CN110337711B - 粘合片 - Google Patents
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- CN110337711B CN110337711B CN201780087474.6A CN201780087474A CN110337711B CN 110337711 B CN110337711 B CN 110337711B CN 201780087474 A CN201780087474 A CN 201780087474A CN 110337711 B CN110337711 B CN 110337711B
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- Prior art keywords
- adhesive
- adhesive sheet
- pressure
- sensitive adhesive
- adhesive layer
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 237
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 237
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- 239000000203 mixture Substances 0.000 claims abstract description 101
- 238000007789 sealing Methods 0.000 claims abstract description 75
- 239000012790 adhesive layer Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 46
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- 239000012298 atmosphere Substances 0.000 claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 57
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- 125000000217 alkyl group Chemical group 0.000 claims description 21
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
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PCT/JP2017/007978 WO2018158857A1 (ja) | 2017-02-28 | 2017-02-28 | 粘着シート |
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JP (1) | JP6220487B1 (ko) |
KR (1) | KR102653071B1 (ko) |
CN (1) | CN110337711B (ko) |
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WO (1) | WO2018158857A1 (ko) |
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CN111907186A (zh) * | 2017-09-28 | 2020-11-10 | 日东电工株式会社 | 增强薄膜 |
KR102116599B1 (ko) * | 2017-09-28 | 2020-06-05 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름 및 이를 포함하는 플라스틱 유기 전자 소자 |
EP3780072A4 (en) | 2018-03-30 | 2021-12-29 | Mitsui Chemicals Tohcello, Inc. | Electronic device manufacturing method |
KR102262695B1 (ko) | 2018-11-22 | 2021-06-08 | 주식회사 엘지화학 | 폴더블 백플레이트, 폴더블 백플레이트의 제조방법 및 이를 포함하는 폴더블 디스플레이 장치 |
JP7372526B2 (ja) | 2019-09-24 | 2023-11-01 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光モジュールの製造方法 |
JP7459576B2 (ja) | 2020-03-12 | 2024-04-02 | 株式会社レゾナック | パネル及びその製造方法、パネル製造用部材及びその製造方法、並びに半導体チップ |
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JPH0598233A (ja) * | 1991-10-14 | 1993-04-20 | Sumitomo Bakelite Co Ltd | 熱圧着可能なフイルム状接着剤 |
JP2002085442A (ja) * | 2000-09-12 | 2002-03-26 | Nitto Denko Corp | ヒートシール用シート基材、及びこれを備えてなる袋材、並びにこれを用いた使い捨てカイロ |
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JP5552404B2 (ja) | 2010-09-14 | 2014-07-16 | 日東電工株式会社 | 半導体装置製造用耐熱性粘着テープ及びそのテープを用いた半導体装置の製造方法。 |
JP2012129649A (ja) | 2010-12-13 | 2012-07-05 | Murata Mach Ltd | 画像読取装置 |
JP5754158B2 (ja) | 2011-02-15 | 2015-07-29 | 富士ゼロックス株式会社 | 帯電装置及びこれを用いた画像形成組立体、画像形成装置 |
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JP2013074184A (ja) * | 2011-09-28 | 2013-04-22 | Nitto Denko Corp | 半導体装置の製造方法 |
US20130298469A1 (en) * | 2012-05-08 | 2013-11-14 | Guardian Industries Corp., | Silanol-inclusive adhesives, articles including components bonded to one another using silanol-inclusive adhesives, and/or associated methods |
-
2017
- 2017-02-28 JP JP2017541406A patent/JP6220487B1/ja active Active
- 2017-02-28 WO PCT/JP2017/007978 patent/WO2018158857A1/ja active Application Filing
- 2017-02-28 CN CN201780087474.6A patent/CN110337711B/zh active Active
- 2017-02-28 KR KR1020197019761A patent/KR102653071B1/ko active IP Right Grant
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JP2012011658A (ja) * | 2010-06-30 | 2012-01-19 | Teijin Dupont Films Japan Ltd | インモールド転写材用粘着離型ポリエステルフィルム |
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CN110337711A (zh) | 2019-10-15 |
KR20190118553A (ko) | 2019-10-18 |
TWI743238B (zh) | 2021-10-21 |
TW201834087A (zh) | 2018-09-16 |
WO2018158857A1 (ja) | 2018-09-07 |
JPWO2018158857A1 (ja) | 2019-03-07 |
JP6220487B1 (ja) | 2017-10-25 |
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