CN110358056B - 半导体密封环氧树脂组合物和半导体器件 - Google Patents
半导体密封环氧树脂组合物和半导体器件 Download PDFInfo
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- CN110358056B CN110358056B CN201910278430.2A CN201910278430A CN110358056B CN 110358056 B CN110358056 B CN 110358056B CN 201910278430 A CN201910278430 A CN 201910278430A CN 110358056 B CN110358056 B CN 110358056B
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- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- NMEUGQCECGTRSA-UHFFFAOYSA-N tris(4-cyanophenyl) phosphate Chemical compound C=1C=C(C#N)C=CC=1OP(OC=1C=CC(=CC=1)C#N)(=O)OC1=CC=C(C#N)C=C1 NMEUGQCECGTRSA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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Abstract
本发明提供半导体密封环氧树脂组合物和半导体器件。包含环氧树脂、固化剂、(A)含羧基的苯并三唑衍生物和(B)含烷氧基甲硅烷基的氨基烷基硅烷衍生物的环氧树脂组合物适用于密封半导体器件。相对于每100重量份环氧树脂和固化剂的总量,(A)+(B)的总量为0.5‑5.0重量份,摩尔比(A)/(B)为0.5‑1.5。该组合物不含硫,且对金属基底具有高粘合性。
Description
相关申请的交叉引用
该非临时申请根据35U.S.C§119(a)要求于2018年4月9日在日本提交的专利申请号2018-074419的优先权,其全部内容通过引用结合于此。
技术领域
该发明涉及一种半导体密封环氧树脂组合物和用该树脂组合物的固化产物密封的半导体器件。
背景技术
目前包括二极管、晶体管、IC和LSI的半导体器件的主流是树脂密封型。相对于其它热固性树脂,环氧树脂具有优异的成形性、粘合性、电学性质、机械性质和耐湿性。环氧树脂组合物常规用于密封半导体器件。十多年来,电子设备市场正朝着半导体器件小型化、轻量化和高性能以及半导体芯片的高集成度的方向发展。随着半导体器件封装技术的不断创新,对用作半导体密封剂的环氧树脂提出了更严格的要求。由于半导体器件目标在于更高的性能和集成度,所以半导体芯片倾向于释放更多的热量。虽然整个半导体器件的结构是为了有效散热,但密封树脂本身必须是耐热的。由于用于汽车和压力应用的半导体器件经常暴露于发动机等周围的高温环境下,所以密封树脂不仅必须耐热,而且还必须可靠。
虽然半导体芯片目标在于更高的性能,但仍需要降低半导体器件的成本。试图用铜、铜合金、银合金、铝等廉价的配线或互连线代替现有技术中常用的昂贵的金的配线或互连线。
此外,由于切换到无铅焊料,封装温度升高。如果半导体器件吸湿,则升高的温度会引起麻烦,例如,在安装期间封装破裂,以及密封剂与金属框架、有机基底或半导体芯片之间界面分离。因此,要求密封树脂组合物与金属框架、有机基底或半导体芯片紧密粘合。
