CN110244519B - 图案形成装置、基板保持装置和物品制造方法 - Google Patents

图案形成装置、基板保持装置和物品制造方法 Download PDF

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Publication number
CN110244519B
CN110244519B CN201910167636.8A CN201910167636A CN110244519B CN 110244519 B CN110244519 B CN 110244519B CN 201910167636 A CN201910167636 A CN 201910167636A CN 110244519 B CN110244519 B CN 110244519B
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China
Prior art keywords
substrate
light
alignment mark
optical system
wavelength
Prior art date
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CN201910167636.8A
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English (en)
Chinese (zh)
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CN110244519A (zh
Inventor
藤岛浩史
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Publication of CN110244519A publication Critical patent/CN110244519A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)
CN201910167636.8A 2018-03-07 2019-03-06 图案形成装置、基板保持装置和物品制造方法 Active CN110244519B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018041198A JP7114277B2 (ja) 2018-03-07 2018-03-07 パターン形成装置及び物品の製造方法
JP2018-041198 2018-03-07

Publications (2)

Publication Number Publication Date
CN110244519A CN110244519A (zh) 2019-09-17
CN110244519B true CN110244519B (zh) 2021-07-09

Family

ID=65686727

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910167636.8A Active CN110244519B (zh) 2018-03-07 2019-03-06 图案形成装置、基板保持装置和物品制造方法

Country Status (5)

Country Link
US (1) US10747116B2 (https=)
EP (1) EP3537219B1 (https=)
JP (1) JP7114277B2 (https=)
CN (1) CN110244519B (https=)
TW (1) TWI722394B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6980562B2 (ja) * 2018-02-28 2021-12-15 キヤノン株式会社 パターン形成装置、アライメントマークの検出方法及びパターン形成方法
JP7659388B2 (ja) 2020-12-08 2025-04-09 キヤノン株式会社 検出装置、検出方法、露光装置、露光システム、物品製造方法、およびプログラム
CN114047137B (zh) * 2021-09-28 2023-09-12 深圳市麓邦技术有限公司 偏振信息转化或复制拼接方法
JP2023178028A (ja) * 2022-06-03 2023-12-14 キヤノン株式会社 露光装置、露光装置の制御方法、および、物品製造方法
CN118448324B (zh) * 2024-03-27 2025-06-06 深圳稳顶聚芯技术有限公司 对准装置及对准方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
CN105807578A (zh) * 2014-12-29 2016-07-27 上海微电子装备有限公司 一种背面对准测量装置及方法
CN107450288A (zh) * 2016-06-01 2017-12-08 佳能株式会社 图案形成装置、设置基板的方法和制造物品的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62262426A (ja) * 1986-05-09 1987-11-14 Canon Inc 露光装置
JP2535889B2 (ja) * 1987-03-26 1996-09-18 株式会社ニコン 投影光学装置
JP2803667B2 (ja) * 1997-11-17 1998-09-24 株式会社ニコン 露光方法
JP2001356488A (ja) 2000-06-14 2001-12-26 Asahi Optical Co Ltd レーザ描画装置
US7113258B2 (en) * 2001-01-15 2006-09-26 Asml Netherlands B.V. Lithographic apparatus
KR100579603B1 (ko) 2001-01-15 2006-05-12 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치
JP2003233198A (ja) 2002-02-12 2003-08-22 Konica Corp 画像露光装置
US20090128792A1 (en) * 2007-10-19 2009-05-21 Asml Netherlands B.V. Lithographic apparatus and method
NL1036308A1 (nl) * 2007-12-19 2009-06-22 Asml Netherlands Bv Lithographic method.
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US20110053092A1 (en) * 2009-08-20 2011-03-03 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
JP6116456B2 (ja) * 2013-09-25 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 描画方法および描画装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
CN105807578A (zh) * 2014-12-29 2016-07-27 上海微电子装备有限公司 一种背面对准测量装置及方法
CN107450288A (zh) * 2016-06-01 2017-12-08 佳能株式会社 图案形成装置、设置基板的方法和制造物品的方法

Also Published As

Publication number Publication date
US20190278186A1 (en) 2019-09-12
TW201939180A (zh) 2019-10-01
JP7114277B2 (ja) 2022-08-08
EP3537219A1 (en) 2019-09-11
US10747116B2 (en) 2020-08-18
CN110244519A (zh) 2019-09-17
EP3537219B1 (en) 2023-05-10
TWI722394B (zh) 2021-03-21
JP2019158926A (ja) 2019-09-19

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