520L)、4-[[4,6-双(辛硫基)-1,3,5-三嗪-2-基]氨基]-2,6-二叔丁基苯酚(BASF公司制、IRGANOX 565)等。另外,可以将它们中的2种以上组合使用。
从提高耐热性的观点考虑,抗氧化剂(C)优选为苯酚化合物。作为具有烷硫基并且是苯酚化合物的抗氧化剂(C),例如可举出:IRGANOX 1520L、IRGANOX 565等。
另外,从提高耐热性的观点考虑,抗氧化剂(C)优选具有三嗪环。作为具有烷硫基和三嗪环的抗氧化剂(C),可举出IRGANOX 565。从提高耐热性的观点考虑,抗氧化剂(C)进一步优选为具有烷硫基和三嗪环的苯酚化合物。抗氧化剂(C)可以与其他抗氧化剂组合使用。
相对于100质量份聚氨酯树脂组合物,抗氧化剂(C)的配合量优选为2.0质量份以下,更优选为1.5质量份以下。另外,相对于100质量份聚氨酯树脂组合物,抗氧化剂(C)的配合量优选为0.05质量份以上,更优选为0.1质量份以上。
本实施方式的聚氨酯树脂组合物中能够加入无机填充剂(D)。无机填充剂(D)例如可用于提高聚氨酯树脂组合物的导热性和放热性。在聚氨酯树脂组合物的密封对象物是电气电子元件等发热体的情况下,对于聚氨酯树脂组合物要求一定程度以上的导热性和放热性。作为无机填充剂(D),能够使用氧化铝、氢氧化铝、氮化铝、氮化硼、氢氧化镁以及氧化镁等。
无机填充剂(D)的钠含量以Na2O换算优选为无机填充剂(D)的0.3质量%以下,更优选为0.2质量%以下,进一步优选为0.15质量%以下,进一步优选为0.10质量%以下。通过使无机填充剂(D)的钠含量为上述值以下,从而能够更为提高耐热性。
从提高聚氨酯树脂组合物的导热性和放热性的观点考虑,相对于100质量份的聚氨酯树脂组合物,无机填充剂(D)的配合量优选为20质量份以上,更优选为30质量份以上。另外,从抑制制造聚氨酯树脂组合物时的混合粘度的观点考虑,相对于聚氨酯树脂组合物100质量份,无机填充剂(D)的配合量优选为90质量份以下,更优选为80质量份以下。在制造时的混合粘度高的情况下,倾向于作业性降低。
本实施方式的聚氨酯树脂组合物中能够加入增塑剂(E)。作为增塑剂(E),能够使用聚氨酯树脂中使用的现有公知的增塑剂,例如能够使用:邻苯二甲酸二辛酯、邻苯二甲酸二异壬酯、邻苯二甲酸二(十一烷基)酯等邻苯二甲酸酯;1,2-环己烷二羧酸二异壬酯等非邻苯二甲酸酯化合物;己二酸二辛脂、己二酸二异壬酯等己二酸酯;乙酰基蓖麻酸甲酯、乙酰基蓖麻酸丁酯、乙酰化蓖麻酸甘油三酯、乙酰化聚蓖麻酸甘油三酯等蓖麻油系酯;偏苯三酸三辛酯、偏苯三酸三异壬酯等偏苯三酸酯;均苯四酸四辛酯、均苯四酸四异壬酯等均苯四酸酯;三甲苯基磷酸酯、三(二甲苯基)磷酸酯、甲苯二苯基磷酸酯、二甲苯基磷酸酯、三苯基磷酸酯等磷酸酯等。
相对于100质量份的聚氨酯树脂组合物,增塑剂(E)的配合量优选为30质量份以下,更优选为25质量份以下,进一步优选为20质量份以下。当增塑剂多时,聚氨酯树脂组合物的强度等各种物性可能下降。
此外,本实施方式的聚氨酯树脂组合物中,根据需要,可以加入催化剂、抗氧化剂、吸湿剂、防霉剂、硅烷偶联剂等各种添加剂。作为硅烷偶联剂,例如可举出:烷氧基硅烷类、含乙烯基的硅烷偶联剂、含环氧基的硅烷偶联剂、含甲基丙烯酸基的硅烷偶联剂、含丙烯酸基硅烷偶联剂等。
制造本实施方式的聚氨酯树脂组合物时的混合粘度在例如对25℃的原料进行的情况下,优选为5Pa·s以下,进一步优选为4Pa·s以下。混合粘度只要在上述数值以下,则作业性方面良好。混合粘度用实施例所记载的方法来测定。