在改进树脂与金属(诸如铜和银)的粘合性的方式中,一种常规技术是加入含硫增粘剂,诸如3-巯基丙基硅烷。此外,专利文件1提出具有噻吩结构的酚醛树脂的使用,专利文件2公开了酚二硫化物化合物。由于这些技术使用含硫化合物,所以存在金属被腐蚀的风险,因为有机组分在高温条件下分解以产生硫化物或硫酸根离子。
引用列表
专利文件1:JP-A 2001-065339
专利文件2:JP-A 2004-137397
发明内容
本发明的一个目的是提供一种半导体密封环氧树脂组合物,该组合物不含硫且与金属基底(特别是铜基底)紧密粘合,且提供一种用该组合物的固化产物密封的半导体器件。
本发明人已经发现,将(A)组分和(B)组分以(A)和(B)的总量落在相对于环氧树脂和固化剂总量的特定范围内且(A)/(B)的摩尔比落在特定范围内的量加入到包含环氧树脂和固化剂作为必要组分的环氧树脂组合物中,上述(A)组分为每个分子中具有至少一个羧基基团的苯并三唑衍生物,上述(B)组分为每个分子中具有至少一个烷氧基甲硅烷基基团的氨基烷基硅烷衍生物;此时,所得到的环氧树脂组合物与金属基底(尤其是铜基底)紧密粘合,而无需硫组分。
在一方面,本发明提供一种用于半导体密封的环氧树脂组合物,其包含环氧树脂和固化剂作为必要组分,该组合物还以(A)和(B)总量相对于每100重量份环氧树脂和固化剂的总量为0.5至5.0重量份且摩尔比(A)/(B)为0.5/1至1.5/1的量包含(A)组分和(B)组分,上述(A)组分为每个分子中具有至少一个羧基基团的苯并三唑衍生物,上述(B)组分为每个分子中具有至少一个烷氧基甲硅烷基基团的氨基烷基硅烷衍生物。
一般,固化剂是酚类固化剂。
在一个优选的实施方案中,组分(A)和(B)作为预混物存在,其通过使组分(A)和(B)以0.5/1至1.5/1的摩尔比(A)/(B)反应而获得。
优选地,组分(A)是具有式(1)的化合物:
其中R1是以羧基封端的C1-C10直链烷基基团或以羧基封端的C7-C20芳烃基团,R2是氢、C1-C10烷基基团、C1-C10含羟基的烃基基团或以羧基封端的C1-C10烃基基团。
优选地,组分(B)是具有式(2)的化合物:
其中R3是C1-C6烷基基团,R4是C1-C6烷基基团或C6-C10芳烃基基团,R5和R6各自独立地是氢、C1-C6烷基基团、C1-C6含氨基的烷基基团、或C6-C10芳烃基团,n为1至3的整数,且m为1至6的整数。
本文还提供了用环氧树脂组合物的固化产物密封的半导体器件。
发明的有益效果
本发明的环氧树脂组合物固化成可与金属(特别是铜)紧密粘合的产物,而无需硫组分。该组合物有利地用作半导体器件的密封剂,上述半导体器件包括铜基底、铜线、铜散热器等。
具体实施方式
符号(Cn-Cm)是指每个基团含有n至m个碳原子的基团。
环氧树脂组合物
本发明的一个实施方案是适用于半导体密封的环氧树脂组合物,其包含环氧树脂和固化剂作为必要组分。对于该组合物,以(A)和(B)总量相对于每100重量份环氧树脂和固化剂的总量为0.5至5.0重量份且摩尔比(A)/(B)为0.5/1至1.5/1的量加入(A)组分和(B)组分,上述(A)组分为每个分子中具有至少一个羧基基团的苯并三唑衍生物,上述(B)组分为每个分子中具有至少一个烷氧基甲硅烷基基团的氨基烷基硅烷衍生物。
环氧树脂
