CN110337711B - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- CN110337711B CN110337711B CN201780087474.6A CN201780087474A CN110337711B CN 110337711 B CN110337711 B CN 110337711B CN 201780087474 A CN201780087474 A CN 201780087474A CN 110337711 B CN110337711 B CN 110337711B
- Authority
- CN
- China
- Prior art keywords
- adhesive
- adhesive sheet
- pressure
- sensitive adhesive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 237
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 237
- 239000004065 semiconductor Substances 0.000 claims abstract description 118
- 239000000203 mixture Substances 0.000 claims abstract description 101
- 238000007789 sealing Methods 0.000 claims abstract description 75
- 239000012790 adhesive layer Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229920001721 polyimide Polymers 0.000 claims abstract description 41
- 239000012298 atmosphere Substances 0.000 claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 57
- -1 2-ethylhexyl Chemical group 0.000 claims description 54
- 229920006243 acrylic copolymer Polymers 0.000 claims description 53
- 239000003431 cross linking reagent Substances 0.000 claims description 50
- 239000000178 monomer Substances 0.000 claims description 38
- 229920001577 copolymer Polymers 0.000 claims description 34
- 238000004132 cross linking Methods 0.000 claims description 29
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 26
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 229920002050 silicone resin Polymers 0.000 claims description 21
- 239000002318 adhesion promoter Substances 0.000 claims description 19
- 229920001296 polysiloxane Polymers 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 18
- 239000013464 silicone adhesive Substances 0.000 claims description 14
- 239000003522 acrylic cement Substances 0.000 claims description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 140
- 229920005989 resin Polymers 0.000 description 74
- 239000011347 resin Substances 0.000 description 74
- 239000010410 layer Substances 0.000 description 63
- 238000000034 method Methods 0.000 description 57
- 239000013256 coordination polymer Substances 0.000 description 42
- 238000010438 heat treatment Methods 0.000 description 39
- 239000000463 material Substances 0.000 description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 32
- 238000004519 manufacturing process Methods 0.000 description 25
- 238000000576 coating method Methods 0.000 description 23
- 239000007789 gas Substances 0.000 description 23
- 230000003014 reinforcing effect Effects 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 22
- 239000000047 product Substances 0.000 description 22
- 238000001723 curing Methods 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 229920002379 silicone rubber Polymers 0.000 description 14
- 239000004945 silicone rubber Substances 0.000 description 14
- 239000005062 Polybutadiene Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 238000007259 addition reaction Methods 0.000 description 13
- 229920002857 polybutadiene Polymers 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000010894 electron beam technology Methods 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 9
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 150000002513 isocyanates Chemical class 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- 239000012752 auxiliary agent Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 238000001029 thermal curing Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000012644 addition polymerization Methods 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 125000000466 oxiranyl group Chemical group 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- HXQKJEIGFRLGIH-UHFFFAOYSA-N 1-ethenyl-2h-pyrazine Chemical compound C=CN1CC=NC=C1 HXQKJEIGFRLGIH-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BSQQSDPTDVETTH-UHFFFAOYSA-N 3-ethenyl-1-methylpyrrolidin-2-one Chemical compound CN1CCC(C=C)C1=O BSQQSDPTDVETTH-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- CFZDMXAOSDDDRT-UHFFFAOYSA-N 4-ethenylmorpholine Chemical compound C=CN1CCOCC1 CFZDMXAOSDDDRT-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical class CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MGTPLVPKJIZKQE-UHFFFAOYSA-N [Pt]#P Chemical class [Pt]#P MGTPLVPKJIZKQE-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to an adhesive sheet (10) used when sealing a semiconductor element on the adhesive sheet, wherein the adhesive sheet (10) comprises a substrate (11) and an adhesive layer (12) containing an adhesive composition, the value of the adhesive layer (12) determined by a die pull test of silicon in a gas atmosphere of 100 ℃ is 3.0N/die or more, and the adhesive strength of the adhesive layer (12) to a polyimide film in a gas atmosphere of 40 ℃ is 1.0N/25mm or less after the adhesive layer is adhered to the polyimide film and heated at 190 ℃ for 1 hour.
Description
Technical Field
The present invention relates to an adhesive sheet.
Background
In recent years, chip Size Package (CSP) technology has been attracting attention as a mounting technology. Among these technologies, a Wafer Level Package (WLP) is particularly attracting attention in terms of miniaturization and high integration, as a Package that is performed only in the form of a chip without using a substrate. In such a substrate-less manufacturing method such as WLP, conventionally, it is necessary to fix a chip fixed on a substrate to a separate support. Therefore, for example, in the production of semiconductor devices, adhesive sheets are used as supports for temporarily fixing chips (patent documents 1 to 4).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2011-134811
Patent document 2: japanese unexamined patent publication No. 2012-062373
Patent document 3: japanese patent laid-open No. 2012-168394
Patent document 4: japanese patent laid-open No. 2012-129649
Disclosure of Invention
Problems to be solved by the invention
However, the conventional adhesive tape does not necessarily sufficiently prevent the semiconductor element from moving (hereinafter, also referred to as "chip misalignment") when sealing the semiconductor element.
On the other hand, in the case where a heat treatment for thermally curing the sealing resin is performed under a temperature condition higher than a conventional temperature condition (for example, 180 ℃ or higher) in the method for manufacturing a semiconductor device, the following problems are encountered in the conventional adhesive sheet: when the pressure-sensitive adhesive sheet is peeled from an adherend after heat treatment, there is a problem that the pressure-sensitive adhesive (so-called adhesive residue) remains on the surface of the adherend, etc., and contamination occurs. In particular, when the adherend is a semiconductor element provided with a polyimide film, and the polyimide film is a surface to be adhered, the adhesive has high adhesion to the polyimide film, and adhesive residue is likely to occur.
The purpose of the present invention is to provide an adhesive sheet that can achieve both prevention of chip misalignment when sealing a semiconductor element on the adhesive sheet and good peelability when peeling the adhesive sheet from an adherend, particularly when the semiconductor element has a polyimide film.
Means for solving the problems
According to one embodiment of the present invention, there is provided an adhesive sheet used for sealing a semiconductor element on the adhesive sheet, the adhesive sheet comprising a substrate and an adhesive layer containing an adhesive composition, wherein the value of the adhesive layer determined by a die pull test on silicon in a gas atmosphere at 100 ℃ is 3.0N/die or more, and the adhesive strength of the adhesive layer to a polyimide film in a gas atmosphere at 40 ℃ is 1.0N/25mm or less after the adhesive layer is attached to the polyimide film and heated at 190 ℃ for 1 hour.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, it is preferable that the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet has an adhesive strength of 0.1N/25mm or more to the polyimide film in a gas atmosphere at 40 ℃ after the pressure-sensitive adhesive layer is adhered to the polyimide film and heated at 190 ℃ for 1 hour.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, it is preferable that the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet has an adhesive strength to the polyimide film of 0.4N/25mm or more and 10.0N/25mm or less at room temperature after being bonded to the polyimide film and heated at 190 ℃ for 1 hour.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the substrate preferably has a storage modulus of 1 × 10 at 100 ℃ 7 Pa or above.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the pressure-sensitive adhesive layer is preferably formed from an acrylic pressure-sensitive adhesive composition or a silicone pressure-sensitive adhesive composition.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the pressure-sensitive adhesive layer is preferably formed from an acrylic pressure-sensitive adhesive composition.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the acrylic pressure-sensitive adhesive composition preferably contains an acrylic copolymer containing a copolymer component derived from an alkyl (meth) acrylate ester, the alkyl group of which has 6 to 10 carbon atoms.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the ratio of the mass of the copolymer component derived from the alkyl (meth) acrylate to the total mass of the acrylic copolymer is preferably 90 mass% or more.
In the adhesive sheet according to one embodiment of the present invention, the acrylic copolymer preferably contains an acrylic copolymer containing 2-ethylhexyl (meth) acrylate as a main monomer.
In the adhesive sheet according to one embodiment of the present invention, the acrylic copolymer preferably contains a copolymer component derived from a monomer having a hydroxyl group.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the proportion of the mass of the copolymer component derived from the monomer having a hydroxyl group in the total mass of the acrylic copolymer is preferably 3 mass% or more.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the acrylic pressure-sensitive adhesive composition preferably contains a crosslinked product obtained by crosslinking a composition containing at least the acrylic copolymer and the crosslinking agent.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the acrylic pressure-sensitive adhesive composition preferably contains a pressure-sensitive adhesive auxiliary agent, and the pressure-sensitive adhesive auxiliary agent contains an oligomer having a reactive group.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the pressure-sensitive adhesive composition preferably contains a crosslinked product obtained by crosslinking a composition containing at least the acrylic copolymer, the pressure-sensitive adhesive auxiliary agent, and a crosslinking agent containing a compound having an isocyanate group as a main component.
In the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the pressure-sensitive adhesive layer is preferably formed from a silicone-based pressure-sensitive adhesive composition containing an addition-polymerizable silicone resin.
According to the present invention, it is possible to provide an adhesive sheet that can achieve both prevention of chip misalignment when sealing a semiconductor element on the adhesive sheet and good peelability when peeling the adhesive sheet from an adherend, particularly when the semiconductor element has a polyimide film.
Drawings
Fig. 1 is a schematic cross-sectional view of a psa sheet according to a first embodiment.
Fig. 2A is a diagram illustrating a part of a process for manufacturing a semiconductor device using the adhesive sheet according to the first embodiment.
Fig. 2B is a diagram illustrating a part of a process for manufacturing a semiconductor device using the adhesive sheet according to the first embodiment.
Fig. 2C is a diagram illustrating a part of a process for manufacturing a semiconductor device using the adhesive sheet according to the first embodiment.
Fig. 2D is a diagram illustrating a part of a process for manufacturing a semiconductor device using the adhesive sheet according to the first embodiment.
Fig. 2E is a diagram illustrating a part of a process for manufacturing a semiconductor device using the adhesive sheet according to the first embodiment.
FIG. 3A is an explanatory view for explaining a method of a chip pull test.
FIG. 3B is an explanatory view for explaining a method of a chip pull test.
FIG. 3C is an explanatory view for explaining a method of a chip pull test.
FIG. 3D is an explanatory view for explaining a method of a chip pull test.
FIG. 3E is an explanatory view for explaining a method of a chip pull test.
FIG. 3F is an explanatory view for explaining a method of a chip pull test.
FIG. 3G is an explanatory view for explaining a method of a chip pull test.
FIG. 3H is an explanatory view for explaining a method of a chip pull test.
Description of the symbols
10-8230and adhesive sheet
11 \ 8230and base material
12' \ 8230and adhesive layer
20-8230and frame member
21 8230a mouth part
Detailed Description
[ first embodiment ]
[ adhesive sheet ]
Fig. 1 shows a schematic sectional view of an adhesive sheet 10 of the present embodiment.
The adhesive sheet 10 has a substrate 11 and an adhesive layer 12 containing an adhesive composition.
