JP6220487B1 - 粘着シート - Google Patents

粘着シート Download PDF

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Publication number
JP6220487B1
JP6220487B1 JP2017541406A JP2017541406A JP6220487B1 JP 6220487 B1 JP6220487 B1 JP 6220487B1 JP 2017541406 A JP2017541406 A JP 2017541406A JP 2017541406 A JP2017541406 A JP 2017541406A JP 6220487 B1 JP6220487 B1 JP 6220487B1
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
acrylic
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017541406A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2018158857A1 (ja
Inventor
高野　健
健 高野
和浩 菊池
和浩 菊池
泰紀 柄澤
泰紀 柄澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of JP6220487B1 publication Critical patent/JP6220487B1/ja
Publication of JPWO2018158857A1 publication Critical patent/JPWO2018158857A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2017541406A 2017-02-28 2017-02-28 粘着シート Active JP6220487B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/007978 WO2018158857A1 (ja) 2017-02-28 2017-02-28 粘着シート

Publications (2)

Publication Number Publication Date
JP6220487B1 true JP6220487B1 (ja) 2017-10-25
JPWO2018158857A1 JPWO2018158857A1 (ja) 2019-03-07

Family

ID=60156790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017541406A Active JP6220487B1 (ja) 2017-02-28 2017-02-28 粘着シート

Country Status (5)

Country Link
JP (1) JP6220487B1 (ko)
KR (1) KR102653071B1 (ko)
CN (1) CN110337711B (ko)
TW (1) TWI743238B (ko)
WO (1) WO2018158857A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102542225B1 (ko) 2018-03-30 2023-06-12 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065375A1 (ja) * 2017-09-28 2019-04-04 日東電工株式会社 補強フィルム
KR102116599B1 (ko) * 2017-09-28 2020-06-05 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름 및 이를 포함하는 플라스틱 유기 전자 소자
KR102262695B1 (ko) 2018-11-22 2021-06-08 주식회사 엘지화학 폴더블 백플레이트, 폴더블 백플레이트의 제조방법 및 이를 포함하는 폴더블 디스플레이 장치
JP7372526B2 (ja) 2019-09-24 2023-11-01 日亜化学工業株式会社 発光装置の製造方法及び発光モジュールの製造方法
JP7459576B2 (ja) 2020-03-12 2024-04-02 株式会社レゾナック パネル及びその製造方法、パネル製造用部材及びその製造方法、並びに半導体チップ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134811A (ja) * 2009-12-22 2011-07-07 Nitto Denko Corp 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法
JP2015168711A (ja) * 2014-03-05 2015-09-28 日東電工株式会社 粘着シート

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JP2716608B2 (ja) * 1991-10-14 1998-02-18 住友ベークライト株式会社 熱圧着可能なフィルム状接着剤
JP2002085442A (ja) * 2000-09-12 2002-03-26 Nitto Denko Corp ヒートシール用シート基材、及びこれを備えてなる袋材、並びにこれを用いた使い捨てカイロ
JP2008274119A (ja) * 2007-04-27 2008-11-13 Kaneka Corp 硬化性組成物
JP2009242776A (ja) * 2008-03-14 2009-10-22 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP5600038B2 (ja) * 2010-06-30 2014-10-01 帝人デュポンフィルム株式会社 インモールド転写材用粘着離型ポリエステルフィルム
JP5552404B2 (ja) 2010-09-14 2014-07-16 日東電工株式会社 半導体装置製造用耐熱性粘着テープ及びそのテープを用いた半導体装置の製造方法。
JP2012129649A (ja) 2010-12-13 2012-07-05 Murata Mach Ltd 画像読取装置
JP5754158B2 (ja) 2011-02-15 2015-07-29 富士ゼロックス株式会社 帯電装置及びこれを用いた画像形成組立体、画像形成装置
JP5837381B2 (ja) * 2011-09-28 2015-12-24 日東電工株式会社 半導体装置の製造方法
JP2013074184A (ja) * 2011-09-28 2013-04-22 Nitto Denko Corp 半導体装置の製造方法
US20130298469A1 (en) * 2012-05-08 2013-11-14 Guardian Industries Corp., Silanol-inclusive adhesives, articles including components bonded to one another using silanol-inclusive adhesives, and/or associated methods
JP2015007191A (ja) * 2013-06-25 2015-01-15 株式会社日本触媒 不飽和カルボニル変性共役ジエン系水添ポリマーを用いたエネルギー線硬化型樹脂組成物
JP6295550B2 (ja) * 2013-09-03 2018-03-20 Dic株式会社 光硬化型樹脂組成物
JP6162033B2 (ja) * 2013-11-29 2017-07-12 綜研化学株式会社 光学用粘着剤組成物、光学用粘着シート、および画像表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134811A (ja) * 2009-12-22 2011-07-07 Nitto Denko Corp 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法
JP2015168711A (ja) * 2014-03-05 2015-09-28 日東電工株式会社 粘着シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102542225B1 (ko) 2018-03-30 2023-06-12 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법

Also Published As

Publication number Publication date
CN110337711B (zh) 2022-11-04
KR20190118553A (ko) 2019-10-18
KR102653071B1 (ko) 2024-03-29
JPWO2018158857A1 (ja) 2019-03-07
TW201834087A (zh) 2018-09-16
WO2018158857A1 (ja) 2018-09-07
TWI743238B (zh) 2021-10-21
CN110337711A (zh) 2019-10-15

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