环氧树脂是本发明组合物中的基础聚合物。包括每分子具有至少两个环氧基团的单体、低聚物和聚合物。环氧树脂的分子量和分子结构不受限制。实例包括酚醛清漆型环氧树脂(诸如苯酚酚醛清漆型环氧树脂、甲酚酚醛清漆型环氧树脂和萘酚酚醛清漆型环氧树脂);结晶环氧树脂(诸如联苯型环氧树脂、双酚型环氧树脂、二苯乙烯型环氧树脂、二氢蒽二醇型环氧树脂(dihydroanthracene diol type epoxy resins));多官能环氧树脂(诸如三酚甲烷型环氧树脂和烷基改性的三酚甲烷型环氧树脂);芳烷基型环氧树脂(诸如具有亚苯基骨架的苯酚芳烷基型环氧树脂、具有亚联苯基骨架的苯酚芳烷基型环氧树脂、具有亚苯基骨架的萘酚芳烷基型环氧树脂、和具有亚联苯基骨架的萘酚芳烷基型环氧树脂);萘酚型环氧树脂(诸如二羟基萘型环氧树脂、通过将二羟基萘的二聚体转化为缩水甘油醚形式而获得的环氧树脂);含三嗪核的环氧树脂(诸如异氰脲酸三缩水甘油酯、异氰脲酸单烯丙基二缩水甘油酯);环状烃改性的酚型环氧树脂(诸如二环戊二烯改性酚型环氧树脂)。这些树脂可以单独使用或混合使用。
固化剂
其它必要组分是固化剂,其一般是酚醛树脂/酚类树脂(phenolic resin)。其包括每分子具有至少两个酚羟基基团的单体、低聚物和聚合物。酚醛树脂的分子量和分子结构不受限制。实例包括苯酚酚醛清漆树脂、苯酚酚醛清漆型酚醛树脂、含萘环酚醛树脂、芳烷基型酚醛树脂、三酚烷烃型酚醛树脂、联苯型酚醛树脂、联苯芳烷基型酚醛树脂、脂环族酚醛树脂、杂环酚醛树脂、含萘环酚醛树脂、和双酚型酚醛树脂(诸如双酚A树脂和双酚F树脂)。这些树脂可以单独使用或混合使用。
在本公开内容中,组合的环氧树脂和固化剂(酚类固化剂)有时被称为“热固性树脂组分”。假设热固性树脂组分的量为100重量份,其用作配制其它组分的基础。在热固性树脂组分中,100重量份的环氧树脂与20-400重量份、优选60-140重量份的固化剂组合。
组分(A)
组分(A)是在分子结构中具有至少一个羧基基团的苯并三唑衍生物。优选具有式(1)的苯并三唑衍生物。
本文中R1是以羧基封端的C1-C10、优选C1-C6直链烷基基团,或以羧基封端的C7-C20、优选C7-C10芳烃基基团。R1的实例包括羧甲基、2-羧乙基、3-羧丙基、4-羧丁基、邻羧苯基、间羧苯基、对羧苯基、邻羧苄基、间羧苄基和对羧苄基。
R2是氢,C1-C10、优选C1-C6烷基基团,C1-C10、优选C1-C6含羟基的烃基基团,或以羧基封端的C1-C10、优选C1-C6烃基基团。R2的实例包括氢,烷基基团(诸如甲基、乙基、丙基、异丙基、正丁基、异丁基、叔丁基、戊基和己基)、含羟基的烃基基团(诸如羟甲基、2-羟乙基、3-羟丙基和4-羟丁基),和羧基封端的烃基基团(诸如羧甲基、2-羧乙基、3-羧丙基和4-羧丁基)。
具有式(1)的苯并三唑衍生物的实例包括4-羧基苯并三唑、5-羧基苯并三唑、其混合物和其水合物。
以相对于每100重量份热固性树脂组分(即,环氧树脂+固化剂)为0.15至4.0重量份、优选0.2至3.0重量份的量使用组分(A)。
组分(B)
组分(B)是每分子具有至少一个烷氧基甲硅烷基基团的氨基烷基硅烷衍生物。优选具有式(2)的氨基烷基硅烷和/或其水解产物。
在此,R3是C1-C6、优选C1-C4烷基基团。实例包括甲基、乙基、丙基、异丙基和正丁基。
R4是C1-C6、优选C1-C4烷基基团,或C6-C10、优选C6-C8芳烃基基团。合适的烷基基团包括甲基、乙基、丙基、异丙基和正丁基。合适的芳基基团包括苯基、苄基和甲苯基。
R5和R6各自独立地选自氢,C1-C6、优选C1-C4烷基基团,C1-C6含氨基的烷基基团,和C6-C10芳烃基基团。实例包括氢、烷基基团(诸如甲基、乙基、丙基、异丙基和正丁基)、含氨基的烷基基团(诸如氨基甲基、2-氨基乙基、3-氨基丙基)、和芳烃基基团(诸如苯基、苄基和甲苯基)。
下标n为1至3、优选为2或3的整数,m为1至6的整数,优选为1、2或3。