The substrate 11 has a first substrate surface 11a and a second substrate surface 11b on the opposite side of the first substrate surface 11 a. In the psa sheet 10 of the present embodiment, a psa layer 12 is laminated on the first substrate surface 11 a. On the pressure-sensitive adhesive layer 12, a release sheet RL is laminated as shown in fig. 1.
The shape of the adhesive sheet 10 may be any shape such as a tape shape or a label shape.
The pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive sheet 10 according to the present embodiment is required to have a value of 3.0N/chip or more as determined by a die pull test on silicon in a gas atmosphere of 100 ℃, and to have an adhesive strength to a polyimide film in a gas atmosphere of 40 ℃ (hereinafter also referred to as "adhesive strength in a gas atmosphere of 40 ℃ after heating") of 1.0N/25mm or less after the pressure-sensitive adhesive layer 12 is attached to the polyimide film and heated at 190 ℃ for 1 hour.
When the value obtained by the die pull test is 3.0N/die or more, the semiconductor element can be prevented from moving and causing a positional deviation (hereinafter, also referred to as "die shift") when sealing the semiconductor element on the adhesive sheet. The reason is not clear, but it is presumed that the mechanism is based on the following. That is, it is estimated that the chip shift does not occur in which the semiconductor element slides laterally on the pressure-sensitive adhesive layer 12, but occurs in which the semiconductor element is peeled off from the pressure-sensitive adhesive layer 12, moves, and then is bonded again. The higher the value obtained by the die pull test, the more difficult the semiconductor element is to be peeled from the pressure-sensitive adhesive layer 12. From this, it is estimated that there is a correlation between the value obtained by the die pull test and the die shift.
In addition, if the adhesive strength (adhesive strength in a 40 ℃ gas atmosphere after heating) of the adhesive sheet 10 under the above conditions is 1.0N/25mm or less, adhesive residue does not occur when the adhesive sheet 10 is peeled from an adherend even after heating, particularly in the case where a polyimide film is an adherend surface.
In the present specification, the adhesive force is a value measured by a 180 ° peel method at a peel speed (stretching speed) of 300mm/min and a width of the adhesive sheet of 25mm, and more specifically, the adhesive force in a gas atmosphere at 40 ℃ after heating can be measured by the method described in the examples below.
In the present embodiment, the value obtained by the die pull test is preferably 3.2N/chip or more, more preferably 3.4N/chip or more and 15N/chip or less, from the viewpoint of more reliably preventing the misalignment of the semiconductor element.
If the value obtained by the die pull test is less than 3.0N/die, die displacement may occur, and if it exceeds 15N/die, the circuit surface of the semiconductor element may be damaged when the semiconductor element is peeled from the adhesive sheet.
The value of the pressure-sensitive adhesive layer 12 obtained by a die pull test of silicon in a gas atmosphere of 100 ℃ can be measured by the method described in the examples below.
As a method for adjusting the value obtained by the die pull test, the following method can be mentioned. For example, the value obtained by the die pull test can be adjusted by changing the composition of the pressure-sensitive adhesive composition used for the pressure-sensitive adhesive layer 12.
In the present embodiment, the adhesive force (adhesive force in a 40 ℃ gas atmosphere after heating) of the adhesive sheet 10 under the above conditions is preferably 0.8N/25mm or less, and more preferably 0.5N/25mm or less.
The lower limit of the adhesive force (adhesive force in a gas atmosphere at 40 ℃ after heating) of the adhesive sheet 10 under the above conditions is preferably 0.1N/25mm or more.
As a method for adjusting the adhesive force (adhesive force in a gas atmosphere at 40 ℃ after heating) of the adhesive sheet 10, the following method can be mentioned. For example, the adhesive strength of the psa sheet 10 (adhesive strength after heating in a 40 ℃ gas atmosphere) can be adjusted by changing the composition of the psa composition used in the psa layer 12.
In the adhesive sheet 10, the adhesive strength to the polyimide film at room temperature after the adhesive layer 12 is adhered to the polyimide film and heated at 190 ℃ for 1 hour (hereinafter, also referred to as "adhesive strength at room temperature after heating") is preferably 0.4N/25mm or more and 10.0N/25mm or less, more preferably 1.0N/25mm or more and 8.0N/25mm or less.
If the adhesive strength of the adhesive sheet 10 after heating at room temperature is within the above range, the adhesive sheet 10 does not fall off from the substrate 11 or the adherend at room temperature after heating, and can be easily peeled off by heating at the time of peeling.
In this specification, the room temperature means 23 ℃.
(substrate)
The substrate 11 is a member supporting the adhesive layer 12.
As the substrate 11, for example, a sheet material such as a synthetic resin film can be used. Examples of the synthetic resin film include: polyethylene films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene-vinyl acetate copolymer films, ionomer resin films, ethylene- (meth) acrylic acid copolymer films, ethylene- (meth) acrylic acid ester copolymer films, polystyrene films, polycarbonate films, polyimide films, and the like. The substrate 11 may be a crosslinked film, a laminated film, or the like.
The base material 11 preferably contains a polyester resin, and more preferably is made of a material mainly composed of a polyester resin. In the present specification, the material containing a polyester-based resin as a main component means that the ratio of the mass of the polyester-based resin to the total mass of the materials constituting the base material is 50 mass% or more. The polyester resin is preferably any resin selected from, for example, polyethylene terephthalate resins, polybutylene terephthalate resins, polyethylene naphthalate resins, polybutylene naphthalate resins, and copolymer resins thereof, and more preferably a polyethylene terephthalate resin.
The substrate 11 is preferably a polyethylene terephthalate film or a polyethylene naphthalate film, and more preferably a polyethylene terephthalate film.
From the viewpoint of dimensional stability during processing, the lower limit of the storage modulus of the base material 11 at 100 ℃ is preferably 1 × 10 7 Pa or more, more preferably 1X 10 8 Pa or above. From the viewpoint of processability, the upper limit of the storage modulus of the base material 11 at 100 ℃ is preferably 1 × 10 12 Pa or less.
In the present specification, the storage modulus of the base material 11 at 100 ℃ is a value of the tensile elastic modulus measured at a frequency of 1Hz using a viscoelasticity measuring apparatus. The substrate to be measured was cut into a width of 5mm and a length of 20mm, and the storage modulus at 100 ℃ was measured in a tensile mode at a frequency of 1Hz using a viscoelasticity measuring apparatus (DMAQ 800, manufactured by TA Instruments).
In order to improve the adhesion between the substrate 11 and the pressure-sensitive adhesive layer 12, the first substrate surface 11a may be subjected to at least one surface treatment selected from primer treatment, corona treatment, plasma treatment, and the like. In order to improve the adhesion between the base material 11 and the pressure-sensitive adhesive layer 12, a preliminary adhesion treatment may be performed by applying a pressure-sensitive adhesive to the first base material surface 11a of the base material 11. Examples of the adhesive that can be used for the adhesion treatment of the substrate 11 include: adhesives such as acrylic adhesives, rubber adhesives, silicone adhesives, and urethane adhesives.
The thickness of the substrate 11 is preferably 10 μm or more and 500 μm or less, more preferably 15 μm or more and 300 μm or less, and further preferably 20 μm or more and 250 μm or less.
(adhesive layer)
The adhesive layer 12 according to the present embodiment contains an adhesive composition. The binder contained in the binder composition is not particularly limited, and various binders can be applied to the binder layer 12. Examples of the binder contained in the binder layer 12 include: rubber-based adhesives, acrylic adhesives, silicone-based adhesives, polyester-based adhesives, urethane-based adhesives, and the like. The type of the adhesive may be selected in consideration of the application, the type of the adherend to be bonded, and the like. The pressure-sensitive adhesive layer 12 is preferably formed of an acrylic pressure-sensitive adhesive composition or a silicone pressure-sensitive adhesive composition, and more preferably formed of an acrylic pressure-sensitive adhesive composition. By forming the adhesive layer 12 from an acrylic adhesive composition, the adhesive residue can be effectively reduced.
Acrylic adhesive composition
When the pressure-sensitive adhesive layer 12 is formed of an acrylic pressure-sensitive adhesive composition, the acrylic pressure-sensitive adhesive composition preferably contains an acrylic copolymer. At this time, the acrylic copolymer preferably contains a monomer derived from an alkyl (meth) acrylate (CH) 2 ＝CR 1 COOR 2 (R 1 Is hydrogen or methyl, R 2 Linear, branched or cyclic (alicyclic)) alkyl group). In addition, alkyl acrylate (CH) is preferred 2 ＝CR 1 COOR 2 ) Is partially or wholly an alkyl group R 2 Alkyl (meth) acrylate having 6 to 10 carbon atoms. As alkyl radicals R 2 The alkyl (meth) acrylate having 6 to 10 carbon atoms includes: n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, and n-decyl (meth) acrylate. Among these alkyl (meth) acrylates, R is preferred 2 Is a linear or branched alkyl group, more preferably 2-ethylhexyl (meth) acrylate, and still more preferably 2-ethylhexyl acrylate.
In the present embodiment, the acrylic copolymer preferably includes an acrylic copolymer having 2-ethylhexyl (meth) acrylate as a main monomer.
In the present specification, the term "2-ethylhexyl (meth) acrylate as a main monomer" means that the proportion of the mass of the copolymer component derived from 2-ethylhexyl (meth) acrylate in the total mass of the acrylic copolymer is 50 mass% or more.
As alkyl radicals R 2 Alkyl (meth) acrylate having 1 to 5 or 11 to 20 carbon atoms (the above CH) 2 ＝CR 1 COOR 2 ) Examples thereof include: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, n-pentyl (meth) acrylate, n-dodecyl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate, and stearyl (meth) acrylate.
The alkyl (meth) acrylate may be used alone or in combination of two or more.
In the present specification, "(meth) acrylic acid" is used to indicate both "acrylic acid" and "methacrylic acid", and the same applies to other similar terms.
In bookIn an embodiment, the acrylic copolymer preferably contains the above CH 2 ＝CR 1 COOR 2 An acrylic copolymer as a main monomer.
In this specification, CH is 2 ＝CR 1 COOR 2 Being a main monomer means derived from CH 2 ＝CR 1 COOR 2 The ratio of the mass of the copolymer component (b) to the total mass of the acrylic copolymer is 50 mass% or more.
In the present embodiment, the adhesive strength of the adhesive sheet 10, in which the adhesive layer 12 is bonded to a polyimide film and heated at 190 ℃ for 1 hour, to the polyimide film in a gas atmosphere at 40 ℃, is adjusted by the alkyl (meth) acrylate (CH) 2 ＝CR 1 COOR 2 ) The proportion of the mass of the copolymer component (b) in the total mass of the acrylic copolymer is preferably 50 mass% or more, more preferably 60 mass% or more, further preferably 80 mass% or more, and further preferably 90 mass% or more. Derived from an alkyl (meth) acrylate (CH described above) from the viewpoint of improving initial adhesion force or the like 2 ＝CR 1 COOR 2 ) The proportion by mass of the copolymer component (b) of (3) is preferably 96% by mass or less.