本实施方式的聚氨酯树脂组合物的导热率在密封对象物为电气电子元件等发热体的情况下,优选为0.3W/m·K以上,更优选为0.4W/m·K以上。导热率由实施例所记载的方法测定。
利用本实施方式的聚氨酯树脂组合物,能够对电气电子元件、医疗用品、玩具及生活用品等物品进行密封。处于由聚氨酯树脂组合物密封的状态的物品也被称为密封物。
实施例
以下,基于实施例和比较例,更详细地说明本实施方式的聚氨酯树脂组合物。本发明并不受这些实施例的限制。另外,关于本说明书中的“份”、“%”,除特别明示的情况以外,分别表示“质量份”、“质量%”。
示出实施例和比较例中使用的原料。
[含羟基化合物]
·含羟基化合物(A1):植物油脂肪酸-多元醇酯
(商品名:HS2T-166H、丰国制油公司制)
·含羟基化合物(A2):蓖麻油系多元醇
(商品名:URIC H-57、伊藤制油公司制)
·含羟基化合物(A3):蓖麻油
(商品名:蓖麻油D、伊藤制油公司制)
[含异氰酸酯基化合物]
·含异氰酸酯基化合物(B1):聚合MDI
(商品名:MILLIONATE MR-200、TOSOH CORPORATION制)
·含异氰酸酯基化合物(B2):MDI的碳化二亚胺改性体
(商品名:Lupranate MM103、BASF INOAC聚氨酯公司制)
·含异氰酸酯基化合物(B3):HDI的异氰脲酸酯改性体
(商品名:Duranate TLA-100、旭化成化学株式会社制)
[抗氧化剂]
·抗氧化剂(C1):含烷硫基抗氧化剂(4-[[4,6-双(辛硫基)-1,3,5-三嗪-2-基]氨基]-2,6-二叔丁基苯酚)
(商品名:IRGANOX 565、BASF公司制)
·抗氧化剂(C2):含烷硫基抗氧化剂(2,4-双(辛硫基甲基)-6-甲基苯酚)
(商品名:IRGANOX 1520L、BASF公司制)
·抗氧化剂(Cc):非含烷硫基抗氧化剂(四[3-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇酯)
(商品名:ADEKA STAB AO-60、ADEKA公司制)
[无机填充剂]
·无机填充剂(D1):氢氧化铝(钠含量(Na2O换算):0.02质量%)
(商品名:BE-043、日本轻金属公司制)
·无机填充剂(D2):氢氧化铝(钠含量(Na2O换算):0.07质量%)
(商品名:CL-310、住友化学公司制)
·无机填充剂(D3):铝(钠含量(Na2O换算):0.07质量%)
(商品名:LS-220、日本轻金属公司制)
·无机填充剂(D4):氢氧化铝(钠含量(Na2O换算):0.17%)
(商品名:C-305、住友化学公司制)
[增塑剂]
·增塑剂(E1):邻苯二甲酸二(十一烷基)酯
(商品名:SANSO CIZER DUP、新日本理化株式会社制)
表1示出为了形成实施例1~15和比较例1~3的聚氨酯树脂组合物而使用的各原料及其配合量(质量份)以及后述的各评价的结果。
<聚氨酯树脂组合物的制备>
使用分散机(Primix公司制、机种名:TK HOMODISPER2.5型)将除了含异氰酸酯基化合物(B)以外的原料的混合物混合30分钟。然后,添加含异氰酸酯基化合物(B)至NCO/OH=1~1.1,进行混合和脱泡。使用按以上方式制备的聚氨酯树脂组合物,如后所述,对于耐热性、导热率及混合粘度进行评价。
<关于耐热性>
1.用于耐热性评价的试验片的制作