具有式(2)的氨基烷基硅烷的实例包括三烷氧基硅烷(诸如N-(β-氨乙基)-γ-氨基丙基三甲氧基硅烷、γ-氨丙基三乙氧基硅烷、γ-氨丙基三甲氧基硅烷、N-苯基-γ-氨丙基三甲氧基硅烷);和二烷氧基硅烷(诸如N-(β-氨乙基)-γ-氨丙基二甲氧基甲基硅烷、γ-氨丙基二乙氧基甲基硅烷、γ-氨丙基二甲氧基甲基硅烷、N-苯基-γ-氨丙基二甲氧基甲基硅烷)。除了具有式(2)的氨基烷基硅烷之外,还可以使用含氨基的双硅烷,诸如双(γ-三甲氧基甲硅烷基丙基)-N-甲胺和双(γ-二甲氧基甲基甲硅烷基丙基)-N-苯胺。前述化合物的部分水解产物、两种或更多种前述化合物的共水解产物、以及任意两种或更多种的混合物也是有用的。其中,从反应性的观点来看,那些具有伯胺的化合物是期望的,最优选的是γ-氨丙基三甲氧基硅烷。
以相对于每100重量份热固性树脂组分(即,环氧树脂+固化剂)为0.25至5.0重量份、优选0.3至4.0重量份的量使用组分(B)。
在环氧树脂组合物中,苯并三唑衍生物(A)和氨基烷基硅烷衍生物(B)以使得摩尔比(A)/(B)为0.5/1至1.5/1、优选0.7/1至1.2/1的量存在。
在另一个实施方案中,组分(A)和(B)可以作为预混物存在于环氧树脂组合物中,上述预混物通过使苯并三唑衍生物(A)和氨基烷基硅烷衍生物(B)以摩尔比(A)/(B)为0.5至1.5、优选0.7至1.2反应而获得。
如果摩尔比(A)/(B)小于0.5,则苯并三唑衍生物(A)难以分散在树脂中。如果摩尔比(A)/(B)大于1.5,则由于氨基的碱性,树脂粘度可能增加。
将苯并三唑衍生物(A)和氨基烷基硅烷衍生物(B)以如下量共混:相对于每100重量份热固性树脂组分(即,环氧树脂+固化剂),组分(A)和(B)的总量或预混物的量为0.5-5.0重量份、优选0.7-3.0重量份、更优选1.0至2.0重量份。如果组分(A)和(B)的总量小于0.5重量份,则粘合性可能差。如果组分(A)和(B)的总量超过5.0重量份,则耐热解性可能差。
其它组分
环氧树脂组合物可以进一步含有选自公知增粘剂的增粘剂。例如,硅烷偶联剂和钛酸酯偶联剂是合适的。实例包括环氧硅烷(诸如γ-缩水甘油氧基丙基三甲氧基硅烷、γ-缩水甘油氧基丙基甲基二乙氧基硅烷、β-(3,4-环氧环己基)乙基三甲氧基硅烷);和钛酸酯偶联剂(诸如异丙基三异硬脂酰基钛酸酯、双(二辛基焦磷酸)氧乙酸钛酸酯)(bis(dioctylpyrophosphate)oxyacetate titanate)。其中,优选环氧硅烷偶联剂,诸如γ-缩水甘油氧基丙基三甲氧基硅烷和γ-缩水甘油氧基丙基甲基二乙氧基硅烷。
相对于每100重量份热固性树脂组分,增粘剂的用量一般为0.25至2.5重量份、优选0.35至1.5重量份、更优选0.5至1.0重量份。如果增粘剂的量小于0.25份,则粘合性可能差。如果增粘剂的量超过2.5份,则耐热解性可能差。应注意,当苯并三唑衍生物(A)和氨基烷基硅烷衍生物(B)或其预混物与增粘剂组合使用时,相对于每100重量份的热固性树脂组分,组分(A)和(B)的总量或预混物的量与增粘剂的量的总和一般为0.5至5.0重量份、优选0.7至3.0重量份、更优选1.0至2.0重量份。增粘剂的量优选等于或小于组分(A)和(B)总量的一半。
环氧树脂组合物可以进一步含有其它添加剂,只要不损害本发明的益处即可。合适的其它添加剂包括除环氧树脂和酚醛树脂之外的氰酸酯树脂、热固性树脂(诸如马来酰亚胺树脂)、固化促进剂、无机填料、脱模剂、阻燃剂、离子捕获剂、颜料和增韧剂。