When the first copolymer component in the acrylic copolymer is an alkyl (meth) acrylate, the type and amount of the copolymer component other than the alkyl (meth) acrylate (hereinafter referred to as "second copolymer component") in the acrylic copolymer are not particularly limited. For example, the second copolymer component is preferably a functional group-containing monomer having a reactive functional group. When a crosslinking agent described later is used as the reactive functional group of the second copolymer component, a functional group capable of reacting with the crosslinking agent is preferable. The reactive functional group is preferably at least any substituent selected from, for example, a carboxyl group, a hydroxyl group, an amino group, a substituted amino group, and an epoxy group, and more preferably at least any substituent selected from a carboxyl group and a hydroxyl group.
Examples of the monomer having a carboxyl group (hereinafter also referred to as "carboxyl group-containing monomer") include: ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. Among the carboxyl group-containing monomers, acrylic acid is preferred from the viewpoint of reactivity and copolymerizability. The carboxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the monomer having a hydroxyl group (hereinafter also referred to as "hydroxyl group-containing monomer") include: hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate. Among the hydroxyl group-containing monomers, 2-hydroxyethyl (meth) acrylate is preferable from the viewpoint of reactivity of the hydroxyl group and copolymerizability. The hydroxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the acrylate having an epoxy group include: glycidyl acrylate, glycidyl methacrylate, and the like.
As the second copolymer component in the acrylic copolymer, in addition to the above, there can be cited a copolymer component derived from at least any one monomer selected from the group consisting of, for example: alkoxyalkyl group-containing (meth) acrylate, (meth) acrylate having an aromatic ring, non-crosslinkable acrylamide, (meth) acrylate having a non-crosslinkable tertiary amino group, vinyl acetate, and styrene.
Examples of the alkoxyalkyl group-containing (meth) acrylate include: methoxymethyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxymethyl (meth) acrylate, and ethoxyethyl (meth) acrylate.
Examples of the (meth) acrylate having an aromatic ring include: phenyl (meth) acrylate, and the like.
Examples of the non-crosslinkable acrylamide include: acrylamide, methacrylamide, and the like.
Examples of the non-crosslinkable (meth) acrylic acid ester having a tertiary amino group include: (N, N-dimethylamino) ethyl (meth) acrylate, and (N, N-dimethylamino) propyl (meth) acrylate.
These monomers may be used alone or in combination of two or more.
In addition to the above, the second copolymer component in the acrylic copolymer is preferably a copolymer component derived from a monomer having a nitrogen atom-containing ring from the viewpoint of improving the polarity of the adhesive, improving the adhesion and the adhesive strength.
Examples of the monomer having a nitrogen atom-containing ring include: n-vinyl-2-pyrrolidone, N-methyl vinyl pyrrolidone, N-vinyl piperidone, N-vinyl piperazine, N-vinyl pyrazine, N-vinyl pyrrole, N-vinyl imidazole, N-vinyl morpholine, N-vinyl caprolactam, N- (meth) acryloyl morpholine and the like. The monomer having a nitrogen atom-containing ring is preferably N- (meth) acryloylmorpholine.
These monomers may be used alone or in combination of two or more.
In the present embodiment, the acrylic copolymer preferably contains a copolymer component derived from a monomer having a hydroxyl group.
When the acrylic copolymer contains a copolymer component derived from a monomer having a hydroxyl group, the cohesive property of the adhesive is improved by crosslinking with the hydroxyl group as a crosslinking point when a crosslinking agent described later is used, and as a result, the adhesiveness of the adhesive sheet is improved. This improves the chip tensile test value.
The proportion of the mass of the copolymer component derived from the monomer having a hydroxyl group in the total mass of the acrylic copolymer is preferably 3 mass% or more, and the upper limit thereof is preferably 9.9 mass% or less.
When the acrylic copolymer contains a copolymer component derived from a carboxyl group-containing monomer, the proportion of the mass of the copolymer component derived from the carboxyl group-containing monomer is preferably 1 mass% or less, more preferably 0.05 mass% or more and 1 mass% or less.
The weight average molecular weight (Mw) of the acrylic copolymer is preferably 30 to 200 ten thousand, more preferably 60 to 150 ten thousand, and still more preferably 80 to 120 ten thousand. When the weight average molecular weight Mw of the acrylic copolymer is 30 ten thousand or more, the pressure-sensitive adhesive sheet can be peeled without leaving adhesive residue on the adherend. When the weight average molecular weight Mw of the acrylic copolymer is 200 ten thousand or less, the pressure-sensitive adhesive sheet can be reliably adhered to an adherend.
The weight average molecular weight (Mw) of the acrylic copolymer is a value measured by a Gel Permeation Chromatography (GPC) method and converted to a standard styrene.
The acrylic copolymer can be produced by a conventionally known method using the above-mentioned various raw material monomers.
The form of the copolymerization of the acrylic copolymer is not particularly limited, and may be any of a block copolymer, a random copolymer, and a graft copolymer.
In the present embodiment, the content of the acrylic copolymer in the acrylic pressure-sensitive adhesive composition is preferably 40% by mass or more and 90% by mass or less, and more preferably 50% by mass or more and 90% by mass or less.
In the present embodiment, when the pressure-sensitive adhesive layer 12 is formed of an acrylic pressure-sensitive adhesive composition, the acrylic pressure-sensitive adhesive composition preferably contains an acrylic copolymer and a pressure-sensitive adhesive auxiliary. When the acrylic pressure-sensitive adhesive composition contains the pressure-sensitive adhesive auxiliary, for example, the initial tack of the pressure-sensitive adhesive sheet is improved, and peeling of the pressure-sensitive adhesive sheet when it is attached to the frame can be prevented. The adhesion promoter preferably contains an oligomer having a reactive group (hereinafter, the adhesion promoter containing an oligomer having a reactive group is also referred to as "reactive adhesion promoter"). The oligomer is preferably a polymer having a molecular weight of less than 10,000.
By including the reactive adhesion promoter in the acrylic adhesive composition, in addition to the above effects, the elongation at break can be improved and the residual gum can be reduced. In addition, the chip tensile test value is easily improved.
In the present embodiment, the reactive group in the reactive adhesion promoter is preferably at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, an amino group, an oxirane group, an acid anhydride group, an alkoxy group, an acryloyl group, and a methacryloyl group, and more preferably a hydroxyl group. The reactive group of the reactive adhesion promoter may be 1 kind or 2 or more kinds. The reactive bonding aids having hydroxyl groups may also further have additional reactive groups as previously described. In addition, the number of the reactive groups in 1 molecule constituting the reactive adhesion promoter may be 1, or may be 2 or more.
The reactive adhesion promoter is preferably a rubber-like material having reactive groups. When the adhesive composition contains a rubber-based material having a reactive group, the effects of improving elongation at break and reducing adhesive residue can be further improved, and the die pull test value can be more easily improved.
The rubber-based material is not particularly limited, but is preferably a polybutadiene-based resin and a hydrogenated product of the polybutadiene-based resin, and more preferably a hydrogenated product of the polybutadiene-based resin.
Examples of the polybutadiene resin include a resin having a 1, 4-repeating unit, a resin having a 1, 2-repeating unit, and a resin having both a 1, 4-repeating unit and a 1, 2-repeating unit. The hydrogenated product of the polybutadiene resin of the present embodiment also includes hydrogenated products of resins having these repeating units.
The polybutadiene resin and the hydrogenated product of the polybutadiene resin preferably have reactive groups at both ends. The reactive groups at both ends may be the same or different. The reactive group at both ends is preferably at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, an amino group, an oxirane group, an acid anhydride group, an alkoxy group, an acryloyl group, and a methacryloyl group, and more preferably a hydroxyl group. In the polybutadiene resin and the hydrogenated product of the polybutadiene resin, both terminals are more preferably hydroxyl groups.
In the present embodiment, the adhesion promoter may contain a non-reactive adhesion promoter, and the non-reactive adhesion promoter may be used in combination with the reactive adhesion promoter described above. Examples of the non-reactive adhesion promoter include esters such as acetylcitric acid triester.
In the present embodiment, the content of the adhesion promoter in the adhesive composition is preferably 3% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 30% by mass or less. When the content of the adhesion promoter in the adhesive composition is 3% by mass or more, the generation of residual glue can be suppressed, and when the content is 50% by mass or less, the decrease in adhesive force can be suppressed.
The proportion of the reactive adhesion promoter in the total mass of the adhesive composition is preferably 3 mass% or more and 50 mass% or less, and more preferably 5 mass% or more and 30 mass% or less.
The acrylic pressure-sensitive adhesive composition according to the present embodiment also preferably contains a crosslinked product obtained by crosslinking a composition containing the acrylic copolymer described above and further containing a crosslinking agent.
The pressure-sensitive adhesive composition according to the present embodiment preferably further contains a crosslinked product obtained by crosslinking a composition containing the acrylic copolymer, the reactive pressure-sensitive adhesive auxiliary agent, and a crosslinking agent.
In the present embodiment, examples of the crosslinking agent include: isocyanate crosslinking agents, epoxy crosslinking agents, aziridine crosslinking agents, metal chelate crosslinking agents, amine crosslinking agents, amino resin crosslinking agents, and the like. These crosslinking agents may be used alone, or two or more of them may be used in combination.
In the present embodiment, among these crosslinking agents, a crosslinking agent (isocyanate-based crosslinking agent) which is a compound having an isocyanate group is preferable from the viewpoint of improving heat resistance and adhesive strength of the acrylic pressure-sensitive adhesive composition. Examples of the isocyanate crosslinking agent include: polyisocyanate compounds such as 2, 4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 1, 3-xylylene diisocyanate, 1, 4-xylylene diisocyanate, diphenylmethane-4, 4 '-diisocyanate, diphenylmethane-2, 4' -diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4, 4 '-diisocyanate, dicyclohexylmethane-2, 4' -diisocyanate, and lysine isocyanate.
The polyisocyanate compound may be a modified product of these compounds in the form of a trimethylolpropane adduct, a modified product of biuret obtained by reaction with water, or a modified product of isocyanurate with an isocyanurate ring.
In the present embodiment, the acrylic pressure-sensitive adhesive composition preferably contains a crosslinked product obtained by crosslinking a composition containing at least the acrylic copolymer described above and a crosslinking agent containing a compound having an isocyanate group as a main component.
The pressure-sensitive adhesive composition according to the present embodiment also preferably contains a crosslinked product obtained by crosslinking a composition containing at least the acrylic copolymer, the reactive pressure-sensitive adhesive auxiliary agent, and a crosslinking agent containing a compound having an isocyanate group as a main component.