使制备后的固化前的聚氨酯树脂组合物流入到直径5cm的圆筒型的模具中至高度达3cm,在80℃的环境下静置16小时,由此使聚氨酯树脂组合物固化。然后,通过将固化后的聚氨酯树脂组合物脱模,从而得到耐热性评价用的试验片。
2.耐热性的评价
准备了在室温环境下静置了24小时后的试验片(以下,也称为未加热试验片)以及在150℃的高温环境下静置了24小时后的试验片(以下,也称为加热后试验片)。然后,按照JIS K6253测定未加热试验片和加热后试验片的各表面的硬度(Type A)。将加热后试验片的硬度相对于未加热试验片的硬度的比例作为硬度保持率(%),基于下述评价基准进行评价。
◎:硬度保持率为70%以上并且没有在加热后试验片上观察到溶解和外观变化
○:硬度保持率小于70%并且没有在加热后试验片上观察到溶解和外观变化
×:在加热后试验片上观察到溶解或外观变化(对于硬度未测量)
<关于导热率>
1.用于导热率评价的试验片的制作
使制备后的固化前的聚氨酯树脂组合物流入到底面为6cm×12cm的箱型的模具至高度达到1cm,在80℃的环境下静置16小时,从而使聚氨酯树脂组合物固化。然后,通过将固化后的聚氨酯树脂组合物脱模,从而得到导热率评价用的试验片。
2.导热率的评价
使用导热率计(京都电子工业株式会社制、QTM-D3),用探针法测定试验片的导热率。
<关于混合粘度>
测量制备聚氨酯树脂组合物时的混合粘度。具体而言,在除了含异氰酸酯基化合物(B)之外的原料的混合物中添加含异氰酸酯基化合物(B)而开始混合,使用BH型粘度计对5分钟后的混合粘度进行测量。进行混合时的各原料的温度和周围的温度为25℃。
<评价结果>
参照表1的评价结果,实施例1~15的聚氨酯树脂组合物的耐热性高且导热率良好,并且混合粘度处于能够适于使用的范围。另外,通过比较实施例1~13与实施例14、15可知,通过并用含有烷硫基的抗氧化剂以及钠成分为0.10质量%(Na2O换算)以下的无机填充剂,能够进一步提高聚氨酯树脂组合物的耐热性。另外,如比较例1~3所示,可知,如果使用不含有烷硫基的抗氧化剂,在与使用含有烷硫基的抗氧化剂的情况相比,耐热性显著变差。
Claims (6)
1.一种聚氨酯树脂组合物,其特征在于,
所述聚氨酯树脂组合物是通过使含羟基化合物(A)与含异氰酸酯基化合物(B)反应而得到,
所述聚氨酯树脂组合物包含具有烷硫基的抗氧化剂(C)。
2.根据权利要求1所述的聚氨酯树脂组合物,其特征在于,
所述抗氧化剂(C)是具有所述烷硫基的苯酚化合物。
3.根据权利要求1或2所述的聚氨酯树脂组合物,其特征在于,
所述聚氨酯树脂组合物还包含无机填充剂(D),
所述无机填充剂(D)的钠含量以Na2O换算为所述无机填充剂(D)的0.15质量%以下。
4.根据权利要求1至3中任1项所述的聚氨酯树脂组合物,其特征在于,
所述聚氨酯树脂组合物还包含无机填充剂(D),
所述聚氨酯树脂组合物中,相对于100质量份的所述聚氨酯树脂组合物,包含20质量份~80质量份的所述无机填充剂(D)。
5.根据权利要求1至4中任1项所述的聚氨酯树脂组合物,其特征在于,
所述聚氨酯树脂组合物中,相对于100质量份的所述聚氨酯树脂组合物,包含0.05质量份~2.0质量份的所述抗氧化剂(C)。
6.一种密封物,其特征在于,
所述密封物已被权利要求1至5中任1项所述的聚氨酯树脂组合物密封。
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