合适的氰酸酯树脂没有特别限制,只要分子结构具有至少两个氰酸酯基团即可。可以使用任何可商购的氰酸酯树脂。实例包括双(4-氰氧苯基)甲烷、双(3-甲基-4-氰氧苯基)甲烷、双(3-乙基-4-氰氧苯基)甲烷、双(3,5-二甲基-4-氰氧苯基)甲烷、1,1-双(4-氰氧苯基)乙烷、2,2-双(4-氰氧苯基)丙烷、2,2-双(4-氰氧苯基)-1,1,1,3,3,3-六氟丙烷、二(4-氰氧苯基)硫醚、1,3-或1,4-二氰酸苯酯(dicyanatobenzene)、2-叔丁基-1,4-二氰酸苯酯、2,4-二甲基-1,3-二氰酸苯酯、2,5-二叔丁基-1,4-二氰酸苯酯、四甲基-1,4-二氰酸苯酯、1,3,5-三氰酸苯酯、2,2'-或4,4'-二氰氧联苯、3,3',5,5'-四甲基-4,4'-二氰氧联苯、1,3-、1,4-、1,5-、1,6-、1,8-、2,6-或2,7-二氰氧萘、1,3,6-三氰氧萘、双(4-氰氧苯基)甲烷;2,2-双(4-氰氧苯基)丙烷、1,1,1-三(4-氰氧苯基)乙烷、双(4-氰氧苯基)醚、4,4'-(1,3-亚苯基二异亚丙基)二苯基氰酸酯、双(4-氰氧苯基)硫醚、双(4-氰氧苯基)砜、三(4-氰氧苯基)膦、三(4-氰氧苯基)磷酸酯、苯酚酚醛清漆型氰酸酯、甲酚酚醛清漆型氰酸酯、二环戊二烯酚醛清漆型氰酸酯、苯基芳烷基型氰酸酯、联苯基芳烷基型氰酸酯和萘芳烷基型氰酸酯。这些氰酸酯可以单独使用或混合使用。
合适的马来酰亚胺树脂没有特别限制,只要该分子结构具有至少两个马来酰亚胺基团即可。可以使用任何可商购的马来酰亚胺树脂。实例包括二官能双马来酰亚胺(诸如4,4'-二苯基甲烷双马来酰亚胺、间亚苯基双马来酰亚胺、双酚A二苯基醚双马来酰亚胺、3,3-二甲基-5,5-二苯基甲烷双马来酰亚胺、4-甲基-1,3-亚苯基双马来酰亚胺、1,6-双马来酰亚胺-(2,2,4-三甲基)己烷);和多官能马来酰亚胺(诸如苯基甲烷马来酰亚胺)。其中,从溶解的观点来看,期望的是具有最高175℃的熔点的4,4'-二苯基甲烷双马来酰亚胺。
可以使用能够帮助环氧树脂和氰酸酯树脂固化的任何公知的固化促进剂。合适的固化促进剂包括叔胺化合物、季铵盐、咪唑、脲化合物、膦化合物和鏻盐。实例包括叔胺化合物(诸如三乙胺、三亚乙基二胺、苄基二甲基胺、2,4,6-三(二甲基氨基甲基)苯酚、1,8-二氮杂双环(5,4,0)十一碳烯-7);咪唑(诸如2-甲基咪唑、2,4-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑);脲化合物(诸如3-苯基-1,1-二甲基脲、3-(邻甲基苯基)-1,1-二甲基脲、3-(对甲基苯基)-1,1-二甲基脲、1,1'-亚苯基双(3,3-二甲基脲)、1,1'-(4-甲基-间亚苯基)-双(3,3-二甲基脲));膦化合物(诸如三苯基膦、三丁基膦、三(对甲基苯基)膦、三(壬基苯基)膦);和鏻盐(诸如三苯基鏻酚盐(例如4-羟基-2-(三苯基鏻)酚盐)、四苯基鏻四苯基硼酸盐和四苯基鏻四萘甲酸硼酸盐)、及其微胶囊形式。它们可以单独使用或混合使用。相对于每100重量份热固性树脂组分,所使用的固化促进剂的量优选为0.5至5.0重量份,更优选1.0至3.0重量份,尽管固化促进剂的量根据与其组合的特定树脂而变化。如果固化促进剂的量小于0.5份,则组合物可能未固化。如果固化促进剂的量超过5.0份,则成形可能无效。
合适的无机填料包括二氧化硅(诸如熔融二氧化硅、晶体二氧化硅和方石英),以及氧化铝、氮化硅、氮化铝、氮化硼、氧化钛、玻璃纤维、氧化铝纤维、氧化镁和氧化锌。填料的形状和平均粒径没有特别限制,并且根据预期应用来选择形状和尺寸。平均粒径一般为1至50μm,尤其是4至25μm。如本文所用,平均粒径是通过激光衍射粒径分布测量系统测定的中值直径(D50)。填料可以单独使用或混合使用。
当在5g样品/50g水的浓度中,在120℃和2.1atm的条件下,从填料中提取杂质时,无机填料优选具有至多10ppm、更优选至多5ppm的氯离子含量和至多10ppm、更优选至多5ppm的钠离子含量。只要杂质含量在该范围内,就不存在用所填充的组合物密封的半导体器件经受耐湿性下降的风险。