In the case of the acrylic pressure-sensitive adhesive composition containing the aforementioned crosslinked material, the die pull test value is further improved, and the cohesive property of the pressure-sensitive adhesive is further improved by crosslinking, so that the effect of suppressing the generation of residual adhesive on an adherend can be obtained.
In the present embodiment, the content of the crosslinking agent in the acrylic pressure-sensitive adhesive composition is preferably 0.1 part by mass or more and 20 parts by mass or less, more preferably 1 part by mass or more and 15 parts by mass or less, and further preferably 5 parts by mass or more and 10 parts by mass or less, with respect to 100 parts by mass of the acrylic copolymer. When the content of the crosslinking agent in the acrylic adhesive composition is within such a range, the die pull test value can be improved.
In the present embodiment, the isocyanate-based crosslinking agent is more preferably a compound having an isocyanurate ring (isocyanurate-based modified product) from the viewpoint of the heat resistance of the acrylic pressure-sensitive adhesive composition. The compound having an isocyanurate ring is preferably blended so that the isocyanate group is 0.7 equivalent or more and 1.5 equivalent or less with respect to the hydroxyl group equivalent of the acrylic copolymer. When the amount of the compound having an isocyanurate ring added is 0.7 equivalent or more, the adhesive strength after heating does not become too high, the adhesive sheet is easily peeled, and the amount of adhesive residue can be reduced. When the amount of the compound having an isocyanurate ring added is 1.5 equivalents or less, it is possible to prevent the initial adhesive force from becoming too low or prevent the adhesiveness from decreasing.
When the acrylic pressure-sensitive adhesive composition in the present embodiment contains a crosslinking agent, the acrylic pressure-sensitive adhesive composition preferably further contains a crosslinking accelerator. The crosslinking accelerator is preferably appropriately selected and used depending on the kind of the crosslinking agent and the like. For example, when the acrylic pressure-sensitive adhesive composition contains a polyisocyanate compound as a crosslinking agent, it is preferable that the acrylic pressure-sensitive adhesive composition further contains a crosslinking accelerator based on an organic metal compound such as an organic tin compound.
Silicone adhesive composition
In the case where the adhesive layer 12 is formed of a silicone-based adhesive composition, the silicone-based adhesive composition preferably contains a silicone resin, and preferably contains an addition-polymerization-type silicone resin. In the present specification, a silicone-based adhesive composition containing an addition-polymerization type silicone resin is referred to as an addition-reaction type silicone-based adhesive composition.
In the present embodiment, the addition reaction type silicone adhesive composition contains a main agent (addition polymerization type silicone resin) and a crosslinking agent. The addition reaction type silicone adhesive composition has an advantage that it can be used only by primary curing at a low temperature and does not require secondary curing at a high temperature. In addition, the conventional peroxide-curable silicone adhesive requires secondary curing at a high temperature of 150 ℃ or higher.
Therefore, the use of the addition reaction type silicone adhesive composition enables the production of an adhesive sheet at a relatively low temperature, and the adhesive sheet 10 can be produced using the substrate 11 having relatively low heat resistance while being excellent in energy saving performance. Further, unlike peroxide-curable silicone adhesives, no by-product is generated during curing, and therefore, there are no problems such as odor and corrosion.
The addition reaction type silicone-based adhesive composition generally contains: a main component comprising a mixture of a silicone resin component and a silicone rubber component, a crosslinking agent containing a hydrosilyl group (SiH group), and a curing catalyst used as needed.
The silicone resin component is an organopolysiloxane having a network structure obtained by hydrolysis of organochlorosilane or organoalkoxysilane followed by dehydration condensation reaction.
The silicone rubber component is a diorganopolysiloxane having a linear structure.
In the case of both the silicone resin component and the silicone rubber component, examples of the organic group include methyl, ethyl, propyl, butyl, and phenyl groups. A part of the organic group may be substituted with an unsaturated group such as a vinyl group, a hexenyl group, an allyl group, a butenyl group, a pentenyl group, an octenyl group, a (meth) acryloyl group, a (meth) acryloylmethyl group, a (meth) acryloylpropyl group, a cyclohexenyl group, or the like. An organic group having a vinyl group, which is industrially easily available, is preferable.
In the addition reaction type silicone adhesive composition, crosslinking proceeds by addition reaction of the unsaturated group in the main agent and the hydrosilyl group in the crosslinking agent to form a network structure, and adhesion is exhibited.
In the silicone resin component, the number of unsaturated groups such as vinyl groups is usually 0.05 or more and 3.0 or less, preferably 0.1 or more and 2.5 or less, per 100 organic groups. By setting the number of unsaturated groups to 0.05 or more per 100 organic groups, it is possible to prevent the reactivity with hydrosilyl groups from decreasing and to prevent curing from becoming difficult, and to provide an appropriate adhesive force. By setting the number of unsaturated groups to 3.0 or less relative to 100 organic groups, it is possible to prevent the crosslinking density of the pressure-sensitive adhesive from increasing, and to prevent the adhesive strength and cohesive force from increasing to adversely affect the surface to be adhered.
As the organopolysiloxane as described above, specifically included are: KS-3703 (the number of vinyl groups is 0.6 relative to 100 methyl groups) manufactured BY shin-Etsu chemical Co., ltd, BY23-753 (the number of vinyl groups is 0.1 relative to 100 methyl groups) manufactured BY Dow Corning Tokeny corporation, BY24-162 (the number of vinyl groups is 1.4 relative to 100 methyl groups), and the like. Further, SD4560PSA, SD4570PSA, SD4580PSA, SD4584PSA, SD4585PSA, SD4587L, and SD4592PSA manufactured by Dow Corning Tokeny corporation can be used.
As described above, the organopolysiloxane as the silicone resin component is generally used in admixture with the silicone rubber component, and as the silicone rubber component, there can be mentioned: KS-3800 (the number of vinyl groups is 7.6 based on 100 methyl groups), BY24-162 (the number of vinyl groups is 1.4 based on 100 methyl groups), BY24-843 (having no unsaturated groups), and SD-7292 (the number of vinyl groups is 5.0 based on 100 methyl groups), all of which are available from shin-Etsu chemical Co., ltd.
Specific examples of the addition-polymerizable silicone resin (addition-type silicone resin) described above are described in, for example, japanese patent laid-open No. h 10-219229.
The crosslinking agent is usually blended so that the number of hydrogen atoms bonded to silicon atoms is 0.5 to 10, preferably 1 to 2.5, per 1 unsaturated group (vinyl group or the like) in the silicone resin component and the silicone rubber component. By setting the number of hydrogen atoms bonded to the silicon atom to 0.5 or more, incomplete reaction of the unsaturated group (vinyl group or the like) with the hydrosilyl group can be prevented, which leads to curing failure. By setting the number of hydrogen atoms bonded to the silicon atom to 10 or less, it is possible to prevent the crosslinking agent from remaining unreacted and adversely affecting the surface to be bonded.
The addition reaction type silicone adhesive composition preferably contains the aforementioned addition reaction type silicone component (main agent composed of a silicone resin component and a silicone rubber component), a crosslinking agent, and a curing catalyst.
The curing catalyst is used for promoting the hydrosilylation reaction between the unsaturated groups in the silicone resin component and the silicone rubber component and the SiH groups in the crosslinking agent.
Examples of the curing catalyst include platinum group catalysts, that is, chloroplatinic acid, alcohol solutions of chloroplatinic acid, reactants of chloroplatinic acid and alcohol solutions, reactants of chloroplatinic acid and olefin compounds, reactants of chloroplatinic acid and vinyl group-containing siloxane compounds, platinum-olefin complexes, platinum-vinyl group-containing siloxane complexes, and platinum-phosphorus complexes. Specific examples of the above-mentioned curing catalyst are described in, for example, japanese patent laid-open Nos. 2006-28311 and 10-147758
More specifically, examples of commercially available products include: SRX-212 manufactured by Dow Kangningdongli corporation, PL-50T manufactured by shin-Etsu chemical Co., ltd.
When the curing catalyst is a platinum-based catalyst, the amount thereof is usually 5 mass ppm or more and 2000 mass ppm or less, preferably 10 mass ppm or more and 500 mass ppm or less, in terms of platinum component, relative to the total amount of the silicone resin component and the silicone rubber component. When the blending amount is 5 mass ppm or more, the decrease in curability and the decrease in crosslinking density, that is, the decrease in adhesive force and cohesive force (holding force) can be prevented, and when the blending amount is 2000 mass ppm or less, the stability of the adhesive layer can be maintained while preventing the increase in cost, and the adverse effect of the excessively used curing catalyst on the surface to be adhered can be prevented.
In the addition reaction type silicone adhesive composition, the above-described components are blended to exhibit adhesive force even at normal temperature, but it is preferable that the addition reaction type silicone adhesive composition is applied to the substrate 11 or a release sheet RL described later, the substrate 11 and the release sheet RL are bonded via the addition reaction type silicone adhesive composition, and then heating or irradiation with an active energy ray is performed to promote a crosslinking reaction between the silicone resin component and the silicone rubber component by the crosslinking agent. The crosslinking reaction is accelerated by heating or irradiation with active energy rays, and a pressure-sensitive adhesive sheet having stable adhesive strength can be obtained.
When the crosslinking reaction is promoted by heating, the heating temperature is usually 60 ℃ or more and 140 ℃ or less, preferably 80 ℃ or more and 130 ℃ or less. Heating at 60 ℃ or higher can prevent insufficient crosslinking between the silicone resin component and the silicone rubber component and hence insufficient adhesive strength, and heating at 140 ℃ or lower can prevent the occurrence of heat shrinkage wrinkles, deterioration, or discoloration of the substrate.
When the crosslinking reaction is promoted by irradiation with an active energy ray, an active energy ray having an energy quantum, that is, an active light such as ultraviolet ray or an electron beam can be used as the electromagnetic wave or the charged particle beam. When crosslinking is performed by irradiation with an electron beam, a photopolymerization initiator is not necessary, and when crosslinking is performed by irradiation with active light such as ultraviolet light, a photopolymerization initiator is preferably present.
The photopolymerization initiator used when crosslinking is performed by irradiation with ultraviolet rays is not particularly limited, and any photopolymerization initiator can be suitably selected from among conventional photopolymerization initiators generally used for ultraviolet-curable resins. Examples of the photopolymerization initiator include: benzoins, benzophenones, acetophenones, α -hydroxyketones, α -aminoketones, α -diketones, α -diketo dialkyl acetals, anthraquinones, thioxanthones, and other compounds.
These photopolymerization initiators may be used alone or in combination of two or more. The amount of the photopolymerization initiator used is usually selected in the range of 0.01 to 30 parts by mass, preferably 0.05 to 20 parts by mass, based on 100 parts by mass of the total amount of the addition-reaction-type silicone component and the crosslinking agent used as the main component.