相对于每100重量份的热固性树脂组分,无机填料以优选为150至1,500重量份、更优选为250至1,200重量份的量共混。同样优选无机填料占树脂组合物总重量的60-94重量%、更优选65-92重量%、甚至更优选70-90重量%。
在使用之前,优选用偶联剂对无机填料进行表面处理,以提高树脂和填料之间的粘结强度。合适的偶联剂是硅烷偶联剂和钛酸酯偶联剂。优选的硅烷偶联剂包括环氧硅烷(诸如γ-缩水甘油氧基丙基三甲氧基硅烷、γ-缩水甘油氧基丙基甲基二乙氧基硅烷、β-(3,4-环氧环己基)乙基三甲氧基硅烷);和氨基硅烷(诸如N-(β-氨基乙基)-γ-氨基丙基三甲氧基硅烷,咪唑与γ-缩水甘油氧基丙基三甲氧基硅烷的反应产物、γ-氨基丙基三乙氧基硅烷、N-苯基-γ-氨基丙基三甲氧基硅烷)。所用偶联剂的量和表面处理模式没有特别限制,可以按照标准技术。应注意,用于填料表面处理的偶联剂不包括在增粘剂中。
脱模剂没有特别限制,可以使用任何公知的试剂。示例性的是蜡(包括巴西棕榈蜡、米蜡)、聚乙烯、聚氧化乙烯、褐煤酸、褐煤酸与饱和醇(诸如2-(2-羟乙基氨基)乙醇、乙二醇和甘油)的酯化合物,以及硬脂酸、硬脂酸酯、硬脂酰胺、亚乙基双(硬脂酰胺)、以及乙烯与乙酸乙烯酯的共聚物。脱模剂可以单独使用或混合使用。
相对于每100重量份的组分(A)和(B)的组合,共混的脱模剂的量优选为0.5至5重量份、更优选为1至3重量份。如果脱模剂的量小于0.5份,则组合物可能难以从模具中分离出来。超过5份的量可能对外观有害。
阻燃剂没有特别限制,可以使用任何公知的阻燃剂。实例包括磷腈化合物、有机硅化合物、载有钼酸锌的滑石、载有钼酸锌的氧化锌、氢氧化铝、氢氧化镁、氧化钼和三氧化锑,它们可以单独使用或混合使用。
相对于每100重量份组分(A)和(B)组合,共混的阻燃剂的量优选为2至20重量份,更优选3至10重量份。少于2份的阻燃剂可能是无效的,而超过20份的阻燃剂可能不利于流动性。
离子捕获剂没有特别限制,可以使用任何公知的试剂。实例包括水滑石、氢氧化铋和稀土氧化物,它们可以单独使用或混合使用。
相对于每100重量份组分(A)和(B)组合,共混的离子捕获剂的量优选为0.5至10重量份,更优选1.5至5重量份。少于0.5份的离子捕获剂可能对改进密封产品的电学性质是无效的,而超过10份的试剂可能不利于流动性。
本发明的环氧树脂组合物可通过任何所需方法制备。例如,树脂组合物可以通过以下方法获得:将环氧树脂、固化剂、苯并三唑衍生物(A)、氨基烷基硅烷(B)和任选组分以预定的组成比例组合,在混合器上充分混合直至均匀,在热轧机、捏合机或挤出机上将它们熔融混合,冷却混合物以固化,并将固体研磨至合适的尺寸。所得组合物适于作为成形材料使用。
半导体器件
环氧树脂组合物作为半导体器件(包括晶体管、模块、DIP、SO、扁平封装和球栅阵列型器件)的密封剂是有用的。用树脂组合物密封半导体器件的方法没有特别限制。可以使用任何现有技术的成形方法(诸如传递成形、注塑成形和铸塑),其中传递成形是优选的。
环氧树脂组合物优选在合适的条件下成形或固化,一般在160至190℃下进行45至300秒,并且理想地在170至250℃下后固化2至16小时。
环氧树脂组合物与铜基底和镀银基底的粘合性得到改进。用固化组合物密封的半导体器件由于紧密粘合而改进了耐回流性。本发明的组合物还在生产率方面得到改进,因为常规环氧树脂组合物的传递成形中所使用的相同的装置和条件是适用的。
实施例
以下通过说明而非限制的方式给出本发明的实施例。
实施例中所使用的组分如下所示。
主要成分
(A)苯并三唑衍生物:
4-羧基苯并三唑(CBT-1,Johoku Chemical Co.,Ltd.)
(B)氨基烷基硅烷衍生物:
3-氨基丙基三甲氧基硅烷
(KBM-903,信越化学株式会社)
环氧树脂1:甲酚酚醛清漆型环氧树脂
(N-665-EXP-S,环氧当量202g/eq,DIC Corp.)
环氧树脂2:联苯基芳烷基型环氧树脂
(NC-3000,环氧当量273g/eq,Nippon Kayaku Co.,Ltd.)
苯酚固化剂1:苯酚酚醛清漆型酚固化剂
(Phenolite TD-2131,羟基当量104g/eq,DIC Corp.)
苯酚固化剂2:联苯基芳烷基型酚固化剂
(MEH-7851,羟基当量203g/eq,Meiwa Chemical Co.,Ltd.)
其它组分
无机填料:RS-8225H(平均粒径15μm,Tatsumori Ltd.)
固化促进剂:4-羟基-2-(三苯基鏻)酚盐
(CAT-MBA,Shinryo Corp.)
增粘剂:3-缩水甘油氧基丙基三甲氧基硅烷
(KBM-403,信越化学株式会社)
脱模剂:巴西棕榈蜡(TOWAX-131,Toa Chemical Co.,Ltd.)
组分(A)和(B)的预混物:
通过以下工序制备预混物1至3,并配制成表1中所示的量。
预混物1
向配备有搅拌器、回流冷凝器、滴液漏斗和温度计的1L可拆式烧瓶中装入81.6g(0.5mol)4-羧基苯并三唑(CBT-1,Johoku Chemical Co.,Ltd.)和200g甲苯,并在40℃加热。向该溶液中滴加89.7g(0.5mol)3-氨基丙基三甲氧基硅烷(KBM-903,信越化学株式会社)。将溶液在30℃下搅拌1小时,然后过滤并干燥。获得白色固体产物。在1H-NMR分析中,该产物被鉴定为4-羧基苯并三唑/3-氨基丙基三甲氧基硅烷盐。
预混物2
向配备有搅拌器、回流冷凝器、滴液漏斗和温度计的1L可拆式烧瓶中装入40.8g(0.25mol)4-羧基苯并三唑(CBT-1,Johoku Chemical Co.,Ltd.)和200g甲苯,并在40℃加热。向该溶液中滴加89.7g(0.5mol)3-氨基丙基三甲氧基硅烷(KBM-903,信越化学株式会社)。将溶液在30℃下搅拌1小时,然后在150℃下减压加热1小时以蒸发掉甲苯,直至挥发物含量低于2%。获得浆状产物。
预混物3
除了使用122.4g(0.75mol)4-羧基苯并三唑之外,通过与预混物2相同的工序制备预混物3。
通过按照表1和2中所示的配方共混各组分,在热的双辊研磨机上将它们熔融混合直至均匀,冷却和粉碎来制备组合物。通过以下测试评估组合物。结果也显示在表1和2中。
粘合性测试
在15mm×15mm×0.15mm厚的铜合金(Olin C7025)基底上,将表1和2中的每种组合物在175℃、120秒和6.9MPa压力的成形条件下传递成形为底面积10mm2和高度3.5mm的零件。将成形零件在180℃下后固化4小时。使用模具剪切测试机(DAGE),以0.2mm/s的剪切速率对成形零件(或试样)施加剪切力。测量将零件从基底表面剥离时的剪切强度。类似地制备试样,并使用镀镍基底进行测试。
耐回流性测试