The acceleration voltage of the electron beam when crosslinking is performed by irradiation with an electron beam, which is one of the active energy rays, is usually 130kV or more and 300kV or less, and preferably 150kV or more and 250kV or less. By irradiating the silicone resin component and the silicone rubber component with an accelerating voltage of 130kV or more, insufficient crosslinking between the silicone resin component and the silicone rubber component and insufficient adhesive force can be prevented, and by irradiating the silicone rubber component with an electron beam at an accelerating voltage of 300kV or less, deterioration or discoloration of the pressure-sensitive adhesive layer and the substrate can be prevented. The preferred range of the beam current is 1mA or more and 100mA or less.
The dose of the electron beam to be irradiated is preferably 1Mrad or more and 70Mrad or less, and more preferably 2Mrad or more and 20Mrad or less. By irradiating the adhesive layer and the base material with an electron beam at a dose of 1Mrad or more, deterioration or discoloration of the adhesive layer and the base material can be prevented, and insufficient adhesiveness due to insufficient crosslinking can be prevented. By irradiating the substrate with an electron beam at a dose of 70Mrad or less, deterioration of the adhesive layer and decrease of cohesive force due to discoloration can be prevented, and deterioration and shrinkage of the substrate can be prevented.
The dose of the ultraviolet light irradiation can be appropriately selected, and the dose is preferably 100mJ/cm 2 Above and 500mJ/cm 2 Below, illuminance 10mW/cm 2 Above 500mW/cm 2 The following.
In order to prevent inhibition of the reaction by oxygen, heating and irradiation with active energy rays are preferably performed in a nitrogen atmosphere.
The adhesive composition may contain other components within a range not impairing the effects of the present invention. Examples of other components that can be contained in the adhesive composition include: organic solvent, flame retardant, tackifier, ultraviolet absorber, light stabilizer, antioxidant, antistatic agent, preservative, mildew preventive, plasticizer, defoaming agent, colorant, filler, wettability modifier, etc.
The addition-reaction type silicone adhesive composition may further contain a non-reactive polyorganosiloxane such as polydimethylsiloxane or polymethylphenylsiloxane as an additive.
As a more specific example of the adhesive composition of the present embodiment, for example, the following adhesive composition can be cited, but the present invention is not limited to such an example.
As an example of the pressure-sensitive adhesive composition of the present embodiment, there can be mentioned a pressure-sensitive adhesive composition containing an acrylic copolymer obtained by copolymerizing at least 2-ethylhexyl acrylate, a carboxyl group-containing monomer and a hydroxyl group-containing monomer, a pressure-sensitive adhesive assistant containing a rubber-based material having a reactive group as a main component, and a crosslinking agent which is an isocyanate-based crosslinking agent.
An example of the pressure-sensitive adhesive composition of the present embodiment includes a pressure-sensitive adhesive composition containing an acrylic copolymer obtained by copolymerizing at least 2-ethylhexyl acrylate, a carboxyl group-containing monomer, and a hydroxyl group-containing monomer, a pressure-sensitive adhesive auxiliary agent that is hydroxyl-hydrogenated polybutadiene at both ends, and a crosslinking agent that is an isocyanate-based crosslinking agent.
An example of the pressure-sensitive adhesive composition of the present embodiment includes a pressure-sensitive adhesive composition containing an acrylic copolymer obtained by copolymerizing at least 2-ethylhexyl acrylate, acrylic acid, and 2-hydroxyethyl acrylate, a pressure-sensitive adhesive auxiliary containing a rubber-based material having a reactive group as a main component, and a crosslinking agent which is an isocyanate-based crosslinking agent.
As an example of the adhesive composition of the present embodiment, there is an adhesive composition containing an acrylic copolymer obtained by copolymerizing at least 2-ethylhexyl acrylate, acrylic acid, and 2-hydroxyethyl acrylate, an adhesion aid which is hydroxyl-hydrogenated polybutadiene at both ends, and a crosslinking agent which is an isocyanate-based crosslinking agent.
In these examples of the adhesive composition according to the present embodiment, it is preferable that the proportion of the mass of the copolymer component derived from 2-ethylhexyl acrylate in the total mass of the acrylic copolymer is 80 mass% or more and 95 mass% or less, the proportion of the mass of the copolymer component derived from the carboxyl group-containing monomer is 1 mass% or less, and the balance is other copolymer components, and it is preferable that the other copolymer components include a copolymer component derived from a hydroxyl group-containing monomer.
The thickness of the adhesive layer 12 may be appropriately determined depending on the use of the adhesive sheet 10. In the present embodiment, the thickness of the pressure-sensitive adhesive layer 12 is preferably 5 μm or more and 60 μm or less, and more preferably 10 μm or more and 50 μm or less. When the thickness of the pressure-sensitive adhesive layer 12 is 5 μm or more, the pressure-sensitive adhesive layer 12 can easily follow the irregularities of the chip circuit surface, and the occurrence of a gap can be prevented. Therefore, there is no risk that, for example, the interlayer insulating material, the sealing resin, or the like enters into the gap between the irregularities of the circuit surface of the semiconductor chip, or the wiring connection electrode pad of the circuit surface of the chip is clogged. When the thickness of the adhesive layer 12 is 60 μm or less, the semiconductor chip is less likely to sink into the adhesive layer, and a level difference is less likely to occur between the semiconductor chip portion and the resin portion sealing the semiconductor chip. Therefore, there is no risk of disconnection or the like of the wiring due to the difference in level when rewiring is performed.
(Release sheet)
The release sheet RL is not particularly limited. For example, from the viewpoint of ease of handling, the release sheet RL preferably includes a release base material and a release agent layer formed by applying a release agent to the release base material. The release sheet RL may be provided with a release agent layer only on one side of the release base material, or may be provided with release agent layers on both sides of the release base material.
Examples of the release substrate include: a paper substrate, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. As the paper substrate, there can be mentioned: polyester films (e.g., polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate), polyolefin films (e.g., polypropylene and polyethylene), and the like.
Examples of the release agent include: olefin-based resins, rubber-based elastomers (e.g., butadiene-based resins and isoprene-based resins), long-chain alkyl-based resins, alkyd-based resins, fluorine-based resins, silicone-based resins, and the like. When the pressure-sensitive adhesive layer is formed of a silicone pressure-sensitive adhesive composition, the release agent is preferably a non-silicone release agent.
The thickness of the release sheet RL is not particularly limited. The thickness of the release sheet RL is usually 20 μm or more and 200 μm or less, and preferably 25 μm or more and 150 μm or less.
The thickness of the release agent layer is not particularly limited. When a solution containing a release agent is applied to form a release agent layer, the thickness of the release agent layer is preferably 0.01 μm or more and 2.0 μm or less, and more preferably 0.03 μm or more and 1.0 μm or less.
In the case of using a plastic film as the release substrate, the thickness of the plastic film is preferably 3 μm or more and 50 μm or less, more preferably 5 μm or more and 40 μm or less.
(method for producing adhesive sheet)
The method for producing the adhesive sheet 10 is not particularly limited.
For example, the adhesive sheet 10 can be manufactured through the following steps.
First, a binder composition is applied to the first substrate surface 11a of the substrate 11 to form a coating film. Subsequently, the coating film is dried to form the pressure-sensitive adhesive layer 12. Then, the release sheet RL is attached so as to cover the adhesive layer 12.
As another method for producing the adhesive sheet 10, the following steps may be performed. First, the pressure-sensitive adhesive composition is applied to the release sheet RL to form a coating film. Subsequently, the coating film is dried to form the pressure-sensitive adhesive layer 12, and the first substrate surface 11a of the substrate 11 is bonded to the pressure-sensitive adhesive layer 12.
When the pressure-sensitive adhesive composition is applied to form the pressure-sensitive adhesive layer 12, the pressure-sensitive adhesive composition is preferably diluted with an organic solvent to prepare a coating liquid (pressure-sensitive adhesive liquid for coating). Examples of the organic solvent include: toluene, ethyl acetate, methyl ethyl ketone, and the like. The method of applying the coating liquid is not particularly limited. Examples of the coating method include: spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, gravure coating, and the like.
In order to prevent the organic solvent and the low boiling point component from remaining in the pressure-sensitive adhesive layer 12, it is preferable to apply the coating liquid to the substrate 11 or the release sheet RL and then dry the coating film by heating.
When a crosslinking agent is blended in the pressure-sensitive adhesive composition, the coating film is preferably heated in order to cause the crosslinking reaction to proceed and improve the cohesive force.
(use of adhesive sheet)
The adhesive sheet 10 is used for sealing a semiconductor element. The adhesive sheet 10 is preferably used for sealing a semiconductor element which is not mounted on a metal lead frame and is attached to the adhesive sheet 10. Specifically, the adhesive sheet 10 is not used for sealing a semiconductor element mounted on a metal lead frame, but is preferably used for sealing a semiconductor element in a state of being bonded to the adhesive layer 12. As a method of packaging a semiconductor element without using a metal lead frame, PSP, WLP, and the like are exemplified.
The adhesive sheet 10 according to the present embodiment has an adhesive strength of 1.0N/25mm or less in a 40 ℃ gas atmosphere after heating, and therefore can be easily peeled even from a large adherend. In particular, the adhesive sheet 10 according to the present embodiment can suppress the generation of adhesive residue even when the adhesive sheet 10 is peeled in an atmosphere having a temperature higher than room temperature (for example, an atmosphere having a temperature of 30 to 60 ℃. When there is a risk of breakage of an adherend, a method may be adopted in which the pressure-sensitive adhesive sheet 10 is peeled off at a low speed, or the pressure-sensitive adhesive sheet 10 is peeled off in an atmosphere at a temperature higher than room temperature, thereby reducing the adhesiveness of the pressure-sensitive adhesive at the time of peeling. Among these methods, it is preferable to peel the adhesive sheet 10 in an atmosphere at a temperature higher than room temperature from the viewpoint of shortening the time required for peeling. Accordingly, the adhesive sheet 10 can be preferably used for a large, complicated structure, and panel-level package with a high possibility of breakage when peeled off.
Examples of the panel-level package include: a panel having a circular, elliptical, or quadrangular shape in plan view. For example, when the face plate is circular, the size is preferably about 200mm to 450mm in diameter. For example, when the panel is a square, each side is preferably about 300mm to 800 mm. When the panel has the above size, the adhesive sheet 10 can be satisfactorily peeled off when peeled off from an adherend.
The adhesive sheet 10 is preferably used in a process having: the method for manufacturing the semiconductor device includes a step of attaching a frame member having a plurality of openings to an adhesive sheet 10, a step of attaching a semiconductor chip to an adhesive layer 12 exposed at the openings of the frame member, a step of coating the semiconductor chip with a sealing resin, a step of thermally curing the sealing resin, and a step of peeling off the adhesive sheet 10 after thermal curing.
(method for manufacturing semiconductor device)
A method for manufacturing a semiconductor device using the adhesive sheet 10 of the present embodiment will be described.
Fig. 2A to 2E are schematic diagrams for explaining a method for manufacturing a semiconductor device according to the present embodiment.
The method for manufacturing a semiconductor device according to the present embodiment includes the steps of: the method for manufacturing the semiconductor device includes a step of attaching the frame member 20 having the plurality of openings 21 formed therein to the adhesive sheet 10 (adhesive sheet attaching step), a step of attaching the semiconductor chip CP to the adhesive layer 12 exposed at the openings 21 of the frame member 20 (bonding step), a step of coating the semiconductor chip CP with the sealing resin 30 (sealing step), a step of thermally curing the sealing resin 30 (thermosetting step), and a step of peeling off the adhesive sheet 10 after thermal curing (peeling step). If necessary, a step of attaching the reinforcing member 40 to the sealing body 50 sealed with the sealing resin 30 (reinforcing member attaching step) may be performed after the thermosetting step.
Hereinafter, each step will be explained.
Adhesive sheet sticking step
Fig. 2A is a schematic view for explaining a process of attaching the frame member 20 to the adhesive layer 12 of the adhesive sheet 10. When the release sheet RL is stuck to the pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive sheet 10, the release sheet RL is peeled in advance.
The frame member 20 in the present embodiment is formed in a lattice shape and has a plurality of openings 21. The frame member 20 is preferably formed of a heat-resistant material. Examples of the material of the frame member 20 include: metals such as copper and stainless steel, and heat-resistant resins such as polyimide resins and glass epoxy resins.
The opening 21 is a hole penetrating the front and back surfaces of the frame member 20. The shape of the opening 21 is not particularly limited as long as it is a shape capable of housing the semiconductor chip CP in the frame. The depth of the hole of the opening 21 is not particularly limited as long as the semiconductor chip CP can be housed therein.
Bonding step
Fig. 2B is a schematic diagram for explaining a process of attaching the semiconductor chip CP to the adhesive layer 12.
After the adhesive sheet 10 is attached to the frame member 20, the adhesive layer 12 is exposed in each opening 21 in accordance with the shape of the opening 21. The semiconductor chip CP is attached to the adhesive layer 12 of each opening 21. The semiconductor chip CP is attached so that its circuit surface is covered with the adhesive layer 12.
The semiconductor chip CP is manufactured by performing, for example, the following steps: a back grinding step of grinding the back surface of the semiconductor wafer having the circuit formed thereon, and a dicing step of singulating the semiconductor wafer. In the dicing step, the semiconductor wafer is attached to the adhesive layer of the dicing sheet, and the semiconductor wafer is singulated using a dicing mechanism such as a dicing saw (dicing saw) to obtain semiconductor chips CP (semiconductor elements).
The cutting device is not particularly limited, and a known cutting device can be used. In addition, the conditions for cleavage are not particularly limited. Instead of the method of cutting with a cutter, a laser cutting method, a stealth cutting method, or the like may be used.
After the dicing step, a sheet expanding step of expanding the intervals between the plurality of semiconductor chips CP by stretching the dicing sheet may be performed. By performing the expanding process, the semiconductor chip CP can be picked up by using a conveying mechanism such as a clip. In addition, by performing the expanding step, the adhesion of the dicing sheet to the adhesive layer can be reduced, and the semiconductor chip CP can be easily picked up.
When the energy ray-polymerizable compound is blended in the adhesive composition or the adhesive layer of the dicing sheet, the adhesive layer is irradiated with energy rays from the base material side of the dicing sheet to cure the energy ray-polymerizable compound. When the energy ray-polymerizable compound is cured, the cohesive force of the adhesive layer is increased, and the adhesive force of the adhesive layer can be decreased. Examples of the energy ray include ultraviolet ray (UV) and Electron Beam (EB), and ultraviolet ray is preferable. The irradiation of the energy ray may be performed at any stage after the semiconductor wafer is attached and before the semiconductor chip is peeled (picked up). For example, the energy ray may be irradiated before or after the dicing, or may be irradiated after the sheet expanding step.
Sealing step and thermosetting step
Fig. 2C is a schematic diagram for explaining a process of sealing the semiconductor chip CP and the frame member 20 attached to the adhesive sheet 10.
The material of the sealing resin 30 is a thermosetting resin, and examples thereof include an epoxy resin. The epoxy resin used as the sealing resin 30 may contain, for example, a phenol resin, an elastomer, an inorganic filler, a curing accelerator, and the like.
The method of coating the semiconductor chip CP and the frame member 20 with the sealing resin 30 is not particularly limited. In the present embodiment, an embodiment using a sheet-like sealing resin 30 will be described as an example. The sealing resin 30 is placed in a sheet form so as to cover the semiconductor chip CP and the frame member 20, and the sealing resin 30 is heated and cured to form a sealing resin layer 30A. In this way, the semiconductor chip CP and the frame member 20 are embedded in the sealing resin layer 30A. When the sheet-like sealing resin 30 is used, the semiconductor chip CP and the frame member 20 are preferably sealed by a vacuum lamination method. By this vacuum lamination method, it is possible to prevent a gap from being generated between the semiconductor chip CP and the frame member 20. The temperature condition for heat curing by the vacuum lamination method is, for example, 80 ℃ or more and 120 ℃ or less.
In the sealing step, a laminate sheet in which a sheet-like sealing resin 30 is supported by a resin sheet such as polyethylene terephthalate may be used. In this case, after the laminated sheet is placed so as to cover the semiconductor chip CP and the frame member 20, the resin sheet is peeled off from the sealing resin 30, and the sealing resin 30 is heated and cured. Examples of such a laminate sheet include: ABF membranes (manufactured by Ajinomoto Fine-Techno Co., ltd.) and the like.
As a method of sealing the semiconductor chip CP and the frame member 20, a transfer molding method may be employed. In this case, for example, the semiconductor chip CP and the frame member 20 attached to the adhesive sheet 10 are housed in a mold of a sealing device. A fluid resin material is injected into the mold to cure the resin material. In the case of the transfer molding method, conditions of heating and pressure are not particularly limited. An example of a typical condition in the transfer molding method is to hold a temperature of 150 ℃ or higher and a pressure of 4MPa to 15MPa for 30 seconds to 300 seconds. Then, the pressure is released, and the cured product is taken out of the sealing device and left in an oven, and kept at a temperature of 150 ℃ or higher for 2 hours to 15 hours. Thus, the semiconductor chip CP and the frame member 20 are sealed.
In the case where the sheet-like sealing resin 30 is used in the sealing step, the first heating and pressing step may be performed before the step of thermally curing the sealing resin 30 (thermal curing step). In the first heat pressing step, the semiconductor chip CP covered with the sealing resin 30 and the adhesive sheet 10 with the frame member 20 are sandwiched between plate-like members on both sides, and pressing is performed under conditions of a predetermined temperature, time, and pressure. By performing the first heating and pressing step, the sealing resin 30 is easily filled in the gap between the semiconductor chip CP and the frame member 20. Further, by performing the heating and pressing step, the unevenness of the sealing resin layer 30A made of the sealing resin 30 can be flattened. As the plate-like member, for example, a metal plate such as stainless steel can be used.
When the adhesive sheet 10 is peeled off after the thermosetting step, the semiconductor chip CP and the frame member 20 sealed with the sealing resin 30 can be obtained. Hereinafter, this may be referred to as a sealing body 50
Reinforcing member attaching step
Fig. 2D is a schematic diagram for explaining a step of attaching the reinforcing member 40 to the sealing body 50.
After the adhesive sheet 10 is peeled off, a rewiring step of forming a rewiring layer and a bump forming step are performed on the exposed circuit surface of the semiconductor chip CP.
In order to improve the workability of the sealing body 50 in such a rewiring step and a step of providing a protrusion, a step of attaching the reinforcing member 40 to the sealing body 50 (reinforcing member attaching step) may be performed as necessary. When the reinforcing member bonding step is performed, it is preferably performed before peeling the adhesive sheet 10. As shown in fig. 2D, the sealing body 50 is supported in a state of being sandwiched between the adhesive sheet 10 and the reinforcing member 40.
In the present embodiment, the reinforcing member 40 includes a heat-resistant reinforcing plate 41 and a heat-resistant adhesive layer 42.
Examples of the reinforcing plate 41 include: a plate-like member made of a heat-resistant resin such as polyimide resin or glass epoxy resin.
The adhesive layer 42 bonds the reinforcing plate 41 and the sealing body 50. The adhesive layer 42 may be appropriately selected according to the materials of the reinforcing plate 41 and the sealing resin layer 30A. For example, when the sealing resin layer 30A contains an epoxy resin and the reinforcing plate 41 contains a glass epoxy resin, a glass cloth containing a thermoplastic resin is preferable as the adhesive layer 42, and a bismaleimide-triazine resin (BT resin) is preferable as the thermoplastic resin contained in the adhesive layer 42.
In the reinforcing member attaching step, the following second heating and pressing step is preferably performed: the adhesive layer 42 is sandwiched between the sealing resin layer 30A of the sealing body 50 and the reinforcing plate 41, and is sandwiched between the reinforcing plate 41 side and the adhesive sheet 10 side by plate-like members, respectively, and is pressed under conditions of a predetermined temperature, time, and pressure. The sealing body 50 and the reinforcing member 40 are preliminarily fixed by the second heating and pressing step. After the second heating and pressing step, the fixed sealing body 50 and reinforcing member 40 are preferably heated under predetermined temperature and time conditions in order to cure the adhesive layer 42. The conditions for heat curing may be set appropriately according to the material of the adhesive layer 42, and are, for example, 185 ℃, 80 minutes, and 2.4 MPa. In the second heating and pressing step, a metal plate such as stainless steel can be used as the plate-like member.
Peeling step
Fig. 2E is a schematic diagram for explaining a process of peeling the adhesive sheet 10.
In the present embodiment, when the substrate 11 of the adhesive sheet 10 can be bent, the adhesive sheet 10 can be bent and easily peeled from the frame member 20, the semiconductor chip CP, and the sealing resin layer 30A. The peel angle θ is not particularly limited, and the adhesive sheet 10 is preferably peeled at a peel angle θ of 90 degrees or more. If the peel angle θ is 90 degrees or more, the adhesive sheet 10 can be easily peeled from the frame member 20, the semiconductor chip CP, and the sealing resin layer 30A. The peeling angle θ is preferably 90 degrees or more and 180 degrees or less, and more preferably 135 degrees or more and 180 degrees or less. By peeling the adhesive sheet 10 while bending in this way, the load applied to the frame member 20, the semiconductor chip CP, and the sealing resin layer 30A can be reduced and peeling can be performed, and damage to the semiconductor chip CP and the sealing resin layer 30A due to peeling of the adhesive sheet 10 can be suppressed. The temperature atmosphere at the time of peeling the adhesive sheet 10 may be room temperature, but when there is a risk of the adhesive-attached members and the interfaces between the members being broken at the time of peeling, the adhesive sheet 10 may be peeled in a temperature atmosphere higher than room temperature in order to reduce the adhesiveness of the adhesive. The temperature atmosphere higher than room temperature is preferably in the range of 30 to 60 ℃, and more preferably in the range of 35 to 50 ℃. After the adhesive sheet 10 is peeled, the rewiring step, the protrusion providing step, and the like described above are performed. After the adhesive sheet 10 is peeled off, the reinforcing member attaching step described above may be performed as needed before the rewiring step, the protrusion providing step, and the like are performed.