使用银糊(Henkel AG)将0.7mm×0.7mm×300μm厚的硅芯片安装在铜合金(C7025)的QFP 100引脚引线框架上。在该测试基底上,将表1和2中的每种组合物在175℃、120秒和6.9MPa压力的条件下传递成形(或密封)。然后在180℃下后固化4小时,完成试样。将试样在85℃和60%湿度下保持168小时后,通过IR回流处理(IR reflow treatment)在260℃下进行测试。使用超声波探伤仪,观察封装是否被剥离。测试10个试样,并计算剥离的试样的数量。
表1
表2
从苯并三唑衍生物或氨基烷基硅烷衍生物是分开共混的比较例2和3中可以明显看出,没有实现粘结力的显著改进。这表明苯并三唑衍生物和氨基烷基硅烷衍生物的组合使用是重要的。摩尔比(A)/(B)在0.5至1.5的范围之外的比较例4和5表明,仅获得接近单独共混的粘合力。苯并三唑衍生物和氨基烷基硅烷衍生物的量过量的比较例7显示出耐回流性的降低。这是因为氨基烷基硅烷衍生物产生在回流期间挥发的醇,并且过量添加量导致耐回流性的降低。
从这些结果可以认为,对铜具有高亲和性的苯并三唑排列在金属表面上,并且苯并三唑中的羧酸部分与氨基烷基硅烷的相互作用确保了紧密粘合。
由于本发明的环氧树脂组合物不含硫原子,因此消除了硫酸根离子生成和由硫化物引起的金属劣化的风险。该组合物对如铜和镍的金属具有高粘结力,并呈现出良好的耐回流性。因此,该组合物有利地适用于期望使用铜线或铜基底的半导体器件和存在含硫组分分解风险的设置在发动机附近并暴露于高温下的车载设备。另外,由于该组合物对镍粘合,所以可以原样使用除非通常涂覆有聚酰亚胺等否则难以确保可靠性的镍基底,带来步骤的简化。因此,该组合物具有很大的工业价值。
日本专利申请号2018-074419通过引用结合入本文中。
尽管已经描述了一些优选实施方案,但是根据上述教导可以对其进行许多修改和变化。因此,应该理解,在不脱离所附权利要求的范围的情况下,可以以不同于具体描述的方式实施本发明。
Claims (5)
1.一种用于半导体密封的环氧树脂组合物,包含环氧树脂和固化剂作为必要组分,
所述组合物还以如下量包含组分(A)和组分(B):组分(A)和(B)作为预混物存在,所述预混物是通过使组分(A)和(B)以0.5/1至1.5/1的摩尔比(A)/(B)反应并形成它们的盐而获得的,且组分(A)和(B)总量相对于每100重量份环氧树脂和固化剂的总量为0.5至5.0重量份,
所述组分(A)为每个分子中具有至少一个羧基基团的苯并三唑衍生物,所述组分(B)为每个分子中具有至少一个烷氧基甲硅烷基基团的氨基烷基硅烷衍生物。
2.根据权利要求1所述的组合物,其中所述固化剂是酚类固化剂。
3.根据权利要求1所述的组合物,其中组分(A)是4-羧基苯并三唑、5-羧基苯并三唑、其混合物或其水合物。
4.根据权利要求1所述的组合物,其中组分(B)是具有式(2)的化合物:
其中R3是C1-C6烷基基团,R4是C1-C6烷基基团或C6-C10芳烃基基团,R5和R6各自独立地是氢、或以伯氨基基团封端的C1-C6亚烷基基团,n为1至3的整数,且m为1至6的整数。
5.一种用权利要求1所述的环氧树脂组合物的固化产物密封的半导体器件。
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