In the present specification, the term "bendable" means, for example: has flexibility to such an extent that the sheet can be rolled up in a roll form and that damage can be sufficiently suppressed even when the sheet is rolled up in a roll form.
In the case of attaching the reinforcing member 40, after the rewiring step, the step of providing a protrusion, and the like are performed, the reinforcing member 40 is peeled off from the sealing body 50 at a stage where the support of the reinforcing member 40 is not necessary.
Then, the sealing body 50 is singulated as a semiconductor chip CP unit (singulation step). The method for making the sealing body 50 monolithic is not particularly limited. For example, the dicing can be performed by the same method as the method used for dicing the semiconductor wafer described above. The step of singulating the sealing body 50 may be performed in a state where the sealing body 50 is attached to a dicing sheet or the like. By singulating the sealing body 50, a semiconductor package of the semiconductor chip CP unit can be manufactured, and the semiconductor package is mounted on a printed wiring board or the like in a mounting step.
According to the present embodiment, it is possible to provide the adhesive sheet 10 having good peelability in which positional misalignment of chips at the time of sealing a semiconductor element on the adhesive sheet can be prevented and adhesive residue is less likely to occur at the time of peeling the adhesive sheet from an adherend particularly in the case where the semiconductor element has a polyimide film.
[ variation of embodiment ]
The present invention is not limited to the above-described embodiments, and variations, improvements, and the like within a range in which the object of the present invention can be achieved are also included in the present invention. In the following description, the same reference numerals are given to the same members and the like as those described in the above embodiments, and the description thereof will be omitted or simplified.
In the above embodiments, the embodiment in which the pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive sheet 10 is covered with the release sheet RL was described as an example, but the present invention is not limited to such an embodiment.
The adhesive sheet 10 may be a sheet, or may be provided in a state where a plurality of adhesive sheets 10 are stacked. In this case, for example, the adhesive layer 12 may be covered with the substrate 11 of another adhesive sheet to be laminated.
The adhesive sheet 10 may be a tape-shaped sheet or may be provided in a roll form. The psa sheet 10 wound into a roll may be used by being fed from a roll and then cut into a desired size.
In the above embodiment, the case where the material of the sealing resin 30 is a thermosetting resin was described as an example, but the present invention is not limited to such an embodiment. For example, the sealing resin 30 may be an energy ray-curable resin that is cured by an energy ray such as an ultraviolet ray.
In the above embodiment, all the steps in the method for manufacturing a semiconductor device are not necessarily required, and some of the steps may be omitted.
In the above embodiment, the embodiment in which the frame member 20 is attached to the adhesive sheet 10 was described as an example in the description of the method for manufacturing a semiconductor device, but the present invention is not limited to such an embodiment. The adhesive sheet 10 may also be used in a semiconductor device manufacturing method for manufacturing a semiconductor element without using the frame member 20.
In the above embodiment, a passivation film of polyimide resin or the like may be provided on the circuit surface of the semiconductor chip CP. When the passivation film is provided on the circuit surface of the semiconductor chip CP, the adhesive sheet 10 can be peeled off more easily.
When peeling the adhesive sheet 10, the sealing body 50 may be held by an adsorption mechanism such as an adsorption table. In the case of the adhesive sheet 10, the peeling can be performed without breaking the seal 50, and the peeling can be performed without moving the seal 50 relative to the suction table.
Examples
The present invention will be described in more detail below with reference to examples. The present invention is not limited to these examples.
[ evaluation method ]
The adhesive sheet was evaluated by the following method.
[ chip tensile test ]
The values of the pressure-sensitive adhesive layer obtained by a die pull test on silicon in a gas atmosphere of 100 ℃ were measured. Specifically, the measurement was performed in the following order (a) to (h).
(a) The wafer was ground and singulated under the following conditions, thereby producing semiconductor chips (silicon) to be measured.
Wafer: single-sided mirror silicon wafer with thickness of 750 μm and size of 8 inches
Back-grinding tape: e-8180HR (manufactured by Lindedaceae), cutting tape: D-174A (Lindeke corporation)
Grinding device: DFG-8540 manufactured by DISCO, inc "
A cutting device: DFD651 manufactured by DISCO of Kabushiki Kaisha "
Standard cleavage conditions: blade =27HECC, 35,000rpm, cutting pattern a, 50mm/s
Chip thickness: 200 μm (polished on the side opposite to the mirror surface of the wafer and subjected to #2000 finishing), chip size: 6.4mm by 6.4mm (6.435 m spacing)
(b) As shown in FIG. 3B, a double-sided tape DF (TL-4100S-50, manufactured by Linko K.K.) was adhered to the entire surface of the aluminum plate AB for lining (150 mm. Times.75 mm size) shown in FIG. 3A, and then the release film of the double-sided tape DF was peeled off.
(c) The pressure-sensitive adhesive layer 12 produced in example 1 was used as a sample film, and as shown in fig. 3C, a pressure-sensitive adhesive sheet was attached to a double-sided tape DF so that a substrate was in contact with the double-sided tape DF, and then a release film of the pressure-sensitive adhesive sheet was peeled off.
(d) As shown in fig. 3D, semiconductor chips CP (8 chips) were placed at 2.5cm intervals on the center of aluminum plate AB with double-sided tape DF attached to adhesive layer 12 with tweezers, and circuit surface CPA was brought into contact with adhesive layer 12. Semiconductor chips CP are arranged in 2 rows in the direction along the short side of the rectangular shape of aluminum plate AB and 4 columns in the direction along the long side. At this time, the semiconductor chip CP is smoothly vertically disposed so that the corners of the semiconductor chip CP do not touch the adhesive layer 12.
(e) The sample prepared in (d) above was vacuum laminated using a vacuum laminator under the following conditions. In the case of vacuum lamination, as shown in FIG. 3E, 2 sheets of release films LF (thickness: 38 μm) were arranged in the upper and lower directions, and vacuum lamination was performed.
Vacuum laminator: nisshinbo Co Ltd
Temperature: 100 deg.C
Pressure: 100Pa, vacuum degree: unset (full suction), press: not set (pressure difference from atmospheric pressure)
The lamination speed: high speed mode
Program: vacuum suction for 60 seconds followed by 40 seconds of high speed lamination
Lamination was performed after 1 hour after the set temperature, and idling was performed for a while before lamination of the actual sample.
(f) The vacuum laminated sample in (e) above was placed in a tensile tester ("Dage 4000" manufactured by Nordson Advanced Technology Co., ltd.) and preheated to 100 ℃.
(g) As shown in FIG. 3G, a tension member PB having a double-sided tape DF2 (TL-4100S-50, manufactured by Linko Co., ltd.) attached thereto as shown in FIG. 3F was placed on the semiconductor chip CP, and a force of 2N was applied for 5 seconds. After 1 minute, a chip pull test was performed as shown in FIG. 3H under the following conditions, and the displacement and force of the load cell were measured, and the peak value of the force was taken as the force applied to 1 chip (semiconductor chip CP) (unit: N/chip).
Atmospheric temperature: 100 deg.C
Test speed: 200 μm/s
(h) Then, after the semiconductor chip CP is removed from the tension member PB, the other semiconductor chip CP is subjected to a chip tension test as in the above (g), and the force applied to 1 chip is obtained for 6 chips. Then, the average value of the obtained effective data was used as a value (unit: N/chip) obtained in the chip pull test.
The pressure-sensitive adhesive layers produced in comparative examples 1 to 3 were measured for values obtained by a die pull test on silicon in a gas atmosphere at 100 ℃.
[ chip Displacement evaluation ]
8000 semiconductor chips (silicon mirror chips, chip size: 2.3mm × 1.7mm, chip thickness: 0.2 mm) were arranged in 80 rows and 100 columns in the pressure-sensitive adhesive layer (pressure-sensitive adhesive surface) of the pressure-sensitive adhesive sheet produced in example 1, and the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet was brought into contact with the circuit surface of the semiconductor chip. At this time, the direction parallel to the 2.3mm long side of the chip was aligned with the column direction in which the chips were arranged. In addition, as for the distance between the adjacent chips, the distance between the centers of the rectangular shapes of the chips was made 5mm. Then, the semiconductor chip on the adhesive sheet was sealed with a sealing resin (ABF film, GX T-31, manufactured by Ajinomoto Fine-Technio Co., ltd.) using a vacuum heat and pressure laminator (7024 HP5, manufactured by ROHM and HAAS Co., ltd.). The sealing conditions were as follows.
Preheating temperature: the working table and the diaphragm are both 100 DEG C
Vacuum suction: 60 seconds
Dynamic throttle mode: 30 seconds
Static hold mode: for 10 seconds
Then, the semiconductor chip on the embedded adhesive sheet was observed with the naked eye and a microscope to confirm whether or not the semiconductor chip was misaligned. The case where there is no positional misalignment of the semiconductor chip is determined as "a", and the case where there is positional misalignment of the semiconductor chip is determined as "B". Note that, when the semiconductor chip moves by 20 μm or more before and after embedding, it is determined that the "existing position is not correct".
The adhesive sheets produced in comparative examples 1 to 3 were also checked for the presence or absence of positional misalignment of the semiconductor chip in the same manner as described above.
[ adhesive force after heating ]
The pressure-sensitive adhesive sheet produced in example 1 was cut into a width of 25mm, and a load of 2kgf was applied to an adherend (polyimide film) to attach the pressure-sensitive adhesive surface of the cut pressure-sensitive adhesive sheet. As the polyimide film, KAPTON 100H (product name) having a thickness of 25 μm, manufactured by Du Pont-Toray corporation, was used.
The pressure-sensitive adhesive sheet with a polyimide film was stored at 25 ℃ under an atmosphere of 50% relative humidity for 0.5 hour, and then heated at 190 ℃ for 1 hour using a thermostat (PHH-202, manufactured by Espec corporation). After heating, the pressure-sensitive adhesive sheet with the polyimide film was stored in an environment of 25 ℃ and 50% relative humidity for 1 hour, and then the pressure-sensitive adhesive sheet was peeled from the polyimide film at room temperature and 40 ℃ in a gas atmosphere with a peel angle of 180 ° and a peel speed of 300mm/min, and the adhesive force of the pressure-sensitive adhesive sheet after heating was measured. As the measuring device, a constant temperature bath measuring device (product of A & D, TENSILON) was used.
The adhesive force after heating was also measured for the adhesive sheets produced in comparative examples 1 to 3 in the same manner as described above.
[ Process adaptability (evaluation of releasability) ]
The adhesive sheet produced in example 1 was cut into a width of 25mm, and the adhesive surface of the adhesive sheet obtained by cutting was bonded to a circuit surface of an adherend (a semiconductor wafer provided with a circuit surface having a polyimide film; diameter 150mm, thickness 200 μm). At this time, the lamination was performed by applying a load of 2 kgf.
The adhesive sheet attached to the semiconductor wafer was stored at 25 ℃ under an atmosphere of 50% relative humidity for 0.5 hour, and then heated at 190 ℃ for 1 hour using a thermostat (PHH-202, manufactured by Espec corporation). After heating, the adhesive sheet attached to the semiconductor wafer was stored in an atmosphere of 25 ℃ and 50% relative humidity for 1 hour, and then the adhesive sheet was peeled from the semiconductor wafer in a gas atmosphere of 40 ℃ with a peel angle of 180 ° and a peel speed of 300 mm/min. As the peeling device, a measuring device with a constant temperature bath (product of A & D, TENSILON) was used. The semiconductor wafer from which the adhesive sheet was peeled was visually observed, and residues on the surface of the semiconductor wafer were confirmed. The tape was peeled off, and the case where the tape could be peeled without residual glue was judged as "C", and the case where residual glue was present and the surface of the semiconductor wafer was contaminated was judged as "D", and the peelability was evaluated.
Residues on the surface of the semiconductor wafer were also confirmed in the adhesive sheets produced in comparative examples 1 to 3 in the same manner as described above.
[ production of adhesive sheet ]
(example 1)
(1) Preparation of adhesive composition
The following materials (polymer, adhesion promoter, crosslinking agent, and diluting solvent) were mixed and sufficiently stirred to prepare a coating adhesive liquid (adhesive composition) of example 1.
Polymer: acrylate copolymer, 40 parts by mass (solid content)
The acrylic ester copolymer was prepared by copolymerizing 92.8 mass% of 2-ethylhexyl acrylate, 7.0 mass% of 2-hydroxyethyl acrylate, and 0.2 mass% of acrylic acid. The weight average molecular weight of the resulting polymer was 850,000.
Adhesion promoter: hydrogenated polybutadiene having hydroxyl groups at both ends [ manufactured by Nippon Caoda corporation; GI-1000, 5 parts by mass (solid component)
Crosslinking agent: aliphatic isocyanates having hexamethylene diisocyanate (isocyanurate-type modified products of hexamethylene diisocyanate) [ manufactured by Nippon polyurethane industries Co., ltd.; CRONATE HX ], 3.5 parts by mass (solid component)
Dilution solvent: the solid content concentration of the coating adhesive liquid was adjusted to 30 mass% using methyl ethyl ketone.
(2) Production of adhesive layer
The prepared adhesive liquid for coating was applied to a release film composed of a 38 μm transparent polyethylene terephthalate film provided with a silicone-based release layer (manufactured by lomidec corporation) using a Comma Coater (registered trademark); SP-PET382150] was heated at 90 ℃ for 90 seconds and subsequently at 115 ℃ for 90 seconds to dry the coating film, thereby preparing an adhesive layer. The thickness of the adhesive layer was 50 μm.
(3) Production of adhesive sheet
After drying the coating film of the coating adhesive liquid, the adhesive layer was bonded to the substrate, and the adhesive sheet of example 1 was obtained. Among them, as a substrate, a transparent polyethylene terephthalate film [ Teijin DuPont Films, inc.; PET50KFL12D, thickness 50 μm, storage modulus at 100 ℃ 3.1X 10 9 Pa]So that the adhesive layer is attached to the easy-adhesion surface of the base material.
Comparative example 1
The pressure-sensitive adhesive sheet of comparative example 1 was produced in the same manner as in example 1, except that 5 parts by mass (solid content) of acetyl tributyl citrate (ATBC) (manufactured by tianggang chemical industries, ltd.) was used as the pressure-sensitive adhesive auxiliary agent contained in the pressure-sensitive adhesive layer.
Comparative example 2
The psa sheet of comparative example 2 was produced in the same manner as in example 1, except that the psa layer included a polymer different from that of example 1.
The polymer used in comparative example 2 was prepared by copolymerizing 80.8 mass% of 2-ethylhexyl acrylate, 7 mass% of 2-hydroxyethyl acrylate, 12 mass% of N-acryloylmorpholine, and 0.2 mass% of acrylic acid. The weight average molecular weight of the resulting polymer was 760,000.
Comparative example 3
The psa sheet of comparative example 3 was produced in the same manner as in example 1, except that the psa layer did not contain any psa agent.
Table 1 shows the evaluation results of the pressure-sensitive adhesive sheets of example 1 and comparative examples 1 to 3.
[ Table 1]
As shown in table 1, it was confirmed that the pressure-sensitive adhesive sheet of example 1 had a value of 3.0N/chip or more as determined by a die pull test on silicon in a gas atmosphere at 100 ℃ for the pressure-sensitive adhesive layer, and had an adhesive force of 1.0N/25mm or less to the polyimide film in a gas atmosphere at 40 ℃ after the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was adhered to the polyimide film and heated at 190 ℃ for 1 hour, so that chip displacement could be prevented and the peelability after heating was also good.
On the other hand, it is considered that the pressure-sensitive adhesive sheet of comparative example 1 cannot prevent chip displacement because the value of the pressure-sensitive adhesive layer determined by a chip pull test on silicon in a gas atmosphere of 100 ℃ is less than 3.0N/chip. In addition, it is considered that the adhesive sheets of comparative examples 2 to 3 have poor peelability after heating because the adhesive strength to the polyimide film in a gas atmosphere at 40 ℃ after the adhesive layer is attached to the polyimide film and heated at 190 ℃ for 1 hour exceeds 1.0N/25 mm.
Claims (15)
1. An adhesive sheet used for sealing a semiconductor element on an adhesive sheet,
the adhesive sheet comprises a substrate and an adhesive layer containing an adhesive composition,
the value of the adhesive layer is 3.0N/chip or more as determined by a chip pull test of silicon in a gas atmosphere of 100 ℃,
the adhesive layer is adhered to a polyimide film and heated at 190 ℃ for 1 hour, and the adhesion to the polyimide film in a gas atmosphere at 40 ℃ is 1.0N/25mm or less.
2. The adhesive sheet according to claim 1, wherein the adhesive layer of the adhesive sheet has an adhesive force of 0.1N/25mm or more to a polyimide film in a gas atmosphere at 40 ℃ after being attached to the polyimide film and heated at 190 ℃ for 1 hour.
3. The adhesive sheet according to claim 1 or 2, wherein the adhesive layer of the adhesive sheet has an adhesive force to a polyimide film of 0.4N/25mm or more and 10.0N/25mm or less at room temperature after being adhered to the polyimide film and heated at 190 ℃ for 1 hour.
4. The adhesive sheet according to claim 1 or 2, wherein the substrate has a storage modulus of 1 x 10 at 100 ℃ 7 Pa or above.
5. The adhesive sheet according to claim 1 or 2, wherein the adhesive layer is formed from an acrylic adhesive composition or a silicone adhesive composition.
6. The adhesive sheet according to claim 5, wherein the adhesive layer is formed of an acrylic adhesive composition.
7. The adhesive sheet according to claim 6, wherein the acrylic adhesive composition comprises an acrylic copolymer,
the acrylic copolymer comprises a copolymer component derived from an alkyl (meth) acrylate,
the alkyl group of the alkyl (meth) acrylate has 6 to 10 carbon atoms.
8. The adhesive sheet according to claim 7, wherein the proportion of the mass of the copolymer component derived from the alkyl (meth) acrylate in the total mass of the acrylic copolymer is 90 mass% or more.
9. The adhesive sheet according to claim 7 or 8, wherein the acrylic copolymer comprises an acrylic copolymer having 2-ethylhexyl (meth) acrylate as a main monomer.
10. The adhesive sheet according to claim 7 or 8, wherein the acrylic copolymer comprises a copolymer component derived from a monomer having a hydroxyl group.
11. The adhesive sheet according to claim 10, wherein the proportion of the mass of the copolymer component derived from the monomer having a hydroxyl group in the total mass of the acrylic copolymer is 3 mass% or more.
12. The adhesive sheet according to claim 7 or 8, wherein the acrylic adhesive composition comprises a crosslinked product obtained by crosslinking a composition containing at least the acrylic copolymer and a crosslinking agent containing a compound having an isocyanate group as a main component.
13. The adhesive sheet according to any one of claims 6 to 8, wherein the acrylic adhesive composition contains an adhesive aid comprising an oligomer having a reactive group.
14. The adhesive sheet according to claim 13, wherein the adhesive composition comprises a crosslinked product obtained by crosslinking a composition containing at least an acrylic copolymer, the adhesion promoter and a crosslinking agent, and the crosslinking agent contains a compound having an isocyanate group as a main component.
15. The adhesive sheet according to claim 5, wherein the adhesive layer is formed from a silicone-based adhesive composition containing an addition-polymerizable silicone resin.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/007978 WO2018158857A1 (en) | 2017-02-28 | 2017-02-28 | Adhesive sheet |
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| Publication Number | Publication Date |
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| CN110337711A CN110337711A (en) | 2019-10-15 |
| CN110337711B true CN110337711B (en) | 2022-11-04 |
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| JP (1) | JP6220487B1 (en) |
| KR (1) | KR102653071B1 (en) |
| CN (1) | CN110337711B (en) |
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| US11945984B2 (en) * | 2017-09-28 | 2024-04-02 | Nitto Denko Corporation | Reinforcing film |
| KR102116599B1 (en) * | 2017-09-28 | 2020-06-05 | 주식회사 엘지화학 | Adhesive composition, adhesive film comprising the same and plastic organic light emitting device comprising the same |
| SG11202009374YA (en) | 2018-03-30 | 2020-10-29 | Mitsui Chemicals Tohcello Inc | Method for manufacturing electronic device |
| KR102262695B1 (en) | 2018-11-22 | 2021-06-08 | 주식회사 엘지화학 | Foldable backplate, manufacturing method of foldable backplate and foldable display device comprising the same |
| JP7372526B2 (en) | 2019-09-24 | 2023-11-01 | 日亜化学工業株式会社 | Method for manufacturing a light emitting device and method for manufacturing a light emitting module |
| JP7459576B2 (en) * | 2020-03-12 | 2024-04-02 | 株式会社レゾナック | Panel and manufacturing method thereof, panel manufacturing member and manufacturing method thereof, and semiconductor chip |
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| Publication number | Publication date |
|---|---|
| KR102653071B1 (en) | 2024-03-29 |
| JP6220487B1 (en) | 2017-10-25 |
| WO2018158857A1 (en) | 2018-09-07 |
| TW201834087A (en) | 2018-09-16 |
| KR20190118553A (en) | 2019-10-18 |
| TWI743238B (en) | 2021-10-21 |
| CN110337711A (en) | 2019-10-15 |
| JPWO2018158857A1 (en) | 2019-03-07 |
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